Driving board heat dissipation structure and heat pump system

By adopting a two-stage fluorine cooling method in the heat dissipation structure of the drive plate, the problem of insufficient cooling effect in the prior art is solved, a more efficient heat dissipation effect is achieved, and the service life of the drive plate is extended.

CN222803258UActive Publication Date: 2025-04-25GUANGDONG PHNIX ECO ENERGY SOLUTION
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Patent Information

Application Number
CN202421352308.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-13
Publication Date
2025-04-25
Estimated Expiration
2034-06-13

AI Technical Summary

Technical Problem

The structure of the existing fluorine-cooled cooling drive plate is not effective enough when cooling the drive plate with abnormally high temperature, resulting in the drive plate being kept at high temperature for a long time and is easily damaged.

Method used

Using a two-stage fluorine cooling structure, the first stage is initially cooled through the first cooling pipeline, and the second stage is further cooled in the second cooling pipeline through the throttling coolant to achieve more efficient heat dissipation.

Benefits of technology

Through the two-stage cooling process, the temperature of the drive plate is significantly reduced, the service life of the drive plate is extended, and the stability and reliability of the system are improved.

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Abstract

The utility model discloses a drive board heat dissipation structure and a heat pump system, the heat dissipation structure comprises a heat dissipation piece, a first cooling pipeline, a throttling piece and a second cooling pipeline, and the heat dissipation piece is installed on a drive board; the first cooling pipeline is at least partially arranged in the heat dissipation piece, and the first cooling pipeline comprises a first inlet end and a first outlet end; the throttling element comprises a throttling inlet end and a throttling outlet end, and the throttling inlet end is connected with the first outlet end; the second cooling pipeline is at least partially arranged in the heat dissipation piece, the second cooling pipeline comprises a second inlet end and a second outlet end, and the second inlet end is connected with the throttling outlet end. According to the invention, the purpose of effectively cooling the driving plate is achieved through two stages of fluorine cooling.
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Description

Technical Field

[0001] The present application relates to the technical field of heat pump equipment, and in particular to a drive plate heat dissipation structure and a heat pump system. Background Art

[0002] In the variable frequency heat pump system, the fluorine cooling method of the driver board is an efficient and accurate heat dissipation technology, which is mainly used to reduce the temperature of the driver board during operation. However, the current structure of using fluorine cooling to cool the driver board is relatively simple during the cooling process. When it is necessary to cool the abnormally high temperature driver board, the cooling effect of a single stage often cannot achieve effective cooling purpose, resulting in the driver board still maintaining a high temperature, which is easy to damage the driver board if used for a long time. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a drive plate heat dissipation structure and a heat pump system, which achieve the purpose of effectively cooling the drive plate through two stages of fluorine cooling.

[0004] To achieve the above objectives, this application adopts the following technical solutions:

[0005] In one aspect, a driving board heat dissipation structure is provided, comprising: a heat dissipation element mounted on the driving board;

[0006] A first cooling pipeline, at least partially disposed inside the heat sink, the first cooling pipeline comprising a first inlet end and a first outlet end;

[0007] A throttling member, comprising a throttling inlet end and a throttling outlet end, wherein the throttling inlet end is connected to the first outlet end;

[0008] The second cooling pipeline is at least partially disposed inside the heat sink, and the second cooling pipeline includes a second inlet end and a second outlet end, and the second inlet end is connected to the throttling outlet end.

[0009] Furthermore, it also includes a control valve, which is connected between the throttling outlet end and the second inlet end, and is used to control the on-off of the pipeline between the throttling outlet end and the second inlet end.

[0010] Further, the control valve is an electrically controlled three-way valve, which includes a first port, a second port and a third port, the first port is connected to the throttling outlet end, the second port is connected to the second inlet end, and the third port and the second outlet end are connected to the evaporator.

[0011] Further, the electrically controlled three-way valve is configured to: obtain the temperature T of the driving plate, when T≤t1, the first port is connected to the third port; when T>t1, the first port is connected to the second port, wherein t1 is a preset temperature threshold.

