LED support and LED packaging device
By using the resin portion of the light-transmissive material and the metal substrate covered with the electroplating reflective layer in the LED bracket, the problem of insufficient light output efficiency of the traditional LED bracket is solved, and a higher light output rate and brightness are achieved.
Patent Information
- Application Number
- CN202421289237.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-06-06
AI Technical Summary
Traditional LED brackets have limitations in improving light output efficiency and are difficult to meet high brightness requirements.
The resin portion made of a light-transmitting material and a metal substrate covered with an electroplating reflective layer are formed to form an LED bracket. The light emitted by the LED chip can be emitted through the resin material and reflected through the electroplating reflective layer to increase the light output rate.
It significantly improves the light output rate of LED packaging devices and meets the product design needs of high brightness.
Smart Images
Figure CN222803344U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of LED packaging, in particular to an LED bracket and an LED packaging device. Background Art
[0002] LED package devices are electronic devices widely used in the field of lighting and display, especially in the field of LED backlight. Light boards with local dimming function and POB (Package on board) packaging technology are favored by the market. The POB solution is to mount LED package devices on the surface of the PCB circuit board, and arrange them linearly or in a matrix to form a backlight board. The bracket of the LED package device is composed of a resin part and a metal substrate. The metal material is etched or stamped into a metal sheet with a specific size and structure, and then the resin material is injection molded into a mold with a customized structure and combined with the metal sheet to form a bracket for the LED package device. Traditional LED brackets add reflective materials such as TiO2 to the resin material to achieve the effect of light reflection to improve the light output efficiency. However, as people's demand for brightness becomes higher and higher, the light output efficiency of LED devices packaged using this bracket is difficult to meet product design requirements. Utility Model Content
[0003] In order to solve the above technical problems, the utility model provides an LED bracket, which can improve the light extraction rate of LED packaging devices. The utility model also provides a packaging device using the above LED bracket. The technical solution of this application is as follows:
[0004] An LED bracket comprises a pair of metal substrates arranged at intervals from each other, and a resin part combined with the metal substrates, the resin part is provided with a recess for mounting an LED chip, the outer surface of the metal substrate is exposed at the bottom of the recess, and is used to connect with the LED chip. It is characterized in that the resin part is made of a light-transmitting material, and the outer surface of the metal substrate is provided with a layer of electroplated reflective layer, and the electroplated reflective layer at least covers the surface of the metal substrate at the bottom of the recess and the surface where the metal substrate and the resin part are combined.
[0005] In one embodiment, the material of the resin portion is a transparent or translucent PCT or EMC or SMC material; and the material of the resin portion does not contain TiO2.
[0006] In one embodiment, the light transmittance of the resin portion is at least greater than 30% or at least greater than 50%.
[0007] In one embodiment, the thickness of the electroplated reflective layer is 20 μm to 150 μm.
[0008] In one embodiment, a negative electrode mark is provided on the front side or on the front side and the back side of one of the pair of metal substrates, and the negative electrode mark on the front side of the metal substrate is located in the bonding area between the resin portion and the metal substrate.
[0009] In one embodiment, the metal substrate is exposed on the surface of the bottom of the recess and has a symmetrical shape; the two ends of the pair of metal substrates are far away from each other and extend out of the coverage range of the resin part.
[0010] In one embodiment, the electroplated reflective layer is a silver-plated layer.
[0011] In one embodiment, the metal substrate includes a base material layer and at least one intermediate plating layer disposed between the base material layer and the electroplated reflective layer.
[0012] In one embodiment, the intermediate plating layer includes at least one nickel layer; the thickness of the nickel layer is 5 μm to 20 μm.
[0013] The utility model also provides an LED packaging device, comprising the above-mentioned LED bracket and an LED chip arranged in a recess of the LED bracket, and a light-transmitting sealant filling the recess.
[0014] Beneficial effects: The LED bracket provided by the utility model is used to manufacture LED packaging devices. Since the resin part is made of light-transmitting material, the light emitted by the LED chip can be emitted through the resin material, and the electroplated reflective layer on the surface of the metal substrate can reflect the light that hits the surface of the metal substrate, thereby further improving the light output rate of the LED packaging device. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1.1 A schematic diagram of the top view (top surface) structure of the LED bracket provided for this embodiment;
[0016] Figure 1.2 for Figure 1.1 AA section view;
[0017] Figure 1.3 A schematic diagram of the back structure of the LED bracket provided for this embodiment;
[0018] Figure 1.4 A schematic diagram of the cross-sectional structure of a metal substrate of an LED bracket in an embodiment
[0019] Figure 2.1 A schematic diagram of the top view (top surface) structure of the LED packaging device provided in this embodiment;
[0020] Figure 2.2 for Figure 2.1 AA cross-section diagram. DETAILED DESCRIPTION
[0021] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.
