Rotatable vacuum adsorption device

Abstract

The utility model provides a rotatable vacuum adsorption device, which comprises a supporting and assembling component, an adapter bearing component, a vacuum adapter component, a bearing and supporting component, a rotating communication component, an adsorption positioning component and a power driving component, and integrates multiple functions of vacuum adsorption, rotating positioning, power driving and the like. Stable adsorption, accurate positioning and rotating operation of a wafer can be achieved, the integrated design can improve the working efficiency, reduce the occupied area of equipment and enable operation to be simpler and more convenient, through accurate matching and stable installation of the parts such as the supporting assembling assembly and the transfer bearing assembly, the stability and reliability of the overall structure of the device are ensured, and the production cost is reduced. The adsorption positioning assembly can accurately adsorb and position the wafer, the power driving assembly can achieve stable rotation of the wafer, the rotating speed and angle can be accurately controlled by adjusting parameters of a driving motor, and different machining requirements are met.

Description

Technical Field

[0001] The utility model relates to semiconductor production equipment, in particular to a rotatable vacuum adsorption device. Background Art

[0002] In the process of semiconductor wafer inspection, it is not only necessary to adsorb the wafer, but also necessary to drive the wafer to perform controllable rotation while adsorbing the wafer. Patent document CN202070460U discloses a vacuum adsorption rotating device, which includes a bearing seat, a bearing and a rotating shaft, the bearing seat is provided with a linear circular shaft hole, the shaft hole is provided with a bearing mounting groove, the bearing is installed in the bearing mounting groove, the shaft hole between the bearing mounting grooves is a smooth surface, the smooth surface forms a sealing hole, the upper end of the rotating shaft protrudes to form an adsorption head, the top surface of the adsorption head is a horizontal structure, the lower end of the rotating shaft rotates through the bearing and the sealing hole, the rotating shaft has a smooth part in sealing contact with the sealing hole, a vacuum channel is provided along the axis of the rotating shaft from the lower end of the rotating shaft to penetrate the top surface of the adsorption head, the vacuum channel forms an adsorption port on the top surface of the adsorption head, the lower end of the rotating shaft is provided with a vacuum groove connected to the vacuum channel around the outer side of the rotating shaft, and the bearing seat is provided with a main vacuum channel corresponding to the vacuum groove, which is a vacuum adsorption rotating device with high stability and reliability and capable of reducing friction and heat generation. However, the rotating shaft of the adsorption rotating device is directly installed in the bearing seat, and its running stability is poor, which affects the stability and reliability of the wafer processing process. Therefore, it is necessary to optimize its structure to overcome the above defects. Utility Model Content

[0003] The purpose of the utility model is to provide a rotatable vacuum adsorption device to improve operation stability and reliability.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A rotatable vacuum adsorption device, comprising:

[0006] A support assembly component is installed in a wafer processing device and has an assembly space inside;

[0007] A transfer bearing assembly, which is installed in the support assembly assembly and has a bearing space inside;

[0008] A vacuum adapter assembly, which is installed in the adapter bearing assembly and is connected to the vacuum generating device through a pipeline;

[0009] A transfer support assembly is installed in the vacuum matching assembly and has a transfer space inside;

[0010] A rotating communication component is installed in the bearing and transfer support component and is connected to the vacuum matching component and can rotate in the bearing and transfer support component;

[0011] The adsorption and positioning component is installed on the rotating communication component and is connected to the vacuum matching component through the rotating communication component. It can rotate with the rotating communication component. It is adapted to the shape of the wafer, can adsorb and position the wafer, and drive it to rotate together;

[0012] The power-driven rotating component is installed in the supporting assembly component and cooperates with the rotating communication component. The power-driven rotating component drives the rotating communication component and the adsorption positioning component to rotate.

[0013] Specifically, the support assembly includes:

[0014] The supporting frame is formed by enclosing plates and is installed in the wafer processing equipment through connecting bolts to form an assembly space inside the supporting frame.

[0015] In one embodiment of the utility model, the support frame is a U-shaped structure, the opening of which is located at the side, a support top plate is formed on the top of the support frame, and a support bottom plate is formed at the bottom.

[0016] The transfer bearing assembly includes:

[0017] The adapter seat body is installed on the top of the supporting frame through connecting bolts, and a load-bearing opening is opened inside the adapter seat body. The load-bearing opening is arranged vertically and passes through the upper and lower ends of the adapter seat body.