[0012] Furthermore, the electrically controlled three-way valve is further configured such that: after the first port and the second port are connected, when T≤t2, the first port and the third port are connected, wherein t2<t1.

[0013] Furthermore, 70℃≤t1≤90℃, 30℃≤t2≤50℃.

[0014] Further, a pipeline between the second outlet end and the evaporator is provided with a one-way valve, and the one-way valve limits the refrigerant to flow from the second outlet end to the evaporator; and / or the first inlet end is connected to a condenser.

[0015] Further, the heat sink includes a first heat sink and a second heat sink that are staggered, the first cooling pipeline is at least partially arranged in the first heat sink, and the second cooling pipeline is at least partially arranged in the second heat sink; or the heat sink includes a first heat sink and a second heat sink that are arranged in parallel, the first cooling pipeline is at least partially arranged in the first heat sink, and the second cooling pipeline is at least partially arranged in the second heat sink; or the heat sink includes a first heat sink, the first cooling pipeline and the second cooling pipeline are both at least partially arranged in the first heat sink, and the pipelines located in the first heat sink are arranged in parallel or staggered.

[0016] Furthermore, the throttling element is an electronic expansion valve.

[0017] On the other hand, a heat pump system is also provided, comprising a condenser, an evaporator and a drive plate heat dissipation structure as described in any of the above items, wherein the first inlet end is connected to the condenser through a pipeline, and the second outlet end is connected to the evaporator through a pipeline.

[0018] The beneficial effects of the present application are as follows: the heat sink is mounted on the drive plate to assist the drive plate in dissipating heat; the first cooling pipeline is at least partially arranged inside the heat sink, and it has a first inlet end and a first outlet end; when the system is started, the fluorine-cooling medium enters the first cooling pipeline through the first inlet end to first perform a first stage of cooling on the drive plate; the throttling element is arranged at the first outlet end of the first cooling pipeline, and it has a throttling inlet end and a throttling outlet end; the function of the throttling element is to control the flow rate of the fluorine-cooling medium passing through and reduce the pressure, thereby reducing the temperature of the fluorine-cooling medium before entering the second cooling pipeline; the second cooling pipeline is also at least partially arranged inside the heat sink, and it has a second inlet end An end and a second outlet end, and the second inlet end is connected to the throttling outlet end, so that the throttled fluorine-cooling medium enters the second cooling pipeline, thereby performing a second stage of cooling on the drive plate. This cooling effect is more effective than the first stage. Through the arrangement of the first cooling pipeline and the second cooling pipeline, a two-stage fluorine-cooling cooling process is realized. The first stage is the cooling of the fluorine-cooling medium in the first cooling pipeline, and the second stage is the further cooling of the throttled fluorine-cooling medium in the second cooling pipeline. In the two cooling pipelines, the fluorine-cooling medium exchanges heat with the heat sink to take away the heat generated by the drive plate, which can more effectively reduce the temperature of the drive plate and prevent the drive plate from being damaged by high temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present application is further described in detail below based on the drawings and embodiments.

[0020] Figure 1 A schematic diagram of the heat dissipation structure of the drive board described in an embodiment of the present application (two-stage cooling);

[0021] Figure 2 Schematic diagram of the heat dissipation structure of the drive plate described in the embodiment of the present application (one-stage cooling);

[0022] Figure 3 A schematic diagram of a heat sink according to an embodiment of the present application;

[0023] Figure 4 This is a schematic diagram of the heat pump system described in an embodiment of the present application.

[0024] In the figure: 110, drive plate heat dissipation structure; 1, heat dissipation element; 101, first heat dissipation plate; 102, second heat dissipation plate; 2, first cooling pipeline; 201, first inlet end; 202, first outlet end; 3, throttling element; 301, throttling inlet end; 302, throttling outlet end; 4, second cooling pipeline; 401, second inlet end; 402, second outlet end; 5, electric-controlled three-way valve; 501, first port; 502, second port; 503, third port; 6, one-way valve; 7, three-way element; 8, evaporator; 9, condenser; 10, drive plate. DETAILED DESCRIPTION

