Auxiliary heat dissipation structure of controller circuit board

Abstract

The utility model relates to the technical field of circuit board protection, in particular to a controller circuit board auxiliary heat dissipation structure which comprises a base, a circuit board is arranged on the upper portion of the base in a composite mode, a plurality of supporting pieces are symmetrically installed at the lower end of the base, and the distance between every two adjacent supporting pieces is the same. A heat dissipation fan is fixed among the three supporting pieces of which one side is located in the middle through a mounting frame; a plurality of heat dissipation fins are arranged at the lower end of the base, the heat dissipation fins are arranged in the long edge direction of the base, and the outer portions of the heat dissipation fins are arranged in an arc shape. According to the utility model, the heat-conducting base is additionally arranged at the bottom of the circuit board, and the corresponding heat dissipation structure is arranged below the base, so that heat generated by the circuit board is completely taken away in the air convection process, and the heat dissipation effect is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board protection, in particular to an auxiliary heat dissipation structure of a controller circuit board. Background Art

[0002] The controller circuit board is the core part of an electronic device used to integrate and connect electronic components. It is responsible for providing physical support for electronic components, making electrical connections, and may contain a microprocessor or integrated circuit to control the operation of the device. Controller circuit boards are widely used in various electronic devices, such as industrial control systems, household appliances, computer hardware, and automotive electronics.

[0003] In the prior art, the heat dissipation solution adopted by some circuit boards is to directly add a variety of heat dissipation structures on the upper part of the circuit board. Although this method can solve the heat dissipation problem, the structure acting on the upper part of the circuit board will increase the load of the circuit board. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes an auxiliary heat dissipation structure for a controller circuit board.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A controller circuit board auxiliary heat dissipation structure is designed, including a base, and a circuit board is compositely arranged on the upper part of the base:

[0007] A plurality of support members are symmetrically mounted at the lower end of the base, and the spacing between two adjacent support members is set to be the same. A cooling fan is fixed between three support members located in the middle on one side through a mounting frame;

[0008] A plurality of heat dissipation fins are arranged at the lower end of the base, and the heat dissipation fins are arranged along the long side direction of the base, and the outer parts of the heat dissipation fins are arranged in an arc shape.

[0009] Preferably, a through slot is provided inside the heat dissipation fin.

[0010] Preferably, a connecting plate is installed between the bottoms of the plurality of heat dissipation fins.

[0011] Preferably, the base is made of aluminum.

[0012] Preferably, the support member is arranged in a vertical column, and the bottom of the support member is mounted on the connecting frame.

[0013] Preferably, a gap is provided between the support member and the heat dissipation fan.

[0014] The utility model proposes an auxiliary heat dissipation structure for a controller circuit board, which has the beneficial effect that a heat-conducting base is added to the bottom of the circuit board, and a corresponding heat dissipation structure is arranged below the base, so that the heat generated by the circuit board can be completely taken away during air convection, thereby achieving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The utility model is a schematic diagram of the structure of a controller circuit board auxiliary heat dissipation structure.

[0016] Figure 2 The utility model provides a structural side view of a controller circuit board auxiliary heat dissipation structure.

[0017] Figure 3 This is a bottom view of the structure of a controller circuit board auxiliary heat dissipation structure proposed by the utility model.

[0018] Figure 4 This is a structural front view of a controller circuit board auxiliary heat dissipation structure proposed by the utility model.

[0019] In the figure: base 1, circuit board 2, support member 3, heat dissipation fins 4, slots 5, connecting plate 6, mounting frame 7, and heat dissipation fan 8. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0021] Example 1

[0022] Reference Figure 1-4 A controller circuit board auxiliary heat dissipation structure includes a base 1, and a circuit board 2 is compositely arranged on the upper part of the base 1: the material of the base 1 is aluminum.