[0022] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0023] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.
[0024] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.
[0025] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0026] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0027] Embodiment 1
[0028] Please refer to Figure 1.1 to Figure 1.3 This embodiment provides an LED bracket 100, including a pair of metal substrates 110 (i.e., two metal substrates 110) spaced apart from each other, and a resin portion 120 combined with the metal substrates 110. A portion of the resin portion 120 is disposed between the two metal substrates 110 to insulate the two metal substrates 110. The resin portion 120 is provided with a LED chip 130 (refer to Figure 2.1 and Figure 2.2 ) is installed in a recess 121. In this embodiment, the recess 121 is arranged in the middle of the resin part and has an opening that is larger at the top and smaller at the bottom, so as to facilitate the installation of the LED chip. The outer surface 111 of the metal substrate 110 is exposed at the bottom of the recess 121 and is used to connect with the LED chip 130. The resin part 120 is made of a light-transmitting material. The outer surface 111 of the metal substrate 110 is provided with a layer of electroplated reflective layer. The electroplated reflective layer 111 at least covers the surface of the metal substrate 110 at the bottom of the recess 121 and the surface where the metal substrate 110 and the resin part 120 are combined.
[0029] The LED bracket 100 provided in this embodiment is used to manufacture an LED package device 200 (refer to Figure 2.1 ), since the resin portion 120 is made of a light-transmitting material, the light emitted by the LED chip 130 can be emitted through the resin material (refer to Figure 2.2 ), and the electroplated reflective layer 111 on the surface of the metal substrate 110 can reflect the light incident on the surface of the metal substrate 110, thereby further improving the light extraction rate of the LED packaging device 200.
[0030] In this embodiment, the front and back surfaces of the metal substrates and the opposite side surfaces of the two metal substrates are electroplated with the electroplated reflective layer 111 .
[0031] In one embodiment, the material of the resin portion 120 is a transparent or translucent PCT or EMC or SMC material, which has low material cost and a mature and stable manufacturing technology.
[0032] In one embodiment, the material of the resin part 120 does not contain reflective particles. In the prior art, reflective materials such as TiO2 are usually added to the resin part to achieve the effect of light reflection. However, the present invention breaks the convention and does not add any reflective material to the resin part 120, thereby reducing the resistance of the light emitted by the LED chip to improve the light output rate of the LED package device.
[0033] In one embodiment, the light transmittance of the resin portion 120 is at least greater than 30% or at least greater than 50% to ensure that the light extraction rate of the LED package device is within an acceptable range.
[0034] In one embodiment, the thickness of the electroplated reflective layer 111 is 20 μm to 150 μm. Since the bonding position between the resin part and the metal substrate is the bonding between the resin material and the electroplated reflective layer, and the electroplated reflective layer 111 also plays the role of reflecting light, the thickness of the electroplated reflective layer 111 cannot be too thin, so as not to affect the bonding strength between the resin part and the metal substrate and the reflection strength of the electroplated reflective layer. However, if the electroplated reflective layer is too thick, the manufacturing cost will also be increased. In practical applications, the thickness of the electroplated reflective layer 111 is preferably 20 μm to 150 μm, or more preferably, the thickness of the electroplated reflective layer 111 is 40 μm to 100 μm.
[0035] In one embodiment, a negative electrode mark 114 is provided on the front side of one of the pair of metal substrates 110, or on the front side and the back side, and the negative electrode mark 114 on the front side of the metal substrate 110 is located in the bonding area between the resin part 120 and the metal substrate 110. The negative electrode mark can facilitate the identification of the position of the negative electrode in the solid crystal (mounting the LED chip on the LED bracket) process, so as to connect the negative electrode of the LED chip to the metal substrate with the negative electrode mark, thereby ensuring the accuracy of the solid crystal process. Since the resin part is a light-transmitting material, and the surface of the metal substrate is provided with an electroplated reflective layer, which has good reflectivity, the negative electrode mark can be directly set on the metal substrate, and the negative electrode mark can be visible through the resin part, which is convenient for identification during the production process. In this embodiment, the negative electrode mark is a "one"-shaped groove punched out on the surface of the metal substrate by a stamping process. In other embodiments, the shape of the groove can also be a triangle or a circle or other custom shapes.
