3D (three-dimensional) heat conduction device

Abstract

The utility model discloses a 3D (three-dimensional) heat conduction device, which comprises a lower plate, an upper plate, at least one special-shaped cavity, at least one capillary support body and the like. Wherein the special-shaped cavity penetrates upwards from an opening in the back face of the upper plate to be combined and fixed, the upper plate and the lower plate are combined and sealed, meanwhile, the end, protruding out of the opening of the special-shaped cavity, of the capillary supporting body is combined and fixed to the interior of the lower plate, and after assembly and sealing, one end of the capillary supporting body abuts against the interior of the special-shaped cavity; the other end abuts against the interior of the lower plate. According to the heat conduction device, the strength of the special-shaped cavity is increased by utilizing the support of the capillary support body in the special-shaped cavity, the deformation resistance of the special-shaped cavity is improved, and the heat dissipation effect of the heat conduction device is improved through the capillary structure of the capillary support body.

Description

Technical Field

[0001] The utility model relates to a 3D thermal conductive device. Background Art

[0002] Existing 3D stereoscopic heat-conducting devices, such as Taiwan Patent Application No. 106112614, a heat-conducting structure and its manufacturing method, wherein the heat-conducting structure includes a temperature-averaging plate, a heat pipe and a working fluid, the temperature-averaging plate includes an upper shell and a lower shell, a cavity is formed between the lower shell and the upper shell, the upper shell is provided with a through hole connected to the cavity, a first capillary structure is laid on the inner surface of the upper shell, and the first capillary structure is provided with a through hole at the corresponding through hole position; the heat pipe includes a tube body and a second capillary structure, the second capillary structure is arranged in the tube body and extends out of the tube body to form an exposed section, the heat pipe passes through the through hole, and the exposed section passes through the through hole to be attached to the first capillary structure; the working fluid is filled in the cavity. Taiwan Patent Application No. 110117321, a three-dimensional heat dissipation device, including a temperature-averaging plate, a heat pipe and a solder joint. The temperature-averaging plate includes an inner chamber and a first joint, and the first joint has a channel connected to the inner chamber. The heat pipe has an inner space and a second joint, the second joint is sleeved and surrounds the first joint, so that the end face of the second joint directly contacts one side of the temperature plate. The inner space of the tube is connected to the inner chamber through a channel. A working fluid is filled in the inner space of the tube and the inner chamber, and the solder joint combines the heat pipe and the temperature plate into one. Taiwan Patent Application No. 111213245, a 3D temperature equalizing plate, includes a temperature equalizing plate and at least one tube body, the temperature equalizing plate has an upper plate covering a lower plate, the upper plate is provided with at least one opening penetrating the upper plate, the upper plate and the lower plate cover each other and jointly define a plate-shaped chamber connected to the opening, a working fluid and a capillary structure are provided in the plate-shaped chamber and are provided on the inner sides of the upper plate and the lower plate, the tube body has a closed end and an open end at each of its two ends, the open end expands outward to form a trumpet-shaped lip connected to the inner side of the upper plate, the closed end penetrates the opening on the inner side of the upper plate and extends outward, and the closed end and the open end jointly define a tubular chamber connecting the open end and the plate-shaped chamber, and a plurality of grooves are provided on the inner sides of the tubular chamber and the lip, the grooves of the lip are in contact with and connected to the capillary structure on the inner side of the upper plate. Patent application number 112208826 from Taiwan, China, is a penetrating 3D temperature equalizing plate structure, in which the protrusion of the lower plate of the temperature equalizing plate is tightly connected with the hollow tube body and penetrates the upper plate, allowing the working fluid and internal steam to flow in each cavity. At the same time, powder sintered bodies are laid at multiple locations such as the inner wall of the lower plate to enhance the occurrence of capillary phenomena.

[0003] Looking at the above existing heat conduction devices, the temperature averaging plates are all equipped with heat conduction pipes, and the adjacent parts of the heat conduction pipes and the temperature averaging plates are not flat. During the manufacturing and welding process, problems such as the addition of welding area materials and the difficulty in handling solder will occur, which easily leads to the disadvantages of labor-consuming and time-consuming manufacturing process and increasing equipment. In addition, the traditional heat conduction pipe has another disadvantage of being narrow and small, and the insufficient external heat dissipation area will also limit the heat dissipation efficiency.

