Etching device of optical chip

Abstract

The utility model relates to the technical field of chip etching, and discloses an etching device of an optical chip, which comprises a base, the top of the base is fixedly connected with a liquid storage tank, two ends of the top of the base are fixedly connected with cylinders, the output ends of the cylinders are fixedly connected with a top seat, the top seat is provided with an etching mechanism, and the etching mechanism comprises a hollow shaft penetrating through the top seat. The bottom of the hollow shaft is fixedly connected with a cover plate, the bottom end of the cover plate is provided with an etching box, the two ends of the cover plate are fixedly connected with clamping blocks, the two ends of the etching box are provided with positioning parts, the side wall of the etching box is provided with a plurality of through holes, the bottom of the cover plate is provided with an air injection part, and one end of the top of the top seat is provided with a driving part. An air supply part is arranged at the other end of the top of the top seat. According to the utility model, the gas is sprayed to the chip through the gas spraying piece, so that the corrosive material with strong adhesive force on the chip is washed away by the high-pressure gas, and the corrosive material attached to the surface of the chip is ensured to be completely removed.

Description

Technical Field

[0001] The utility model relates to the technical field of chip etching, and more specifically, to an etching device for an optical chip. Background Art

[0002] The semiconductor manufacturing process is complex and tedious, and a large amount of equipment is required in the semiconductor manufacturing process. Among them, etching equipment is a very important equipment in the semiconductor manufacturing process. Etching is mainly divided into wet etching and dry etching according to the process. Wet etching is favored by chip manufacturers because of its strong adaptability, little damage to silicon wafers, and wide application. Wet etching is usually used in some applications with larger process sizes.

[0003] After searching, the Chinese patent publication number CN219917127U discloses "a chip etching device, comprising a base and an etching groove, the etching groove is placed on the surface of the base, and is used to hold a sufficient amount of etching liquid; electric push rods are vertically installed at the four corners of the surface of the base, and a lifting plate is fixed to the top of the electric push rods on a horizontal support, and a rotating groove is rotatably installed at the middle position of the bottom of the lifting plate through a rotating rod, and a support block is arranged in the middle position of the rotating groove, and the outer circle of the support block and the inner circle surface of the rotating groove are evenly provided with corresponding support grooves; a stepper motor is installed in the middle position of the surface of the lifting plate, and the stepper motor is connected to the rotating rod for transmission".

[0004] The above patent places the wafer support in a rotating tank and immerses the rotating tank and the wafer as a whole in the etching liquid. As the rotating tank and the wafer are driven to rotate, there is a certain flushing force between the etching liquid and the wafer to flush away the corroded material residues. Among them, the corroded material attached to the wafer is mainly separated from the wafer by the action of centrifugal force. However, some corroded materials have strong adhesion and are difficult to be flushed by centrifugal rotation, which leads to excessive corrosion of the wafer. Utility Model Content

[0005] In order to overcome the deficiencies of the prior art, the utility model provides an optical chip etching device, which has the advantage of being able to completely remove corrosive materials through the cooperation of centrifugal rotation and air jet flushing.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an etching device for an optical chip, comprising a base, a liquid storage tank for storing an etching liquid is fixedly connected to the top of the base, cylinders are fixedly connected to both ends of the top of the base, a top seat is fixedly connected to the output end of the cylinder, an etching mechanism is arranged on the top seat, the etching mechanism comprises a hollow shaft penetrating the top seat, the hollow shaft is rotatably connected to the top seat, a cover plate is fixedly connected to the bottom of the hollow shaft, an etching box for placing the chip is arranged at the bottom end of the cover plate, blocks are fixedly connected to both ends of the cover plate, positioning members for positioning and fixing the blocks are arranged at both ends of the etching box, a plurality of through holes are opened on the side wall of the etching box, and the plurality of through holes are distributed at equal angles around the etching box, a jet component for jetting gas to the chip is arranged at the bottom of the cover plate, a driving member for driving the hollow shaft to rotate is arranged at one end of the top of the top seat, and a gas supply member for supplying gas to the jet component is arranged at the other end of the top of the top seat.

[0007] As a preferred technical solution of the utility model, one end of the liquid storage tank is fixedly connected to a liquid inlet pipe, and the other end of the liquid storage tank is fixedly connected to a liquid outlet pipe.

[0008] As a preferred technical solution of the utility model, the positioning member includes a socket, which is fixedly connected to the outside of the etching box, the clamping block slidingly cooperates with the corresponding socket, the inner side of the socket is slidably connected to a positioning rod that passes through the side wall of the socket, one end of the positioning rod is inserted into the inner side of the clamping block, and the other end of the positioning rod is fixedly connected to a pull block.

