Heating cushion block used on chip mounting machine table

Abstract

The utility model relates to the technical field of chip mounting machines, in particular to a heating cushion block used on a chip mounting machine table, and provides the following technical scheme that the heating cushion block used on the chip mounting machine table comprises a heating block and a cushion block, the heating block is fixedly connected to the upper end of the cushion block through a fixing bolt, and the cushion block is arranged on the heating block. A plurality of vacuum suction holes are evenly formed in the middle of the heating block, a plurality of heat dissipation grooves are formed in the left side and the right side of the upper end of the heating block, a through hole is formed between every two adjacent heat dissipation grooves, the left end and the right end of the heating block are in threaded connection with air pipe connecting pipes, and first electromagnetic valves are fixedly installed on the outer walls of the air pipe connecting pipes. By means of a mode of adding an air path, under the condition that a pressing plate is not used, the problem of vacuum adsorption of the QFN rear film pasting frame in a cushion block heating mode is solved by completely depending on vacuum adsorption of the rear film pasting frame and heat balance by additionally arranging a heat dissipation groove.

Description

Technical Field

[0001] The utility model relates to the technical field of chip loading machines, in particular to a heating pad block used on a chip loading machine table. Background Art

[0002] The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and post-packaging testing. Semiconductor packaging testing refers to the process of processing the tested wafers into independent chips according to product models and functional requirements. There are dozens of popular devices in the wafer mounting (DA) section in the semiconductor packaging field. Almost all the popular DA devices on the market have a wafer mounting heating function. The so-called wafer mounting heating function means that a layer of glue is directly applied on the wafer to bond the chip to the frame without using silver paste or using tape to bond the chip to the frame.

[0003] At present, the pads of the chip mounter equipment can only produce QFN front film frames. In the pad heating mode, the rear film frame cannot be adsorbed on the track, and the frame will float to varying degrees due to the thermal effect, resulting in unstable patch, etc. If you want to produce a rear-mounted frame, you can only use multiple rows of pressure plates to fix it. However, this product cannot use pressure plates, otherwise it will scratch the first layer of chips and the frame fingers. Utility Model Content

[0004] The utility model aims to provide a heating pad for a wafer loading machine to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heating pad block for a wafer loading machine, comprising: a heating block and a pad block, the heating block is fixedly connected to the upper end of the pad block by a fixing bolt, a plurality of vacuum suction holes are evenly opened in the middle part of the heating block, a plurality of heat dissipation grooves are opened on both sides of the upper end of the heating block, a through hole is opened between two adjacent heat dissipation grooves, an air pipe connecting pipe is threadedly connected to the left and right ends of the heating block, and an electromagnetic valve 1 is fixedly installed on the outer wall of the air pipe connecting pipe;

[0006] One end of the heating block and the cushion block is respectively provided with groove one and groove two, the outer ends of groove one and groove two are threadedly connected with vacuum tube connecting pipes, and the outer wall of the vacuum tube connecting pipe is fixedly installed with electromagnetic valve two.

[0007] Preferably, bolt holes are provided at the four ends of the heating block, threaded holes two corresponding to the bolt holes are provided at the four ends of the cushion block, and one end of the fixing bolt passes through the bolt hole and is threadedly connected to the inner wall of the threaded hole two.

[0008] Preferably, threaded holes 1 are provided on the side walls at both ends of the heating block, and the inner port of the threaded hole 1 is connected to the inner end of the heat dissipation groove.

[0009] Preferably, the outer wall of the trachea connecting pipe is threadedly connected to the inner wall of the threaded hole 1.

[0010] Preferably, a cavity one is opened at the center of the lower end of the heating block, and the cavity one is connected to the vacuum suction hole and the groove one respectively.

[0011] Preferably, a second cavity begins at the center of the upper end of the cushion block, and the second cavity is connected to the second groove.

[0012] Preferably, the outer ends of the groove 1 and the groove 2 are both provided with thread grooves.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] By adding an air path, the rear film frame is completely vacuum-adsorbed without using a pressure plate, and a heat sink is added to achieve thermal balance, thus solving the vacuum adsorption problem of the QFN rear film frame in the pad heating mode. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a second schematic diagram of the overall structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the expansion of the heating block and the pad block of the utility model;

[0018] Figure 4 This is a bottom view of the heating block of the utility model.

[0019] In the figure: 1. heating block; 2. cushion block; 3. vacuum suction hole; 4. heat dissipation groove; 5. through hole; 6. threaded hole one; 7. air pipe connecting pipe; 8. solenoid valve one; 9. bolt hole; 10. threaded hole two; 11. fixing bolt; 12. cavity one; 13. groove one; 14. groove two; 15. cavity two; 16. threaded groove; 17. vacuum tube connecting pipe; 18. solenoid valve two. DETAILED DESCRIPTION

[0020] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-Figure 4The utility model provides a technical solution: a heating pad block for a wafer loading machine, comprising: a heating block 1 and a pad block 2, the heating block 1 is fixedly connected to the upper end of the pad block 2 by a fixing bolt 11, the four ends of the heating block 1 are provided with bolt holes 9, the four ends of the pad block 2 are provided with threaded holes 10 corresponding to the bolt holes 9, one end of the fixing bolt 11 passes through the bolt hole 9 and is threadedly connected to the inner wall of the threaded hole 10 to fix the heating block 1 and the pad block 2 together, and sealant can also be applied between the heating block 1 and the pad block 2 to increase the sealing between the heating block 1 and the pad block 2.

