Motor controller and all-in-one machine IGBT tube heat dissipation assembly structure

Abstract

The utility model relates to the technical field of power electronics, and discloses a motor controller and all-in-one machine IGBT tube heat radiation assembly structure comprising an aluminum substrate and an IGBT module: six plotting marks integrally arranged on the aluminum substrate; the through hole is formed in the position, close to the edge, of the aluminum substrate; the controller circuit board is connected to the IGBT module; wherein the six IGBT modules are sequentially welded on the plotting marks, and the positions of the six IGBT modules are in one-to-one correspondence with the positions of the six plotting marks; the six IGBT modules are all located on the front face of the aluminum substrate, and the back face of the aluminum substrate is fully coated with heat conduction silicone grease. According to the motor controller and all-in-one machine IGBT tube heat dissipation assembly structure, the problems that the IGBT chip is directly mounted on the ceramic chip, the heat dissipation capacity of the IGBT module is insufficient, and the maximum voltage and the maximum current borne by the IGBT module are limited, so that the voltage resistance and the heat dissipation capacity of the IGBT module cannot meet the requirements of electronic equipment are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of power electronics, in particular to an assembly structure for heat dissipation of an IGBT tube of a motor controller and an integrated machine. Background Art

[0002] The current power electronics technology is developing very rapidly, and the requirements of various industrial power electronic equipment for high-performance, high-reliability, and high-power components are naturally increasing. In this context, the heat dissipation of these high-power power electronic components per unit volume is getting higher and higher, which leads to a sharp increase in heat generation and temperature. The mechanical, chemical, and electrical problems caused by thermal drive are becoming more and more serious, seriously restricting product quality, stability, safety, and manufacturability. Taking the IGBT module as an example, the heat dissipation problem of this high-power device is becoming more and more important. The IGBT (Insulated Gate Bipolar Transistor), specifically called the insulated gate bipolar transistor, is a composite fully controlled voltage-driven power semiconductor device composed of a BJT (bipolar transistor) and a MOS (insulated gate field effect transistor). As a common electronic device, it has been widely used in various electronic devices.

[0003] With the development of high-current electronic devices such as frequency converters, higher requirements are placed on the performance of IGBT chips, such as requiring IGBT chips to withstand higher currents, etc. However, as the current borne by the IGBT chip increases, the heat generated during operation also increases. If the heat generated by the IGBT chip is not dissipated in time, it will seriously affect the operation of the IGBT chip and even affect the operation of other electronic devices on the circuit board. In addition, if the heat on the IGBT module cannot be transferred in time, the IGBT module will overheat. The most serious problem may be that the drive device cannot work normally. Therefore, IGBT modules with high heat dissipation capabilities have become a common goal pursued by the industry. Therefore, when installing or replacing the IGBT module, great attention should be paid to the contact surface status and tightening degree between the IGBT module and the heat sink.

[0004] In the existing IGBT assembly process, a conventional method is to package the IGBT chip on a circuit board. Usually, a heat sink is provided on one side of the circuit board. In order to achieve insulation of the heat sink, a ceramic sheet is usually provided on one side of the heat sink, and the IGBT chip is usually packaged on the ceramic sheet through a patch process. In this way, the IGBT chip is connected to the heat sink through the ceramic sheet, and the heat generated by the IGBT chip will be conducted to the heat sink through the ceramic sheet, and the heat will be dissipated into the air through the heat sink. However, since the IGBT chip is directly mounted on the ceramic sheet, the heat dissipation capacity of the IGBT module is insufficient, and the maximum voltage and maximum current that the IGBT module can withstand are also limited, resulting in the voltage resistance and heat dissipation capacity of the IGBT module not meeting the requirements of electronic equipment.

[0005] In addition, there is a more common installation process that is to install the IGBT on the insulating gasket, and then fix the two together with bolts. Although this method effectively avoids the problem of short circuit between IGBT modules, it also has many shortcomings. Since the insulating gasket has good insulation performance, it mainly plays the role of heat insulation and insulation. In electrical equipment, insulating gaskets are usually used to separate the potential difference between the conductor and the ground to avoid current leakage and arc discharge, thereby protecting the equipment. Since the thermal conductivity of the insulating gasket material is very low, it will not have a great impact on heat conduction, that is, the insulating gasket will not have a good effect on the heat dissipation of the equipment. However, the IGBT module will withstand a certain current during operation and will always generate heat, but the heat dissipation capacity of the insulating gasket is very poor. The heat generated by the IGBT module cannot be transferred. Under long-term operation, the heat continues to accumulate, which will not only affect the IGBT module, but in more serious cases, the controller may not work properly, affecting the overall performance and life. In addition, when assembling the IGBT module with the insulating gasket and the controller, there are certain requirements for the strength of the mounting bolts. If they are tightened too much, the IGBT module may be damaged. If they are tightened too loosely, firstly, the contact between the IGBT module and the controller will be poor. Secondly, dust will accumulate in the gap between the two after a period of use, seriously affecting the heat dissipation of the IGBT module, which already has poor heat dissipation, and greatly shortening the service life of the IGBT module and the controller. Utility Model Content

[0006] In view of the shortcomings of the prior art, the utility model provides a motor controller and an integrated IGBT tube heat dissipation assembly structure, which solves the problems mentioned in the above background. In the existing installation process, the installation method of the IGBT module is improved to fully dissipate heat of the IGBT module.