[0004] The utility model mainly aims at the shortcomings of the above-mentioned existing temperature equalizing plates and provides a 3D thermal conductive device. Utility Model Content

[0005] The main purpose of the utility model is to provide a 3D thermal conductive device, which can form a flat welding area plane design around the opening end of the special-shaped cavity and the joint with the upper plate, so as to improve the complex structure and manufacturing procedures of the welding point in the traditional manufacturing process and improve production efficiency.

[0006] Another purpose of the utility model is to provide a 3D thermal conductive device, which utilizes the design of a structure in which a capillary support body is arranged in a special-shaped cavity. Through the support of the capillary support body, the strength of the special-shaped cavity is increased to enhance the ability of the special-shaped cavity to resist deformation.

[0007] Another purpose of the utility model is to provide a 3D thermal conductive device, which utilizes the design of a capillary support structure in a special-shaped cavity to increase the speed at which the liquid working fluid returns to the temperature equalizing plate chamber through the capillary structure of the support body, thereby enhancing the heat dissipation effect of the thermal conductive device.

[0008] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0009] A 3D thermal conductive device comprises: a lower plate, an upper plate, at least one special-shaped cavity and at least one capillary support body; wherein:

[0010] The lower plate has a temperature-averaging chamber formed inside and has an opening;

[0011] The upper plate has at least one opening formed thereon and passes through the upper plate;

[0012] The at least one special-shaped cavity has an opening at one end and is closed on the other sides, forming a special-shaped cavity chamber inside;

[0013] The at least one capillary support body is disposed inside the special-shaped cavity, one end of which is against the inside of the closed end opposite to the open end of the special-shaped cavity, and the other end protrudes from the open end of the special-shaped cavity;

[0014] The special-shaped cavity is inserted upward from the opening on the back of the upper plate and fixed together, and the upper plate is assembled and sealed together with the lower plate. At the same time, the end of the capillary support body protruding from the opening of the special-shaped cavity is fixed to the inside of the lower plate, so that after the assembly and sealing, one end of the capillary support body supports the inside of the special-shaped cavity, and the other end supports the inside of the lower plate.

[0015] Preferably, the shape of the opening end of the special-shaped cavity matches the opening of the upper plate.

[0016] Preferably, the special-shaped cavity has a thin-walled cavity structure, and is a rectangular body, a tube or other irregular shapes.

[0017] Preferably, a chamber capillary structure is arranged inside the shell of the lower plate, a lower plate capillary structure is arranged on the side of the upper plate facing the opening of the lower plate, and a capillary structure is arranged inside the special-shaped cavity to form a complete internal capillary structure together with the support body capillary structure arranged on the capillary support body.

[0018] Preferably, the length of the capillary support body protruding from the opening end of the special-shaped cavity matches the thickness of the temperature equalizing plate chamber of the lower plate.

[0019] Preferably, a flange is formed around the opening end of the special-shaped cavity, a groove is formed around the opening of the upper plate facing the opening end of the lower plate, and the flange and the groove can form a plane after matching.

[0020] Preferably, the capillary support body forms a support body capillary structure along the long axis direction of the special-shaped cavity, and forms a fixing portion along the short axis direction of the special-shaped cavity.

[0021] Preferably, a capillary structure is arranged at a predetermined position inside the temperature equalizing plate composed of the upper and lower plates, a capillary structure is arranged inside the special-shaped cavity, and a capillary structure of a support body is arranged at a predetermined position of the capillary support body.

[0022] Preferably, the capillary support body is connected by welding, bonding or other connection and fixing methods.

[0023] Preferably, the special-shaped cavity is manufactured by deep-drawing a plate through a mold to form a thin-walled cavity having only one open end and a flat closed end.

[0024] The utility model increases the strength of the special-shaped cavity and improves the heat dissipation effect of the heat-conducting device, and utilizes a relatively simple manufacturing method of the special-shaped cavity to improve production efficiency and reduce production costs.

[0025] For detailed description, the following embodiments are given for illustration, but the following embodiments are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above structure and advantages of the utility model will become obvious and easy to understand from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0027] Figure 1 It is a three-dimensional exploded schematic diagram of the 3D thermal conductive device of the utility model;

[0028] Figure 2 It is a three-dimensional combination schematic diagram of the 3D thermal conductive device of the utility model;

[0029] Figure 3 This utility model Figure 2 3-3 sectional view;

[0030] Figure 4 This is a three-dimensional exploded schematic diagram of another embodiment of the 3D thermal conductive device of the utility model;

[0031] Figure 5 This utility model Figure 4 An upper plate is added to provide a three-dimensional exploded schematic diagram of the back side of A viewed from bottom to top.