[0023] A plurality of support members 3 are symmetrically mounted on the lower end of the base 1, and the spacing between two adjacent support members 3 is set to be the same. A cooling fan 8 is fixed between three support members 3 located in the middle on one side through a mounting frame 7;

[0024] A plurality of heat dissipation fins 4 are disposed at the lower end of the base 1 , and the heat dissipation fins 4 are disposed along the long side direction of the base 1 , and the exterior of the heat dissipation fins 4 is disposed in an arc shape.

[0025] The support member 3 is arranged in a vertical column, and the bottom of the support member 3 is installed on the connecting frame.

[0026] The material of the base 1 is aluminum, which has excellent thermal conductivity. After the heat generated by the circuit board 2 is transferred to the base 1, the power of the heat dissipation fan 8 arranged on one side of the base 1 is turned on, which will increase the speed of air convection under the base 1. At the same time, the heat dissipation fins 4 arranged along the long side direction of the base 1 can increase the area in contact with the air. At the same time, slots 5 are opened on the inner side of the heat dissipation fins 4. Both the slots 5 and the heat dissipation fins 4 are arc-shaped, which increases the surface area in contact with the air. When the heat dissipation fan 8 is turned on, the heat can be taken away.

[0027] Example 2

[0028] refer to Figure 1-4 The difference between this embodiment and embodiment 1 is that a through slot 5 is provided inside the heat sink fin 4, a connecting plate 6 is installed between the bottoms of the plurality of heat sink fins 4, and a gap is provided between the support member 3 and the heat sink fan 8. In order to prevent the heat sink fin 4 from deforming and bending, the connecting plate 6 connected to the lower end of the bottom heat sink fin 4 can limit the heat sink fin 4. The bottom of the support member 3 is fixed to the internal connection frame of the controller by screws or bonding, so that there is space for air convection at the lower end of the base 1.

[0029] The working principle of the device is:

[0030] The material of the base 1 is aluminum, which has excellent thermal conductivity. After the heat generated by the circuit board 2 is transferred to the base 1, the power of the heat dissipation fan 8 arranged on one side of the base 1 is turned on, which will increase the speed of air convection under the base 1. At the same time, the heat dissipation fins 4 arranged along the long side direction of the base 1 can increase the area in contact with the air. At the same time, slots 5 are opened on the inner side of the heat dissipation fins 4. Both the slots 5 and the heat dissipation fins 4 are arc-shaped, which increases the surface area in contact with the air. When the heat dissipation fan 8 is turned on, the heat can be taken away.

[0031] In order to prevent the heat sink 4 from being deformed and bent, the connecting plate 6 connected to the lower end of the bottom heat sink 4 can limit the heat sink 4. The bottom of the support member 3 is fixed to the internal connection frame of the controller by screws or bonding, so that there is space for air convection at the lower end of the base 1.

[0032] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A controller circuit board auxiliary heat dissipation structure, comprising a base (1), a circuit board (2) being compositely arranged on the upper part of the base (1), characterized in that: A plurality of support members (3) are symmetrically mounted at the lower end of the base (1), the spacing between two adjacent support members (3) is set to be the same, and a heat dissipation fan (8) is fixed between three support members (3) located in the middle on one side via a mounting frame (7); A plurality of heat dissipation fins (4) are arranged at the lower end of the base (1), and the heat dissipation fins (4) are arranged along the long side direction of the base (1), and the exterior of the heat dissipation fins (4) is arranged in an arc shape.

2. The controller circuit board auxiliary heat dissipation structure according to claim 1, characterized in that: A through slot (5) is provided inside the heat dissipation fin (4).

3. The auxiliary heat dissipation structure of the controller circuit board according to claim 2, characterized in that: A connecting plate (6) is installed between the bottoms of the plurality of heat dissipation fins (4).

4. The controller circuit board auxiliary heat dissipation structure according to claim 3, characterized in that: The material of the base (1) is aluminum.

5. The controller circuit board auxiliary heat dissipation structure according to claim 4, characterized in that: The support member (3) is arranged in a vertical column, and the bottom of the support member (3) is mounted on a connecting frame.

6. The controller circuit board auxiliary heat dissipation structure according to claim 5, characterized in that: A gap is provided between the support member (3) and the heat dissipation fan (8).

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