LED circuit board heat dissipation structure

Abstract

The utility model provides an LED circuit board heat dissipation structure, which relates to the technical field of LED circuit board heat dissipation, and comprises a circuit board, a lamp bead is embedded on the circuit board, a protective tube is arranged on one side of the lamp bead, heat generated at the bottom of the lamp bead is transferred to a heat conduction column through a silicone grease layer, and the heat conduction column is used for heat dissipation of the LED circuit board. Heat is evenly transmitted to the heat conduction plate, heat absorbed on the protection plate is dissipated under the action of the first heat dissipation fins and the second fins, and due to the crossed design of the second fins and the first heat dissipation fins, air flowing paths between the fins can be increased through the fins which are arranged in a crossed mode, the convection effect is enhanced, and the heat dissipation effect is improved. The arrangement mode is suitable for a condition with a compact space or a relatively high control requirement on a flowing path, and the heat dissipation surface area and the heat transfer efficiency can be maximized in a limited space, so that the heat dissipation effect of the circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED circuit board heat dissipation, in particular to a LED circuit board heat dissipation structure. Background Art

[0002] LED circuit board is an electronic device specially used to drive and control LED (light emitting diode). It usually includes LED chip, power management circuit, control circuit and necessary heat dissipation structure. The purpose of LED circuit board design is to ensure that LED can work stably and efficiently while minimizing energy consumption and heat loss.

[0003] However, the LED circuit board will generate heat during use, so it is necessary to set a heat dissipation structure adapted thereto to dissipate the heat of the LED circuit board to prevent the LED circuit board from being in a high temperature environment for a long time, thereby causing damage to the electronic components on the LED circuit board;

[0004] However, most of the existing LED circuit board heat dissipation structures use a heat conductive block to absorb the heat at the bottom of the LED circuit and then dissipate the heat through the heat dissipation fins. However, in actual use, since the heat dissipation structure is arranged at the bottom of the LED circuit board, after installation, the bottom of the LED circuit board fits the installation point. At this time, since the distance between the LED circuit board and the installation point is small, the heat dissipation effect cannot be effectively achieved only by the heat dissipation fins.

[0005] Therefore, the utility model proposes a heat dissipation structure of an LED circuit board. Utility Model Content

[0006] The purpose of the utility model is to solve the shortcomings existing in the prior art and to provide a heat dissipation structure for an LED circuit board.

[0007] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an LED circuit board heat dissipation structure, comprising a circuit board, a lamp bead is embedded and installed on the circuit board, a fuse is arranged on one side of the lamp bead, a protective plate is arranged at the bottom of the circuit board, and a bottom plate is arranged at the bottom of the protective plate;

[0008] A heat conducting plate is arranged between the circuit board and the protection plate, a heat conducting column is arranged at the bottom of the fuse tube, and a silicone grease layer is arranged between the protection plate and the bottom of the fuse tube.

[0009] As a preferred implementation, the lamp beads are distributed in a rectangular shape, and the intervals between two adjacent lamp beads are equal.

[0010] The beneficial effect of adopting the above further solution is that under the action of the circuit board, the lamp bead is a semiconductor light source and can therefore emit light under the action of the circuit board.

[0011] As a preferred implementation, the heat conducting plate is provided with first notches, the first notches are distributed in a rectangular shape, and the intervals between two adjacent first notches are equal.

[0012] The beneficial effect of adopting the above further scheme is: a movable space is reserved for the first heat dissipation fin through the first slot, and since the heat conducting plate is embedded between the circuit board and the protective plate, the heat on the circuit board is absorbed by the heat conducting plate during use, and the heat is discharged through the first heat dissipation fin.

[0013] As a preferred implementation, first heat dissipation fins are arranged at the bottom of the protective plate, and there are six first heat dissipation fins in total, and the intervals between the six first heat dissipation fins are equal.

[0014] The beneficial effect of adopting the above further solution is that under the action of the first heat dissipation fins, the heat at the bottom of the protective plate is dissipated through the first heat dissipation fins.

[0015] As a preferred embodiment, second fins are arranged at the bottom of the base plate, and the spacing between two adjacent second fins is equal. The heat dissipation spacing of the first heat dissipation fins is arranged horizontally, and the heat dissipation spacing of the second fins is arranged vertically.

