Silicon wafer transfer device

Abstract

The utility model discloses a silicon wafer transfer device, which relates to the technical field of silicon wafer processing equipment and comprises a mounting seat and a plurality of suckers, and the suckers are vertically arranged on the mounting seat side by side. The same side of the multiple suction cups is provided with an adsorption air channel. When the silicon wafer transfer device is used, silicon wafers are adsorbed on the suction cups through the adsorption air channels on one sides of the suction cups, adsorption of the silicon wafers is completed, then transfer of the silicon wafers is completed, due to the fact that the suction cups are vertically arranged on the installation base in parallel, the multiple silicon wafers can be transferred at a time, and due to the fact that the silicon wafers are in the vertical state after being adsorbed by the suction cups, the silicon wafers can be transferred at a time. Therefore, the small space can adapt to adsorption and transfer of more silicon wafers, and the processing efficiency of the silicon wafers is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing equipment, in particular to a silicon wafer transport device. Background Art

[0002] Silicon is refined from quartz sand. Silicon wafers are purified silicon elements. Then the pure silicon is made into silicon crystal rods, which become the material of quartz semiconductors for manufacturing integrated circuits. With the development of large-scale integrated circuits, silicon wafers are widely used as the main substrate material for semiconductors and other electronic products.

[0003] During the silicon wafer processing, a transfer device is required to transfer the silicon wafers between different processing processes. Most of the silicon wafer transfer devices in the prior art use a number of adsorption heads distributed in a rectangular array at the bottom to adsorb and transfer the silicon wafers. During transportation, the silicon wafers are in a horizontal state, resulting in a small number of silicon wafers transferred at one time.

[0004] In view of this, a silicon wafer transfer device is urgently needed. Summary of the invention

[0005] In view of the problems existing in the prior art, the utility model solves the problems with the following technical structure.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A silicon wafer transfer device comprises: a mounting seat and a plurality of suction cups, wherein the plurality of suction cups are vertically and juxtaposedly arranged on the mounting seat;

[0008] A suction air channel is arranged on the same side of the plurality of suction cups.

[0009] A further feature is that

[0010] The suction cup comprises a main suction cup and a plurality of supporting suction cups arranged in parallel on one side of the main suction cup.

[0011] The adsorption air channel includes a first air channel and a plurality of second air channels, wherein the plurality of second air channels respectively extend from a main suction cup to corresponding branch suction cups, the first air channel is arranged on the main suction cup, and one end of the plurality of second air channels intersects with the first air channel.

[0012] A first air inlet is disposed at one end of the second air passage away from the first air passage.

[0013] A second air inlet is arranged on one side of the intersection of the second air passage and the first air passage.

[0014] The edges of the main suction cup and the plurality of supporting suction cups are all provided with chamfers.

[0015] The suction cup also includes a mounting portion arranged on the top of the main suction cup, a mounting groove is arranged at the bottom of the mounting seat, and the mounting portion is clamped in the mounting groove.

[0016] The air outlet of the adsorption air channel is arranged on the top of the mounting portion.

[0017] Both sides of the mounting portion are provided with card slots, and both sides of the mounting seat are provided with card plates, and the two card plates are respectively clamped in the corresponding card slots.

[0018] A plurality of mounting holes are arranged on the top of the mounting seat.

[0019] The above structure of the utility model can achieve the following beneficial effects:

[0020] When in use, the silicon wafer is adsorbed on the suction cup through the adsorption air channel on one side of the suction cup to complete the adsorption of the silicon wafer, and then the silicon wafer is transported. Since multiple suction cups are vertically and parallelly arranged on the mounting base, multiple silicon wafers can be transported at one time, and since the silicon wafer is in a vertical state after being adsorbed by the suction cup, more silicon wafers can be adsorbed and transported in a smaller space, thereby improving the processing efficiency of the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of this embodiment;

[0022] Figure 2 Schematic diagram of the structure of the suction cup in this embodiment;

[0023] Figure 3 for Figure 2 A schematic diagram of the structure enlargement at the center A;

[0024] Figure 4 for Figure 2 A magnified schematic diagram of the structure at point B in the middle.

[0025] In the figure: 1. mounting seat; 11. mounting hole; 2. suction cup; 21. card slot; 3. first air duct; 4. second air duct; 5. first air intake port; 6. second air intake port; 7. card plate. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0027] It should be noted that the terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, apparatus, product or equipment comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0028] The following is combined with Figure 1-4 This application is described in further detail.

[0029] refer to Figure 1-2 A silicon wafer transfer device is shown, comprising: a mounting base 1 and a plurality of suction cups 2, wherein the plurality of suction cups 2 are vertically and parallelly arranged on the mounting base 1; an adsorption air channel is arranged on the same side of the plurality of suction cups 2, so that when in use, the silicon wafer is adsorbed on the suction cup 2 through the adsorption air channel on one side of the suction cup 2, thereby completing the adsorption of the silicon wafer and then completing the transfer of the silicon wafer. Since the plurality of suction cups 2 are vertically and parallelly arranged on the mounting base 1, multiple silicon wafers can be transferred at one time, and since the silicon wafer is in a vertical state after being adsorbed by the suction cup 2, more silicon wafers can be adsorbed and transferred in a smaller space, thereby improving the processing efficiency of the silicon wafers.

