Adsorption clamping type wafer turnover device

Abstract

The adsorption clamping type wafer turnover device comprises a base, a finger unit, a turnover unit and a telescopic unit, the turnover unit comprises a rotating transmission mechanism, a main rotating shaft, a first bearing assembly and an air pipe fitting, the main rotating shaft is connected with a rotating shaft of a main shaft hole of the base through the first bearing assembly, the main rotating shaft is provided with an air channel, and the first bearing assembly is connected with the air pipe fitting. Two ports of the air passage are respectively arranged at the head part and the middle part of the main rotating shaft; the rotating transmission mechanism is in transmission connection with the main rotating shaft; the finger units are connected with the head of the main rotating shaft; air paths corresponding to suckers on the finger units are communicated with air path ports of the head of the main rotating shaft through air pipes; the telescopic unit comprises a telescopic transmission mechanism, a push rod and a second bearing assembly, the telescopic transmission mechanism is fixed to one side of the base, the second bearing assembly is fixed to the telescopic end of the telescopic transmission mechanism, the tail end of the push rod is connected with the bearing end of the second bearing assembly, and a rod body extends into an axis hole channel of the main rotating shaft and forms a wafer supporting point with the limiting end of the finger unit. Therefore, double modes of adsorption and clamping are supported.

Description

Technical Field

[0001] The utility model relates to a semiconductor wafer transmission technology, in particular to a wafer flipping device capable of being compatible with adsorption and clamping dual modes. Background Art

[0002] With the rapid development of the semiconductor industry, the domestic IC and other industries have doubled their demands for the functional diversity of semiconductor equipment. For example, the CMP, cleaning machines, wafer thinning and other process equipment used in this field need to be able to pick up and place wafers at various angles. However, the wafer gripping and flipping solutions of the existing handling robots are mainly divided into two types: one is an adsorption solution, which is mainly used for the handling of ultra-thin wafers, and the other is a clamping solution, which is mainly used for the handling of standard wafers.

[0003] Therefore, in some processes, if both standard wafers and ultra-thin wafers are to be compatible, it is usually necessary to set up equipment for the above two wafer holding and flipping solutions at the same time. However, the disadvantage that comes with it is that the two separate devices not only occupy a larger space, but also increase the production cost. Utility Model Content

[0004] To this end, the main purpose of the utility model is to provide an adsorption and clamping type wafer flipping device to support dual modes of adsorption and clamping, so as to be compatible with flipping of standard wafers and ultra-thin wafers.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the utility model, there is provided an adsorption clamping wafer flipping device, which includes: a base, a finger unit, a flipping unit, and a telescopic unit. The flipping unit includes: a rotating transmission mechanism, a main shaft assembly, and an air pipe. The main shaft assembly is connected to the main shaft hole of the base, and an air duct is provided on the main shaft assembly, and two ports of the air duct are respectively arranged at the head and the middle of the main shaft assembly. The rotating transmission mechanism is connected to the main shaft assembly in a transmission manner; the finger unit is connected to the head of the main shaft assembly, and a suction cup and a corresponding air path are provided on the finger unit. The air path is connected to the air duct port at the head of the main shaft assembly via an air pipe; the telescopic unit is fixed on one side of the base, and the push rod of the telescopic unit extends outward through the axial hole of the main shaft assembly to define the wafer support position with the limiting end of the finger unit.

[0006] Preferably, the telescopic unit includes: a telescopic transmission mechanism, a push rod, and a second bearing assembly. The telescopic transmission mechanism is fixed on one side of the base, the second bearing assembly is fixed on the telescopic end of the telescopic transmission mechanism, the rear end of the push rod is connected to the bearing end of the second bearing assembly, and the rod body extends into the axial channel of the main rotating shaft assembly.

[0007] Preferably, the second bearing assembly includes: a secondary bearing, a secondary bearing cover, a flange, and a grooved shaft. The secondary bearing is sleeved on the tail end of the push rod, the secondary bearing cover is sleeved on the secondary bearing, the flange cover is connected to one side of the secondary bearing cover and rests against the secondary bearing, a fork arm extends from one side of the flange, one side of the grooved shaft is connected to the telescopic end of the telescopic transmission mechanism, and the fork arm of the flange is clamped with the groove of the grooved shaft.

