Semiconductor integrated circuit protection mechanism

Abstract

The utility model relates to the technical field of semiconductor integrated circuits, and discloses a semiconductor integrated circuit protection mechanism, which comprises an assembly box, an integrated circuit board, a mounting groove, a mounting seat, a butt joint groove, a sleeve, a support shaft, a main buffer air bag and an auxiliary buffer air bag. A main buffering air bag and an auxiliary buffering air bag which can support and fit the upper side and the lower side of the limiting piece are arranged in the sleeve, the main buffering air bag and the auxiliary buffering air bag are filled with air pressure, and when the integrated circuit board vibrates up and down or is pressed, the integrated circuit board can extrude the supporting shaft located in the sleeve through the mounting base; the supporting shaft can adaptively extrude the main buffering air bag and the auxiliary buffering air bag through the limiting piece when moving up and down, supporting and buffering are conducted through the deformation effect formed by air pressure in the main buffering air bag and the auxiliary buffering air bag, and the problem that metal fatigue is generated due to the fact that an existing spring is used is solved; therefore, the protection effect of the integrated circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor integrated circuits, in particular to a semiconductor integrated circuit protection mechanism. Background Art

[0002] A semiconductor integrated circuit is a semiconductor integrated circuit device that has at least one circuit block on a semiconductor substrate. A semiconductor integrated circuit is an active component such as a transistor, a diode, and a passive component such as a resistor, a capacitor, etc. that are interconnected according to a certain circuit and "integrated" on a semiconductor single chip to complete a specific circuit or system function.

[0003] After searching for a utility model of a semiconductor integrated circuit protection mechanism with application number 202121516709.9, the scheme is to set a retractable fixed seat and a sliding seat at the bottom of the circuit board, and a spring and other mechanisms located inside the fixed seat to support the sliding seat. When the circuit board is subjected to vibration or deformation and pressure, the circuit board can be adaptively extruded and retracted through the cooperation of the fixed seat, the sliding seat and the spring, etc., to ensure that the circuit board itself can be buffered and protected when it is under pressure to avoid damage; however, when its spring mechanism is used for a long time under extrusion and deformation, the spring mechanism itself will produce metal fatigue, resulting in its elastic support effect gradually reducing, affecting the subsequent normal support and buffering use of the circuit board. The circuit board is still prone to damage, and the protection effect is limited. For this reason, we propose a semiconductor integrated circuit protection mechanism. Utility Model Content

[0004] The utility model mainly solves the technical problems existing in the above-mentioned prior art and provides a semiconductor integrated circuit protection mechanism.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a semiconductor integrated circuit protection mechanism, including an assembly box and an integrated circuit board, an installation groove is opened inside the integrated circuit board, a mounting seat is installed on the inner side of the installation groove, and docking grooves are opened on the upper and lower ends of the mounting seat, and sleeves are installed on the inner sides of the two groups of assembly boxes, and the inner telescopic sliding of the sleeve has a support shaft that supports and cooperates with the mounting seat, one end of the support shaft is engaged with the inner limit of the sleeve through a limit piece, and the interior of the sleeve is provided with a main buffer airbag with air pressure inside on one side of the limit piece, and the outer sleeve of the support shaft is connected to a secondary buffer airbag with air pressure inside.

[0006] Preferably, a docking piece is provided at the other end of the support shaft, and the end of the support shaft is engaged and supported in a docking groove inside the mounting seat through the docking piece.

[0007] Preferably, one side of the limit member is connected and cooperated with the main buffer airbag support, and the other end of the limit member is connected and cooperated with the auxiliary buffer airbag support.

[0008] Preferably, when the integrated circuit board drives the support shaft to move up and down through the mounting seat, the limit piece at the end of the support shaft is located inside the sleeve to squeeze and buffer the main buffer airbag and the auxiliary buffer airbag.

[0009] Preferably, a circular groove is provided at one end of the docking piece, a built-in groove connected to the circular groove is provided inside the docking piece, a circular shaft passing through the built-in groove is installed at the end of the support shaft, and a protective sleeve pad is connected to the outer sleeve of the circular shaft and fits the inner side of the built-in groove.

[0010] Preferably, the protective sleeve pad itself has a deformation property, and when the integrated circuit board drives the mounting seat to move horizontally, the mounting seat is in an extrusion buffer state with the circular shaft through the protective sleeve pad inside the docking piece.