[0032] The reference numerals in the above drawings are explained as follows:

[0033] 10-lower plate, 20-upper plate, 30-special-shaped cavity, 40-capillary support, 50-temperature balancing plate;

[0034] 11-temperature balancing chamber, 12-chamber capillary structure;

[0035] 21-opening, 22-capillary structure of lower plate, 23-groove;

[0036] 31-special-shaped cavity chamber, 32-flange, 33-capillary structure;

[0037] 41-supporting body capillary structure, 42-fixing part. DETAILED DESCRIPTION

[0038] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be interpreted as limiting the present invention.

[0039] The utility model provides a 3D thermal conductive device, please also refer to Figure 1 , Figure 2 and Figure 3 ;like Figure 1 As shown, it is a three-dimensional exploded schematic diagram of the 3D thermal conductive device; Figure 2 As shown, it is a three-dimensional combination schematic diagram of the 3D thermal conductive device; Figure 3 As shown, Figure 23-3 cross-sectional view. The 3D thermal conductive device comprises: a lower plate 10, an upper plate 20, at least one special-shaped cavity 30 and at least one capillary support body 40. Among them, the lower plate 10 is a thin sheet shell, and a temperature equalizing plate chamber 11 is formed inside, and has an opening. The upper plate 20 is a thin sheet cover, and its size can just cover the shell opening of the lower plate 10. At least one opening 21 is opened on the upper plate 20 and penetrates the upper plate 20. The size and shape of the opening 21 correspond to the special-shaped cavity 30 described later. The upper plate 20 covers the lower plate 10 and is sealed to form a structure of a temperature equalizing plate 50. The special-shaped cavity 30 is open at one end and closed on the other sides, and a special-shaped cavity chamber 31 is formed inside. The shape of the opening end of the special-shaped cavity 30 matches the opening 21 of the upper plate 20 mentioned above. The special-shaped cavity 30 is preferably manufactured by deep extension to form a cavity structure with a thin wall; and it is a rectangular body, a tube or other irregular shapes. For example, one of the preferred shapes can be a thin rectangular body. The utility model is illustrated by a rectangular body, but it is not used to limit the utility model. Any design of any shape that can maximize the volume of the special-shaped cavity chamber 31 inside the hollow interior of the special-shaped cavity 30 and maximize the heat dissipation area outside the special-shaped cavity 30 is feasible. The material of the lower plate 10, the upper plate 20 and the special-shaped cavity 30 can be made of copper, aluminum, stainless steel or other alloys with better heat dissipation. The capillary support body 40 is arranged at a predetermined position inside the special-shaped cavity 30, one end of which presses against the inside of the closed end opposite to the open end of the special-shaped cavity 30, and the other end protrudes from the open end of the special-shaped cavity 30, and the protruding length matches the thickness of the temperature-averaging plate chamber 11 of the lower plate 10. Therefore, when the combined sealing of the utility model is completed, one end of the capillary support body 40 presses against the inside of the special-shaped cavity 30, and the other end presses against the inside of the lower plate 10 (see FIG. Figure 3), and its supporting force is used to increase the ability of the special-shaped cavity 30 to resist deformation. The capillary support body 40 forms a support body capillary structure 41 on the left and right sides along the long axis direction of the special-shaped cavity 30. When the special-shaped cavity 30 is assembled, it can cooperate with the capillary structure inside the upper plate 10 and the lower plate 20 to form a complete capillary structure inside the special-shaped cavity 30. The front and rear surfaces of the capillary support body 40 in contact with the inner surface of the special-shaped cavity 30 along the short axis direction of the special-shaped cavity 30 form a fixing part 42 to connect and fix the capillary support body 40 at a predetermined position inside the special-shaped cavity 30. Because the fixing part 42 and the inner surface of the special-shaped cavity 30 are both planes, it is relatively easy to fix the capillary support body 40 inside the special-shaped cavity 30 by welding, bonding or other methods. Because the fixing part 42 and the inner surface of the special-shaped cavity 30 are both planes, and the welding operation of the plane is relatively simple in practice, the manufacturing process can be simplified and the operation is also relatively easy. When the heat conducting device is actually used, it is easy for the heat conducting device to deform due to the internal negative pressure because of the large amount of heat generated by the electronic device, causing damage to the equipment. This is one of the main disadvantages of the existing device. The utility model increases the strength of the special-shaped cavity 30 through the support of the capillary support body 40, which can resist the occurrence of deformation and improve the shortcomings of the existing device. In addition, the capillary support body 40 has a support body capillary structure 41, which can increase the speed of the liquid working fluid returning to the temperature equalizing plate chamber 11, and enhance the heat dissipation effect of the 3D three-dimensional heat conducting device of the utility model. This embodiment uses a capillary support body 40 as an example. One or more capillary support bodies 40 are feasible as long as the number can match the selection and design of the internal space of the special-shaped cavity 30. The combination method is that at least one capillary support body 40 is first arranged at a predetermined position inside the special-shaped cavity 30, one end of which is against the inside of the closed end opposite to the opening end of the special-shaped cavity 30, and the other end protrudes from the opening end of the special-shaped cavity 30, and the protruding length matches the thickness of the temperature-averaging plate chamber 11 of the lower plate 10. The capillary support body 40 can be arranged and combined by welding, bonding or other methods of combination and fixation. Then, the special-shaped cavity 30 is inserted upward through the opening 21 on the back of the upper plate 20, and the opening end of the special-shaped cavity 30 and the opening 21 of the upper plate 20 can be flush on the back of the upper plate 20, so as to facilitate the subsequent combination operation (such as welding) of the two to proceed smoothly. Then, the special-shaped cavity 30 is combined with the upper plate 20, and the preferred method can be welding. Of course, other methods that can combine and fix the special-shaped cavity 30 and the upper plate 20 together and airtight are all feasible.Finally, the upper plate 20 is assembled with the lower plate 10 for welding and sealing, and at the same time, the end of the capillary support body 40 protruding from the opening of the special-shaped cavity 30 is fixed to the inside of the lower plate 10 to form a uniform temperature plate 50, and the degassing pipe is used to perform the operation steps of degassing, vacuuming and filling the working fluid, so that the uniform temperature plate 50 and at least one special-shaped cavity 30 thereon form an integral heat dissipation device, and at this time, the space of the uniform temperature plate chamber 11 will be interconnected with the space of the special-shaped cavity chamber 31, and it is in a state of containing a predetermined amount of working fluid in a closed vacuum. The working fluid can be selected as pure water or other fluids that are easy to convert into two phases. Of course, in order to enhance the heat dissipation effect, a chamber capillary structure 12 can be set inside the shell of the lower plate 10, a lower plate capillary structure 22 can be set on the side of the upper plate 20 facing the opening of the lower plate 10, and a capillary structure 33 (such as) can be set inside the special-shaped cavity 30. Figure 3 As shown). Such capillary structures can be metal braids, powder sintered bodies or groove structures. At this time, one end of the support body capillary structure 41 is in contact with the internal capillary structure 33 of the special-shaped cavity 30, and the other end is in contact with the chamber capillary structure 12 inside the lower plate 10, forming a complete internal capillary structure. When in use, one side of the temperature equalizing plate 50 is the condensation end, and the other side is the evaporation end, and the support body capillary structure 41 inside the special-shaped cavity 30 assists the liquid phase working fluid to flow back to the temperature equalizing plate chamber 11 quickly, so as to achieve the purpose of rapid heat dissipation. Of course, the utility model can also add heat dissipation fins outside the special-shaped cavity 30 to increase the heat dissipation area and assist in heat dissipation.

