Support for TOP LED convex mirror lamp bead and LED lamp bead

By adopting a multi-occlusion structure composed of multiple annular edges and multiple grooves on the TOP LED lamp beads, the problem of existing lamp bead light sources being blocked by the edges is solved, the brightness and luminous angle are improved, and the reliability of LED lamp beads is improved.

CN222803345UActive Publication Date: 2025-04-25JIANGXI MTC OPTOELECTRONICS CO LTD
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Patent Information

Application Number
CN202421704164.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-18
Publication Date
2025-04-25
Estimated Expiration
2034-07-18

AI Technical Summary

Technical Problem

The bowl and cup structure of the existing TOP LED lamp beads causes the light source to be blocked by the edge blocking, resulting in a smaller brightness and a smaller luminous angle. The existing convex mirror lamp beads have poor lifting effect, which limits the application of the product.

Method used

A multi-occlusion structure bracket consisting of multiple annular edges and multiple trenches ensures the bonding strength of the encapsulated resin layer and the packaging glue and the external leakage blocking effect, while reducing the barrier to the light output of the chip.

Benefits of technology

It effectively improves the brightness and luminous angle of the lamp beads, and at the same time improves the bonding strength and airtightness of the encapsulated resin layer and the encapsulated rubber, avoids moisture intrusion, and improves the reliability of the LED lamp beads.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductors, in particular to a support for a TOP LED convex mirror lamp bead and an LED lamp bead, the support comprises a main body, the main body comprises a metal frame and an encapsulation resin layer, the front side of the main body is provided with an installation end face used for installing a chip, the encapsulation resin layer is provided with at least three annular surrounding edges in a protruding mode, and the annular surrounding edges are arranged on the metal frame. The surrounding edges are arranged on the periphery of the installation end face and are sequentially arranged at intervals in the direction from the periphery of the body to the installation end face, the height of the surrounding edge located on the outermost side is larger than that of the other surrounding edges, and grooves are formed between the adjacent surrounding edges. The depth and the width of the groove located on the outermost side are larger than the depth and the width of the other grooves. The support provided by the utility model can ensure the bonding strength of the packaging resin layer and the packaging glue and effectively prevent the packaging glue from leaking, effectively reduces the blocking of the light emitted by the chip, is applied to the TOP LED convex mirror lamp bead, and can effectively improve the brightness and the light-emitting angle.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a bracket for a TOP LED convex mirror lamp bead and an LED lamp bead. Background Art

[0002] The existing TOP LED lamp beads use TOP stamping injection molding brackets as brackets, see Figure 5 As shown, the bracket is composed of a metal frame and an encapsulating resin. The bracket has a front and a back side. On the front side of the bracket, the metal frame has a functional area exposed on the upper surface of the encapsulating resin, and the encapsulating resin is formed into a cup by injection molding to protect the functional area; on the back side of the bracket, the metal frame is bent to form a pin exposed on the lower surface of the encapsulating resin.

[0003] During assembly, silver glue or insulating glue is used to fix the chip in the functional area, and then the chip and the functional area are electrically connected through bonding wires. The bracket is then sealed with glue through a dispensing process, and then the beads are blanked into regular lamp beads that can emit RGB three primary colors.

[0004] The bowl of this conventional lamp bead has an inverted frustum-shaped structure. Since the encapsulation glue has a certain fluidity, in order to prevent the encapsulation glue from leaking from all sides during the dispensing process, the bowl mainly relies on the surrounding ribs to prevent the encapsulation glue from leaking. The surrounding ribs need to be at a relatively high height, usually higher than the height of the chip. As a result, when in use, part of the light source will be blocked by the ribs around the bowl, resulting in a part of the light source being lost, causing the brightness of the lamp bead to decrease and the luminous angle to narrow.

[0005] In the prior art, in order to improve the brightness and luminous angle of lamp beads, secondary glue dispensing is performed on the basis of the above-mentioned glue sealing of conventional lamp beads, and convex mirrors are formed by secondary glue dispensing, and then the materials are blanked into conventional convex mirror lamp beads that can emit RGB three primary colors.

[0006] Although this type of convex mirror lamp bead can improve the brightness and luminous angle to a certain extent through the convex mirror, the problem of blocking the light source by the retaining edge still exists, and the improvement effect is still not good, which limits the application of the product. Utility Model Content

[0007] The purpose of the utility model is to provide a bracket and LED lamp bead for TOP LED convex mirror lamp beads in response to the existing technical status. The bracket of the utility model can effectively reduce the obstruction of chip light while ensuring the bonding strength between the encapsulation resin layer and the packaging glue and effectively preventing the packaging glue from leaking out. When applied to TOP LED convex mirror lamp beads, it can effectively improve the brightness and light-emitting angle.