[0008] Preferably, the telescopic transmission mechanism comprises: a first bracket, a telescopic cylinder, the bottom of the first bracket is fixed on a base, the telescopic cylinder is connected to the first bracket, and one side of the groove shaft is connected to the telescopic end of the telescopic cylinder.

[0009] Preferably, the telescopic transmission mechanism further comprises: a linear guide rail and a second bracket, wherein the linear guide rail is arranged on the base, and its track is arranged toward the telescopic direction of the push rod, and one end of the second bracket is connected to the sliding end of the linear guide rail and the other end is connected to the flange.

[0010] Preferably, the adsorption clamping wafer flipping device also includes: a first sensor, a trigger member, wherein the trigger member is fixed on the second bracket, and a plurality of trigger arms arranged at intervals are provided on the trigger member, the first sensor is fixed on the base, and the first sensor is arranged on a moving path toward the trigger arm, and a plurality of sensing ends are arranged at intervals according to the telescopic gear position of the push rod, so that the trigger arm can be triggered as the push rod is telescopically displaced.

[0011] Preferably, the main rotating shaft assembly comprises: a main bearing, a main bearing cover, and a first rotating shaft, wherein the first rotating shaft is provided with an axial center hole at the axis center, an air guide channel is provided in the axis wall, and a drop section is provided in the middle of the axis body, the first rotating shaft is provided with a pair of spaced hoops at both ends of the drop section of the first rotating shaft, the main bearing cover is sleeved with the first rotating shaft, and is suspended on the drop section of the first rotating shaft to define an air guide space between the drop section of the first rotating shaft and the main bearing cover, the main bearing cover is connected to the main shaft hole of the base, and the head of the first rotating shaft is extended out of the main shaft hole, wherein the front port of the air guide channel is provided at the head of the first rotating shaft, and the rear port is provided at the drop section of the first rotating shaft, the main bearing cover is provided with an air hole, and the air hole is connected with the rear port through the air guide space to form an air channel with the air guide channel.

[0012] Preferably, the rotary transmission mechanism comprises: a driving motor and a gear meshing mechanism, wherein the driving motor is fixed on a base, the driving gear of the gear meshing mechanism is connected to the driving end of the driving motor, and the transmission gear is connected to the tail end of the first rotating shaft.

[0013] Preferably, the rotary transmission mechanism comprises: a driving motor and a pulley mechanism, wherein the driving motor is fixed on a base, a driving wheel of the pulley mechanism is connected to a driving end of the driving motor, and a transmission wheel of the pulley mechanism is connected to the tail end of the first rotating shaft.

[0014] Preferably, the suction cup is arranged on the back side of the finger unit.

[0015] The adsorption and clamping wafer flipping device provided by the utility model cleverly designs the flipping unit, and sets structures such as air channels and axial channels on its main shaft assembly, thereby providing a suction source for the suction cup of the finger unit, and can be connected with the rotation transmission mechanism to support the rotation transmission of the finger unit, and can also be connected with the telescopic unit to provide a telescopic space for its push rod to form a clamping structure with the limit end of the finger unit, so that the entire device structure can be compatible with holding the wafer in two modes of adsorption or clamping, so as to be compatible with flipping standard wafers or ultra-thin wafers. Compared with traditional discrete wafer rotation devices with different modes, this not only solves the problem of a large footprint of a single configuration flipping mechanism, but also improves the efficiency of wafer transmission to a certain extent. Compared with traditional single flipping mechanisms, it has lower costs and is simple to implement. Compared with single clamping flipping forms or single adsorption flipping forms, it has stronger compatibility and is particularly suitable for occasions that need to support multiple wafer specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0017] Figure 1 to Figure 2 It is a schematic diagram of the overall structure of the adsorption clamping type wafer flipping device of the utility model;

[0018] Figure 3 It is a perspective structural diagram of the finger unit of the adsorption clamping type wafer flipping device of the utility model;

[0019] Figure 4 It is a schematic diagram of the structure of the flip unit and the telescopic unit of the adsorption clamping type wafer flip device of the present utility model;

[0020] Figure 5 It is a schematic diagram of a half-section structure of the adsorption clamping type wafer flipping device of the utility model;

[0021] Figure 6 This is a schematic diagram of the base structure of the adsorption clamping type wafer flipping device of the utility model;

[0022] Figure 7 It is a schematic diagram of the structure of the main shaft assembly of the adsorption clamping type wafer flipping device of the utility model;

