Liquid cooling plate with heat dissipation structure

Abstract

The utility model discloses a liquid cooling plate with a heat dissipation structure, which comprises an aluminum substrate and an aluminum cover plate which are attached to each other, a groove is arranged on the substrate, a heat conduction copper plate is embedded in the groove, a passage for circulation of a cooling medium is arranged in the heat conduction copper plate, and a plurality of heat conduction sheets are uniformly distributed in the passage at equal angles to increase the heat conduction area; the top surface and the bottom surface of the heat-conducting copper plate are fixedly connected with a plurality of heat-conducting columns; the heat-conducting columns distributed up and down are respectively embedded in the substrate and the cover plate; according to the utility model, the copper insert with better heat-conducting property is inlaid on the aluminum liquid cooling plate body, components with larger heat productivity are arranged on the copper insert to accelerate heat dissipation, and the liquid cooling plate increases the heat-conducting area and effectively improves the heat dissipation efficiency through the heat-conducting fins in the heat-conducting copper plate and the heat-conducting columns arranged on the upper and lower surfaces of the heat-conducting copper plate.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling plates, in particular to a liquid cooling plate with a heat dissipation structure. Background Art

[0002] With the development of new energy vehicles and electronic technology, the integration of electronic equipment is getting higher and higher. Not only the heat generated by chips or modules in electronic equipment is getting higher and higher, but the heat dissipation devices of electronic equipment mainly include air-cooled heat dissipation devices and liquid-cooled heat dissipation devices. Due to the high heat capacity and high conductivity of liquid, liquid-cooled heat dissipation devices have stronger heat dissipation capacity than air-cooled heat dissipation devices. Therefore, liquid cooling plates have good heat dissipation performance. However, the existing liquid cooling plate structure is a single plate structure. Although the heat of the heating element is taken away by the opened water channel, on the one hand, the thermal conductivity of the liquid cooling plate itself is poor, and heat transfer cannot be performed well. On the other hand, the contact area with the cooling medium is insufficient, and the heat cannot be taken away quickly, resulting in heat accumulation and low cooling efficiency. Utility Model Content

[0003] The purpose of the utility model is to solve the problem that the existing liquid cooling plate structure is a single plate structure. Although the heat of the heating element is taken away by the opened water channel, on the one hand, the thermal conductivity of the liquid cooling plate itself is poor and the heat transfer cannot be performed well. On the other hand, the contact area with the cooling medium is insufficient and the heat cannot be taken away quickly, which leads to heat accumulation and low cooling efficiency.

[0004] The utility model achieves the above-mentioned purpose through the following technical scheme: providing a liquid cooling plate with a heat dissipation structure, comprising an aluminum base plate and a cover plate bonded to each other, a groove is provided on the base plate, a heat-conducting copper plate is embedded in the groove, a passage for the circulation of cooling medium is provided in the heat-conducting copper plate, a plurality of heat-conducting sheets are evenly distributed at equal angles in the passage to increase the heat-conducting area; a plurality of heat-conducting columns are fixedly connected to the top surface and the bottom surface of the heat-conducting copper plate, and the heat-conducting columns distributed up and down are respectively embedded in the base plate and the cover plate.

[0005] Furthermore, a liquid inlet hole and a liquid outlet hole connected with the passage are provided on the substrate, and water nozzles are sealedly mounted on the liquid inlet hole and the liquid outlet hole.

[0006] Furthermore, six heat-conducting plates are evenly distributed at equal angles in the straight-line passage in the passage, and a plurality of heat-conducting columns are evenly distributed at equal distances on the top and bottom surfaces of the heat-conducting copper plate.

[0007] Furthermore, a sealing ring for sealing the passage is provided on the inner wall of the groove.

[0008] Furthermore, the height of the heat-conducting copper plate is greater than the depth of the groove, so that the heat-conducting copper plate protrudes out of the groove and is embedded in the cover plate.

[0009] Furthermore, the base plate and the cover plate are attached to each other and fixedly connected by screws.

[0010] Furthermore, the liquid inlet hole and the liquid outlet hole are arranged on the same side of the substrate.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. The utility model adopts copper inserts with better thermal conductivity inlaid on the aluminum liquid cooling plate body, and components with large heat generation are arranged on the copper inserts to accelerate heat dissipation. The liquid cooling plate increases the heat conduction area through the heat conducting sheet in the heat conducting copper plate, effectively improves the heat dissipation efficiency, and helps to transfer heat to the cooling medium more quickly; the heat conducting sheets in the passage are evenly distributed, ensuring that the cooling medium flows evenly in the entire heat conducting copper plate, thereby maximizing the heat dissipation effect.

[0013] 2. By providing heat-conducting columns on the upper and lower surfaces of the heat-conducting copper plate, and the heat-conducting columns are respectively embedded in the base plate and the cover plate, the contact area between the heat-conducting copper plate and the base plate and the cover plate is increased, so that the base plate and the cover plate can quickly conduct heat and dissipate heat. In addition, by embedding the heat-conducting columns in the base plate and the cover plate, a stable connection between the various components of the liquid cooling plate is ensured, thereby improving the overall stability and durability of the system.