[0018] The transfer components include:

[0019] A support core body is installed in the support opening, and a vacuum cavity is provided inside the support core body, and the vacuum cavity runs through both ends of the support core body;

[0020] A carrier plug, which is located at the lower end of the vacuum chamber and is screwed into the carrier core through threads;

[0021] A pair of support bearings are provided, and each support bearing is respectively embedded at two ends of the support plug.

[0022] The rotating communication assembly includes:

[0023] A rotating core shaft is located in the supporting core body, cooperates with the supporting bearing, and passes through the supporting plug and both ends of the supporting core body, with its top end exposed from above the adapter body and its bottom end exposed from below the adapter body. It can be rotated in the supporting core body through the supporting bearing. A radial through hole and an axial through hole are provided in the rotating core shaft. The radial through hole radially passes through both sides of the rotating core shaft and is connected with the bearing through hole. The axial through hole extends axially from the top of the rotating core shaft to the inside thereof and is connected with the radial through hole.

[0024] In one embodiment of the utility model, an auxiliary support bearing is further provided between the rotating core shaft and the supporting core body, and the auxiliary support bearing assists in supporting the rotation process of the rotating core shaft.

[0025] The adsorption positioning components include:

[0026] The adsorption end plate is located above the adapter body and is engaged with the top of the rotating core shaft. The adsorption end plate is driven to rotate by the rotating core shaft. An adsorption groove is opened on the top of the adsorption end plate, and the adsorption groove is connected to the axial through hole, so that the adsorption end plate can adsorb and position the wafer.

[0027] In one embodiment of the utility model, an external end tube is installed on the side of the carrier core, the external end tube is connected to the vacuum chamber, and extends outward after passing through the adapter body, and the vacuum generating device is connected to the external end tube through a pipeline.

[0028] The power drive assembly includes:

[0029] The driving motor is installed at the bottom of the supporting frame, and its power output shaft extends upward and is connected to the bottom end of the rotating core shaft through a coupling. The driving motor drives the rotating core shaft to rotate.

[0030] In one embodiment of the present invention, the driving motor is a stepping motor.

[0031] The advantages of the utility model are:

[0032] The rotatable vacuum adsorption device integrates multiple functions such as vacuum adsorption, rotational positioning and power drive, and can realize stable adsorption, precise positioning and rotation operations of wafers. This integrated design can improve work efficiency, reduce equipment footprint, and make operation easier. The precise matching and firm installation of supporting assembly components, transfer bearing components and other parts ensure the stability and reliability of the overall structure of the device, which is very important for ensuring the accuracy and safety of wafers during processing. The adsorption and positioning components can accurately adsorb and position the wafers, while the power drive rotation components can realize stable rotation of the wafers. By adjusting the parameters of the drive motor, the rotation speed and angle can be accurately controlled to meet different processing requirements. The device can be installed in wafer processing equipment and is suitable for processing wafers of different specifications and types. It can be flexibly adjusted and expanded according to actual needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a structural schematic diagram of the rotatable vacuum adsorption device proposed by the utility model;

[0034] Figure 2 It is a schematic diagram of the cross-sectional structure of the vacuum adsorption device. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical scheme and advantages of the embodiment of the utility model clearer, the technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. The components of the embodiment of the utility model generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the utility model provided in the drawings is not intended to limit the scope of the utility model claimed for protection, but merely represents the selected embodiment of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model.

[0036] like Figure 1 , Figure 2As shown, the rotatable vacuum adsorption device proposed by the utility model includes a supporting assembly component, a transfer bearing component, a vacuum matching component, a receiving and transporting support component, a rotating communication component, an adsorption and positioning component and a power-driven rotation component. The supporting assembly component is installed in the wafer processing equipment and has an assembly space inside. The transfer bearing component is installed in the supporting assembly component and has a bearing space inside. The vacuum matching component is installed in the transferring bearing component and is connected with the vacuum generating equipment through a pipeline. The receiving and transporting support component is installed in the vacuum matching component and has a receiving and transporting space inside. The rotating communication component is installed in the receiving and transporting support component and is connected with the vacuum matching component and can rotate in the receiving and transporting support component. The adsorption and positioning component is installed on the rotating communication component and is connected with the vacuum matching component through the rotating communication component and can rotate with the rotating communication component. It is adapted to the shape of the wafer, can adsorb and position the wafer, and drive it to rotate together. The power-driven rotation component is installed in the supporting assembly component and cooperates with the rotating communication component. The rotating communication component and the adsorption and positioning component are driven to rotate by the power-driven rotation component.

