Heat conduction, heat storage and heat dissipation device

Abstract

The utility model provides a heat conduction, heat storage and heat dissipation device which comprises a heat conduction module, a heat storage cavity is arranged above the heat conduction module, and a heat dissipation structure is arranged above the heat storage cavity. The heat generated by the electronic component is quickly transferred into the heat storage cavity through the heat conduction module, and the heat storage cavity can quickly conduct the heat to the outside through the fan while utilizing natural heat dissipation, so that the heat dissipation efficiency is improved, stable operation of the electronic component is ensured, and the service life of an electronic product is prolonged.

Description

Technical Field

[0001] The utility model relates to the field of electronic products, in particular to a heat-conducting, heat-storing and heat-dissipating device. Background Art

[0002] With the development of science and technology, the speed of electronic product updates and iterations is getting faster and faster, and what follows is a blowout of electronic product functions. However, the more feature-rich the electronic products are, the more complex their internal electronic components are. Electronic components will generate a lot of heat while operating efficiently. If this heat is not discharged in time, it will seriously affect the operating efficiency of the electronic components. At present, the conventional heat dissipation method for electronic components is generally natural heat dissipation. Although the above heat dissipation method has low cost and simple structure, the heat dissipation efficiency is low.

[0003] Therefore, there is an urgent need for a heat-conducting, heat-storing and heat-dissipating device that can solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a heat conduction, heat storage and heat dissipation device to solve the problems existing in the above-mentioned prior art.

[0005] To achieve the above purpose, the utility model provides the following solutions:

[0006] The utility model provides a heat conduction, heat storage and heat dissipation device, comprising a heat conduction module, a heat storage cavity is arranged above the heat conduction module, and a heat dissipation structure is arranged above the heat storage cavity.

[0007] Preferably, the heat-conducting module comprises a heat-conducting layer, and a lower shell is connected above the heat-conducting layer.

[0008] Preferably, the heat-conducting layer is made of a heat-conducting silicone pad.

[0009] Preferably, a connecting hole and a heat-conducting hole are provided at the bottom of the lower shell, and a connecting protrusion and a heat-conducting column are provided on the upper surface of the heat-conducting layer, the connecting protrusion cooperates with the connecting hole, and the heat-conducting column cooperates with the heat-conducting hole.

[0010] Preferably, the heat dissipation structure includes an upper shell, which is buckled with the lower shell to form the heat storage cavity, a fan is provided in the upper shell, and a heat dissipation hole is provided on the top of the upper shell.

[0011] Preferably, the side of the upper shell and the side of the lower shell are both provided with heat dissipation fins.

[0012] Compared with the prior art, the utility model has achieved the following beneficial technical effects:

[0013] The utility model provides a heat-conducting, heat-storing and heat-dissipating device, comprising a heat-conducting module, a heat-storing cavity is provided above the heat-conducting module, and a heat-dissipating structure is provided above the heat-storing cavity; the heat generated by the electronic component is quickly transferred to the heat-storing cavity through the heat-conducting module, and the heat-storing cavity can quickly conduct the heat to the outside through a fan while utilizing natural heat dissipation, thereby improving the heat dissipation efficiency, ensuring the stable operation of the electronic component, and prolonging the service life of the electronic product. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0015] Figure 1 The utility model provides a schematic structural diagram of a heat-conducting, heat-storing and heat-dissipating device. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] The purpose of the utility model is to provide a heat conduction, heat storage and heat dissipation device to solve the problems existing in the prior art.

[0018] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0019] Embodiment 1:

[0020] This embodiment provides a heat conduction heat storage and heat dissipation device, such as Figure 1 As shown, it includes a heat conduction module 1 , a heat storage cavity 2 is provided above the heat conduction module 1 , and a heat dissipation structure 3 is provided above the heat storage cavity 2 .

[0021] Specifically, the heat-conducting module 1 includes a heat-conducting layer 11 , and a lower shell 12 is connected above the heat-conducting layer 11 .

[0022] Furthermore, the heat-conducting layer 11 is made of a heat-conducting silicone pad, which is soft and has a good heat transfer effect.

[0023] Furthermore, a connecting hole 13 and a heat-conducting hole 14 are provided at the bottom of the lower shell 12, and a connecting protrusion 15 and a heat-conducting column 16 are provided on the upper surface of the heat-conducting layer 11. The connecting protrusion 15 cooperates with the connecting hole 13 to connect the two, and the heat-conducting column 16 cooperates with the heat-conducting hole 14 to transfer heat upward through the heat-conducting column 16.

[0024] Furthermore, the heat dissipation structure 3 includes an upper shell 31, which is buckled with the lower shell 12 to form a heat storage chamber 2 therebetween. A fan 32 is provided in the upper shell 31, and a heat dissipation hole 33 is provided on the top of the upper shell 31 to discharge the heat in the heat storage chamber 2.

[0025] Furthermore, the side of the upper shell 31 and the side of the lower shell 12 are both provided with heat dissipation fins 4, so as to perform natural heat dissipation simultaneously, thereby improving the heat dissipation effect.

[0026] The utility model provides a heat-conducting heat storage and heat dissipation device, and the method of using the device is as follows: fix the device above the electronic component so that the heat-conducting module 1 is close to the electronic component, and the heat generated by the electronic component is quickly transferred to the heat storage cavity 2 through the heat-conducting module 1. The heat storage cavity 2 can quickly conduct heat to the outside through the fan 32 while utilizing the heat dissipation fins 4 to dissipate heat naturally, thereby improving the heat dissipation efficiency, ensuring the stable operation of the electronic component, and prolonging the service life of the electronic product.

[0027] The utility model uses specific examples to illustrate the principle and implementation of the utility model. The above examples are only used to help understand the method and core idea of ​​the utility model. At the same time, for those skilled in the art, according to the idea of ​​the utility model, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be understood as limiting the utility model.

Claims

1. A heat conduction, heat storage and heat dissipation device, characterized in that: It comprises a heat conduction module, a heat storage cavity is provided above the heat conduction module, and a heat dissipation structure is provided above the heat storage cavity; The heat conduction module comprises a heat conduction layer, and a lower shell is connected above the heat conduction layer; The bottom of the lower shell is provided with a connection hole and a heat-conducting hole, the upper surface of the heat-conducting layer is provided with a connection protrusion and a heat-conducting column, the connection protrusion is matched with the connection hole, and the heat-conducting column is matched with the heat-conducting hole; The heat dissipation structure comprises an upper shell, the upper shell is buckled with the lower shell, and the heat storage cavity is formed between the two, a fan is arranged in the upper shell, and a heat dissipation hole is arranged on the top of the upper shell; The side of the upper shell and the side of the lower shell are both provided with heat dissipation fins.

2. The heat conduction, heat storage and heat dissipation device according to claim 1, characterized in that: The heat-conducting layer adopts a heat-conducting silicone pad.

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