[0040] Please also see Figure 4 and Figure 5 , Figure 4 This is a three-dimensional exploded schematic diagram of another embodiment of the 3D thermal conductive device of the utility model; Figure 5 for Figure 4 A three-dimensional exploded diagram of the back side of A viewed from the bottom up with an additional upper plate added. The 3D thermal conductive device of this embodiment also comprises: a lower plate 10, an upper plate 20, at least one special-shaped cavity 30 and at least one capillary support body 40. The main difference is that a flange 32 is formed around the opening end of the special-shaped cavity 30, and a groove 23 (such as a groove 23) matching the shape, size and depth of the flange 32 is formed around the opening 21 of the upper plate 20 facing the opening end of the lower plate 10. Figure 5As shown by arrow A when looking from bottom to top). Therefore, when the opening end of the special-shaped cavity 30 is inserted into the opening 21 of the upper plate 20, the flange 32 of the special-shaped cavity 30 can be inserted into the groove 23 of the upper plate 20, and the two can form a plane after being inserted, which is convenient for the welding operation and can make the special-shaped cavity 30 and the temperature plate 50 more firmly combined. Among them, the flange 32 around the opening end of the special-shaped cavity 30 expands outward and forms a predetermined angle. The predetermined angle can form a flat welding area plane with the groove 23 formed around the opening 21 of the upper plate 20, on the plane of the upper plate 20 facing the opening end of the lower plate 10, so as to facilitate the welding operation and improve the current industry's shortcomings in 3D three-dimensional heat-conducting structures that are not easy to weld. And the predetermined angle can preferably be selected to be 90 degrees with the special-shaped cavity 30, so the groove 23 is also a 90-degree recessed plane on the side of the upper plate 20 facing the opening end of the lower plate 10, so that the two can form a plane after being inserted.

