Frame for manufacturing semiconductor product with full side wings capable of being infiltrated

Abstract

The utility model discloses a frame for manufacturing a semiconductor product with full side wings capable of being infiltrated, which comprises a frame body, and positioning circular holes are respectively formed in the edges of the two sides of the frame body; a plurality of unit bodies are evenly distributed on the frame body, and stress releasing grooves are formed in the positions, between the adjacent unit bodies, of the frame body. Each unit body comprises a plurality of base island groups arranged in rows and reinforcing ribs located in the middle, and the reinforcing ribs are used for separating the base island groups. By arranging the reinforcing ribs, the strength of the whole frame is improved, and the whole frame is prevented from being bent and damaged.

Description

Technical Field

[0001] The utility model belongs to the technical field of packaging, and in particular relates to a frame for manufacturing a full-flank wettable semiconductor product. Background Art

[0002] DFN package is a type of double-sided pinless semiconductor package. During the production process, this type of product can be plated by pre-cutting before plating, so that the pin sides are fully tinned to enhance the bonding between the product and the printed circuit board, and allow the use of 2D optical detection of the sides to determine whether tinning is applied. However, the use of conventional frames to manufacture full-flank wettable semiconductor products has major defects: 1. After most frames are cut horizontally, the inside of the unit and the overall frame are not conductive, so electroplating operations cannot be performed, which greatly limits the use of the method for manufacturing full-flank wettable semiconductor products. 2. The strength of the product is reduced after being cut horizontally, and it is easy to be damaged in subsequent processing links. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art.

[0004] The technical solution of the utility model is: a frame for manufacturing a full-flank wettable semiconductor product, comprising a frame body, both side edges of the frame body are respectively provided with positioning circular holes; a plurality of unit bodies are evenly distributed on the frame body, the unit bodies include a plurality of base island groups arranged in rows,

[0005] The base island group includes a plurality of base island units, and the base island units are connected to the frame body through conductive connecting bars.

[0006] The base island unit includes a drain base island, a source base island and a gate base island.

[0007] The drain base island, the source base island and the gate base island are respectively connected to the frame body through pins and reinforcing ribs.

[0008] The frame body is provided with stress release grooves between adjacent unit bodies;

[0009] The unit body further includes a reinforcing rib located in the middle, and the reinforcing rib is used to separate the base island groups.

[0010] Both sides of the unit body include at least one column of base island units to form a reserved unit.

[0011] An identification hole is arranged on the drain base island of the reserved unit.

[0012] The pin is provided with a pit.

[0013] The edges of the unit body are surrounded by stress release holes.

[0014] An annular silver-plated area is provided on the unit body at the inner side of the stress release hole.

[0015] An encapsulation step is provided on the back side of the base island unit.

[0016] The frame body is provided with positioning square holes around the unit body.

[0017] The back side of the frame body is provided with a positioning cross portion in the middle of the adjacent base island groups.

[0018] During operation, the utility model evenly arranges a plurality of unit bodies on the frame body, and the unit bodies include a plurality of base island groups arranged in a row and reinforcing ribs in the middle, and the reinforcing ribs are used to separate the base island groups. Thus, the overall frame strength is increased by arranging the reinforcing ribs to avoid overall bending damage;

[0019] At the same time, the reserved units are set not to be cut off, which enhances the strength of the single row after cutting.

[0020] By providing conductive ribs, the DFN frame can still be conductive after being cut transversely, and can be used to manufacture full-flank wettable semiconductor products. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall framework of the utility model;

[0022] Figure 2 It is a partial schematic diagram of the framework of the utility model;

[0023] Figure 3 It is a partial back schematic diagram of the frame of the utility model;

[0024] Figure 4 This is a schematic diagram of the utility model after horizontal cutting;

[0025] In the figure, 1 is the frame body; 101 is the positioning circular hole; 102 is the stress release groove; 103 is the reinforcing rib; 104 is the positioning square hole; 105 is the stress release hollow hole; 106 is the identification hole; 107 is the drain base island; 108 is the source base island; 109 is the gate base island; 110 is the reinforcing rib; 111 is the conductive rib; 112 is the pin; 113 is the pit; 114 is the wire bonding silver-plated area; 115 is the annular silver-plated area; 116 is the encapsulation step; 117 is the positioning cross part. DETAILED DESCRIPTION

[0026] like Figure 1-4 As shown, a frame for manufacturing a full-flank wettable semiconductor product comprises a frame body 1, and two side edges of the frame body 1 are respectively provided with positioning circular holes 101;

[0027] A plurality of unit bodies are evenly distributed on the frame body 1, and a stress release groove 102 is provided between adjacent unit bodies on the frame body 1;

[0028] The unit body includes a plurality of base island groups arranged in a row and a reinforcing rib 103 in the middle, wherein the reinforcing rib 103 is used to separate the base island groups.

[0029] The positioning circular holes 101 are located at the edges of both sides of the frame body 1 and are used for die bonding, wire bonding, front and back identification and positioning of plastic packaging.

[0030] The stress release groove 102 is located between each unit body of the frame body 1, and the stress release hole 105 is located at the edge of each unit body for releasing stress. The reinforcing rib 103 is located in the middle of the unit body, and this part is not cut when the groove is cut horizontally, so as to enhance the overall strength of the frame.

[0031] The frame body 1 is provided with positioning square holes 104 around the unit body, and the back of the frame body 1 is provided with a positioning cross portion 117 in the middle of the adjacent base island groups. The positioning square holes 104 and the positioning cross portion 117 are used for positioning during disassembly.