[0023] Figure 8 It is a schematic diagram of the assembly structure of the main shaft assembly of the adsorption clamping wafer flipping device of the utility model;

[0024] Fig. 9 It is a schematic diagram of the telescopic unit structure of the adsorption clamping type wafer flipping device of the utility model;

[0025] Fig.10 It is a schematic diagram of the assembly structure of the telescopic unit of the adsorption clamping type wafer flipping device of the utility model;

[0026] Fig.11 It is a schematic diagram of various triggering states of the first sensor and the triggering member of the adsorption clamping wafer flipping device of the present utility model;

[0027] Fig.12 It is a schematic structural diagram of the linkage relationship between the main shaft assembly, the rotating transmission mechanism and the telescopic transmission mechanism of the adsorption clamping type wafer flipping device of the utility model;

[0028] Fig.13 It is a schematic structural diagram of the adsorption-clamping wafer flipping device of the utility model when clamping a wafer.

[0029] Description of Reference Numerals

[0030] Base 1, finger unit 2, flip unit 3, telescopic unit 4, first sensor 5, trigger 6, wafer 99, spindle hole 11, suction cup 21, limit end 22, air path 23, rotation transmission mechanism 31, main shaft assembly 32, axial hole 34, air channel 35, telescopic transmission mechanism 41, push rod 42, second bearing assembly 43, drive motor 311, pulley mechanism 312, main bearing 321, main bearing cover 322, first shaft 323, air guide channel 324, drop section 325, air guide space 326, sealing ring 327, first bracket 411, telescopic cylinder 412, linear guide rail 413, second bracket 414, secondary bearing 431, secondary bearing cover 432, flange 433, groove shaft 434, fork arm 435. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. The terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0035] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0036] In the description of the present utility model, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "layout", "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances and in combination with the prior art. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other without conflict. And one or more of the components in the diagram may be necessary or non-essential, and the relative position relationship between the components in the above diagram can be adjusted according to actual needs.

[0037] In order to achieve dual modes of adsorption and clamping, it is compatible with flipping of standard wafers and ultra-thin wafers. Figures 1 to 13 As shown, the utility model provides an adsorption clamping wafer flipping device, which includes: a base 1, a finger unit 2, a flipping unit 3, and a telescopic unit 4, wherein the flipping unit 3 includes: a rotating transmission mechanism 31, a main shaft assembly 32, and an air pipe component.

[0038] The base 1 is provided with a spindle hole 11, the main shaft assembly 32 is connected to the spindle hole 11 of the base 1, so that the head of the main shaft assembly 32 extends out of the spindle hole 11, the main shaft assembly 32 is provided with an axial hole 34 and an airway 35, and the two ends of the airway 35 are respectively arranged at the head and the middle of the main shaft assembly 32, and the rotation transmission mechanism 31 is connected to the main shaft assembly 32 in a transmission manner; the finger unit 2 is connected to the head of the main shaft assembly 32, wherein the finger unit A suction cup 21 is provided on the back of the element 2, and a pair of limit ends 22 are provided at the end of the front end. An air path 23 corresponding to the suction cup 21 is provided in the body of the finger unit 2, and the air path 23 is connected to the air channel 35 port at the head of the main shaft assembly 32 through an air pipe fitting; the telescopic unit 4 is fixed on one side of the base 1, and the push rod 42 of the telescopic unit 4 extends outward through the axial hole 34 of the main shaft assembly 32 to define at least three wafer support positions with the limit ends 22 of the finger unit 2.

[0039] Specifically, if Figures 4 to 8 As shown, in this example, the main shaft assembly 32 includes: a main bearing 321, a main bearing cover 322, and a first shaft 323, wherein the first shaft 323 is provided with an axial center channel 34 at the axis center, an air guide channel 324 is provided in the shaft wall, and a drop section 325 is provided in the middle of the shaft body, the first shaft 323 is sleeved in pairs at intervals at both ends of the drop section 325 of the first shaft 323, the main bearing cover 322 is sleeved on the first shaft 323, and is suspended on the drop section 325 of the first shaft 323 to define an air guide space 326 between the drop section 325 of the first shaft 323 and the main bearing cover 322.

