Cathode body capable of sputtering magnetic material

Abstract

The utility model discloses a cathode body capable of sputtering magnetic materials, which comprises a cathode body base, a base groove is arranged on the upper side face of the cathode body base, a cushion block, a magnet yoke, a cooling piece and a target material are sequentially arranged in the base groove from bottom to top, and a plurality of magnets which are arranged along the length direction of the base groove at intervals are arranged between the magnet yoke and the cooling piece. Magnetic conductive plates are arranged on the two sides of the cathode body base respectively, a magnetic field is guided to the lower side position of the cathode body from the two sides of the cathode body through the magnetic conductive plates and is guided to return to the magnet yoke and the magnet, and the magnetic field intensity on the two sides of the cathode body is weakened and is lower than the magnetic field intensity on the surface of the target material; therefore, a sputtering area is formed on the surface of the target material for normal sputtering production.

Description

[Technical field]

[0001] The utility model relates to a cathode body capable of sputtering magnetic materials. [Background Technology]

[0002] The magnetic conductivity of the magnetic material of the flat cathode body in the existing vacuum magnetron sputtering coating equipment changes the distribution of the magnetic field lines of the original magnetic field, making the distribution of the magnetic field lines as follows Figure 2 As shown, the magnetic field strength on both sides of the magnetic material is much higher than the magnetic field strength on the target surface. Therefore, when the point target sputtering is working, the sputtering area will appear in the area of ​​high magnetic field strength on both sides of the cathode body, rather than on the surface of the target, resulting in the magnetic material cannot be sputtered normally. [Utility Model Content]

[0003] The utility model overcomes the shortcomings of the prior art and provides a cathode body capable of sputtering magnetic materials.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A cathode body capable of sputtering magnetic materials is characterized in that it includes a cathode body base, a base groove is provided on the upper side of the cathode body base, a pad, a magnetic yoke, a cooling member and a target material are arranged in sequence from bottom to top in the base groove, a plurality of magnets are arranged and spaced apart along the length direction of the base groove are provided between the magnetic yoke and the cooling member, and magnetic conductive plates are provided on both sides of the cathode body base.

[0006] The cathode body capable of sputtering magnetic materials as described above is characterized in that: a plurality of yoke grooves are provided on the upper side of the yoke, and magnets are respectively arranged in the yoke grooves; a plurality of cooling member grooves are provided on the lower side of the cooling member to cooperate with the yoke grooves to enclose the magnets.

[0007] A cathode body capable of sputtering magnetic materials as described above is characterized in that a cooling member water trough is provided on the lower side of the cooling member between two cooling member grooves, a yoke through-hole is provided on the yoke on the lower side of the cooling member water trough, a pad through-hole is provided on the pad corresponding to the yoke through-hole, and a base through-hole is provided on the bottom surface of the cathode body base corresponding to the pad through-hole.

[0008] The cathode body capable of sputtering magnetic materials as described above is characterized in that sealing rings are respectively provided between the magnetic yoke and the cooling element at both sides of the cooling element water tank.

[0009] The cathode body capable of sputtering magnetic materials as described above is characterized in that three magnets are provided between the magnetic yoke and the cooling member, and the polarity of the magnet in the middle is opposite to the polarity of the magnets on both sides.

[0010] The cathode body capable of sputtering magnetic materials as described above is characterized in that the cooling member is a cooling copper member.

[0011] The cathode body of the sputterable magnetic material as described above is characterized in that: the height of the upper side of the magnetic conductive plate is not higher than the height of the upper side of the target material and is not lower than the height of the lower side of the target material; the height of the lower side of the magnetic conductive plate is not higher than the height of the upper side of the magnetic yoke and is not lower than the height of the lower side of the magnetic yoke.

[0012] The cathode body capable of sputtering magnetic materials as described above is characterized in that the thickness of the magnetic conductive plate is not greater than 6 mm.

[0013] The cathode body capable of sputtering magnetic materials as described above is characterized in that the magnetic conductive plate is a pure iron magnetic conductive plate.

[0014] The beneficial effects of the utility model are:

[0015] The utility model provides magnetic conductive plates on both sides of the cathode body, and guides the magnetic field from both sides of the cathode body to the lower side of the cathode body and returns to the magnetic yoke and the magnet through the magnetic conductive plates, thereby weakening the magnetic field strength on both sides of the cathode body, making the magnetic field strength on both sides of the cathode body lower than the magnetic field strength on the surface of the target material, thereby forming a sputtering area on the surface of the target material for normal sputtering production. [Brief Description of the Drawings]

[0016] Figure 1 This is a schematic diagram of the structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the magnetic field line distribution of the cathode body when the magnetic conductive plate is not installed;

[0018] Figure 3 This is a schematic diagram of the magnetic field line distribution of the present utility model. [Specific implementation method]

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings.

[0020] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly. In addition, the descriptions of "preferred", "sub-preferred", etc. in the present invention are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "preferred" or "sub-preferred" may explicitly or implicitly include at least one such feature.

[0021] like Figure 1 and Figure 3As shown, a cathode body capable of sputtering magnetic materials includes a cathode body base 1, a base groove 11 is provided on the upper side of the cathode body base 1, and a pad 2, a yoke 3, a cooling member 4 and a target material 5 are arranged in order from bottom to top in the base groove 11. A plurality of magnets 6 are arranged and spaced apart along the length direction of the base groove 11 between the yoke 3 and the cooling member 4. Magnetic conductive plates 7 are provided on both sides of the cathode body base 1. Figure 3 As shown, the magnetic field is guided from both sides of the cathode base 1 to the lower side of the cathode base 1 and then back to the yoke 3 and the magnet 6 through the magnetic conductive plate 7, thereby weakening the magnetic field strength on both sides of the cathode body, making the magnetic field strength on both sides of the cathode body lower than the magnetic field strength on the target surface, thereby forming a sputtering area on the target surface for normal sputtering production.