[0025] In order to make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved more clearly, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0026] In the description of this application, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0028] like Figure 1-Figure 4 As shown, this embodiment provides a drive plate heat dissipation structure, including: a heat sink 1, a first cooling pipeline 2, a throttling device 3 and a second cooling pipeline 4, the heat sink 1 is installed on the drive plate 10; the first cooling pipeline 2 is at least partially arranged inside the heat sink 1, and the first cooling pipeline 2 includes a first inlet end 201 and a first outlet end 202; the throttling device 3 includes a throttling inlet end 301 and a throttling outlet end 302, and the throttling inlet end 301 is connected to the first outlet end 202; the second cooling pipeline 4 is at least partially arranged inside the heat sink 1, and the second cooling pipeline 4 includes a second inlet end 401 and a second outlet end 402, and the second inlet end 401 is connected to the throttling outlet end 302.

[0029] Based on the above scheme, when the variable frequency heat pump system is running, the drive plate 10 will generate heat due to work. In order to reduce this heat, the coolant first enters through the first inlet end 201 of the first cooling pipeline 2, and flows inside the heat sink 1 to absorb the heat generated by the drive plate 10. In the first stage cooling process, after the coolant absorbs heat from the drive plate 10, it flows out through the first outlet end 202 of the first cooling pipeline 2. At this time, the temperature of the coolant has increased, but it may not have reached a level sufficient to fully cool the drive plate 10. Therefore, the coolant then enters the throttling member 3. The function of the throttling member 3 is to increase the flow rate and reduce the pressure by reducing the flow area of ​​the coolant, and the temperature is further reduced. This effect of reducing the temperature is based on the throttling cooling principle in fluid dynamics. The coolant cooled by the throttling member 3 then enters the second cooling pipeline 4. In the second cooling pipeline 4, the coolant flows inside the heat sink 1 again to further absorb the heat of the drive plate 10. Since the temperature of the coolant is already low at this time, it can more effectively absorb heat from the drive plate 10, thereby achieving more efficient heat dissipation. Finally, the coolant flows out through the second outlet port 402 of the second cooling line 4, completing the entire heat dissipation cycle. Through two stages of fluorine cooling, the heat dissipation structure provided in the present application can more effectively reduce the temperature of the drive plate 10, avoid it being in a high temperature state for a long time, thereby extending the service life of the drive plate 10, and because the throttling device 3 is adopted, the flow rate and pressure of the coolant can be adjusted as needed, so as to achieve precise control of the heat dissipation effect, which helps to improve the stability and reliability of the system. In addition, the two cooling lines and the throttling device 3 are integrated inside the heat sink 1, making the entire heat dissipation structure more compact and saving space, and it is also conducive to improving the integration of the system. At the same time, environmentally friendly coolants such as tetrafluoroethane or trifluoromethane are used preferentially, which not only reduces pollution to the environment, but also improves the energy efficiency ratio of the system, achieving the goal of energy saving and emission reduction.

[0030] It is worth mentioning that the refrigerant entering the first cooling pipeline 2 from the first inlet port 201 is a high-temperature and high-pressure refrigerant, and its temperature is generally the water temperature in the heat pump system, with an error value within plus or minus 5°C and a maximum of no more than 95°C; and the refrigerant passing through the throttling device 3 becomes a low-temperature and low-pressure gas-liquid two-phase refrigerant, and its temperature is generally 5-9°C lower than the ambient temperature. That is to say, the temperature difference of the refrigerant in the two stages is relatively large, which can achieve the purpose of fully cooling the drive plate 10.