[0040] In addition, the main bearing cover 322 is also connected to the main shaft hole 11 of the base 1 so that the head of the first rotating shaft 323 extends out of the main shaft hole 11, wherein the front port of the air guide channel 324 is arranged at the head of the first rotating shaft 323, and the rear port is arranged at the drop section 325 of the first rotating shaft 323, and the main bearing cover 322 is provided with an air hole, which is connected to the air guide space 326, and is connected to the rear port of the air guide channel 324 through the air guide space 326 to form an air channel 35 with the air guide channel 324.

[0041] Through this arrangement, the main shaft assembly 32 can not only provide rotational structural support for the connected finger unit 2, but also the design structure of the air channel 35 allows the suction source to overcome the obstruction of the base 1 and the first shaft 323, and connect with the air path 23 of the finger unit 2 along the first shaft 323 to provide support for the suction cup 21 of the finger unit 2 to adsorb the wafer.

[0042] Further, such as Figure 5 and Figure 8As shown, in a preferred embodiment, a sealing ring 327 may be provided at the drop section 325 of the first rotating shaft 323 near the first rotating shaft 323 to enhance the sealing performance of the air guiding space 326 on the shaft section.

[0043] Further, such as Figure 4 As shown, in this example, the rotating transmission mechanism 31 includes: a driving motor 311 and a pulley mechanism 312. The driving motor 311 is fixed on the base 1. The driving wheel of the pulley mechanism 312 is connected to the driving end of the driving motor 311. The transmission wheel of the pulley mechanism 312 is connected to the tail end of the first rotating shaft 323, thereby providing rotational power to the first rotating shaft 323 through the pulley transmission.

[0044] In other optional replacement embodiments, the rotation transmission mechanism 31 includes: a driving motor 311 and a gear meshing mechanism, wherein the driving motor 311 is fixed on the base 1, and the driving gear of the gear meshing mechanism is connected to the driving end of the driving motor 311, and the transmission gear is connected to the tail end of the first rotating shaft 323. Thus, the first rotating shaft 323 is provided with rotational power through gear meshing transmission.

[0045] Further, such as Figure 5 , Figures 9 and 10 , Figure 12 to Figure 13 As shown, in this example, the telescopic unit 4 includes: a telescopic transmission mechanism 41, a push rod 42, and a second bearing assembly 43, wherein the telescopic transmission mechanism 41 is fixed on one side of the base 1, the second bearing assembly 43 is fixed on the telescopic end of the telescopic transmission mechanism 41, the rear end of the push rod 42 is connected to the bearing end of the second bearing assembly 43, and the rod body extends into the axial channel 34 of the main rotating shaft assembly 32.

[0046] Specifically, Figures 9 and 10 As shown, the second bearing assembly 43 includes: a secondary bearing 431, a secondary bearing cover 432, a flange 433, and a groove shaft 434. The secondary bearing 431 is sleeved on the rear end of the push rod 42, and the secondary bearing cover 432 is sleeved on the secondary bearing 431. The flange 433 is covered on one side of the secondary bearing cover 432 and abuts against the secondary bearing 431, so as to maintain the secondary bearing 431 at the rear end of the push rod 42 together with the secondary bearing cover 432. A fork arm 435 extends from one side of the flange 433, and one side of the groove shaft 434 is connected to the telescopic end of the telescopic transmission mechanism 41. The fork arm 435 of the flange 433 is clamped with the groove of the groove shaft 434, so that the cooperation between the groove shaft 434 and the fork arm 435 plays a role of fine adjustment to prevent the telescopic end of the telescopic transmission mechanism 41 from being jammed by over-positioning.

[0047] Further, such as Figure 12 to Figure 13As shown, the telescopic transmission mechanism 41 includes: a first bracket 411, a telescopic cylinder 412, the bottom of the first bracket 411 is fixed on the base 1, the telescopic cylinder 412 is connected to the first bracket 411, and one side of the groove shaft 434 is connected to the telescopic end of the telescopic cylinder 412, thereby pushing the flange 433 through the telescopic cylinder 412, thereby driving the push rod 42 to pass through the axial channel 34 of the main rotating shaft assembly 32 and telescope outward, so as to hold the wafer in a three-point clamping manner with the limit end 22 of the finger unit 2.