[0008] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0009] First, the utility model provides a bracket for TOP LED convex mirror lamp beads, including a main body, the main body includes a metal frame and an encapsulation resin layer, the front of the main body is provided with a mounting end surface for mounting a chip, and the encapsulation resin layer is convexly provided with at least three annular surrounding edges.

[0010] Each of the surrounding edges is arranged around the mounting end surface and is arranged in sequence along the four sides of the main body toward the mounting end surface, and the height of the outermost surrounding edge is greater than the height of the remaining surrounding edges.

[0011] Grooves are formed between adjacent surrounding edges, and the depth and width of the outermost grooves are greater than the depth and width of the remaining grooves.

[0012] In some embodiments, the relative height distance from the bottom of the outermost groove to the surface where the mounting end surface is located is smaller than the relative height distance from the bottom of the remaining grooves to the surface where the mounting end surface is located.

[0013] In some embodiments, the metal frame includes a front side and a side surface, the encapsulation resin layer includes a lateral covering portion arranged outside the side surface and a forward covering portion arranged at the edge of the front surface, the lateral covering portion is located at one end of the front surface of the main body to form a forward end, the forward end and the forward covering portion together form a protective end, the surrounding edge is arranged on the surface of the protective end, and the groove located on the outermost side is arranged on the forward end.

[0014] In some embodiments, the height of each of the surrounding edges is arranged to decrease successively along the four sides of the main body toward the mounting end surface.

[0015] In some embodiments, an upper end of the surrounding edge is provided with an arc-shaped corner.

[0016] In some embodiments, the surrounding edge includes a first surrounding edge, a second surrounding edge, and a third surrounding edge that are sequentially arranged in a spaced relationship along the periphery of the main body toward the mounting end surface, a first groove is formed between the first surrounding edge and the second surrounding edge, and a second groove is formed between the second surrounding edge and the third surrounding edge.

[0017] The height of the first surrounding edge is greater than the height of the second surrounding edge and the height of the third surrounding edge,

[0018] The depth and width of the first trench are greater than the depth and width of the second trench.

[0019] In some embodiments, the perimeter further includes a fourth perimeter disposed on a side of the third perimeter away from the second perimeter, a third groove is formed between the third perimeter and the fourth perimeter, and a height of the fourth perimeter is equal to or lower than a height of the third perimeter.

[0020] In some embodiments, the height of the outermost peripheral edge is less than or equal to the height of a chip to be mounted on the main body.

[0021] Secondly, the utility model provides an LED lamp bead, including a packaging adhesive layer and the above-mentioned TOP LED convex mirror lamp bead bracket, the packaging adhesive layer includes a convex lens curved surface and a bottom surface arranged below the convex lens curved surface, the outermost surrounding edge is arranged on the outer side of the convex lens curved surface, the bottom surface protrudes downward to form an interlocking portion, and the interlocking portion is embedded in the groove.

[0022] In some embodiments, a chip is disposed on the front side of the main body, the chip is disposed between the encapsulation resin layer and the packaging glue layer, and the height of the outermost surrounding edge is less than or equal to the height of the chip.

[0023] The beneficial effects of the utility model are:

[0024] Compared with the existing truncated bowl-cup structure, the utility model uses a multiple interlocking structure composed of multiple edges and multiple grooves to make the encapsulating resin layer have a higher interlocking property and leakage prevention effect on the encapsulating glue. Therefore, it is not necessary to set a higher height like the existing truncated bowl-cup structure. While ensuring the bonding strength between the encapsulating resin layer and the encapsulating glue and effectively preventing the leakage of the encapsulating glue, it effectively reduces the obstruction of the chip light. When applied to TOP LED convex mirror lamp beads, it can effectively improve the brightness and light-emitting angle. In addition, the multiple interlocking structure forms an undulating and tortuous bonding interface between the multiple interlocking structures of the encapsulating resin layer and the encapsulating glue, making it difficult for external moisture to enter from the outside. The bracket has high airtightness, which can effectively prevent moisture intrusion from causing LED lamp beads to fail, thereby improving the reliability of LED lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a top view of the LED lamp bead of the utility model before being sealed with glue.