[0041] In summary, the utility model provides a 3D thermal conductive device, which can increase the setting of the capillary support body by maximizing the internal volume of the hollow special-shaped cavity, and utilize the support of the capillary support body to increase the strength of the special-shaped cavity, improve the ability of the special-shaped cavity to resist deformation, and be suitable for industrial utilization. The capillary structure of the support body in the special-shaped cavity of the utility model can increase the speed of the liquid working fluid returning to the chamber of the temperature equalizing plate, and enhance the heat dissipation effect of the thermal conductive device. At the same time, the increase in the chamber space of the special-shaped cavity can also effectively improve the heat dissipation efficiency, improve the existing shortcomings of the narrow tube of the temperature equalizing plate, and the liquid working fluid cannot flow back smoothly, thereby causing empty burning, equipment damage, etc., which is more effective than the existing technology and is progressive.

[0042] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention. However, these changes do not deviate from the essential concept and scope of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A 3D thermal conductive device, comprising: a lower plate, an upper plate, at least one special-shaped cavity and at least one capillary support body; wherein: The lower plate has a temperature-averaging chamber formed inside and has an opening; The upper plate is provided with at least one opening penetrating through the upper plate; The at least one special-shaped cavity has an opening at one end and is closed on the other sides, forming a special-shaped cavity chamber inside; the characteristic is that: The at least one capillary support body is disposed inside the special-shaped cavity, one end of which bears against the inside of the closed end opposite to the open end of the special-shaped cavity, and the other end protrudes from the open end of the special-shaped cavity; The special-shaped cavity is inserted upward from the opening on the back of the upper plate and fixed together, and the upper plate is assembled and sealed together with the lower plate. At the same time, the end of the capillary support body protruding from the opening of the special-shaped cavity is fixed to the inside of the lower plate, so that after the assembly and sealing, one end of the capillary support body supports the inside of the special-shaped cavity, and the other end supports the inside of the lower plate.

2. The 3D thermal conductive device according to claim 1, characterized in that: The shape of the opening end of the special-shaped cavity matches the opening of the upper plate.

3. The 3D thermal conductive device according to claim 1, characterized in that: The special-shaped cavity has a thin-walled cavity structure, and is a rectangular body, a tube body or other irregular shapes.

4. The 3D thermal conductive device according to claim 1, wherein: A chamber capillary structure is arranged inside the shell of the lower plate, a lower plate capillary structure is arranged on the side of the upper plate facing the opening of the lower plate, and a capillary structure is arranged inside the special-shaped cavity to form a complete internal capillary structure together with the support body capillary structure arranged on the capillary support body.

5. The 3D thermal conductive device according to claim 1, wherein: The length of the capillary support body protruding from the opening end of the special-shaped cavity is matched with the thickness of the temperature-averaging plate chamber of the lower plate.

6. The 3D thermal conductive device according to claim 1, characterized in that: A flange is formed around the opening end of the special-shaped cavity, a groove is formed around the opening of the upper plate facing the opening end of the lower plate, and the flange and the groove can form a plane after matching.

7. The 3D thermal conductive device according to claim 1, characterized in that: The capillary support body forms a support body capillary structure along the long axis direction of the special-shaped cavity, and forms a fixing part along the short axis direction of the special-shaped cavity.

8. The 3D thermal conductive device according to claim 1, characterized in that: A capillary structure is arranged at a predetermined position inside the temperature equalizing plate composed of the upper and lower plates, a capillary structure is arranged inside the special-shaped cavity, and a capillary structure of a supporting body is arranged at a predetermined position of the capillary supporting body.

9. The 3D thermal conductive device according to claim 1, characterized in that: The capillary support body is combined by welding, bonding or other combination and fixing methods.

10. The 3D thermal conductive device according to claim 1, characterized in that: The special-shaped cavity is manufactured by deep-drawing a plate through a mold to form a thin-walled cavity with only one open end and a flat closed end.

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