[0011] The utility model provides a semiconductor integrated circuit protection mechanism, which has the following beneficial effects:

[0012] 1. A semiconductor integrated circuit protection mechanism, in this article, a mounting seat is installed in the interior of the integrated circuit board through a mounting groove, and the end of the support shaft can be supported and docked with the docking grooves at both ends of the mounting seat through a docking piece, and the interior of the sleeve is provided with a main buffer airbag and a sub-buffer airbag that can support and fit the upper and lower sides of the limit member, and the interiors of the main buffer airbag and the sub-buffer airbag are filled with air pressure. When the integrated circuit board vibrates up and down or is pressurized, the integrated circuit board can squeeze the support shaft located inside the sleeve through the mounting seat, and the support shaft can squeeze the main buffer airbag and the sub-buffer airbag accordingly when moving up and down through the limit member, and support and buffer are performed through the deformation effect formed by the internal air pressure of the main buffer airbag and the sub-buffer airbag, which solves the problem of metal fatigue caused by the use of the existing spring, thereby improving the protection effect of the integrated circuit board.

[0013] 2. A semiconductor integrated circuit protection mechanism, wherein the end of the support shaft is supported and docked in a docking groove at the end of the mounting seat through a docking piece, and a round shaft is installed at the end of the support shaft, and a protective sleeve pad mounted on the outside of the round shaft is adaptively and fitly docked with a built-in groove inside the docking piece, and the protective sleeve pad itself has a deformation effect. When the integrated circuit board generates horizontal vibration, after the integrated circuit board drives the mounting seat to move horizontally, the docking piece can squeeze the protective sleeve pad as the mounting seat moves accordingly, and the horizontal force generated by the integrated circuit board is adaptively supported and buffered through the characteristics of the protective sleeve pad itself, thereby achieving a multi-directional and multi-functional protection effect on the integrated circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings described below are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0015] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 For this utility model Figure 1 A magnified view of middle;

[0018] Figure 3 For this utility model Figure 1 Enlarged view of B.

[0019] Legend:

[0020] 1. Assembly box; 2. Integrated circuit board; 3. Mounting groove; 4. Mounting seat; 5. Docking groove; 6. Sleeve; 7. Support shaft; 8. Docking piece; 9. Limiting piece; 10. Main cushion airbag; 11. Auxiliary cushion airbag; 12. Round groove; 13. Built-in groove; 14. Round shaft; 15. Protective sleeve pad. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Embodiment 1: A semiconductor integrated circuit protection mechanism, such as Figure 1-Figure 3As shown, it includes an assembly box 1 and an integrated circuit board 2, a mounting groove 3 is opened inside the integrated circuit board 2, a mounting seat 4 is installed on the inner side of the mounting groove 3, and docking grooves 5 are opened at the upper and lower ends of the mounting seat 4, and sleeves 6 are installed on the inner sides of the two groups of assembly boxes 1. The inner telescopic sliding of the sleeve 6 has a support shaft 7 that supports and cooperates with the mounting seat 4, and one end of the support shaft 7 is engaged with the inner limit of the sleeve 6 through a limit piece 9. The interior of the sleeve 6 is located on one side of the limit piece 9. A main buffer airbag 10 with air pressure inside is provided, and the outer sleeve of the support shaft 7 is connected to a secondary buffer airbag 11 with air pressure inside.

[0023] Furthermore, a docking piece 8 is provided at the other end of the support shaft 7 , and the end of the support shaft 7 is engaged and supported in the docking groove 5 inside the mounting seat 4 through the docking piece 8 .

[0024] Furthermore, one side of the limiting member 9 is connected and matched with the main buffer airbag 10 in a supporting manner, and the other end of the limiting member 9 is connected and matched with the auxiliary buffer airbag 11 in a supporting manner.

[0025] Furthermore, when the integrated circuit board 2 drives the support shaft 7 to move up and down through the mounting seat 4, the stopper 9 at the end of the support shaft 7 is located inside the sleeve 6 to squeeze and buffer the main buffer airbag 10 and the auxiliary buffer airbag 11.

[0026] Embodiment 2: A semiconductor integrated circuit protection mechanism, such as Figure 1-Figure 3 As shown, it includes an assembly box 1 and an integrated circuit board 2, a mounting groove 3 is opened inside the integrated circuit board 2, a mounting seat 4 is installed on the inner side of the mounting groove 3, and docking grooves 5 are opened at the upper and lower ends of the mounting seat 4, and sleeves 6 are installed on the inner sides of the two groups of assembly boxes 1. The inner telescopic sliding of the sleeve 6 has a support shaft 7 that supports and cooperates with the mounting seat 4, and one end of the support shaft 7 is engaged with the inner limit of the sleeve 6 through a limit piece 9. The interior of the sleeve 6 is located on one side of the limit piece 9. A main buffer airbag 10 with air pressure inside is provided, and the outer sleeve of the support shaft 7 is connected to a secondary buffer airbag 11 with air pressure inside.