[0026] Figure 2 This is a cross-sectional view of a bracket for a TOP LED convex mirror lamp bead of the utility model.

[0027] Figure 3 for Figure 2 A partial enlarged view of part A.

[0028] Figure 4 The figure is a schematic diagram of the structure of the LED lamp bead of the present invention (the arrow in the figure represents the light emitting direction).

[0029] Figure 5 It is a cross-sectional view of a conventional lamp bead with RGB three primary colors in the prior art. DETAILED DESCRIPTION

[0030] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0031] See also Figure 1 to Figure 2 As shown, this embodiment discloses a bracket for TOP LED convex mirror lamp beads, including a main body 1, the main body 1 includes a metal frame 12 and an encapsulation resin layer 3, the front of the main body 1 is provided with a mounting end surface 11 for mounting a chip 5, and the encapsulation resin layer 3 is convexly provided with at least three annular surrounding edges 31,

[0032] Each of the surrounding edges 31 is disposed around the mounting end surface 11 and is sequentially spaced along the periphery of the main body 1 in the direction of the mounting end surface 11, and the height of the outermost surrounding edge 31 is greater than the heights of the remaining surrounding edges 31. In this embodiment, the height of the outermost surrounding edge 31 is the first surrounding edge 311.

[0033] Grooves 32 are formed between adjacent surrounding edges 31 . The depth and width of the outermost groove 32 are greater than the depth and width of the other grooves 32 . In this embodiment, the outermost groove 32 is a first groove 321 .

[0034] In this embodiment, at least three annular edges 31 are arranged around the mounting end surface 11, and grooves 32 are formed between adjacent edges 31, thereby forming a multiple bite structure consisting of multiple edges 31 and multiple grooves 32 around the main body 1. When sealing, after the sealing glue flows from the center of the main body 1 to the surroundings, the outward flow trend of the sealing glue is delayed and blocked layer by layer by the multiple edges 31, and the sealing glue will penetrate into the groove 32 and embed into the groove 32. The sealing glue is cured to form a sealing glue layer 4. The bottom surface of the cured sealing glue layer 4 is tightly combined with the encapsulation resin layer 3 through the multiple bite structures around the outermost The height of the side border 31 (the first border 311) is set to be greater than the height of the remaining borders 31, so as to increase the blocking effect of the encapsulation resin layer 3 on the leakage of the packaging glue, and avoid the blocking of the light by the border 31. At the same time, the depth and width of the outermost groove 32 (the first groove 321) are greater than the depth and width of the remaining grooves 32, which can improve the bonding effect between the outermost groove 32 and the packaging glue and enhance the blocking effect on the leakage of the packaging glue. Therefore, through the setting of the above-mentioned multiple bite structures, the bite between the encapsulation resin layer 3 and the packaging glue is enhanced, and the packaging glue is effectively prevented from leaking.

[0035] Compared with the existing truncated bowl-cup structure, the multiple interlocking structure of the utility model relies on the above-mentioned structural design to make the encapsulating resin layer 3 have a higher interlocking property and leakage prevention effect on the packaging glue. Therefore, there is no need to set a higher height like the existing truncated bowl-cup structure. While ensuring the bonding strength between the encapsulating resin layer 3 and the packaging glue and effectively preventing the packaging glue from leaking out, it effectively reduces the obstruction of the light emitting from the chip 5. When applied to TOP LED convex mirror lamp beads, it can effectively improve the brightness and light-emitting angle, and at the same time reduce the amount of packaging glue used.

[0036] In addition, the multiple interlocking structures form an undulating, tortuous bonding interface between the multiple interlocking structures of the encapsulating resin layer 3 and the packaging glue, making it difficult for external moisture to enter from the outside. The bracket has high airtightness, which can effectively prevent moisture intrusion from causing LED lamp beads to fail, thereby improving the reliability of LED lamp beads.

[0037] See also Figures 2 to 3 As shown, the relative height distance from the bottom of the outermost groove 32 (first groove 321 ) to the surface where the mounting end surface 11 is located is smaller than the relative height distances from the bottom of the remaining grooves 32 to the surface where the mounting end surface 11 is located.