[0048] Further, such as Fig. 9 , Fig.12 As shown, in order to stabilize the transmission structure of the telescopic transmission mechanism 41 and the second bearing assembly 43, in an optional embodiment, the telescopic transmission mechanism 41 also includes: a linear guide 413 and a second bracket 414, wherein the linear guide 413 is arranged on the base 1, and its track is arranged toward the telescopic direction of the push rod 42, and one end of the second bracket 414 is connected to the sliding end of the linear guide 413, and the other end is connected to the flange 433, so that the flange 433 can be guided by the linear guide 413 and stably displaced in the telescopic direction of the telescopic cylinder 412.

[0049] In addition, if Fig. 9 , Fig.11 As shown, in order to be able to sense the telescopic position of the push rod 42 to know whether the wafer is clamped on the finger unit 2, in an optional example, the adsorption clamping wafer flipping device also includes: a first sensor 5 and a trigger member 6, wherein the trigger member 6 is fixed on the second bracket 414, and a pair of trigger arms arranged at intervals are provided on the trigger member 6, the first sensor 5 is fixed on the base 1, and the first sensor 5 is arranged on the moving path of the trigger arm according to the telescopic gear position of the push rod 42, so that the trigger arm can be triggered by the telescopic displacement of the push rod 42.

[0050] Among them, Fig.11 As shown, Fig.11 The A1 state is that the entire telescopic unit 4 is in a loose clamping state, and the telescopic cylinder 412 is just in a retracted state. At this time, only the lower trigger member 6 extends into the sensing end of the lower side of the first sensor 5; Fig.11 The A2 state is that the entire telescopic unit 4 is in a clamping state, at which time the telescopic cylinder 412 drives the push rod 42 to extend and clamp the wafer, so that only the lower trigger member 6 extends into the sensing end in the middle of the first sensor 5; Fig.11 The A3 state is that the entire telescopic unit 4 is in an over-clamping state, the push rod 42 is in a fully extended state, and at this time only the upper trigger member 6 extends into the sensing end in the middle of the first sensor 5. Thus, through the above solution, when the first sensor 5 is connected to the master controller, the current state of the push rod 42 can be sensed, thereby logically inferring whether there is a wafer on the finger unit 2.

[0051] Thus, in the adsorption and clamping wafer flipping device exemplified in the above scheme, when working, the front side of the finger unit 2 can clamp the standard wafer through the telescopic unit 4, and the back side can adsorb the ultra-thin wafer through the suction cup 21, so as to be compatible with flipping the standard wafer or the ultra-thin wafer.

[0052] In summary, the adsorption and clamping wafer flipping device provided by the utility model cleverly designs the flipping unit 3, and sets the air channel 35 and axial channel and other structures on its main shaft assembly 32, thereby providing a suction source for the suction cup 21 of the finger unit 2, and can be matched with the rotation transmission mechanism 31 to support the rotation transmission of the finger unit 2, and can be matched with the telescopic unit 4 to provide a telescopic space for its push rod 42 to form a clamping structure with the limit end 22 of the finger unit 2, so that the entire device structure can be compatible with holding the wafer in two modes of adsorption or clamping, so as to be compatible with flipping standard wafers or ultra-thin wafers. Compared with the traditional discrete wafer rotation device with different modes, this not only solves the problem of large floor space occupied by the flipping mechanism configured separately, but also improves the efficiency of wafer transmission to a certain extent. Compared with the traditional single flipping mechanism, it has lower cost and simpler implementation. Compared with the single clamping flipping form or the single adsorption flipping form, it has stronger compatibility and is particularly suitable for occasions that need to support multiple wafer specifications.

[0053] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the contents of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can understand and use the utility model well. The utility model is only limited by the claims and their full scope and equivalents. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the scope of protection of the utility model.

[0054] In addition, various implementations of the embodiments of the present utility model can also be arbitrarily combined, as long as they do not violate the concept of the embodiments of the present utility model, they should also be regarded as the contents disclosed in the embodiments of the present utility model.

Claims

1. An adsorption clamping wafer flipping device, characterized in that include: A base, a finger unit, a flip unit, and a telescopic unit, wherein the flip unit includes: a rotating transmission mechanism, a main shaft assembly, and an air pipe fitting. The main shaft assembly is connected to the main shaft hole of the base, an air passage is provided on the main shaft assembly, and two ports of the air passage are respectively provided at the head and the middle of the main shaft assembly, and the rotating transmission mechanism is in transmission connection with the main shaft assembly; the finger unit is connected to the head of the main shaft assembly, a suction cup and a corresponding air passage are provided on the finger unit, and the air passage is connected to the air passage port at the head of the main shaft assembly via an air pipe fitting; the telescopic unit is fixed on one side of the base, and a push rod of the telescopic unit extends outward through the axial hole of the main shaft assembly to define a wafer support position with the limiting end of the finger unit.

