Photovoltaic diode module

Abstract

The utility model relates to a photovoltaic diode module which comprises a lead frame. The lead frame is provided with a base island, and the two sides of the base island are respectively provided with a bus bar through hole. A chip is arranged on the base island; the chip is located between the two bus bar through holes; a plastic package body is arranged outside the chip; the plastic package body wraps the side edge, adjacent to the base island, of the bus bar through hole. The edge of the lead frame is provided with a notch; and positioning holes are arranged at four vertex angles of the lead frame. Through comprehensive application of the technical scheme, miniaturization and efficient heat dissipation of the module and high automation and high efficiency of the production process are successfully realized.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, in particular to a bypass diode module for a photovoltaic junction box. Background Art

[0002] With the rapid development of the photovoltaic industry, the requirements for miniaturization, high efficiency and reliability of junction boxes and their internal components are increasing. Traditional photovoltaic diode modules often have deficiencies in volume, heat dissipation performance and adaptability to automated production, which limits the overall performance and production efficiency of photovoltaic systems. Therefore, it is particularly important to develop a photovoltaic diode module that can meet the needs of miniaturization, enhance heat dissipation capabilities and facilitate automated production. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a photovoltaic diode module which has the characteristics of miniaturization, high efficiency heat dissipation and easy automatic production.

[0004] The technical solution adopted by the utility model to solve its technical problems is: a photovoltaic diode module, including a lead frame; the lead frame is provided with a base island, and bus bar perforations are respectively provided on both sides of the base island; a chip is provided on the base island; the chip is located between two bus bar perforations; a plastic package is provided outside the chip; the plastic package wraps the side of the bus bar perforation adjacent to the base island; a notch is provided on the edge of the lead frame; and positioning holes are provided at the four vertex positions of the lead frame.

[0005] Furthermore, the chip and the lead frame described in the utility model are connected via copper jumpers.

[0006] Furthermore, the number of the chips in the utility model is one or two; the two chips are vertically distributed on the base island.

[0007] Furthermore, the base island of the utility model is provided with convex dots in a dot matrix shape.

[0008] Furthermore, the frame of the utility model is provided with positive and negative pole markings.

[0009] Furthermore, the utility model arranges multiple lead frames in a structure of five columns and six rows; after arrangement, the upper edge of the lead frame in the first column and the lower edge of the lead frame in the fifth column are provided with anti-fool structures at corresponding positions, and the anti-fool structures are grooves; after arrangement, the connecting ribs between the columns of the lead frames are away from the chip and the plastic package.

[0010] The beneficial effects of the utility model are that it solves the defects existing in the background technology, and while ensuring the creepage distance required by the safety standards, it minimizes the module volume to adapt to the trend of miniaturization of photovoltaic junction boxes; significantly improves the grouping efficiency of welding operations and improves the overall assembly efficiency; can adapt to dual-core packaging with different electrical performance requirements, and is convenient for adjusting product performance according to actual needs; enhances the bonding strength between the plastic package and the frame to ensure structural stability and reliability under long-term use; can quickly and accurately perform circuit connections to reduce assembly errors; introduces a fool-proofing mechanism into the frame design to ensure that misalignment or reverse installation can be effectively avoided during the automated packaging and testing process, thereby improving the automation level of the production line and product quality;

[0011] Precise installation and positioning simplifies the installation process and improves assembly accuracy and efficiency. The arrangement of dot matrix bumps on the base island optimizes the contact performance of the electrical connection and acts as a stress buffer to extend the service life. The ribs are minimized and located away from the chip and the plastic package, which reduces the damage to the plastic package that may be caused during the rib cutting and molding process and protects the integrity of the plastic package. The module is successfully miniaturized, heat dissipated efficiently, and the production process is highly automated and efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of the prior art;

[0013] Figure 2 It is a structural schematic diagram of the utility model;

[0014] Figure 3 It is a structural schematic diagram of the lead frame of the utility model;

[0015] Figure 4 This is a schematic structural diagram of the lead frame of the utility model from another perspective;

[0016] Figure 5 This is a schematic diagram of the layout structure of the lead frame of the utility model;

[0017] In the figure: 1. Lead frame; 2. Base island; 3. Bus bar perforation; 4. Plastic package; 5. Notch; 6. Positioning hole; 7. Dot matrix bump; 8. Positive and negative pole identification; 9. Groove; 10. Connecting rib. DETAILED DESCRIPTION

[0018] Now the utility model is further described in detail in conjunction with the accompanying drawings and preferred embodiments. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the utility model in a schematic manner, and therefore only show the components related to the utility model.