[0038] By deepening the bottom of the outermost groove 32 (first groove 321), the outermost groove 32 (first groove 321) has a larger space for accommodating the packaging glue flowing to the surroundings, and at the same time has a larger contact area with the packaging glue, thereby improving the bonding effect between the outermost groove 32 (first groove 321) and the packaging glue and the effect of preventing the packaging glue from leaking out. At the same time, there is no need to increase the relative height distance from the upper end of the outermost surrounding edge 31 (first surrounding edge 311) to the surface where the mounting end surface 11 is located, thereby further avoiding the surrounding edge 31 from blocking the light output.

[0039] See also Figures 2 to 3 As shown, the metal frame 12 includes a front side and a side surface, and the encapsulation resin layer includes a lateral covering portion arranged outside the side surface and a positive covering portion arranged at the edge of the front surface. The lateral covering portion is located at one end of the front surface of the main body 1 to form a positive end, and the positive end and the positive covering portion together form a protective end. The surrounding edge 31 is arranged on the surface of the protective end, and the outermost groove 32 (the first groove 321) is arranged on the positive end.

[0040] On the one hand, by setting the lateral covering part and the front covering part, the side and front edges of the metal frame 12 are covered to further improve the air tightness and prevent the invasion of external moisture. On the other hand, compared with the method of setting the surrounding edge 31 completely on the front side of the metal frame 12, this method of setting the outermost groove 32 (first groove 321) on the positive end allows the bottom of the outermost groove 32 (first groove 321) to be deepened downward without affecting the covering of the front edge of the metal frame 12.

[0041] See also Figure 2 As shown, the upper end of the surrounding edge 31 is provided with an arc-shaped corner to increase the contact area between the packaging glue and the encapsulation resin layer 3 .

[0042] Exemplarily, the number of the edges 31 is 3, 4, 5 or 6, but is not limited thereto. Preferably, the number of the edges 31 is 4 or 5, and more preferably, the number of the edges 31 is 4. When the number of the edges 31 is too large, the precision requirements of the processing equipment increase, the production cost increases, and the yield rate decreases.

[0043] See also Figures 1 to 3 As shown, the surrounding edge 31 includes a first surrounding edge 311, a second surrounding edge 312 and a third surrounding edge 313 which are sequentially arranged along the periphery of the main body 1 in the direction of the mounting end surface 11. A first groove 321 is formed between the first surrounding edge 311 and the second surrounding edge 312, and a second groove 322 is formed between the second surrounding edge 312 and the third surrounding edge 313.

[0044] The height of the first surrounding edge 311 is greater than the height of the second surrounding edge 312 and the height of the third surrounding edge 313.

[0045] The depth and width of the first trench 321 are greater than the depth and width of the second trench 322 .

[0046] The peripheral edge 31 further includes a fourth peripheral edge 314 disposed on a side of the third peripheral edge 313 away from the second peripheral edge 312 . A third groove 323 is formed between the third peripheral edge 313 and the fourth peripheral edge 314 . The height of the fourth peripheral edge 314 is equal to or lower than that of the third peripheral edge 313 .

[0047] In the first setting mode, the height of each surrounding edge 31 is set to decrease successively along the four sides of the main body 1 toward the mounting end surface 11. When in use, the light source is emitted from the chip 5 located in the enclosed space of the surrounding edge 31 to the surrounding area. The decreasing setting of the height of the surrounding edge 31 can ensure the effect of preventing the leakage of the packaging glue while avoiding the inner side The surrounding edge 31 is too high and causes obstruction to the light.

[0048] See also Figure 3 As shown, in the second setting mode, the heights of the first surround 311 to the third surround 313 are arranged in decreasing order, and the height of the fourth surround 314 is consistent with the height of the third surround 313 to ensure that the inner surround 31 has a sufficient height and the inner groove 32 has a sufficient depth.

[0049] The encapsulating resin layer 3 is made of PPA material.

[0050] See also Figure 2As shown, the height of the outermost surrounding edge 31 (first surrounding edge 311) is less than or equal to the height of the chip 5 to be mounted on the main body 1, which ensures the bonding strength between the encapsulation resin layer 3 and the packaging glue and effectively prevents the packaging glue from leaking out, while effectively reducing the obstruction of the light emitting from the chip 5. When used in TOP LED convex mirror lamp beads, it can effectively improve the brightness and light-emitting angle.