[0027] Furthermore, a docking piece 8 is provided at the other end of the support shaft 7, and the end of the support shaft 7 is supported and engaged with the docking groove 5 inside the mounting seat 4 through the docking piece 8. One side of the limit member 9 is supported and connected with the main buffer airbag 10, and the other end of the limit member 9 is supported and connected with the auxiliary buffer airbag 11. When the integrated circuit board 2 drives the support shaft 7 to move up and down through the mounting seat 4, the limit member 9 at the end of the support shaft 7 is located inside the sleeve 6 to be in an extrusion and buffering state for the main buffer airbag 10 and the auxiliary buffer airbag 11.

[0028] Furthermore, a circular groove 12 is provided at one end of the docking piece 8, and a built-in groove 13 connected to the circular groove 12 is provided inside the docking piece 8. A circular shaft 14 passing through the built-in groove 13 is installed at the end of the support shaft 7, and a protective sleeve pad 15 that fits the inner side of the built-in groove 13 is connected to the outer sleeve of the circular shaft 14.

[0029] Furthermore, the protective sleeve pad 15 itself has a deformation property. When the integrated circuit board 2 drives the mounting seat 4 to move horizontally, the mounting seat 4 is in an extrusion buffer state with the round shaft 14 through the protective sleeve pad 15 inside the docking member 8 .

[0030] The working principle of this utility model:

[0031] The interior of the integrated circuit board 2 is installed with a mounting seat 4 through a mounting groove 3, and the end of the support shaft 7 can be supported and docked with the docking grooves 5 at both ends of the mounting seat 4 through a docking piece 8, and the interior of the sleeve 6 is provided with a main buffer airbag 10 and a sub-buffer airbag 11 that can support and fit the upper and lower sides of the limit member 9. The interiors of the main buffer airbag 10 and the sub-buffer airbag 11 are filled with air pressure. When the integrated circuit board 2 vibrates up and down or is pressurized, the integrated circuit board 2 can squeeze the support shaft 7 located inside the sleeve 6 through the mounting seat 4, and the support shaft 7 can squeeze the main buffer airbag 10 and the sub-buffer airbag 11 accordingly when moving up and down through the limit member 9, and support and buffer are performed through the deformation effect formed by the internal air pressure of the main buffer airbag 10 and the sub-buffer airbag 11, thereby solving the existing problem of metal fatigue caused by the use of springs, thereby improving the protection effect of the integrated circuit board 2.

[0032] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor integrated circuit protection mechanism, comprising an assembly box (1) and an integrated circuit board (2), characterized in that: The integrated circuit board (2) is provided with a mounting groove (3) inside, a mounting seat (4) is installed inside the mounting groove (3), and docking grooves (5) are provided at both upper and lower ends of the mounting seat (4). Sleeves (6) are installed inside the two groups of assembly boxes (1), and a support shaft (7) supporting and cooperating with the mounting seat (4) is provided inside the sleeve (6) in a telescopic and sliding manner, and one end of the support shaft (7) is engaged with the inner limit of the sleeve (6) through a limit member (9), and a main buffer airbag (10) with air pressure inside is provided inside the sleeve (6) on one side of the limit member (9), and a secondary buffer airbag (11) with air pressure inside is connected to the outer sleeve of the support shaft (7).

2. A semiconductor integrated circuit protection mechanism according to claim 1, characterized in that: The other end of the support shaft (7) is provided with a docking piece (8), and the end of the support shaft (7) is clamped and supported in a docking groove (5) inside the mounting seat (4) through the docking piece (8).

3. A semiconductor integrated circuit protection mechanism according to claim 1, characterized in that: One side of the limiting member (9) is connected and matched with the main buffer airbag (10) in a supporting manner, and the other end of the limiting member (9) is connected and matched with the auxiliary buffer airbag (11) in a supporting manner.

4. A semiconductor integrated circuit protection mechanism according to claim 3, characterized in that: When the integrated circuit board (2) drives the support shaft (7) to move up and down through the mounting seat (4), the stopper (9) at the end of the support shaft (7) is located inside the sleeve (6) to squeeze and buffer the main buffer airbag (10) and the auxiliary buffer airbag (11).

5. A semiconductor integrated circuit protection mechanism according to claim 2, characterized in that: A circular groove (12) is formed at one end of the docking piece (8), a built-in groove (13) communicating with the circular groove (12) is formed inside the docking piece (8), a circular shaft (14) penetrating the built-in groove (13) is mounted at the end of the support shaft (7), and a protective sleeve pad (15) is sleeved and connected to the inner side of the built-in groove (13) on the outer side of the circular shaft (14).

6. A semiconductor integrated circuit protection mechanism according to claim 5, characterized in that: The protective sleeve pad (15) itself has a deformation property, and when the integrated circuit board (2) drives the mounting seat (4) to move horizontally, the mounting seat (4) is in an extrusion buffer state with the circular shaft (14) through the protective sleeve pad (15) inside the docking piece (8).

Images