[0031] In addition, for the above-mentioned solution, in the actual application process, if Figure 2As shown, if the temperature of the driving plate 10 is within the normal temperature rise range, that is, it has not reached an abnormally high temperature, then there is no need to perform the second stage of cooling through the second cooling pipeline 4, because the refrigerant temperature in the second cooling pipeline 4 is relatively low, and it is easy to cause condensation on the driving plate 10 after cooling. Therefore, in view of this problem, a control valve is also specially provided, and the control valve is connected between the throttling outlet end 302 and the second inlet end 401, and the control valve is used to control the on-off of the pipeline between the throttling outlet end 302 and the second inlet end 401. In short, the function of the control valve is to select whether to enable the second stage of cooling of the second cooling pipeline 4 according to actual needs. When it is not needed, the control valve blocks the pipeline between the throttling outlet end 302 and the second inlet end 401, and the refrigerant cannot enter the second cooling pipeline 4, but directly enters the flow path of the next stage. When the second stage cooling effect is required, the control valve conducts the pipeline between the throttling outlet end 302 and the second inlet end 401 to ensure that the low-temperature refrigerant can enter the second cooling pipeline 4 to cool the driving plate 10.

[0032] Further, the control valve is an electrically controlled three-way valve 5, and the electrically controlled three-way valve 5 includes a first port 501, a second port 502 and a third port 503, the first port 501 is connected to the throttling outlet port 302, the second port 502 is connected to the second inlet port 401, and the third port 503 and the second outlet port 402 are connected to the evaporator 8; the electrically controlled three-way valve 5 is configured to: obtain the temperature T of the drive plate 10, when T≤t1, the first port 501 is connected to the third port 503; when T>t1, the first port 501 is connected to the second port 502, wherein t1 is a preset temperature threshold. In this solution, when T≤t1, the electrically controlled three-way valve 5 connects the first port 501 with the third port 503, which means that after the coolant is cooled by the throttling device 3, it will directly flow into the evaporator 8 through the third port 503, instead of entering the second cooling pipeline 4 again for secondary cooling. This design is to reduce unnecessary cooling processes and improve system efficiency when the temperature of the drive plate 10 is low. When T>t1, the electrically controlled three-way valve 5 connects the first port 501 with the second port 502. At this time, after the coolant is cooled by the throttling device 3, it will enter the second cooling pipeline 4 for secondary cooling, and then flow into the evaporator 8 through the second outlet port 402. This design is to more effectively reduce the temperature of the drive plate 10 by increasing the cooling process when the temperature of the drive plate 10 is high. By detecting the temperature of the driving board 10 in real time and automatically adjusting the working state of the electric-controlled three-way valve 5 according to the temperature, the intelligent control of the heat dissipation system is realized, and the automation level of the system is improved; when the temperature of the driving board 10 is low, unnecessary cooling processes are reduced, and the energy consumption of the system is reduced; when the temperature of the driving board 10 is high, the temperature is more effectively reduced by adding cooling processes, and the heat dissipation efficiency of the system is improved. At the same time, through precise temperature control and efficient heat dissipation effect, the driving board 10 is prevented from being in a high temperature state for a long time, thereby extending the service life of the driving board 10.

[0033] Furthermore, the electrically controlled three-way valve 5 is further configured such that: after the first port 501 and the second port 502 are connected, when T≤t2, the first port 501 and the third port 503 are connected, wherein t2<t1.

[0034] When the system starts running, the temperature T of the driving board 10 is first obtained in real time. Based on the above control settings, the following modes are included:

[0035] High-temperature heat dissipation mode (T>t1): When it is detected that the temperature T of the drive plate 10 exceeds the preset high-temperature threshold t1, the electrically controlled three-way valve 5 connects the first port 501 and the second port 502. After the coolant is cooled in the throttling device 3, it enters the second cooling pipeline 4 for secondary cooling to ensure that the drive plate 10 is adequately cooled.

[0036] Temperature drop mode (T≤t2, t2<t1): As the cooling process proceeds, the temperature of the drive plate 10 gradually drops. When the system detects that the temperature T drops to the preset low temperature threshold t2 (t2 is less than t1), the electrically controlled three-way valve 5 will adjust its working state again. At this time, the electrically controlled three-way valve 5 connects the first port 501 with the third port 503, and disconnects the connection with the second port 502, which means that after the coolant is cooled by the throttling member 3, it will no longer enter the second cooling pipeline 4, but directly flow into the evaporator 8 through the third port 503.