[0051] See also Figure 4 As shown, the present embodiment further discloses an LED lamp bead, including a packaging adhesive layer 4 and the above-mentioned TOPLED convex mirror lamp bead bracket, the packaging adhesive layer 4 includes a convex lens surface and a bottom surface arranged below the convex lens surface, the outermost surrounding edge 31 is arranged on the outer side of the convex lens surface, the bottom surface protrudes downward to form an interlocking portion, and the interlocking portion is embedded in the groove 32, wherein the packaging adhesive layer 4 is formed by curing the packaging adhesive, and the packaging adhesive layer 4 with the convex lens surface is formed by dispensing.

[0052] The packaging glue layer 4 is made of a transparent material, and is a cured molded part, while the encapsulating resin layer 3 is an injection molded part.

[0053] See also Figure 2 and Figure 4 As shown, a chip 5 is provided on the front of the main body 1 , and the chip 5 is provided between the encapsulation resin layer 3 and the packaging glue layer 4 , and the height of the outermost surrounding edge 31 is less than or equal to the height of the chip 5 .

[0054] Of course, the above illustrations are only preferred implementation modes of the present invention, and are not intended to limit the scope of use of the present invention. Therefore, any equivalent changes made to the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A bracket for TOP LED convex mirror lamp beads, comprising a main body, the main body comprising a metal frame and an encapsulation resin layer, characterized in that: The front side of the main body is provided with a mounting end surface for mounting a chip, and the encapsulation resin layer is provided with at least three annular surrounding edges. Each of the surrounding edges is arranged around the mounting end surface and is arranged in sequence along the four sides of the main body toward the mounting end surface, and the height of the outermost surrounding edge is greater than the height of the remaining surrounding edges. Grooves are formed between adjacent surrounding edges, and the depth and width of the outermost grooves are greater than the depth and width of the remaining grooves.

2. A TOP LED convex mirror lamp bead bracket according to claim 1, characterized in that: The relative height distance from the bottom of the outermost groove to the surface where the mounting end surface is located is smaller than the relative height distance from the bottom of the remaining grooves to the surface where the mounting end surface is located.

3. A TOP LED convex mirror lamp bead bracket according to claim 2, characterized in that: The metal frame includes a front side and a side surface, the encapsulation resin layer includes a lateral covering portion arranged outside the side surface and a forward covering portion arranged at the edge of the front surface, the lateral covering portion is located at one end of the front surface of the main body to form a forward end, the forward end and the forward covering portion together form a protective end, the surrounding edge is arranged on the surface of the protective end, and the outermost groove is arranged on the forward end.

4. A TOP LED convex mirror lamp bead bracket according to claim 1, characterized in that: The height of each of the surrounding edges is arranged to decrease in sequence along the four sides of the main body toward the mounting end surface.

5. A TOP LED convex mirror lamp bead bracket according to claim 1, characterized in that: An arc-shaped corner is arranged at the upper end of the surrounding edge.

6. A TOP LED convex mirror lamp bead bracket according to claim 1, characterized in that: The surrounding edge includes a first surrounding edge, a second surrounding edge, and a third surrounding edge which are sequentially arranged in a spaced manner along the periphery of the main body toward the mounting end surface, a first groove is formed between the first surrounding edge and the second surrounding edge, and a second groove is formed between the second surrounding edge and the third surrounding edge. The height of the first surrounding edge is greater than the height of the second surrounding edge and the height of the third surrounding edge, The depth and width of the first trench are greater than the depth and width of the second trench.

7. A TOP LED convex mirror lamp bead bracket according to claim 6, characterized in that: The surrounding edge also includes a fourth surrounding edge arranged on a side of the third surrounding edge away from the second surrounding edge, a third groove is formed between the third surrounding edge and the fourth surrounding edge, and a height of the fourth surrounding edge is equal to or lower than a height of the third surrounding edge.

8. A TOP LED convex mirror lamp bead bracket according to claim 1, characterized in that: The height of the outermost surrounding edge is less than or equal to the height of a chip to be mounted on the main body.

9. An LED lamp bead, characterized in that: It includes a packaging adhesive layer and a bracket for a TOP LED convex mirror lamp bead according to any one of claims 1 to 8, wherein the packaging adhesive layer includes a convex lens curved surface and a bottom surface arranged below the convex lens curved surface, the outermost surrounding edge is arranged on the outer side of the convex lens curved surface, the bottom surface protrudes downward to form an interlocking portion, and the interlocking portion is embedded in the groove.

10. The LED lamp bead according to claim 9, characterized in that: A chip is arranged on the front of the main body, and the chip is arranged between the encapsulation resin layer and the packaging glue layer. The height of the outermost surrounding edge is less than or equal to the height of the chip on the main body.