[0037] In Example 1, the support assembly component includes a support frame 100, which is formed by enclosing plates and is installed in the wafer processing equipment through connecting bolts to form an assembly space therein.

[0038] The adapter bearing assembly includes an adapter seat body 200, which is installed on the top of the support frame through connecting bolts. A bearing opening is opened inside the adapter seat body, which is arranged vertically and passes through the upper and lower ends of the adapter seat body.

[0039] The carrying support assembly includes a support core 310, a support plug 320 and a support bearing 330. The support core is installed in the bearing opening, and a vacuum cavity is opened inside the support core. The vacuum cavity runs through both ends of the support core. The support plug is located at the lower end of the vacuum cavity and is screwed to the support core through threads. A pair of support bearings are provided, and each support bearing is embedded in both ends of the support plug.

[0040] The rotating communication assembly includes a rotating core shaft 400, which is located in the support core body. It cooperates with the support bearing and passes through the support plug and both ends of the support core body. Its top end is exposed from the top of the adapter seat body, and its bottom end is exposed from the bottom of the adapter seat body. It can be rotated in the support core body through the support bearing. A radial through hole 410 and an axial through hole 420 are opened in the rotating core shaft. The radial through hole radially passes through both sides of the rotating core shaft and is connected with the bearing through hole. The axial through hole extends axially from the top of the rotating core shaft to the inside thereof and is connected with the radial through hole.

[0041] The adsorption positioning component includes an adsorption end plate 500, which is located above the adapter body and engaged with the top of the rotating core shaft. The adsorption end plate is driven to rotate by the rotating core shaft. An adsorption slot 510 is opened on the top of the adsorption end plate, and the adsorption slot is connected to the axial through hole, so that the adsorption end plate can adsorb and position the wafer.

[0042] The power drive assembly includes a drive motor 600, which is installed at the bottom of the support frame. Its power output shaft extends upward and is connected to the bottom end of the rotating core shaft through a coupling 610. The driving motor drives the rotating core shaft to rotate.

[0043] In Embodiment 2, the support assembly component includes a support frame 100, which is formed by enclosing plates and is installed in the wafer processing equipment by connecting bolts to form an assembly space therein.

[0044] In this embodiment, the support frame is a U-shaped structure with an opening located at the side, a support top plate is formed at the top of the support frame, and a support bottom plate is formed at the bottom.

[0045] The adapter bearing assembly includes an adapter seat body 200, which is installed on the top of the support frame through connecting bolts. A bearing opening is opened inside the adapter seat body, which is arranged vertically and passes through the upper and lower ends of the adapter seat body.

[0046] The carrying support assembly includes a support core 310, a support plug 320 and a support bearing 330. The support core is installed in the bearing opening, and a vacuum cavity is opened inside the support core. The vacuum cavity runs through both ends of the support core. The support plug is located at the lower end of the vacuum cavity and is screwed to the support core through threads. A pair of support bearings are provided, and each support bearing is embedded in both ends of the support plug.

[0047] In this embodiment, a sealing ring is provided between the outer wall of the carrier plug and the inner wall of the vacuum chamber to prevent air leakage at the lower end of the vacuum chamber.

[0048] The rotating communication assembly includes a rotating core shaft 400, which is located in the support core body. It cooperates with the support bearing and passes through the support plug and both ends of the support core body. Its top end is exposed from the top of the adapter seat body, and its bottom end is exposed from the bottom of the adapter seat body. It can be rotated in the support core body through the support bearing. A radial through hole 410 and an axial through hole 420 are opened in the rotating core shaft. The radial through hole radially passes through both sides of the rotating core shaft and is connected with the bearing through hole. The axial through hole extends axially from the top of the rotating core shaft to the inside thereof and is connected with the radial through hole.

[0049] In this embodiment, a sealing ring is provided between the rotating core shaft and the support plug to prevent air leakage from the vacuum chamber between the rotating core shaft and the support plug.

[0050] In this embodiment, a sealing ring is provided between the upper section of the rotating core shaft and the supporting core body to prevent air leakage at the upper end of the vacuum chamber.

[0051] In this embodiment, an auxiliary bearing 340 is further provided between the rotating core shaft and the supporting core body, and the auxiliary bearing is used to assist in supporting the rotation process of the rotating core shaft.

