High-efficiency circuit board hot-pressing forming machine
By designing a mobile rack and suction cup rack that automatically grabs and places, combined with a pressure mechanism and a heating resistor wire, the circuit board hot press forming is automated, solving the problems of high manual operation and safety hazards in the prior art, and improving work efficiency and safety.
Patent Information
- Application Number
- CN202421733804.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-07-22
AI Technical Summary
Existing circuit board hot-pressing molding machines require manual operation, resulting in high labor consumption and operators are susceptible to scalding from heat sources.
A high-efficiency circuit board hot-pressing molding machine is designed, using the combination of a mobile rack and a suction cup rack to automatically grab and place the protective film and circuit board, and achieve hot-pressing molding through a pressure mechanism and a heating resistor wire.
It reduces manpower consumption, avoids the risk of operators approaching the hot pressing tank, and improves work efficiency and safety.
Smart Images

Figure CN222803125U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board manufacturing, in particular to a high-performance circuit board hot pressing molding machine. Background Art
[0002] Circuit board protective film can provide protection for the circuit board, prevent dust and moisture from entering the circuit board surface, isolate the circuit board from the external environment to prevent leakage and short circuit. The protective film is generally set on the circuit board by hot pressing. The general hot pressing machine requires manual placement of the protective film and the circuit board on the hot pressing equipment. In order to reduce labor costs, the utility model proposes a high-efficiency circuit board hot pressing forming machine. Summary of the invention
[0003] The purpose of the utility model is to provide a high-performance circuit board hot pressing molding machine to solve the problems raised in the above background technology.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-efficiency circuit board hot pressing forming machine, comprising a workbench, a first material trough, a second material trough and a third material trough for placing materials are provided on the top of the workbench, a hot pressing groove is provided on the top of the workbench, the hot pressing groove and the first material trough, the second material trough and the third material trough are located on the same straight line and movable tracks are provided in parallel on both sides, a movable frame is slidably provided on the movable track, a plurality of first telescopic machines are installed on the movable frame, a suction cup frame for adsorbing materials is installed on the telescopic end of the first telescopic machine, a pressure mechanism for applying pressure to the material is provided above the hot pressing groove, and a heating resistance wire is provided at the bottom of the hot pressing groove.
[0005] Preferably, a roller is rotatably installed at the bottom of the movable frame, a raised slide rail is provided on the top of the movable track, an annular groove that can be inserted into the slide rail is opened on the outer side of the roller, the annular groove of the roller is slidably connected to the slide rail, and a motor is installed in the movable frame, and the output end of the motor is connected to the roller through a rotating shaft to drive the roller to rotate.
[0006] Preferably, a suction cup is installed on the suction cup frame, and a vacuum pump is installed on the movable frame, and the vacuum pump is connected to the suction cup through an air pipe.
[0007] Preferably, the pressure mechanism comprises a second telescopic machine and a pressure plate, the pressure plate is installed at the telescopic end of the second telescopic machine, and the pressure plate can be extended into the hot pressing groove and is slidably connected to the hot pressing groove.
[0008] Compared with the prior art, the beneficial effects of the utility model are: by setting up a mobile frame, grabbing materials and placing them in the hot pressing tank, and taking out the circuit board after the protective film is combined with the circuit board, while reducing manpower consumption, it can prevent personnel from getting close to the heat source of the hot pressing tank during operation to prevent burns. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 This is a side sectional view of the hot pressing tank of the utility model;
[0010] Figure 2 It is a top view schematic diagram of the utility model.
[0011] In the figure: 1 working table, 11 hot pressing tank, 12 first material tank, 13 second material tank, 14 third material tank, 2 moving track, 21 slide rail, 3 moving frame, 31 roller, 32 motor, 33 first telescopic machine, 34 suction cup frame, 35 vacuum pump, 4 pressure mechanism, 41 second telescopic machine, 42 pressing plate. DETAILED DESCRIPTION
[0012] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0013] Referring to Figure (1-2), a high-efficiency circuit board hot pressing molding machine includes a workbench 1, characterized in that: a first material trough 12, a second material trough 13 and a third material trough 14 for placing materials are provided on the top of the workbench 1, a hot pressing groove 11 is provided on the top of the workbench 1, the hot pressing groove 11 and the first material trough 12, the second material trough 13 and the third material trough 14 are located on the same straight line and movable rails 2 are arranged in parallel on both sides, a movable frame 3 is slidably arranged on the movable rail 2, a plurality of first telescopic machines 33 are installed on the movable frame 3, a suction cup frame 34 for adsorbing materials is installed on the telescopic end of the first telescopic machine 33, a pressure mechanism 4 for applying pressure to the material is arranged above the hot pressing groove 11, and a heating resistor wire is arranged at the bottom of the hot pressing groove 11.