[0016] The beneficial effect of adopting the above-mentioned further scheme is: under the action of the second fin, the heat dissipation effect is further improved, and due to the cross-design of the second fin and the first heat dissipation fin, the cross-arranged fins can increase the air flow path between the fins, enhance the convection effect, and help improve the heat dissipation efficiency. This arrangement is suitable for compact spaces or situations with high requirements for control of the flow path, and can maximize the heat dissipation surface area and heat transfer efficiency in a limited space.

[0017] As a preferred embodiment, connecting legs are provided at both ends of the bottom of the base plate, and a second notch is provided on the base plate below the first heat sink fin, and the diameter of the second notch is greater than the diameter of the first heat sink fin.

[0018] The beneficial effect of adopting the above further solution is that the bottom plate and the mounting point are fixed by soldering through the connecting legs, and further, under the action of the second notch, a movable space is reserved for the first heat dissipation fin.

[0019] Compared with the prior art, the advantages and positive effects of the utility model are:

[0020] In the utility model, firstly, the heat generated by the bottom of the bottom of the lamp bead is transferred to the heat-conducting column through the silicone grease layer. Under the action of the heat-conducting column, the heat is evenly transferred to the heat-conducting plate. At this time, under the action of the first heat dissipation fin and the second fin, the heat adsorbed on the protective plate is dissipated. In addition, due to the cross-design of the second fin and the first heat dissipation fin, the cross-arranged fins can increase the air flow path between the fins, enhance the convection effect, and help improve the heat dissipation efficiency. This arrangement is suitable for compact spaces or situations with high requirements for control of the flow path. It can maximize the heat dissipation surface area and heat transfer efficiency in a limited space, thereby improving the heat dissipation effect of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a front view of a heat dissipation structure of an LED circuit board of the utility model;

[0022] Figure 2 This is a disassembled diagram of a heat dissipation structure of an LED circuit board of the utility model;

[0023] Figure 3 This is a structural diagram of a circuit board in a LED circuit board heat dissipation structure of the utility model;

[0024] Figure 4 This is a disassembled diagram of a heat conducting plate in a heat dissipation structure of an LED circuit board of the utility model;

[0025] Figure 5 This is a disassembled diagram of a bottom plate in a heat dissipation structure of an LED circuit board of the utility model.

[0026] Reference numerals

[0027] 1. Circuit board; 11. Lamp beads; 12. Fuse tube; 13. Silicone grease layer; 14. Heat conducting plate; 15. Heat conducting column; 16. First notch;

[0028] 2. Protective plate; 21. First heat sink fin;

[0029] 3. Bottom plate; 31. Second notch; 32. Second fin; 33. Connecting legs. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] like Figure 1-5As shown, the utility model provides a technical solution: a heat dissipation structure of an LED circuit board, comprising a circuit board 1, a lamp bead 11 is embedded and installed on the circuit board 1, a fuse tube 12 is arranged on one side of the lamp bead 11, a protective plate 2 is arranged at the bottom of the circuit board 1, and a bottom plate 3 is arranged at the bottom of the protective plate 2; a heat conducting plate 14 is arranged between the circuit board 1 and the protective plate 2, a heat conducting column 15 is arranged on the heat conducting plate 14 at the bottom of the fuse tube 12, a silicone grease layer 13 is arranged between the protective plate 2 and the bottom of the fuse tube 12, and the lamp beads 11 are distributed in a rectangular shape and are relatively The spacing between two adjacent lamp beads 11 is equal, and a first heat dissipation fin 21 is arranged at the bottom of the protective plate 2. There are six first heat dissipation fins 21 in total, and the spacing between the six first heat dissipation fins 21 is equal. The heat generated by the bottom of the lamp bead 11 is transferred to the heat-conducting column 15 through the silicone grease layer 13. Under the action of the heat-conducting column 15, the heat is evenly transferred to the heat-conducting plate 14. At this time, under the action of the first heat dissipation fin 21 and the second fin 32, the heat absorbed on the protective plate 2 is dissipated, thereby solving the technical problem of heat dissipation of the circuit board 1.