[0030] refer to Figure 2-4 As shown, in order to improve the stability of adsorption, the suction cup 2 includes a main suction cup and multiple branch suction cups arranged in parallel on one side of the main suction cup. In this way, the suction cup composed of multiple branch suction cups and the main suction cup can expand the contact area with the silicon wafer, thereby increasing the stability of silicon wafer adsorption.

[0031] refer to Figure 2-4 As shown, the adsorption air channel includes a first air channel 3 and multiple second air channels 4, and the multiple second air channels 4 extend from the main suction cup to the corresponding branch suction cup respectively. The first air channel 3 is arranged on the main suction cup, and one end of the multiple second air channels 4 intersects with the first air channel 3. In this way, the multiple parallel second air channels 4 cooperate with the first air channel 3 to stably adsorb the silicon wafer, and in order to improve the adsorption force of the adsorption air channel on the silicon wafer at each position during adsorption, a first air intake port 5 is arranged at one end of the second air channel 4 away from the first air channel 3, and a second air intake port 6 is arranged on the side of the intersection of the second air channel 4 and the first air channel 3. In this way, the second air intake port 6 first extracts the gas in the first air channel 3, and the first air intake port 5 extracts the gas in the second air channel 4 to complete the adsorption of the silicon wafer.

[0032] A further optimization is that, in order to facilitate the insertion of the silicon wafer between the two suction cups 2, chamfers are provided at the edges of the main suction cup and the plurality of supporting suction cups.

[0033] refer to Figure 1-2As shown, in order to facilitate the installation of the suction cup 2, the suction cup 2 also includes a mounting portion arranged on the top of the main suction cup, and a mounting groove is arranged at the bottom of the mounting seat 1. The mounting portion is clamped in the mounting groove, and in order to improve the stability of the installation of the suction cup 2, clamping grooves 21 are opened on both sides of the mounting portion, and clamping plates 7 are arranged on both sides of the mounting seat 1. The two clamping plates 7 are respectively clamped in the corresponding clamping grooves 21. In this way, when the clamping plate 7 is clamped in the mounting seat 1, the other side extends into the mounting groove and is clamped in the clamping groove 21 of the mounting portion, so that the suction cup 2 is locked.

[0034] It is further optimized that the air outlet of the adsorption air duct is preferably arranged at the top of the mounting portion, so that the gas extracted from the first air inlet 5 and the second air inlet 6 is discharged from the top of the mounting portion.

[0035] It is further optimized that, in order to facilitate the installation of the mounting base 1 on the rail, a plurality of mounting holes 11 are provided on the top of the mounting base 1 .

[0036] In summary, when in use, the silicon wafer is adsorbed on the suction cup 2 through the adsorption air channel on one side of the suction cup 2, completing the adsorption of the silicon wafer, and then completing the transportation of the silicon wafer. Since multiple suction cups 2 are vertically and parallelly arranged on the mounting base 1, multiple silicon wafers can be transported at one time, and since the silicon wafer is in a vertical state after being adsorbed by the suction cup 2, more silicon wafers can be adsorbed and transported in a smaller space, thereby improving the processing efficiency of the silicon wafers.

[0037] The above are only preferred embodiments of the present application, and the present invention is not limited to the above embodiments. It is understood that other improvements and changes directly derived or associated by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included in the protection scope of the present invention.

Claims

1. A silicon wafer transport device, characterized in that: include: A mounting seat (1) and a plurality of suction cups (2), wherein the plurality of suction cups (2) are vertically and parallelly arranged on the mounting seat (1); A suction air channel is provided on the same side of the plurality of suction cups (2); The suction cup (2) comprises a main suction cup and a plurality of supporting suction cups arranged in parallel on one side of the main suction cup; The suction cup (2) further comprises a mounting portion arranged on the top of the main suction cup, a mounting groove is arranged on the bottom of the mounting seat (1), and the mounting portion is clamped in the mounting groove; The air outlet of the adsorption air channel is arranged on the top of the mounting portion.

2. A silicon wafer transport device according to claim 1, characterized in that: The adsorption air channel comprises a first air channel (3) and a plurality of second air channels (4), wherein the plurality of second air channels (4) respectively extend from a main suction cup to corresponding branch suction cups, the first air channel (3) is arranged on the main suction cup, and one end of the plurality of second air channels (4) intersects with the first air channel (3).

3. A silicon wafer transport device according to claim 2, characterized in that: A first air inlet (5) is provided at one end of the second air passage (4) away from the first air passage (3).

4. The silicon wafer transport device according to claim 2, characterized in that: A second air inlet (6) is provided on one side of the intersection of the second air passage (4) and the first air passage (3).

5. The silicon wafer transport device according to claim 1, characterized in that: The edges of the main suction cup and the plurality of supporting suction cups are all provided with chamfers.

6. The silicon wafer transport device according to claim 1, characterized in that: Both sides of the mounting portion are provided with card slots (21), and both sides of the mounting seat (1) are provided with card plates (7), and the two card plates (7) are respectively carded in the corresponding card slots (21).

7. The silicon wafer transport device according to claim 1, characterized in that: A plurality of mounting holes (11) are provided on the top of the mounting seat (1).

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