Fixing tool for silicon wafer
By designing a fixed tool for silicon wafers, the detachable first limiting member and lifting rod is used to solve the problem of damage to the In column when tweezers clamp the silicon wafer, the pass rate of the readout circuit is improved and operation is simplified.
Patent Information
- Application Number
- CN202421350824.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-14
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-06-14
AI Technical Summary
The existing peeling operation is carried out by clamping the silicon wafer by tweezers, which can easily cause damage to the In column and affect the readout circuit pass rate.
A fixed tool for silicon wafers is designed, including a base, a plurality of first limiting parts and a pull rod. The first limiting member is detachably connected to the base, arranged at the load bearing surface at intervals, can abut with the edges of the silicon wafer, and can limit the silicon wafer to fix it. The lifting rod is convenient for the operator to perform peeling operation.
Through the use of fixed tooling, the silicon wafer can be fixed stably, avoid damage to the In column, improve the pass rate of the readout circuit, and simplify the peeling operation process.
Smart Images
Figure CN222801784U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of semiconductor auxiliary tools, and specifically relates to a fixing tool for silicon wafers. Background Art
[0002] The function of the readout circuit chip is to realize signal conversion and output. The preparation of the readout circuit chip mainly uses large-size silicon wafers, and the preparation process requires the application of photoresist, and then the formation of In columns. After the In columns are formed, the photoresist and indium film need to be removed, that is, the stripping operation is performed. At present, the stripping operation is usually performed by clamping the silicon wafer with tweezers. Due to the large size of the silicon wafer, in order to ensure the clamping stability, more positions of the silicon wafer need to be clamped, which is easy to damage the In column and affect the qualified rate of the readout circuit. Utility Model Content
[0003] The technical problem to be solved by the present application is that the existing stripping operation is performed by clamping the silicon wafer with tweezers, which easily damages the In column. A fixing tool for the silicon wafer is provided, which can fix the silicon wafer for the stripping operation and avoid damaging the In column.
[0004] The technical solution proposed in this application is:
[0005] A fixing tool for silicon wafers, comprising:
[0006] A base having a bearing surface for bearing the silicon wafer;
[0007] A plurality of first limiting members are detachably connected to the base and arranged at intervals on the carrying surface, and the plurality of first limiting members can abut against the edge of the silicon wafer on the carrying surface to limit and fix the silicon wafer on the carrying surface;
[0008] A lifting rod has one end connected to a side of the base having the bearing surface, and the other end extending in a direction away from the base.
[0009] Further, the first limiting member includes a first connecting portion and a first limiting portion, the first connecting portion is detachably connected to the base, the first limiting portion is connected to the first connecting portion and protrudes from the carrying surface, the orthographic projection of the first limiting portion on the carrying surface partially overlaps with the orthographic projection of the silicon wafer on the carrying surface, and the height of the first limiting portion protruding from the carrying surface is greater than the thickness of the silicon wafer.
[0010] Furthermore, the first limiting portion has a first end and a second end opposite to each other along its length direction, the first end is connected to the first connecting portion, and a width dimension of the first limiting portion gradually increases from the first end to the second end.
[0011] Furthermore, the bearing surface is provided with a plurality of threaded holes, and each of the first limiting members is threadedly connected to a corresponding one of the threaded holes.
[0012] Furthermore, the fixing tool also includes a plurality of second limiting members, which are connected to the base, and the plurality of second limiting members are arranged at intervals to enclose on the supporting surface to form a fixed position for accommodating the silicon wafer, and to form an entrance and exit for the silicon wafer located at the fixed position to enter and exit, and the plurality of first limiting members are arranged corresponding to the entrance and exit to limit the silicon wafer to the fixed position.
[0013] Furthermore, the second limiting member includes a second connecting portion and a second limiting portion, the second connecting portion is connected to the base, the second limiting member is connected to the second connecting portion and protrudes from the carrying surface, the orthographic projection of the second limiting portion on the carrying surface partially overlaps with the orthographic projection of the silicon wafer on the carrying surface, and the height of the second limiting portion protruding from the carrying surface is greater than the thickness of the silicon wafer.
[0014] Furthermore, the second limiting portion has a third end and a fourth end opposite to each other along its length direction, the third end is connected to the second connecting portion, and the width of the second limiting portion gradually increases from the third end to the fourth end.
[0015] Furthermore, the base is penetrated by a step hole, the step hole penetrates the bearing surface, the second limiting portion passes through the step hole and protrudes from the bearing surface, and the second connecting portion is clamped in the step hole.
[0016] Furthermore, the fixing tool also includes a connecting block, the connecting block is fixedly connected to the base, and the lifting rod is detachably connected to the connecting block.