[0022] like Figure 1 As shown, three magnets 6 are provided between the yoke 3 and the cooling member 4, and the polarity of the middle magnet 6 is opposite to that of the magnets 6 on both sides; a plurality of yoke grooves 31 are provided on the upper side of the yoke 3, and the magnets 6 are respectively arranged in the yoke grooves 31, and a plurality of cooling member grooves 41 are provided on the lower side of the cooling member 4 for cooperating with the yoke grooves 31 to enclose the magnets 6, so that the three yokes 6 can be quickly positioned and installed between the yoke 3 and the cooling member 4, while increasing the contact area between the magnet 6 and the cooling member 4 and enhancing the cooling effect.

[0023] like Figure 1 As shown, a cooling water tank 42 is provided on the underside of the cooling element 4, located between two cooling element grooves 41. A yoke through-hole 32 is provided on the yoke 3, located below the cooling water tank 42. A pad through-hole 21 is provided on the spacer 2, corresponding to the yoke through-hole 32. A base through-hole 12 is provided on the bottom surface of the cathode base 1, corresponding to the pad through-hole 21. During sputtering production, cooling water is sequentially supplied to the cooling water tank 42 through the base through-hole 12, the pad through-hole 21, and the yoke through-hole 32. This cooling water cools the cooling element 4 and the magnet 6. The cooling element 4 is a copper cooling element, which enhances the cooling effect.

[0024] like Figure 1 As shown, sealing rings 8 are provided between the yoke 3 and the cooling element 4 at both sides of the cooling element water tank 42 to improve the sealing performance of the cooling element water tank 42 and prevent the cooling water from contacting the magnet 6 and corroding the magnet 6.

[0025] In this case, the height of the upper side of the magnetic conductive plate 7 is not higher than the height of the upper side of the target material 5 and not lower than the height of the lower side of the target material 5. At the same time, the height of the lower side of the magnetic conductive plate 7 is not higher than the height of the upper side of the magnetic yoke 3 and not lower than the height of the lower side of the magnetic yoke 3, so as to better guide the magnetic field from both sides of the cathode base 1 to the lower side of the cathode base 1 and return to the magnetic yoke 3 and the magnet 6; the thickness of the magnetic conductive plate 7 is not more than 6 mm, and the magnetic conductive plate 7 is a high-efficiency magnetic conductive plate, which has good magnetic conductivity while maintaining a small volume, so that the cathode body remains light and small in volume.

[0026] The above are only preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the practical concept of the present invention, or directly or indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A cathode body capable of sputtering magnetic material, characterized in that: The invention comprises a cathode base (1), wherein a base groove (11) is provided on the upper side of the cathode base (1), a cushion block (2), a magnetic yoke (3), a cooling member (4) and a target material (5) are arranged in sequence from bottom to top in the base groove (11), a plurality of magnets (6) are arranged along the length direction of the base groove (11) and arranged at intervals between the magnetic yoke (3) and the cooling member (4), and magnetic conductive plates (7) are respectively provided on both sides of the cathode base (1).

2. A cathode body capable of sputtering magnetic material according to claim 1, characterized in that: The upper side of the yoke (3) is provided with a plurality of yoke grooves (31), the magnets (6) are respectively arranged in the yoke grooves (31), and the lower side of the cooling member (4) is provided with a plurality of cooling member grooves (41) which cooperate with the yoke grooves (31) to enclose the magnets (6).

3. A cathode body capable of sputtering magnetic material according to claim 2, characterized in that: A cooling member water tank (42) is provided on the lower side of the cooling member (4) between two cooling member grooves (41); a yoke through hole (32) is provided on the yoke (3) below the cooling member water tank (42); a pad through hole (21) is provided on the pad (2) corresponding to the yoke through hole (32); and a base through hole (12) is provided on the bottom surface of the cathode body base (1) corresponding to the pad through hole (21).

4. A cathode body capable of sputtering magnetic material according to claim 2, characterized in that: Sealing rings (8) are respectively provided between the yoke (3) and the cooling element (4) and at positions on both sides of the cooling element water tank (42).

5. A cathode body capable of sputtering magnetic material according to claim 1, characterized in that: Three magnets (6) are arranged between the magnetic yoke (3) and the cooling member (4), and the polarity of the magnet (6) in the middle is opposite to the polarity of the magnets (6) on both sides.

6. A cathode body capable of sputtering magnetic material according to claim 1, characterized in that: The cooling member (4) is a cooling copper member.

7. A cathode body capable of sputtering magnetic material according to claim 1, characterized in that: The height of the upper side of the magnetic conductive plate (7) is not higher than the height of the upper side of the target material (5) and is not lower than the height of the lower side of the target material (5); the height of the lower side of the magnetic conductive plate (7) is not higher than the height of the upper side of the magnetic yoke (3) and is not lower than the height of the lower side of the magnetic yoke (3).

8. A cathode body capable of sputtering magnetic material according to claim 1, characterized in that: The thickness of the magnetic conductive plate (7) is not greater than 6 mm.

9. A cathode body capable of sputtering magnetic material according to claim 1, characterized in that: The magnetic conductive plate (7) is a pure iron magnetic conductive plate.

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