[0007] The utility model provides the following technical solution: an assembly structure of a motor controller and an integrated IGBT tube heat dissipation, including an aluminum substrate and an IGBT module:

[0008] six plotting marks integrally disposed on the aluminum substrate;

[0009] A through hole is provided near the edge of the aluminum substrate; and

[0010] A controller circuit board connected to the IGBT module;

[0011] Wherein, six of the IGBT modules are welded on the marking marks in sequence, and the positions of the six IGBT modules and the six marking marks correspond one to one;

[0012] The six IGBT modules are all located on the front side of the aluminum substrate, and the back side of the aluminum substrate is fully coated with thermal conductive silicone grease.

[0013] Preferably, the plotting mark includes:

[0014] Evenly apply the coating mark at the planned position on the aluminum substrate;

[0015] A tinning mark disposed near the outer edge of the aluminum substrate and located on the coating mark;

[0016] Wherein, the IGBT module is welded on the tinned mark.

[0017] Preferably, the IGBT module comprises:

[0018] A module body having a first passage groove and a second passage groove;

[0019] Three terminals embedded in the module body and corresponding to the positions of the first passage groove and the second passage groove respectively;

[0020] The module body is welded on the marking mark, and one end of the terminal passing through the module body is located at the center of the aluminum substrate.

[0021] Preferably, different pairing marks are engraved on the surfaces of the six module bodies, numbering marks corresponding to the positions of the marking marks are drawn on the aluminum substrate, and the pairing marks match the numbering marks.

[0022] Preferably, the aluminum substrate is mounted with the controller housing via through holes using screws, and the back side of the aluminum substrate coated with thermal conductive silicone grease is attached to the inside of the controller housing.

[0023] Compared with the prior art, the utility model has the following beneficial effects:

[0024] 1. The assembly structure of the motor controller and the integrated IGBT tube heat dissipation changes the traditional installation process and conducts the heat generated by the IGBT module when it is working to the aluminum substrate, which effectively improves the heat dissipation of the IGBT module. It can not only extend the service life of the IGBT module, but also extend the service life of the controller as a whole, solve the problem of high power and difficult heat dissipation of the controller, and improve the overall performance of the controller.

[0025] 2. The assembly structure of the motor controller and the all-in-one IGBT tube heat dissipation uses an aluminum substrate to transfer heat, and uses the aluminum substrate to fix the IGBT module and the controller housing. This is not only easier to operate, but also solves the problem of controlling the strength of traditional screws when installing the IGBT module. There is no need to worry about poor heat dissipation and damage to the IGBT module due to loose fixing when fixing the IGBT module.

[0026] 3. The assembly structure of the motor controller and the all-in-one IGBT tube heat dissipation can flexibly select an aluminum substrate with a suitable thermal conductivity according to the power of the controller in the actual application scenario, thereby ensuring good heat dissipation of the IGBT module, increasing the service life of the IGBT module and the controller, thereby reducing the waste of resources, and reducing the replacement frequency of the controller, which also saves costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the welding structure of the aluminum substrate and the IGBT module of the utility model;

[0028] Figure 2 This is a schematic diagram of the aluminum substrate structure of the utility model;

[0029] Figure 3 This is a schematic diagram of the structure of the IGBT module of the utility model;

[0030] Figure 4 This is a schematic diagram of the back structure of the aluminum substrate of the utility model.

[0031] In the figure: 1, aluminum substrate; 2, marking mark; 21, coating mark; 22, tinning mark; 3, IGBT module; 31, module body; 32, terminal; 33, first passage groove; 34, second passage groove; 35, pairing mark; 4, through hole; 5, numbering mark; 6, controller circuit board. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] See also Figure 1-4 , an assembly structure of a motor controller and an integrated IGBT tube heat dissipation, comprising an aluminum substrate 1 and an IGBT module 3:

[0034] Six marking marks 2 integrally arranged on the aluminum substrate 1;

[0035] A through hole 4 is provided near the edge of the aluminum substrate 1; and

[0036] A controller circuit board 6 connected to the IGBT module 3;

[0037] Wherein, six IGBT modules 3 are welded on the marking mark 2 in sequence, and the positions of the six IGBT modules 3 and the six marking marks 2 correspond one to one;

[0038] The six IGBT modules 3 are all located on the front side of the aluminum substrate 1 , and the back side of the aluminum substrate 1 is fully coated with thermal conductive silicone grease.

[0039] Wherein, the plotting mark 2 includes:

[0040] Uniformly apply the coating mark 21 at the planned position on the aluminum substrate 1;

[0041] A tinning mark 22 disposed near the outer edge of the aluminum substrate 1 and located on the coating mark 21;

[0042] The IGBT module 3 is welded on the tinning mark 22, and the welding position of the IGBT module 3 is further marked by the tinning mark 22. At the same time, the ability of tinning itself is utilized to make the aluminum substrate 1 have good weldability, making the welding process easier and improving the wettability of welding.