[0017] Furthermore, a through hole is formed through the base, and the through hole passes through the bearing surface. A plurality of the first limiting members are arranged around the through hole to fix the silicon wafer at the through hole.
[0018] By using the above-mentioned fixing fixture, the silicon wafer is placed on the carrying surface, and the multiple first limit members abut against the edge of the silicon wafer, so as to limit and fix the silicon wafer on the carrying surface. Since the multiple first limit members only need to abut against the edge of the silicon wafer, they will not damage the In column, thereby improving the qualified rate of the readout circuit. In addition, the operator can peel the silicon wafer on the carrying surface by holding the lifting rod, which is more convenient. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The accompanying drawings are used to provide further understanding of the present application and constitute a part of the specification. They are used to explain the present application together with the embodiments of the present application and do not constitute a limitation of the present application.
[0020] Figure 1 A schematic diagram of a partially exploded structure of a fixing tool for a silicon wafer provided in one embodiment of the present application;
[0021] Figure 2 for Figure 1 A schematic diagram of the top view of the fixed tooling shown;
[0022] Figure 3 A schematic diagram of a partial exploded structure of a fixing tool provided in another embodiment of the present application.
[0023] Description of labels:
[0024] 100. Fixing tool; 110. Base; 111. Bearing surface; 112. Through hole; 113. Threaded hole; 114. Step hole; 120. Lifting rod; 130. First limiting member; 131. First connecting portion; 132. First limiting portion; 140. Connecting block; 150. Second limiting member; 151. Second connecting portion; 152. Second limiting portion; 160. Fixed position. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0027] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a fixing tool 100 for a silicon wafer, including a base 110 and a plurality of first limiting members 130 .
[0028] The base 110 has a carrying surface 111 for carrying a silicon wafer. The first limiting member 130 is detachably connected to the base 110, and multiple first limiting members 130 are arranged at intervals on the carrying surface 111. The multiple first limiting members 130 can abut against the edge of the silicon wafer on the carrying surface 111 to limit and fix the silicon wafer on the carrying surface 111.
[0029] Furthermore, the fixing tool 100 also includes a lifting rod 120, one end of which is connected to a side of the base 110 having a bearing surface 111, and the other end of the lifting rod 120 extends in a direction away from the base 110 to facilitate the operator to carry the fixing tool 100 for operation.
[0030] By using the above-mentioned fixing fixture 100, the silicon wafer is placed on the carrying surface 111, and the multiple first stoppers 130 abut against the edge of the silicon wafer, so as to limit and fix the silicon wafer on the carrying surface 111. Since the multiple first stoppers 130 only need to abut against the edge of the silicon wafer, they will not damage the In column, thereby improving the qualified rate of the readout circuit. In addition, the operator can peel the silicon wafer on the carrying surface 111 by holding the lifting rod 120, which is more convenient.
[0031] In one embodiment, the base 110 is provided with a through hole 112, the through hole 112 passes through the bearing surface 111, and a plurality of first stoppers 130 are arranged around the through hole 112 to fix the silicon wafer at the through hole 112. In this way, the through hole 112 can expose the other side surface of the silicon wafer, thereby facilitating processing of the two opposite sides of the silicon wafer.
[0032] In one embodiment, the fixing tool 100 also includes a connecting block 140, which is fixedly connected to the base 110, and the lifting rod 120 is detachably connected to the connecting block 140, so that the lifting rod 120 and the connecting block 140 can be detached when storage or transportation is required, thereby facilitating the storage and transportation of the fixing tool 100.
[0033] At the same time, it can be understood that the lifting rod 120 is connected to the surface of the connection block 140 on the same side as the bearing surface 111, that is, when the bearing surface 111 is the top surface of the base 110, the lifting rod 120 is also connected to the top surface of the connection block 140. Specifically, the lifting rod 120 is threadedly connected to the connection block 140.
[0034] In one embodiment, the first limiting member 130 includes a first connecting portion 131 and a first limiting portion 132, the first connecting portion 131 is detachably connected to the base 110, the first limiting portion 132 is connected to the first connecting portion 131, and the first limiting portion 132 protrudes from the supporting surface 111, the orthographic projection of the first limiting portion 132 on the supporting surface 111 partially overlaps with the orthographic projection of the silicon wafer on the supporting surface 111, and the height of the first limiting portion 132 protruding from the supporting surface 111 is greater than the thickness of the silicon wafer.
[0035] Taking the carrying surface 111 as a horizontal surface, for example, a plurality of first stoppers 130 can be arranged around the silicon wafer to limit the silicon wafer in the horizontal direction, and the first stopper 132 of each first stopper 130 extends above the silicon wafer to limit the silicon wafer in the vertical direction. In this way, the plurality of first stoppers 130 can limit and fix the silicon wafer on the carrying surface 111.