[0037] Normal heat dissipation mode (t2<T≤t1): When the temperature T of the driving board 10 is between t2 and t1, the electrically controlled three-way valve 5 maintains the conduction state between the first port 501 and the second port 502, and continues to execute the high-temperature heat dissipation mode to ensure that the temperature of the driving board 10 is stable within a safe range.

[0038] Specifically, 70℃≤t1≤90℃, 30℃≤t2≤50℃. The high temperature threshold t1 is set between 70℃ and 90℃, which means that when the temperature of the drive plate 10 exceeds this range, the electrically controlled three-way valve 5 will start the high temperature heat dissipation mode and guide the coolant to the second cooling line 4 for secondary cooling. The low temperature threshold t2 is set between 30℃ and 50℃. When the temperature of the drive plate 10 drops to this range, the electrically controlled three-way valve 5 will switch to the temperature reduction mode and guide the coolant directly to the evaporator 8 to reduce unnecessary secondary cooling. By setting a specific temperature threshold range, the electrically controlled three-way valve 5 can more accurately adjust its working state according to the temperature of the drive plate 10 to achieve more refined temperature control.

[0039] More specifically, t1 is set to 80°C and t2 is set to 40°C. These specific temperature thresholds are set based on common industrial applications and equipment heat dissipation requirements. In actual applications, they may need to be adjusted according to specific circumstances to adapt to different water temperatures and ambient temperatures, thereby achieving better heat dissipation purposes.

[0040] As an optional specific implementation scheme, the control valve is a solenoid valve, which uses the electromagnetic principle to achieve switch control. The solenoid valve is characterized by simple operation, fast response speed, accuracy and reliability.

[0041] As another optional specific implementation scheme, the control valve is an electronic stop valve, which has a similar structure to a manual stop valve. The difference is that the pipeline is opened and closed by driving the valve disc up and down through an electric actuator, which also serves to cut off the medium in the pipeline. The electronic stop valve can realize remote control and automatic operation.

[0042] Optionally, a one-way valve 6 is provided on the pipeline between the second outlet port 402 and the evaporator 8, and the one-way valve 6 limits the refrigerant from the second outlet port 402 to the evaporator 8; and / or the first inlet port 201 is connected to the condenser 9. This solution includes three different specific situations, the first one is that a one-way valve 6 is provided between the second outlet port 402 and the evaporator 8, and the first inlet port 201 is connected to the condenser 9; the second one is that only a one-way valve 6 is provided between the second outlet port 402 and the evaporator 8; the third one is that only the first inlet port 201 is connected to the condenser 9. Based on different actual needs, different matching schemes can be selected, that is, the first inlet port 201 does not necessarily have to be connected to the condenser 9, or the one-way valve 6 does not have to be set. However, in terms of effect, the effect of the first scheme is undoubtedly better. A one-way valve 6 is set on the pipeline between the second outlet port 402 and the evaporator 8 to ensure that the refrigerant only flows from the second outlet port 402 to the evaporator 8 to prevent the refrigerant from flowing back. This is very important for maintaining the normal operation of the system and improving efficiency. The condenser 9 plays a role in condensing the refrigerant from gas to liquid in the refrigeration system. Therefore, connecting the first inlet port 201 to the condenser 9 can ensure that the refrigerant has been condensed before entering the control valve, which is beneficial to the subsequent cooling process.

[0043] It is worth mentioning that preventing the refrigerant from flowing back is specifically to prevent the system from judging that the refrigerant flows back to the second outlet port 402 due to pressure reasons during the process of entering the evaporator 8 from the second port 502, thereby avoiding condensation caused by the excessively low temperature of the heat sink 1.

[0044] In addition, a tee piece 7 is provided, and three ports of the tee piece 7 are respectively connected to the evaporator 8, the third port 503 and the second outlet port 402, so as to achieve the purpose of reasonably connecting the pipelines.