[0009] As a preferred technical solution of the utility model, a plug hole matching the positioning rod is provided at the bottom end of the clamping block, and the positioning rod is slidably matched with the plug hole.

[0010] As a preferred technical solution of the utility model, the middle part of the positioning rod is fixedly connected to the limiting block, the inner side of the socket is provided with an installation groove that slides with the limiting block, and the positioning rod is sleeved with a spring, one end of the spring is in contact with the limiting block, and the other end of the spring is in contact with the inner wall of the installation groove.

[0011] As a preferred technical solution of the utility model, the jet component includes an air guide tube that passes through the hollow shaft, the air guide tube is fixedly connected to the hollow shaft, the bottom of the air guide tube is fixedly connected to a mounting plate, the outer edge of the mounting plate is fixedly connected to a plurality of diversion tubes, the plurality of diversion tubes are distributed at equal angles around the mounting plate, the top ends of the plurality of diversion tubes are connected to the air guide tube, and the bottom ends of the plurality of diversion tubes are fixedly connected to jet heads.

[0012] As a preferred technical solution of the utility model, the driving member includes a bracket, the bracket is fixedly connected to the top of the top seat, a motor is fixedly installed on the top of the bracket, the output shaft of the motor is fixedly connected to gear one, the top end of the hollow shaft is fixedly connected to gear two, and gear two is meshed with gear one.

[0013] As a preferred technical solution of the utility model, the air supply component includes an air pump, which is fixedly installed on the top of the top seat, the outlet end of the air pump is fixedly connected to an air supply pipe, the outlet end of the air supply pipe is fixedly connected to an adapter, the top end of the air guide pipe is rotatably connected to the adapter, and the air guide pipe is communicated with the inside of the air supply pipe.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows: the hollow shaft is driven to rotate by the driving member, which makes the cover plate drive the etching box to rotate synchronously, which makes the chip rotate synchronously, and the corrosive material attached to the chip is separated from the chip under the action of centrifugal force. At the same time, the gas supply member supplies gas to the jet member, and then the gas is sprayed to the chip through the jet member, which makes the corrosive material with strong adhesion on the chip be washed away by the high-pressure gas, thereby ensuring that all the corrosive materials attached to the chip surface are removed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of an optical chip etching device of the utility model;

[0016] Figure 2 It is a structural schematic diagram of the etching mechanism of the utility model;

[0017] Figure 3 It is a structural schematic diagram of the positioning member of the utility model;

[0018] Figure 4 It is a structural schematic diagram of the jetting component of the utility model;

[0019] Figure 5 It is a structural schematic diagram of the driving member of the utility model;

[0020] Figure 6 It is a structural schematic diagram of the air supply component of the utility model.

[0021] In the figure: base 1, liquid storage tank 2, cylinder 3, top seat 4, etching mechanism 5, hollow shaft 51, cover plate 52, etching box 53, block 54, jack 541, positioning member 55, holder 551, positioning rod 552, pull block 553, limit block 554, mounting groove 555, spring 556, jet member 56, air guide pipe 561, mounting plate 562, shunt pipe 563, jet head 564, driving member 57, bracket 571, motor 572, gear 1 573, gear 2 574, air supply member 58, air pump 581, air supply pipe 582, adapter 583, through hole 59, liquid inlet pipe 6, liquid outlet pipe 7. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] like Figures 1 to 6 As shown, the utility model provides an etching device for an optical chip, comprising a base 1, a liquid storage tank 2 for storing etching liquid is fixedly connected to the top of the base 1, a liquid inlet pipe 6 is fixedly connected to one end of the liquid storage tank 2, and a liquid outlet pipe 7 is fixedly connected to the other end of the liquid storage tank 2, both ends of the top of the base 1 are fixedly connected to a cylinder 3, the output end of the cylinder 3 is fixedly connected to a top seat 4, an etching mechanism 5 is arranged on the top seat 4, the etching mechanism 5 comprises a hollow shaft 51 penetrating the top seat 4, the hollow shaft 51 is rotatably connected to the top seat 4, the bottom of the hollow shaft 51 is fixedly connected to a cover plate 52, and the bottom of the cover plate 52 is fixedly connected to the bottom of the hollow shaft 51. An etching box 53 for placing chips is provided at the end, blocks 54 are fixedly connected to both ends of the cover plate 52, positioning parts 55 for positioning and fixing the blocks 54 are provided at both ends of the etching box 53, a plurality of through holes 59 are opened on the side wall of the etching box 53, and the plurality of through holes 59 are distributed at equal angles around the etching box 53, a jet component 56 for spraying gas to the chip is provided at the bottom of the cover plate 52, a driving component 57 for driving the hollow shaft 51 to rotate is provided at one end of the top of the top seat 4, and a gas supply component 58 for supplying gas to the jet component 56 is provided at the other end of the top of the top seat 4.