[0032] Further, such as Figure 5 As shown: a second fin 32 is arranged at the bottom of the base plate 3, and a second fin 32 is arranged at the bottom of the base plate 3, and the spacing between two adjacent second fins 32 is equal, the heat dissipation spacing of the first heat dissipation fin 21 is arranged horizontally, and the heat dissipation spacing of the second fin 32 is arranged vertically. Due to the cross design of the second fin 32 and the first heat dissipation fin 21, the cross-arranged fins can increase the air flow path between the fins, enhance the convection effect, and help improve the heat dissipation efficiency. This arrangement is suitable for compact spaces or situations with high requirements for control of the flow path. It can maximize the heat dissipation surface area and heat transfer efficiency in a limited space, and solves the technical problem of low heat dissipation effect of the circuit board 1.

[0033] The above solution still has the problem that the first heat sink fin 21 penetrates the bottom of the bottom plate 3. Figure 4-Figure 5 As shown: In the present embodiment, a first slot 16 is provided on the heat conducting plate 14, the first slots 16 are distributed in a rectangular shape, and the spacing between two adjacent first slots 16 is equal, connecting legs 33 are provided at both ends of the bottom of the base plate 3, and a second slot 31 is provided on the base plate 3 below the first heat dissipation fin 21, and the diameter of the second slot 31 is larger than the diameter of the first heat dissipation fin 21, and a movable space is reserved for the first heat dissipation fin 21 through the first slot 16 and the second slot 31, and the circuit board 1 is cooled by the first heat dissipation fin 21.

[0034] Working principle:

[0035] like Figure 1-5As shown, first, under the action of the connecting legs 33, the base plate 3 is soldered to the mounting point, and the lamp bead 11 is controlled to turn on the lamp bead 11. The lamp bead 11 will generate heat during use. At this time, the heat generated by the bottom of the lamp bead 11 is transferred to the heat conducting column 15 through the silicone grease layer 13. Under the action of the heat conducting column 15, the heat is evenly transferred to the heat conducting plate 14. At this time, under the action of the first heat dissipation fins 21 and the second fins 32, the heat adsorbed on the protective plate 2 is dissipated. Due to the cross design of the second fins 32 and the first heat dissipation fins 21, the cross-arranged fins can increase the air flow path between the fins, enhance the convection effect, and help improve the heat dissipation efficiency.

[0036] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A LED circuit board heat dissipation structure, comprising a circuit board (1), characterized in that: A lamp bead (11) is embedded and installed on the circuit board (1), a fuse (12) is arranged on one side of the lamp bead (11), a protective plate (2) is arranged at the bottom of the circuit board (1), and a bottom plate (3) is arranged at the bottom of the protective plate (2); A heat conducting plate (14) is arranged between the circuit board (1) and the protective plate (2); a heat conducting column (15) is arranged on the bottom of the fuse (12); and a silicone grease layer (13) is arranged between the protective plate (2) and the bottom of the fuse (12).

2. The LED circuit board heat dissipation structure according to claim 1, characterized in that: The lamp beads (11) are distributed in a rectangular shape, and the distance between two adjacent lamp beads (11) is equal.

3. The LED circuit board heat dissipation structure according to claim 1, characterized in that: The heat conducting plate (14) is provided with first notches (16), the first notches (16) are distributed in a rectangular shape, and the spacing between two adjacent first notches (16) is equal.

4. The LED circuit board heat dissipation structure according to claim 1, characterized in that: The bottom of the protective plate (2) is provided with first heat dissipation fins (21), and there are six first heat dissipation fins (21) in total, and the spacings between the six first heat dissipation fins (21) are equal.

5. The LED circuit board heat dissipation structure according to claim 4, characterized in that: The bottom of the base plate (3) is provided with a second fin (32), the bottom of the base plate (3) is provided with a second fin (32), and the spacing between two adjacent second fins (32) is equal, the heat dissipation spacing of the first heat dissipation fins (21) is arranged horizontally, and the heat dissipation spacing of the second fins (32) is arranged vertically.

6. The LED circuit board heat dissipation structure according to claim 1, characterized in that: Both ends of the bottom of the base plate (3) are provided with connecting legs (33), and a second notch (31) is provided on the base plate (3) below the first heat dissipation fin (21), wherein the diameter of the second notch (31) is greater than the diameter of the first heat dissipation fin (21).

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