[0052] The adsorption positioning component includes an adsorption end plate 500, which is located above the adapter body and engaged with the top of the rotating core shaft. The adsorption end plate is driven to rotate by the rotating core shaft. An adsorption slot 510 is opened on the top of the adsorption end plate, and the adsorption slot is connected to the axial through hole, so that the adsorption end plate can adsorb and position the wafer.

[0053] In this embodiment, an external end tube 311 is installed on the side of the carrier core body, the external end tube is connected to the vacuum chamber, and extends outward after passing through the adapter body. The vacuum generating device is connected to the external end tube through a pipeline.

[0054] The power drive assembly includes a drive motor 600, which is installed at the bottom of the support frame. Its power output shaft extends upward and is connected to the bottom end of the rotating core shaft through a coupling 610. The driving motor drives the rotating core shaft to rotate.

[0055] In this embodiment, the driving motor is a stepping motor.

[0056] In the description of the present utility model, it should be noted that when terms such as "upper", "lower", "inner", "outer", "left", "right" and the like indicating orientation or positional relationship appear, it should be understood that the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use, or the orientation or positional relationship commonly understood by those skilled in the art, is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the equipment or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, when terms such as "first" and "second" appear, they are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of the present utility model, it should also be noted that, unless otherwise clearly specified and limited, terms such as "installation", "setting", and "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

Claims

1. A rotatable vacuum adsorption device, characterized in that: include: A support assembly component is installed in a wafer processing device and has an assembly space inside; A transfer bearing assembly, which is installed in the support assembly assembly and has a bearing space inside; A vacuum adapter assembly, which is installed in the adapter bearing assembly and is connected to the vacuum generating device through a pipeline; A transfer support assembly is installed in the vacuum matching assembly and has a transfer space inside; A rotating communication component is installed in the bearing and transfer support component and is connected to the vacuum matching component and can rotate in the bearing and transfer support component; The adsorption and positioning component is installed on the rotating communication component and is connected to the vacuum matching component through the rotating communication component. It can rotate with the rotating communication component. It is adapted to the shape of the wafer, can adsorb and position the wafer, and drive it to rotate together; The power-driven rotating component is installed in the supporting assembly component and cooperates with the rotating communication component. The power-driven rotating component drives the rotating communication component and the adsorption positioning component to rotate.

2. A rotatable vacuum adsorption device according to claim 1, characterized in that: The support assembly includes: The supporting frame is formed by enclosing plates and is installed in the wafer processing equipment through connecting bolts to form an assembly space inside the supporting frame.

3. A rotatable vacuum adsorption device according to claim 2, characterized in that: The transfer bearing assembly includes: The adapter seat body is installed on the top of the supporting frame through connecting bolts, and a load-bearing opening is opened inside the adapter seat body. The load-bearing opening is arranged vertically and passes through the upper and lower ends of the adapter seat body.

4. A rotatable vacuum adsorption device according to claim 3, characterized in that: The transfer components include: A support core body is installed in the support opening, and a vacuum cavity is provided inside the support core body, and the vacuum cavity runs through both ends of the support core body; A carrier plug, which is located at the lower end of the vacuum chamber and is screwed into the carrier core through threads; A pair of support bearings are provided, and each support bearing is respectively embedded at two ends of the support plug.

5. A rotatable vacuum adsorption device according to claim 4, characterized in that: The rotating communication assembly includes: A rotating core shaft is located in the supporting core body, cooperates with the supporting bearing, and passes through the supporting plug and both ends of the supporting core body, with its top end exposed from above the adapter body and its bottom end exposed from below the adapter body. It can be rotated in the supporting core body through the supporting bearing. A radial through hole and an axial through hole are provided in the rotating core shaft. The radial through hole radially passes through both sides of the rotating core shaft and is connected with the bearing through hole. The axial through hole extends axially from the top of the rotating core shaft to the inside thereof and is connected with the radial through hole.

6. A rotatable vacuum adsorption device according to claim 5, characterized in that: The adsorption positioning components include: The adsorption end plate is located above the adapter body and is engaged with the top of the rotating core shaft. The adsorption end plate is driven to rotate by the rotating core shaft. An adsorption groove is opened on the top of the adsorption end plate, and the adsorption groove is connected to the axial through hole, so that the adsorption end plate can adsorb and position the wafer.

7. The rotatable vacuum adsorption device according to claim 6, characterized in that: The power drive assembly includes: The driving motor is installed at the bottom of the supporting frame, and its power output shaft extends upward and is connected to the bottom end of the rotating core shaft through a coupling. The driving motor drives the rotating core shaft to rotate.

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