[0014] A roller 31 is rotatably installed at the bottom of the mobile frame 3, a raised slide rail 21 is set at the top of the mobile track 2, an annular groove that can be inserted into the slide rail is opened on the outer side of the roller 31, the annular groove of the roller 31 is slidably connected with the slide rail 21, and a motor 32 is installed in the mobile frame 3, and the output end of the motor 32 is connected to the roller 31 through a rotating shaft to drive the roller 31 to rotate.
[0015] The suction cup frame 34 is provided with a suction cup, and the moving frame 3 is provided with a vacuum pump 35, which is connected to the suction cup through an air pipe. The pressure mechanism 4 includes a second telescopic machine 41 and a pressing plate 42, which is installed at the telescopic end of the second telescopic machine 41, and can be extended into the hot pressing tank 11 and slidably connected to the hot pressing tank 11.
[0016] When the device is in use, the circuit board and the protective film are placed on the first material slot 12 and the second material slot 13 respectively. At this time, the motor 32 on the moving frame 3 is started to drive the roller 31 to rotate, driving the moving frame 3 to move along the slide rail 21, first allowing the moving frame 3 to move above the protective film, controlling the first telescopic machine 33 to drive the suction cup frame 34 to move downward, so that the bottom of the suction cup is attached to the protective film, and at the same time starting the vacuum pump to extract the air in the suction cup to adsorb the protective film, and then the protective film is brought to the top of the hot pressing groove 11 by the moving frame 3 and placed in the hot pressing groove 11; thereafter, the circuit board is placed in the hot pressing groove and covered on the protective film, and the second telescopic machine is started to drive the pressing plate to press down to apply pressure to the circuit board in the hot pressing groove, and at the same time, the heating resistor wire at the bottom of the hot pressing groove is energized and heated, so as to heat the protective film and soften it. After the protective film is attached to the circuit board, the moving mechanism drives the circuit board to move to the third material slot for placement.
[0017] The orientations or positional relationships shown in the drawings are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention.
[0018] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0019] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A high-performance circuit board hot pressing machine, comprising a workbench (1), characterized in that: The top of the workbench (1) is provided with a first material trough (12), a second material trough (13) and a third material trough (14) for placing materials, and the top of the workbench (1) is provided with a hot pressing trough (11). The hot pressing trough (11) is located on the same straight line as the first material trough (12), the second material trough (13) and the third material trough (14), and movable rails (2) are arranged in parallel on both sides. A movable frame (3) is slidably arranged on the movable rail (2), and a plurality of first telescopic machines (33) are installed on the movable frame (3). A suction cup frame (34) for adsorbing materials is installed on the telescopic end of the first telescopic machine (33). A pressure mechanism (4) for applying pressure to materials is arranged above the hot pressing trough (11), and a heating resistance wire is arranged at the bottom of the hot pressing trough (11).
2. The high-performance circuit board hot pressing machine according to claim 1, characterized in that: A roller (31) is rotatably mounted at the bottom of the movable frame (3); a protruding slide rail (21) is arranged at the top of the movable track (2); an annular groove capable of being inserted into the slide rail is provided on the outer side of the roller (31); the annular groove of the roller (31) is slidably connected to the slide rail (21); a motor (32) is installed in the movable frame (3); an output end of the motor (32) is connected to the roller (31) via a rotating shaft, and drives the roller (31) to rotate.
3. The high-performance circuit board hot pressing machine according to claim 1, characterized in that: A suction cup is installed on the suction cup frame (34), and a vacuum pump (35) is installed on the movable frame (3), wherein the vacuum pump (35) is connected to the suction cup through an air pipe.
4. The high-performance circuit board hot pressing machine according to claim 1, characterized in that: The pressure mechanism (4) comprises a second telescopic machine (41) and a pressing plate (42), wherein the pressing plate (42) is installed at the telescopic end of the second telescopic machine (41), and the pressing plate (42) can be extended into the hot pressing groove (11) and is slidably connected to the hot pressing groove (11).