2. The adsorption clamping type wafer flipping device according to claim 1, characterized in that: The telescopic unit includes: a telescopic transmission mechanism, a push rod, and a second bearing assembly. The telescopic transmission mechanism is fixed on one side of the base, the second bearing assembly is fixed on the telescopic end of the telescopic transmission mechanism, the rear end of the push rod is connected to the bearing end of the second bearing assembly, and the rod body extends into the axial channel of the main shaft assembly.

3. The adsorption clamping type wafer flipping device according to claim 2, characterized in that: The second bearing assembly includes: a secondary bearing, a secondary bearing cover, a flange, and a grooved shaft. The secondary bearing is sleeved on the rear end of the push rod, the secondary bearing cover is sleeved on the secondary bearing, the flange cover is connected to one side of the secondary bearing cover and rests against the secondary bearing, a fork arm extends from one side of the flange, one side of the grooved shaft is connected to the telescopic end of the telescopic transmission mechanism, and the fork arm of the flange is clamped with the groove of the grooved shaft.

4. The adsorption clamping type wafer flipping device according to claim 3, characterized in that: The telescopic transmission mechanism comprises: a first bracket and a telescopic cylinder. The bottom of the first bracket is fixed on a base. The telescopic cylinder is connected to the first bracket. One side of the groove shaft is connected to the telescopic end of the telescopic cylinder.

5. The adsorption clamping type wafer flipping device according to claim 4, characterized in that: The telescopic transmission mechanism also includes: a linear guide rail and a second bracket, wherein the linear guide rail is arranged on a base, and its track is arranged toward the telescopic direction of the push rod, and one end of the second bracket is connected to the sliding end of the linear guide rail and the other end is connected to the flange.

6. The adsorption clamping type wafer flipping device according to claim 5, characterized in that: Also includes: A first sensor and a trigger member, wherein the trigger member is fixed on the second bracket and is provided with a plurality of trigger arms arranged at intervals. The first sensor is fixed on the base, and a plurality of sensing ends are arranged at intervals according to the telescopic gear position of the push rod on the moving path of the first sensor toward the trigger arm, so that the trigger arm can be triggered as the push rod is telescopically displaced.

7. The adsorption clamping type wafer flipping device according to claim 1, characterized in that: The main rotating shaft assembly comprises: a main bearing, a main bearing cover, and a first rotating shaft, wherein the first rotating shaft is provided with an axial center hole at the axial center, an air guide channel is provided in the shaft wall, and a drop section is provided in the middle of the shaft body, the first rotating shaft is provided with a pair of spaced hoops at both ends of the drop section of the first rotating shaft, the main bearing cover is sleeved with the first rotating shaft, and is suspended on the drop section of the first rotating shaft to define an air guide space between the drop section of the first rotating shaft and the main bearing cover, the main bearing cover is connected to the main shaft hole of the base, and the head of the first rotating shaft is extended out of the main shaft hole, wherein the front port of the air guide channel is provided at the head of the first rotating shaft, and the rear port is provided at the drop section of the first rotating shaft, the main bearing cover is provided with an air hole, and the air hole is connected with the rear port through the air guide space to form an air channel with the air guide channel.

8. The adsorption clamping type wafer flipping device according to claim 7, characterized in that: The rotary transmission mechanism comprises: a driving motor and a gear meshing mechanism. The driving motor is fixed on a base. The driving gear of the gear meshing mechanism is connected to the driving end of the driving motor, and the transmission gear is connected to the tail end of the first rotating shaft.

9. The adsorption clamping type wafer flipping device according to claim 7, characterized in that: The rotary transmission mechanism comprises: a driving motor and a pulley mechanism. The driving motor is fixed on a base. The driving wheel of the pulley mechanism is connected to the driving end of the driving motor. The transmission wheel of the pulley mechanism is connected to the tail end of the first rotating shaft.

10. The adsorption clamping type wafer flipping device according to claim 1, characterized in that: The suction cup is arranged on the back side of the finger unit.

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