[0045] In some embodiments, the heat sink 1 includes a staggered first heat sink 101 and a second heat sink 102, the first cooling pipeline 2 is at least partially disposed in the first heat sink 101, and the second cooling pipeline 4 is at least partially disposed in the second heat sink 102. Through the staggered first heat sink 101 and the second heat sink 102, and the cooling pipelines inside each, the heat sink 1 forms an efficient heat dissipation system. This design can ensure that heat is quickly and evenly transferred from the heat source to the heat sink, and is taken away by the cooling medium in the cooling pipeline. At the same time, the staggered connection method can also increase the heat conduction area between the heat sinks, further improving the heat dissipation efficiency.

[0046] As an optional specific implementation scheme, the heat sink 1 includes a first heat sink 101 and a second heat sink 102 arranged in parallel, the first cooling pipeline 2 is at least partially arranged in the first heat sink 101, and the second cooling pipeline 4 is at least partially arranged in the second heat sink 102. The heat sinks arranged in parallel make the manufacturing process simpler and reduce the production cost. At the same time, this design also makes the structure of the heat sink 1 more compact and easy to install and deploy. Since the heat sinks are parallel, the heat can be more evenly distributed on the two heat sinks. In addition, the first cooling pipeline 2 and the second cooling pipeline 4 are respectively arranged in different heat sinks, and can independently absorb and dissipate the heat in their respective areas, thereby improving the heat dissipation efficiency.

[0047] As another optional specific implementation scheme, the heat sink 1 includes a first heat sink 101, and the first cooling pipeline 2 and the second cooling pipeline 4 are at least partially arranged in the first heat sink 101, and the pipelines located in the first heat sink 101 are arranged in parallel. Since all cooling pipelines are integrated in a single first heat sink 101, the structure of the entire heat sink 1 becomes very compact, which is conducive to saving space and makes installation and deployment more convenient. The parallel pipeline design in the first heat sink 101 ensures that heat can be evenly and efficiently distributed on the entire heat sink. Although the pipelines are located in the same heat sink, the first cooling pipeline 2 and the second cooling pipeline 4 can still be independently controlled, and the flow rate, temperature and other parameters of the coolant are adjusted according to the heat dissipation requirements, thereby achieving more refined heat dissipation control. Moreover, since all pipelines are integrated in the same heat sink, maintenance personnel can more easily inspect and repair these pipelines, reducing maintenance costs and difficulties.

[0048] As another optional specific implementation scheme, the heat sink 1 includes a first heat sink 101, the first cooling pipeline 2 and the second cooling pipeline 4 are at least partially arranged in the first heat sink 101, and the pipelines in the first heat sink 101 are arranged in a staggered manner. The staggered pipelines enable the cooling medium to more fully contact the heat sink when flowing through the heat sink, thereby improving the heat exchange efficiency. This design can more effectively remove heat from the heat sink, ensuring the improvement of heat dissipation performance. At the same time, the staggered pipelines enable the heat to be more evenly distributed on the heat sink, avoiding the problem of local overheating or uneven heat dissipation, and improving the overall stability of the heat dissipation effect.

[0049] Specifically, the throttling element 3 is an electronic expansion valve. The working principle of the electronic expansion valve is to drive the valve needle or valve plate to move through an electric actuator (such as a stepper motor or a servo motor) to change the flow area of ​​the valve port, thereby realizing the control of the refrigerant flow. It can automatically adjust the opening of the valve port according to parameters such as the load change of the system and the change of the superheat of the refrigerant at the outlet of the evaporator 8, so that the refrigerant flow matches the system demand. The electronic expansion valve can quickly respond to changes in the system load, quickly adjust the refrigerant flow, ensure that the refrigerant temperature meets the cooling demand, and through the precise control of the electric actuator, the electronic expansion valve can realize precise regulation of the refrigerant flow and improve the refrigeration efficiency of the system.

[0050] On the other hand, a heat pump system is also provided, comprising a condenser 9, an evaporator 8 and a drive plate heat dissipation structure 110 as described in any of the above items, wherein the first inlet end 201 is connected to the condenser 9 via a pipeline, and the second outlet end 402 is connected to the evaporator 8 via a pipeline; wherein the evaporator 8 is specifically a fin heat exchanger, and the condenser 9 is a shell and tube heat exchanger.