[0036] Furthermore, the first limiting portion 132 has a first end and a second end opposite to each other along its length direction, the first end is connected to the first connecting portion 131, and the width of the first limiting portion 132 gradually increases from the first end to the second end. In this way, the first limiting portion 132 can form a limiting space with the bearing surface 111, and the edge of the silicon wafer can extend into the limiting space, thereby achieving the limiting of the silicon wafer.
[0037] In one embodiment, the first stopper 130 is threadedly connected to the base 110. In practical applications, the bearing surface 111 is provided with a plurality of threaded holes 113, which are arranged at intervals around the through hole 112, and the first connection portion 131 of each first stopper 130 is threadedly connected to a corresponding threaded hole 113.
[0038] In one embodiment, the fixing tool 100 also includes a plurality of second limiting members 150, which are connected to the base 110, and the plurality of second limiting members 150 are arranged at intervals to enclose a fixed position 160 for accommodating a silicon wafer on the carrying surface 111, and to form an entrance and exit for the silicon wafer located at the fixed position 160 to enter and exit, that is, the silicon wafer is placed at the fixed position 160 through the entrance and exit, or the silicon wafer at the fixed position 160 is taken out through the entrance and exit.
[0039] Please participate Figure 2 It can be understood that when the silicon wafer is circular, the edge of the fixing position 160 formed by the second limiting member 150 is arc-shaped. At the same time, in order to ensure that the silicon wafer can pass through the entrance and exit, the arc formed by the edge of the fixing position 160 is a semicircle or a minor arc.
[0040] Furthermore, the plurality of first limiting members 130 are arranged corresponding to the inlet and outlet to limit the silicon wafer at the fixed position 160 , that is, the plurality of second limiting members 150 cooperate with the plurality of first limiting members 130 to fix the silicon wafer on the carrying surface 111 .
[0041] It can be understood that the second limiting member 150 is first connected to the base 110 to form a fixed position 160 and an entrance and exit on the carrying surface 111, and then the silicon wafer is placed in the fixed position 160 through the entrance and exit, and then the first limiting member 130 is connected to the base 110 to limit the silicon wafer in the fixed position 160.
[0042] It should be noted that, in this embodiment, the silicon wafer is fixed by the cooperation of the second limiter 150 and the first limiter 130. The second limiter 150 can be pre-set, and the silicon wafer can be fixed and released only by loading and unloading the first limiter 130. Therefore, compared with the use of the first limiter 130 to fix the silicon wafer, the use of the second limiter 150 and the first limiter 130 can reduce the number of first limiters 130 used, reduce the workload during loading and unloading, and improve the efficiency of fixing and releasing operations. Figure 1 For example, the number of the second limit members 150 is 4, and the number of the first limit members 130 is 2. When fixing or releasing, only two first limit members 130 need to be turned; if six first limit members 130 are used, six first limit members 130 need to be turned, which is inefficient.
[0043] In one embodiment, the second stopper 150 includes a second connection portion 151 and a second stopper 152, the second connection portion 151 is connected to the base 110, the second stopper 152 is connected to the second connection portion 151, and the second stopper 152 protrudes from the bearing surface 111, the orthographic projection of the second stopper 152 on the bearing surface 111 partially overlaps with the orthographic projection of the silicon wafer on the bearing surface 111, and the height of the second stopper 152 protruding from the bearing surface 111 is greater than the thickness of the silicon wafer. The function of the second stopper 152 is the same as that of the first stopper 132, and will not be repeated here.
[0044] Furthermore, the second limiting portion 152 has a third end and a fourth end opposite to each other along its length direction, the third end is connected to the second connecting portion 151, and the width of the second limiting portion 152 gradually increases from the third end to the fourth end. Similarly, the second limiting portion 152 can also be enclosed with the bearing surface 111 to form the above-mentioned limiting space, and the edge of the silicon wafer extends into the limiting space where the first limiting portion 132 and the second limiting portion 152 are located, so as to be fixed under the action of the first limiting portion 132 and the second limiting portion 152.
[0045] Please also see Figure 3 In one embodiment, the base 110 is further provided with a step hole 114, the step hole 114 passes through the bearing surface 111, the second limiting portion 152 passes through the step hole 114 and protrudes from the bearing surface 111, and the second connecting portion 151 is clamped in the step hole 114, thereby realizing the connection between the second limiting member 150 and the base 110.
[0046] Taking the top of the step hole 114 passing through the bearing surface 111 as an example, the second stopper 150 is inserted from the bottom of the step hole 114, so that the second stopper 152 extends from the top of the step hole 114 and protrudes from the bearing surface 111, and the second connecting portion 151 is provided with a step structure matching the step hole 114, and the step structure cooperates with the step hole 114 to clamp. In this way, the loading and unloading of the second stopper 150 can be further facilitated. Of course, in other embodiments, the second stopper 150 can also be fixed to the base 110, which is not limited here.