[0014] 3. The setting of the sealing ring effectively prevents the leakage of the cooling medium, ensures the sealing performance of the liquid cooling plate system, and reduces the risk of system failure; the base plate and the cover plate are fixedly connected by screws, and the liquid inlet and outlet holes are set on the same side of the base plate, making the installation and maintenance of the liquid cooling plate more convenient and reducing the workload of operators. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0016] Figure 2 It is an exploded view of the utility model;

[0017] Figure 3 Schematic diagram of the heat-conducting copper plate in the utility model;

[0018] Figure 4 for Figure 3 Sectional view of AA.

[0019] In the figure: 1-base plate, 2-cover plate, 3-groove, 4-heat-conducting copper plate, 5-passage, 6-heat-conducting sheet, 7-heat-conducting column, 8-liquid inlet hole, 9-liquid outlet hole, 10-water nozzle, 11-sealing ring. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0022] Combination Figures 1 to 4 A liquid cooling plate with a heat dissipation structure shown in the figure comprises an aluminum substrate 1 and a cover plate 2 which are bonded to each other, a groove 3 is provided on the substrate 1, a heat-conducting copper plate 4 is embedded in the groove 3, a passage 5 for the circulation of a cooling medium is provided in the heat-conducting copper plate 4, and a plurality of heat-conducting sheets 6 are evenly distributed at equal angles in the passage 5 to increase the heat-conducting area; a plurality of heat-conducting columns 7 are fixedly connected to the top and bottom surfaces of the heat-conducting copper plate 4, and the heat-conducting columns 7 distributed up and down are respectively embedded in the substrate 1 and the cover plate 2;

[0023] Among them, a liquid inlet hole 8 and a liquid outlet hole 9 connected with the passage 5 are provided on the substrate 1, and a water nozzle 10 is sealed on the liquid inlet hole 8 and the liquid outlet hole 9; six heat conducting plates 6 are evenly distributed at equal angles in the straight-line passage 5 in the passage 5, and a plurality of heat conducting columns 7 are evenly distributed at equal distances on the top and bottom surfaces of the heat conducting copper plate 4; a sealing ring 11 for sealing the passage 5 is provided on the inner wall of the groove 3; the height of the heat conducting copper plate 4 is greater than the depth of the groove 3, so that the heat conducting copper plate 4 protrudes out of the groove 3 and is embedded in the cover plate 2; the substrate 1 and the cover plate 2 are attached to each other and fixedly connected by screws; the liquid inlet hole 8 and the liquid outlet hole 9 are provided on the same side of the substrate 1.

[0024] Working principle: When in use, close the substrate 1 and the cover plate 2 and fix them with screws, then place the components with higher heat generation at the position of the heat-conducting copper plate 4, then transport the cooling medium to the passage 5 from the liquid inlet 8 through the water nozzle 10, wherein the cooling medium can be cold water. At this time, the heat generated by the components is transferred to the heat-conducting copper plate 4 through the substrate 1 or the cover plate 2, and then the cooling medium in the passage 5 takes the heat away from the liquid outlet 9 and discharges it; and the heat-conducting sheet 6 in the passage 5 increases the contact area with the cooling medium, so that more heat can be transferred. In addition, heat-conducting columns 7 are provided on the upper and lower surfaces of the heat-conducting copper plate 4, and the heat-conducting columns 7 are respectively embedded in the substrate 1 and the cover plate 2, thereby increasing the contact area between the heat-conducting copper plate 4 and the substrate 1 and the cover plate 2, thereby quickly conducting heat and dissipating heat to the substrate 1 and the cover plate 2.

[0025] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0026] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A liquid cooling plate with a heat dissipation structure, comprising an aluminum base plate (1) and a cover plate (2) bonded to each other, characterized in that: The base plate (1) is provided with a groove (3), a heat-conducting copper plate (4) is embedded in the groove (3), a passage (5) for the circulation of cooling medium is provided in the heat-conducting copper plate (4), a plurality of heat-conducting plates (6) are evenly distributed at equal angles in the passage (5) to increase the heat-conducting area; a plurality of heat-conducting columns (7) are fixedly connected to the top and bottom surfaces of the heat-conducting copper plate (4), and the heat-conducting columns (7) distributed up and down are respectively embedded in the base plate (1) and the cover plate (2).

2. The liquid cooling plate with heat dissipation structure according to claim 1, characterized in that: The substrate (1) is provided with a liquid inlet hole (8) and a liquid outlet hole (9) which are in communication with the passage (5), and a water nozzle (10) is sealedly mounted on the liquid inlet hole (8) and the liquid outlet hole (9).

3. The liquid cooling plate with heat dissipation structure according to claim 2, characterized in that: Six heat-conducting plates (6) are evenly distributed at equal angles in the straight-line passage (5) of the passage (5), and a plurality of heat-conducting columns (7) are evenly distributed at equal distances on the top and bottom surfaces of the heat-conducting copper plate (4).

4. The liquid cooling plate with heat dissipation structure according to claim 3, characterized in that: A sealing ring (11) for sealing the passage (5) is provided on the inner wall of the groove (3).

5. The liquid cooling plate with heat dissipation structure according to claim 4, characterized in that: The height of the heat-conducting copper plate (4) is greater than the depth of the groove (3), so that the heat-conducting copper plate (4) protrudes out of the groove (3) and is thus embedded in the cover plate (2).

6. The liquid cooling plate with heat dissipation structure according to claim 5, characterized in that: The base plate (1) and the cover plate (2) are attached to each other and fixedly connected by screws.

7. The liquid cooling plate with heat dissipation structure according to claim 6, characterized in that: The liquid inlet hole (8) and the liquid outlet hole (9) are arranged on the same side of the substrate (1).

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