[0024] The chip is placed in the etching box 53, and the positioning member 55 is used to position and fix the clamping block 54 so that the cover plate 52 covers the top of the etching box 53. The cylinder 3 is then controlled to make the top seat 4 move downward, so that the etching box 53 moves downward and immerses into the liquid storage tank 2 to achieve etching of the chip.

[0025] The hollow shaft 51 is driven to rotate by the driving member 57, which causes the cover plate 52 to drive the etching box 53 to rotate synchronously, which causes the chip to rotate synchronously, and the corrosive material attached to the chip is separated from the chip under the action of centrifugal force. At the same time, the gas supply member 58 supplies gas to the jet member 56, and the gas is sprayed to the chip through the jet member 56. This causes the corrosive material with strong adhesion on the chip to be washed away by the high-pressure gas, thereby ensuring that all the corrosive materials attached to the chip surface are removed.

[0026] Among them, the positioning member 55 includes a socket 551, which is fixedly connected to the outer side of the etching box 53, and the block 54 is slidably matched with the corresponding socket 551. The inner side of the socket 551 is slidably connected with a positioning rod 552 that penetrates the side wall of the socket 551. One end of the positioning rod 552 is inserted into the inner side of the block 54, and the other end of the positioning rod 552 is fixedly connected with a pull block 553. The bottom end of the block 54 is provided with a socket 541 that matches the positioning rod 552. The positioning rod 552 is slidably matched with the socket 541. The middle part of the positioning rod 552 is fixedly connected with a limiting block 554. The inner side of the socket 551 is provided with a mounting groove 555 that is slidably matched with the limiting block 554. A spring 556 is sleeved on the positioning rod 552, one end of the spring 556 abuts against the limiting block 554, and the other end of the spring 556 abuts against the inner wall of the mounting groove 555.

[0027] When installing the etching box 53, the pull block 553 is pulled outward to make the positioning rod 552 slide and completely slide into the installation groove 555. At this time, the spring 556 is compressed to accumulate potential energy, and then the clamping block 54 is matched with the clamping seat 551, and then the pull block 553 is released to release the potential energy of the spring 556, so that the positioning rod 552 slides in the opposite direction and slidably cooperates with the socket 541, so that the clamping block 54 and the clamping seat 551 remain fixed, thereby realizing the installation of the etching box 53.

[0028] Among them, the jet component 56 includes an air guide pipe 561 that passes through the hollow shaft 51, the air guide pipe 561 is fixedly connected to the hollow shaft 51, the bottom of the air guide pipe 561 is fixedly connected to a mounting plate 562, the outer edge of the mounting plate 562 is fixedly connected to a plurality of diversion pipes 563, the plurality of diversion pipes 563 are distributed around the mounting plate 562 at equal angles, the top ends of the plurality of diversion pipes 563 are connected to the air guide pipe 561, the bottom ends of the plurality of diversion pipes 563 are fixedly connected to jet heads 564, the air supply component 58 includes an air pump 581, the air pump 581 is fixedly installed on the top of the top seat 4, the outlet end of the air pump 581 is fixedly connected to an air supply pipe 582, the outlet end of the air supply pipe 582 is fixedly connected to an adapter 583, the top end of the air guide pipe 561 is rotatably connected to the adapter 583, and the air guide pipe 561 is communicated with the inside of the air supply pipe 582.

[0029] Gas is introduced into the gas supply pipe 582 through the air pump 581, so that the gas is introduced into the air guide pipe 561, and then under the guidance of the air guide pipe 561, the gas is respectively introduced into each branch pipe 563, and finally sprayed onto the chip through each nozzle 564, so that the sprayed high-pressure gas can flush away the corrosive materials attached to the chip.

[0030] Among them, the driving member 57 includes a bracket 571, the bracket 571 is fixedly connected to the top of the top seat 4, a motor 572 is fixedly installed on the top of the bracket 571, the output shaft of the motor 572 is fixedly connected to a gear 1 573, and the top end of the hollow shaft 51 is fixedly connected to a gear 2 574, and the gear 2 574 is meshed with the gear 1 573.