[0043] Wherein, the IGBT module 3 comprises:

[0044] A module body 31 having a first passage groove 33 and a second passage groove 34;

[0045] Three terminals 32 embedded in the module body 31 and corresponding to the positions of the first passage groove 33 and the second passage groove 34 respectively;

[0046] Among them, the module body 31 is welded on the marking mark 2, and the terminal 32 passes through one end of the module body 31 and is located at the center of the aluminum substrate 1. The IGBT module 3 is set at a pre-planned position on the aluminum substrate 1, so that the structure on the IGBT module 3 can correspond one-to-one with the structure on the controller circuit board 6 in the subsequent installation, which is convenient for installation.

[0047] Among them, the surfaces of the six module bodies 31 are engraved with different matching marks 35, and the aluminum substrate 1 is drawn with a numbered mark 5 corresponding to the position of the marking mark 2. The matching mark 35 matches the numbered mark 5, and the numbered mark 5 is used to match the IGBT module 3 ready for welding to confirm that there will be no error in the installation position of each IGBT module 3, making the installation and docking more accurate.

[0048] Among them, the aluminum substrate 1 is installed with the controller housing by screws through the through hole 4, and the back of the aluminum substrate 1 coated with thermal grease is attached to the inside of the controller housing. The thermal grease is used to fill the installation gap between the aluminum substrate 1 and the controller housing, making the installation more compact and greatly improving its heat dissipation effect.

[0049] Working principle: before installing the IGBT module 3, according to the controller power, select an aluminum substrate 1 with a suitable thermal conductivity, pre-plan the placement position of the IGBT module 3 on the aluminum substrate 1, plate tin on the position where the IGBT module 3 needs to be installed, and then avoid the installation position of the IGBT module 3 and select a suitable position near the edge of the aluminum substrate 1 to punch a through hole 4 for installing the screws that fix the aluminum substrate 1 and the controller. Then, evenly weld the six IGBT modules 3 to be used on the pre-planned installation positions on the aluminum substrate 1, fully apply thermal grease on the other side of the aluminum substrate 1, and then fit the side with thermal grease on the controller housing. Finally, use screws to fix the aluminum substrate 1 and the controller housing.

[0050] When the IGBT module 3 is working, the heat generated will be conducted to the aluminum substrate 1, and the aluminum substrate 1 will transfer the heat to the controller housing through thermal grease. The controller housing is in full contact with the outside world and effectively dissipates heat. In this way, the heat generated by the IGBT module 3 is continuously transferred outward and finally conducted to the controller housing. The heat dissipation area is increased through the controller housing, and the heat dissipation efficiency is also increased, so that the heat on the IGBT module 3 can be effectively and quickly dissipated to the outside world.

[0051] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An assembly structure for heat dissipation of a motor controller and an integrated IGBT tube, comprising an aluminum substrate (1) and an IGBT module (3), characterized in that: Six marking marks (2) integrally arranged on the aluminum substrate (1); A through hole (4) is provided near the edge of the aluminum substrate (1); and A controller circuit board (6) connected to the IGBT module (3); Wherein, six IGBT modules (3) are welded on the marking marks (2) in sequence, and the positions of the six IGBT modules (3) and the six marking marks (2) correspond one to one; The six IGBT modules (3) are all located on the front side of the aluminum substrate (1), and the back side of the aluminum substrate (1) is fully coated with thermal conductive silicone grease.

2. The assembly structure of a motor controller and an integrated IGBT tube heat dissipation according to claim 1, characterized in that: The plotting mark (2) comprises: Uniformly applying a coating mark (21) at a planned position on the aluminum substrate (1); A tinning mark (22) disposed near the outer edge of the aluminum substrate (1) and located on the coating mark (21); Wherein, the IGBT module (3) is welded on the tinned mark (22).

3. The assembly structure of a motor controller and an integrated IGBT tube heat dissipation according to claim 1, characterized in that: The IGBT module (3) comprises: A module body (31) having a first passage groove (33) and a second passage groove (34); Three terminals (32) embedded in the module body (31) and corresponding to the positions of the first passage groove (33) and the second passage groove (34); The module body (31) is welded on the marking mark (2), and one end of the terminal (32) that passes through the module body (31) is located at the center of the aluminum substrate (1).

4. The assembly structure of a motor controller and an integrated IGBT tube heat dissipation according to claim 3, characterized in that: Different matching marks (35) are engraved on the surfaces of the six module bodies (31), number marks (5) corresponding to the positions of the marking marks (2) are drawn on the aluminum substrate (1), and the matching marks (35) match the number marks (5).

5. The assembly structure of a motor controller and an integrated IGBT tube heat dissipation according to claim 1, characterized in that: The aluminum substrate (1) is mounted on the controller housing by means of screws through the through holes (4), and the back side of the aluminum substrate (1) coated with thermal conductive silicone grease is attached to the inside of the controller housing.

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