[0019] like Figure 2-Figure 4A photovoltaic diode module shown includes a lead frame 1; the lead frame is provided with a base island 2, and bus bar through-holes 3 are respectively provided on both sides of the base island; a chip is provided on the base island; the chip is located between two bus bar through-holes; a plastic encapsulation body 4 is provided outside the chip; the plastic encapsulation body wraps the side of the bus bar through-hole adjacent to the base island. Figure 1 The original design structure is shown. Figure 1 It can be seen that the original busbar perforation design is far away from the plastic package, while in this embodiment, the plastic package surrounds the two busbar perforations, which can significantly shorten the total length of the diode; through the precise design and adjustment of the plastic package, while ensuring the creepage distance required by the safety standard, the module volume is minimized to adapt to the trend of miniaturization of photovoltaic junction boxes. In addition, the exposed area of ​​the copper sheet is increased, which significantly improves the heat dissipation efficiency of the module.

[0020] The edge of the lead frame 1 is provided with a notch 5; the edge of the frame is specially treated to enhance the bonding strength between the plastic package and the frame, thereby ensuring the structural stability and reliability under long-term use.

[0021] Positioning holes 6 are provided at the four vertex positions of the lead frame 1. The positioning holes are added for accurate installation and positioning, simplifying the installation process and improving assembly accuracy and efficiency.

[0022] The lead frame 1 is provided with positive and negative electrode markings 8, and the positive and negative electrode markings are clearly marked on the frame to facilitate quick and accurate circuit connection and reduce assembly errors.

[0023] The base island structure of this embodiment is flexible in design and can adapt to dual-core packaging with different electrical performance requirements, making it easy to adjust product performance according to actual needs. The chip can be one or two; when there are two chips, the two chips are distributed up and down on the base island. The base island is provided with dot matrix bumps, which are arranged on the base island to optimize the contact performance of the electrical connection, and at the same time play a stress buffering role to extend the service life.

[0024] like Figure 5 As shown, multiple lead frames 1 are arranged in a structure of five columns and six rows; the design of 4 columns and 6 rows of lead frames can significantly improve the grouping efficiency of welding operations and improve the overall assembly efficiency. Two die bond machines are assigned to one welding line, and each machine is responsible for the mounting of 3 rows of lead frames, which is conducive to the smooth operation of the equipment. At the same time, the chip and the lead frame are connected by copper jumpers, and the overall welding adopts the clip bond process, which is conducive to improving the packaging efficiency.

[0025] After the arrangement, the upper edge of the first row of lead frames and the lower edge of the fifth row of lead frames are provided with anti-fool structures at corresponding positions, and the anti-fool structures are grooves 9; the anti-fool mechanism is introduced into the frame design to ensure that misalignment or reverse installation can be effectively avoided during the automated packaging and testing process, thereby improving the automation level of the production line and product quality. After the arrangement, the length of the connecting ribs 10 between the rows of lead frames is small, the connecting ribs are minimized, and the connecting ribs are located away from the chip and the plastic package, reducing the damage that may be caused to the plastic package during the rib cutting and molding process, and protecting the integrity of the plastic package.

[0026] The above description only describes the specific implementation methods of the utility model. Various examples do not limit the essential content of the utility model. Ordinary technicians in the relevant technical field can modify or deform the specific implementation methods described above after reading the description without departing from the essence and scope of the utility model.

Claims

1. A photovoltaic diode module, characterized in that: It includes a lead frame; the lead frame is provided with a base island, and bus bar perforations are respectively provided on both sides of the base island; a chip is provided on the base island; the chip is located between two bus bar perforations; a plastic package is provided outside the chip; the plastic package wraps the side of the bus bar perforation adjacent to the base island; a notch is provided on the edge of the lead frame; and positioning holes are provided at the four top corners of the lead frame.

2. A photovoltaic diode module according to claim 1, characterized in that: The chip and the lead frame are connected via a copper jumper.

3. A photovoltaic diode module according to claim 1, characterized in that: The number of the chip is one or two; the two chips are distributed on the base island up and down.

4. A photovoltaic diode module according to claim 1, characterized in that: The base island is provided with convex points in a dot matrix shape.

5. A photovoltaic diode module according to claim 1, characterized in that: The frame is provided with positive and negative pole markings.

6. A photovoltaic diode module according to claim 1, characterized in that: A plurality of lead frames are arranged in a structure of five columns and six rows; after arrangement, an anti-fool structure is provided at the corresponding positions of the upper edge of the lead frame in the first column and the lower edge of the lead frame in the fifth column, and the anti-fool structure is a groove; after arrangement, the connecting ribs between the columns of the lead frames are away from the chip and the plastic package.

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