[0022] A plurality of vacuum suction holes 3 are evenly provided in the middle part of the heating block 1, a plurality of heat dissipation grooves 4 are provided on the left and right sides of the upper end of the heating block 1, a through hole 5 is provided between two adjacent heat dissipation grooves 4, an air pipe connecting pipe 7 is threadedly connected to the left and right ends of the heating block 1, an electromagnetic valve 8 is fixedly installed on the outer wall of the air pipe connecting pipe 7, a threaded hole 6 is provided on the side walls of the left and right ends of the heating block 1, the inner port of the threaded hole 6 is connected to the inner end of the heat dissipation groove 4, the outer wall of the air pipe connecting pipe 7 is threadedly connected to the inner wall of the threaded hole 6, the air pipe connecting pipe 7 is fixed to the side wall of the heating block 1, a compressed air input pipe is fixedly installed on the outer end of the air pipe connecting pipe 7, and the electromagnetic valve 8 is used to realize that the frame is opened when the track is transferred, but closed when welding, compressed air is used to dissipate heat by blowing below the heat dissipation groove 4, and the air pipe is used to bring out the heat energy to achieve a thermal balance effect;

[0023] A groove 13 and a groove 2 14 are respectively provided at one end of the heating block 1 and the cushion block 2. A cavity 12 is provided at the center of the lower end of the heating block 1. The cavity 12 is connected to the vacuum suction hole 3 and the groove 13 respectively. A cavity 2 15 begins to be provided at the center of the upper end of the cushion block 2. The cavity 2 15 is connected to the groove 2 14. When the heating block 1 is fixed to the upper end of the cushion block 2, the cavity 12 is connected to the cavity 2 15, and the groove 13 and the groove 2 14 are connected to form a circle. The outer ends of the groove 13 and the groove 2 14 are provided with a threaded groove 16. The outer ends of the groove 13 and the groove 2 14 are threadedly connected with a vacuum tube connecting pipe 17 through the threaded groove 16. An electromagnetic valve 2 18 is fixedly installed on the outer wall of the vacuum tube connecting pipe 17. A vacuum tube is fixedly installed on the outer end of the vacuum tube connecting pipe 17. Three vacuums are input simultaneously, and the electromagnetic valve 2 18 is used to realize that the frame is closed at the same time when it is transferred on the track, and the vacuum is opened at the same time during welding, and the film is attached to the frame after adsorption.

[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heating pad for a wafer loading machine, comprising: A heating block (1) and a cushion block (2), wherein the heating block (1) is fixedly connected to the upper end of the cushion block (2) by means of fixing bolts (11), and is characterized in that: a plurality of vacuum suction holes (3) are evenly arranged in the middle part of the heating block (1), a plurality of heat dissipation grooves (4) are arranged on both the left and right sides of the upper end of the heating block (1), a through hole (5) is arranged between two adjacent heat dissipation grooves (4), an air pipe connecting pipe (7) is threadedly connected to the left and right ends of the heating block (1), and an electromagnetic valve (8) is fixedly installed on the outer wall of the air pipe connecting pipe (7); One end of the heating block (1) and the cushion block (2) is respectively provided with a groove 1 (13) and a groove 2 (14); the outer ends of the groove 1 (13) and the groove 2 (14) are threadedly connected with a vacuum tube connecting pipe (17); and a solenoid valve 2 (18) is fixedly mounted on the outer wall of the vacuum tube connecting pipe (17).

2. The heating pad for a wafer loading machine according to claim 1, characterized in that: The four ends of the heating block (1) are each provided with a bolt hole (9), the four ends of the cushion block (2) are each provided with a threaded hole (10) corresponding to the bolt hole (9), and one end of the fixing bolt (11) passes through the bolt hole (9) and is threadedly connected to the inner wall of the threaded hole (10).

3. The heating pad for a wafer loading machine according to claim 1, characterized in that: The side walls at both ends of the heating block (1) are provided with threaded holes (6), and the inner end of the threaded hole (6) is connected to the inner end of the heat dissipation groove (4).

4. The heating pad for a wafer loading machine according to claim 3, characterized in that: The outer wall of the air pipe connecting pipe (7) is threadedly connected to the inner wall of the threaded hole 1 (6).

5. The heating pad for a wafer loading machine according to claim 1, characterized in that: A cavity one (12) is provided at the center of the lower end of the heating block (1), and the cavity one (12) is respectively connected to the vacuum suction hole (3) and the groove one (13).

6. The heating pad for a wafer loading machine according to claim 5, characterized in that: A second cavity (15) begins at the center of the upper end of the cushion block (2), and the second cavity (15) is connected to the second groove (14).

7. The heating pad for a wafer loading machine according to claim 6, characterized in that: The outer ends of the groove 1 (13) and the groove 2 (14) are both provided with a thread groove (16).

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