[0031] By starting the motor 572, the gear 1 573 rotates, which causes the gear 2 574 to rotate synchronously, and the hollow shaft 51 rotates, so that the cover plate 52 drives the etching box 53 to rotate synchronously, which causes the chip to rotate synchronously, and the corrosion material attached to the chip is separated from the chip under the action of centrifugal force.

[0032] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An optical chip etching device, comprising a base (1), the top of the base (1) being fixedly connected to a liquid storage tank (2) for storing etching liquid, both ends of the top of the base (1) being fixedly connected to a cylinder (3), the output end of the cylinder (3) being fixedly connected to a top seat (4), characterized in that: The top seat (4) is provided with an etching mechanism (5), the etching mechanism (5) comprising a hollow shaft (51) penetrating the top seat (4), the hollow shaft (51) being rotatably connected to the top seat (4), a cover plate (52) being fixedly connected to the bottom of the hollow shaft (51), an etching box (53) for placing a chip being provided at the bottom end of the cover plate (52), a clamping block (54) being fixedly connected to both ends of the cover plate (52), and a clamping block (54) being fixedly connected to both ends of the etching box (53). A positioning member (55) is fixed in position, a plurality of through holes (59) are opened on the side wall of the etching box (53), and the plurality of through holes (59) are distributed at equal angles around the etching box (53), a jet component (56) for jetting gas to the chip is arranged at the bottom of the cover plate (52), a driving member (57) for driving the hollow shaft (51) to rotate is arranged at one end of the top of the top seat (4), and a gas supply member (58) for supplying gas to the jet component (56) is arranged at the other end of the top of the top seat (4).

2. The optical chip etching device according to claim 1, characterized in that: One end of the liquid storage tank (2) is fixedly connected to a liquid inlet pipe (6), and the other end of the liquid storage tank (2) is fixedly connected to a liquid outlet pipe (7).

3. The optical chip etching device according to claim 1, characterized in that: The positioning member (55) comprises a clamping seat (551), wherein the clamping seat (551) is fixedly connected to the outside of the etching box (53), the clamping block (54) is slidably matched with the corresponding clamping seat (551), the inner side of the clamping seat (551) is slidably connected to a positioning rod (552) that passes through the side wall of the clamping seat (551), one end of the positioning rod (552) is inserted into the inner side of the clamping block (54), and the other end of the positioning rod (552) is fixedly connected to a pulling block (553).

4. The optical chip etching device according to claim 3, characterized in that: A plug hole (541) matching the positioning rod (552) is provided at the bottom end of the clamping block (54), and the positioning rod (552) is slidably matched with the plug hole (541).

5. The optical chip etching device according to claim 4, characterized in that: The middle part of the positioning rod (552) is fixedly connected to the limiting block (554); the inner side of the clamping seat (551) is provided with a mounting groove (555) that slidably cooperates with the limiting block (554); a spring (556) is sleeved on the positioning rod (552); one end of the spring (556) abuts against the limiting block (554), and the other end of the spring (556) abuts against the inner wall of the mounting groove (555).

6. The optical chip etching device according to claim 1, characterized in that: The jet component (56) comprises an air guide tube (561) penetrating the hollow shaft (51); the air guide tube (561) is fixedly connected to the hollow shaft (51); a mounting plate (562) is fixedly connected to the bottom of the air guide tube (561); a plurality of flow diversion tubes (563) are fixedly connected to the outer edge of the mounting plate (562); the plurality of flow diversion tubes (563) are distributed at equal angles around the mounting plate (562); the top ends of the plurality of flow diversion tubes (563) are all connected to the air guide tube (561); and the bottom ends of the plurality of flow diversion tubes (563) are fixedly connected to jet heads (564).

7. The optical chip etching device according to claim 6, characterized in that: The driving member (57) comprises a bracket (571), the bracket (571) being fixedly connected to the top of the top seat (4), a motor (572) being fixedly mounted on the top of the bracket (571), an output shaft of the motor (572) being fixedly connected to a gear 1 (573), and a top end of the hollow shaft (51) being fixedly connected to a gear 2 (574), the gear 2 (574) being meshed with the gear 1 (573).

8. The optical chip etching device according to claim 7, characterized in that: The air supply component (58) comprises an air pump (581), the air pump (581) being fixedly mounted on the top of the top seat (4), the outlet end of the air pump (581) being fixedly connected to an air supply pipe (582), the outlet end of the air supply pipe (582) being fixedly connected to an adapter (583), the top end of the air guide pipe (561) being rotatably connected to the adapter (583), and the air guide pipe (561) and the air supply pipe (582) being internally communicated.

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