[0036] In one embodiment, the surface of the metal substrate 110 exposed at the bottom of the recess 121 is symmetrical in shape; two ends of a pair of metal substrates 110 that are far away from each other extend out of the coverage of the resin portion 120. Figure 1.1 As shown, the surface of the metal substrate exposed at the bottom of the recess 121 is approximately semicircular, and the two semicircles are symmetrically arranged, which can improve the light emitting form of the LED chip, make the light pattern of the LED package device symmetrical, and facilitate optical design. The metal substrate partially extends out of the coverage of the resin part 120, so that during the manufacturing process of the LED package device, the exposed end of the metal substrate can be clamped by the manufacturing equipment to protect the resin part from being damaged.
[0037] In one embodiment, the electroplated reflective layer 111 is a silver-plated layer, which has a good reflective effect.
[0038] refer to Figure 1.4In one embodiment, the metal substrate 110 includes a substrate layer 112 and at least one intermediate plating layer 113 disposed between the substrate layer 112 and the electroplated reflective layer 111. The substrate layer is generally made of copper or iron. When manufacturing the metal substrate, at least one intermediate plating layer 113 is first plated on the substrate layer to improve the surface finish of the substrate layer, so that when the electroplated reflective layer 111 is manufactured, the surface of the electroplated reflective layer 111 can be electroplated smoother and have a better reflection effect. Of course, if the surface of the substrate layer is already smooth enough, it is not necessary to manufacture the intermediate plating layer 113, and the electroplated reflective layer 111 can be manufactured directly.
[0039] In one embodiment, the intermediate plating layer 113 includes at least one nickel layer; the thickness of the nickel layer is 5 μm to 20 μm. Since the intermediate plating layer 113 does not need to be combined with the resin part 120, the intermediate plating layer does not need to be too thick, and the thickness can be 5 μm to 20 μm.
[0040] Embodiment 2
[0041] refer to Figure 2.1 and Figure 2.2 This embodiment provides an LED packaging device 200, including the LED bracket 100 described in the embodiment and a recess 121 (reference Figure 1.2 ) and a light-transmitting sealant 140 filling the recess 121. Figure 2.2 As shown, part of the light emitted by the LED (indicated by the straight arrow in the figure) is reflected by the electroplated reflective layer 111 on the surface of the metal substrate 110 and then emitted from the side of the resin part 120. The electroplated reflective layer on the surface of the metal substrate 110 combined with the resin part 120 can also reflect light, and the reflection effect is very good, thereby improving the light output rate of the LED packaging device 200.
[0042] The above are several embodiments provided for the utility model. It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in the field, they can also be improved or transformed according to the above description. All these improvements and transformations should belong to the protection scope of the claims attached to the present invention. In the above embodiments, in the absence of conflict, each feature can be combined, interchanged, reused, etc. to form a new embodiment. All belong to the scope of the embodiments of the utility model, and the utility model will not be repeated here.
Claims
1. An LED bracket, comprising a pair of metal substrates spaced apart from each other, and a resin portion combined with the metal substrates, wherein the resin portion is provided with a recess for mounting an LED chip, and the outer surface of the metal substrate is exposed at the bottom of the recess for connecting with the LED chip, characterized in that: The resin part is made of a light-transmitting material, and the outer surface of the metal substrate is provided with a plated reflective layer, which at least covers the metal substrate surface at the bottom of the recess and the surface where the metal substrate and the resin part are combined.
2. The LED bracket according to claim 1, characterized in that: The material of the resin part is transparent or translucent PCT, EMC or SMC material; the material of the resin part does not contain TiO2.
3. The LED bracket according to claim 1, characterized in that: The light transmittance of the resin portion is at least greater than 30% or at least greater than 50%.
4. The LED bracket according to claim 1, characterized in that: The thickness of the electroplated reflective layer is 20 μm to 150 μm, or 40 μm to 100 μm.
5. The LED bracket according to claim 1, characterized in that: A negative electrode mark is provided on the front side of one of the pair of metal substrates, or on the front side and the back side, and the negative electrode mark on the front side of the metal substrate is located in the bonding area between the resin portion and the metal substrate.
6. The LED bracket according to claim 1, characterized in that: The surface of the metal substrate exposed at the bottom of the recess is symmetrical in shape; the two ends of the pair of metal substrates are far away from each other and extend out of the coverage range of the resin part.
7. The LED bracket according to claim 1, characterized in that: The electroplated reflective layer is a silver-plated layer.
8. The LED bracket according to claim 1, characterized in that: The metal substrate comprises a base material layer and at least one intermediate plating layer arranged between the base material layer and the electroplating reflective layer.
9. The LED bracket according to claim 8, characterized in that: The intermediate plating layer comprises at least one nickel layer; the thickness of the nickel layer is 5 μm to 20 μm.
10. An LED packaging device, characterized in that: It comprises the LED bracket according to any one of claims 1 to 9, an LED chip arranged in a recess of the LED bracket, and a light-transmitting sealant filling the recess.