[0032] The base island group includes a plurality of base island units, and both sides of the unit body include at least one column of base island units to form a reserved unit.

[0033] The base island unit includes a drain base island 107, a source base island 108 and a gate base island 109.

[0034] The drain base island 107 , the source base island 108 and the gate base island 109 are connected to the frame body 1 through pins 112 and reinforcement ribs 110 , respectively.

[0035] The drain base island 107 is used to install the chip and connect the chip drain, the source base island 108 is used as a wire platform to connect the chip surface source, and the gate base island 109 is used as a wire platform to connect the chip gate. The drain base island, source base island, and gate base island are connected to the external circuit through pins 112. There are pits 113 formed by corrosion on the pins 112 to reduce the cross-sectional area of ​​the pins to reduce the stress generated by the frame when disassembled.

[0036] The source base island 108 and the gate base island 109 are respectively located on one side of the drain base island 107, and the outer sides of each are connected to the frame body through the pins 112;

[0037] The drain base island 107, the source base island 108 and the gate base island 109 are connected to the frame body on the left or right through the reinforcing ribs 110 to fix the base islands and prevent shaking during die bonding and wire bonding. In application, the pins 112 and the reinforcing ribs 110 are formed by opening holes in the frame body.

[0038] The conductive connecting ribs 111 are used to connect the interior of the unit with the frame body in a transverse direction, so that the frame can still be connected to the edge for conductivity and electroplating after being cut in a transverse direction.

[0039] The drain base island 107 in the base island unit is connected to the frame body 1 through a conductive connecting rib 111 .

[0040] The wire bonding silver plated area 114 is located on the source base island 108 and the gate base island 109 to facilitate wire bonding. The annular silver plated area 115 is located at the edge of each unit cell to balance the current in the frame production electroplating wire bonding silver plated area 114 to avoid burning.

[0041] The drain base island 107 in the base island unit (ie, the reserved unit) located outside the base island group is provided with an identification hole 106. The identification hole 106 is used to distinguish other units from performing the die bonding and wire bonding operations during die bonding.

[0042] Compared with conventional frames, the overall strength of the frame is reduced after the horizontal grooves are cut, and it is easy to deform during electroplating. Therefore, two columns of units are left on the left and right sides of each unit body. The positions of these two columns of units are not cut when the horizontal grooves are cut to strengthen the overall strength of the frame. Since these two columns are not used as products, there is no need to perform die bonding and wire bonding. In order to facilitate machine image recognition to distinguish normal units, an identification hole 106 is drilled on the drain base island.

[0043] The back side of the frame body 1 has an encapsulation step 116 (ie, a step-shaped one) formed by etching, which is used to enhance the bonding force between the frame and the plastic package body.

[0044] Regarding the contents disclosed in this case, there are a few points that need to be explained:

[0045] (1) The drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design;

[0046] (2) In the absence of conflict, the embodiments and features of the embodiments disclosed in this case may be combined with each other to obtain new embodiments;

[0047] The above are only specific implementation methods disclosed in this case, but the protection scope of the present disclosure is not limited thereto. The protection scope disclosed in this case should be based on the protection scope of the claims.

Claims

1. A frame for manufacturing a fully flank wettable semiconductor product, comprising a frame body (1), wherein two side edges of the frame body (1) are respectively provided with positioning circular holes (101); the characteristics are as follows: A plurality of unit bodies are evenly distributed on the frame body (1), and the unit bodies include a plurality of base island groups arranged in rows. The base island group comprises a plurality of base island units, and the base island units are connected to the frame body (1) via conductive connecting bars (111).

2. A framework for manufacturing a full-flank wettable semiconductor product according to claim 1, characterized in that: The base island unit comprises a drain base island (107), a source base island (108) and a gate base island (109), The drain electrode base island (107), the source electrode base island (108) and the gate electrode base island (109) are respectively connected to the frame body (1) via pins (112) and reinforcing ribs (110).

3. A framework for manufacturing a full-flank wettable semiconductor product according to claim 2, characterized in that: The frame body (1) is provided with stress release grooves (102) between adjacent unit bodies; The unit body further comprises a reinforcing rib (103) located in the middle, and the reinforcing rib (103) is used to separate the base island groups.

4. A framework for manufacturing a full-flank wettable semiconductor product according to claim 3, characterized in that: Both sides of the unit body include at least one column of base island units to form a reserved unit.

5. A framework for manufacturing a full-flank wettable semiconductor product according to claim 4, characterized in that: An identification hole (106) is provided on the drain base island (107) of the reserved unit.

6. A framework for manufacturing a full-flank wettable semiconductor product according to claim 2, characterized in that: The pin (112) is provided with a recess (113).

7. A framework for manufacturing a full-flank wettable semiconductor product according to claim 1, characterized in that: Stress release holes (105) are provided on the four edges of the unit body.

8. A framework for manufacturing a full-flank wettable semiconductor product according to claim 7, characterized in that: An annular silver-plated area (115) is provided on the unit body, located inside the stress release hole (105).

9. A framework for manufacturing a full-flank wettable semiconductor product according to claim 1, characterized in that: An encapsulation step (116) is provided on the back side of the base island unit.

10. The framework for manufacturing a full-flank wettable semiconductor product according to claim 1, characterized in that: The frame body (1) is provided with positioning square holes (104) on the four sides of the unit body. A positioning cross portion (117) is provided on the back side of the frame body (1) in the middle of adjacent base island groups.

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