[0051] In the description of this article, it should be understood that the terms "upper", "lower", "left", "right", etc., and other directions or positional relationships are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of this application. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0052] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0053] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0054] The technical principles of the present application are described above in conjunction with specific embodiments. These descriptions are only for explaining the principles of the present application and cannot be interpreted as limiting the scope of protection of the present application in any way. Based on the explanations herein, those skilled in the art can think of other specific implementation methods of the present application without creative work, and these methods will fall within the scope of protection of the present application.

Claims

1. A driving plate heat dissipation structure, characterized in that: include: A heat sink (1) is mounted on the driving plate (10); A first cooling pipeline (2), at least partially disposed inside the heat sink (1), the first cooling pipeline (2) comprising a first inlet end (201) and a first outlet end (202); A throttling member (3), comprising a throttling inlet end (301) and a throttling outlet end (302), wherein the throttling inlet end (301) is connected to the first outlet end (202); The second cooling pipeline (4) is at least partially arranged inside the heat sink (1), and the second cooling pipeline (4) comprises a second inlet end (401) and a second outlet end (402), and the second inlet end (401) is connected to the throttling outlet end (302).

2. The driving plate heat dissipation structure according to claim 1, characterized in that: It also includes a control valve, which is connected between the throttling outlet end (302) and the second inlet end (401), and is used to control the on-off of the pipeline between the throttling outlet end (302) and the second inlet end (401).

3. The driving plate heat dissipation structure according to claim 2, characterized in that: The control valve is an electrically controlled three-way valve (5), which comprises a first port (501), a second port (502) and a third port (503), wherein the first port (501) is connected to the throttling outlet port (302), the second port (502) is connected to the second inlet port (401), and the third port (503) and the second outlet port (402) are connected to the evaporator (8) at the confluence.

4. The driving plate heat dissipation structure according to claim 3, characterized in that: The electrically controlled three-way valve (5) is configured to: obtain the temperature T of the drive plate (10); when T≤t1, the first port (501) is connected to the third port (503); when T>t1, the first port (501) is connected to the second port (502), wherein t1 is a preset temperature threshold.

5. The driving plate heat dissipation structure according to claim 4, characterized in that: The electrically controlled three-way valve (5) is further configured such that: after the first port (501) and the second port (502) are connected, when T≤t2, the first port (501) and the third port (503) are connected, wherein t2<t1.

6. The driving plate heat dissipation structure according to claim 5, characterized in that: 70℃≤t1≤90℃, 30℃≤t2≤50℃.

7. The driving plate heat dissipation structure according to claim 3, characterized in that: A one-way valve (6) is provided in the pipeline between the second outlet port (402) and the evaporator (8), and the one-way valve (6) limits the refrigerant from flowing from the second outlet port (402) to the evaporator (8); and / or the first inlet port (201) is connected to the condenser (9).

8. The driving plate heat dissipation structure according to any one of claims 1 to 7, characterized in that: The heat sink (1) comprises a first heat sink (101) and a second heat sink (102) which are connected in an alternating manner, the first cooling pipeline (2) is at least partially arranged in the first heat sink (101), and the second cooling pipeline (4) is at least partially arranged in the second heat sink (102); or the heat sink (1) comprises a first heat sink (101) and a second heat sink (102) which are arranged in parallel, the first cooling pipeline (2) is at least partially arranged in the first heat sink (101), and the second cooling pipeline (4) is at least partially arranged in the second heat sink (102); or the heat sink (1) comprises a first heat sink (101), the first cooling pipeline (2) and the second cooling pipeline (4) are both at least partially arranged in the first heat sink (101), and the pipelines in the first heat sink (101) are arranged in parallel or in an alternating manner.

9. The driving plate heat dissipation structure according to any one of claims 1 to 7, characterized in that: The throttling element (3) is an electronic expansion valve.

10. A heat pump system, characterized in that: It comprises a condenser (9), an evaporator (8) and a drive plate heat dissipation structure (110) as claimed in any one of claims 1 to 9, wherein the first inlet end (201) is connected to the condenser (9) via a pipeline, and the second outlet end (402) is connected to the evaporator (8) via a pipeline.