[0047] In order to facilitate understanding of the technical solution of the present application, the specific operation method of the fixing tool 100 is described here:
[0048] First, connect the lifting rod 120 and the second limiting member 150 to the base 110, then place the silicon wafer in the fixed position 160 formed by the second limiting member 150 through the entrance and exit, and then connect the first limiting member 130 to the base 110 to limit and fix the silicon wafer in the fixed position 160.
[0049] Add degumming liquid to the glass container, and then heat the degumming liquid to 80°C on the heating table. Next, place the fixed tool 100 in the glass container to ensure that the silicon wafer is immersed in the degumming liquid for 3 hours. After the immersion is completed, the degumming liquid is sprayed to the edge of the silicon wafer through a syringe. The indium on the surface of the silicon wafer will bulge completely. The indium metal layer is clamped and peeled off with tweezers, and then the degumming liquid is continued to be sprayed through the syringe to wash away the residual indium. Next, the operator holds the lifting rod 120 and then sprays acetone to clean the degumming liquid on the surface of the silicon wafer. The spray gun can be used to spray at a pressure of 0.1~0.2MPa. After spraying and cleaning for 5 minutes, the silicon wafer is placed in an oven for drying.
[0050] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A fixing tool for silicon wafers, characterized in that: include: A base having a bearing surface for bearing the silicon wafer; A plurality of first limiting members are detachably connected to the base and arranged at intervals on the carrying surface, and the plurality of first limiting members can abut against the edge of the silicon wafer on the carrying surface to limit and fix the silicon wafer on the carrying surface; A lifting rod has one end connected to a side of the base having the bearing surface, and the other end extending in a direction away from the base.
2. The fixing tool for silicon wafer according to claim 1, characterized in that: The first limiting member includes a first connecting portion and a first limiting portion, the first connecting portion is detachably connected to the base, the first limiting portion is connected to the first connecting portion and protrudes from the carrying surface, the orthographic projection of the first limiting portion on the carrying surface partially overlaps with the orthographic projection of the silicon wafer on the carrying surface, and the height of the first limiting portion protruding from the carrying surface is greater than the thickness of the silicon wafer.
3. The fixing tool for silicon wafer according to claim 2, characterized in that: The first limiting portion has a first end and a second end opposite to each other along its length direction, the first end is connected to the first connecting portion, and a width dimension of the first limiting portion gradually increases from the first end to the second end.
4. The fixing tool for silicon wafer according to claim 1, characterized in that: The bearing surface is provided with a plurality of threaded holes, and each of the first limiting members is threadedly connected to a corresponding one of the threaded holes.
5. The fixing tool for silicon wafer according to claim 1, characterized in that: The fixing tool also includes a plurality of second limiting members, which are connected to the base, and the plurality of second limiting members are arranged at intervals to enclose a fixed position on the carrying surface to accommodate the silicon wafer, and to form an entrance and exit for the silicon wafer located at the fixed position to enter and exit, and the plurality of first limiting members are arranged corresponding to the entrance and exit to limit the silicon wafer at the fixed position.
6. The fixing tool for silicon wafer according to claim 5, characterized in that: The second limiting member includes a second connecting portion and a second limiting portion, the second connecting portion is connected to the base, the second limiting member is connected to the second connecting portion and protrudes from the carrying surface, the orthographic projection of the second limiting portion on the carrying surface partially overlaps with the orthographic projection of the silicon wafer on the carrying surface, and the height of the second limiting portion protruding from the carrying surface is greater than the thickness of the silicon wafer.
7. The fixing tool for silicon wafer according to claim 6, characterized in that: The second limiting portion has a third end and a fourth end opposite to each other along its length direction, the third end is connected to the second connecting portion, and the width of the second limiting portion gradually increases from the third end to the fourth end.
8. The fixing tool for silicon wafer according to claim 7, characterized in that: The base is penetrated by a step hole, the step hole penetrates the bearing surface, the second limiting portion passes through the step hole and protrudes from the bearing surface, and the second connecting portion is clamped in the step hole.
9. The fixing tool for silicon wafer according to claim 1, characterized in that: The fixing fixture further comprises a connecting block, the connecting block is fixedly connected to the base, and the lifting rod is detachably connected to the connecting block.
10. The fixing tool for silicon wafer according to claim 1, characterized in that: The base is penetrated by a through hole, the through hole passes through the bearing surface, and a plurality of the first limiting members are arranged around the through hole to fix the silicon chip at the through hole.