Condensation part for refrigeration module, semiconductor refrigeration module and semiconductor dehumidifier
By designing a reasonably arranged condensate fin condensate in the refrigeration module, the problems of condensation and poor ventilation effects caused by the unreasonable structure of the existing condensate are solved, and more efficient condensation and ventilation effects are achieved.
Patent Information
- Application Number
- CN202420975305.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-05-07
AI Technical Summary
The shape and structural settings of existing condensates are unreasonable, which affects the condensation effect and ventilation effect.
A condenser for a refrigeration module is designed, which includes a condensing substrate and a plurality of condensing fins. The condensing fins are arranged in parallel in the length direction of the condensing substrate. The spacing between two adjacent condensing fins is 5.5 mm to 8 mm, the thickness of the condensing fins is 0.8 mm to 2 mm, the width is 15 mm to 22 mm, and the upper and lower ends are inclined downwards.
Through reasonable condensation fin layout and spacing design, the condensation and ventilation effect is improved, ensuring that condensation water can flow out easily and reduce the barrier to airflow.
Smart Images
Figure CN222811965U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of refrigeration and dehumidification, and in particular relates to a condensing element for a refrigeration module, a semiconductor refrigeration module and a semiconductor dehumidifier. Background Art
[0002] The semiconductor refrigeration module uses the Peltier effect between P-type and N-type semiconductor materials to achieve refrigeration and dehumidification. When current passes through the two semiconductor materials, heat and cold are generated. When the temperature difference between the cold end and the ambient temperature is large, the water molecules in the air will be condensed into water to achieve the dehumidification effect.
[0003] In order to improve the condensation effect, a condensation element is currently installed at the cold end of the semiconductor refrigeration plate. The condensation element absorbs the low temperature of the cold end of the semiconductor refrigeration plate and increases the contact area with the airflow so that the moisture in the airflow is cooled and liquefied. However, the existing condensation elements have different shapes and specifications. For condensation elements with fin structures, the structural setting of the fins will directly affect the condensation and ventilation effects. Utility Model Content
[0004] The utility model aims to provide a condensing element for a refrigeration module, which greatly improves the condensation and ventilation effects through the reasonable layout design of multiple condensing fins.
[0005] Based on this, the utility model provides a condensing part for a refrigeration module, including a condensing substrate and a plurality of condensing fins arranged on the condensing substrate, one side of the condensing substrate is a connecting side for connecting to the cold end of a semiconductor refrigeration plate, the condensing fins are arranged on the other side opposite to the connecting side, the condensing fins are sheet-shaped fins extending from the upper side to the lower side of the condensing substrate and extending in a direction away from the connecting side, a plurality of condensing fins are arranged in parallel at intervals along the length direction of the condensing substrate, and the spacing D between two adjacent condensing fins is 5.5 mm to 8 mm.
[0006] In the condensing element for a refrigeration module as described above, the thickness B of a single condensing fin is 0.8 mm to 2 mm.
[0007] In the condensing element for a refrigeration module as described above, the width d of the condensing fins extending in the direction away from the connecting side surface is 15 mm to 22 mm.
[0008] In the condensing element for a refrigeration module as described above, the upper end surface and the lower end surface of the condensing fin are respectively inclined downward.
[0009] In the condensing element for a refrigeration module as described above, the inclination angle K of the condensing fins is 20° to 45°.
[0010] In the condensing component for a refrigeration module as described above, the condensing substrate and the condensing fins are integrally formed.
[0011] The utility model also provides a semiconductor refrigeration module, comprising a semiconductor refrigeration plate, a heat dissipation component arranged on the hot end of the semiconductor refrigeration plate, and the above-mentioned condensation element is arranged on the cold end of the semiconductor refrigeration plate.
[0012] A semiconductor refrigeration module as described above, wherein the heat dissipation component includes a base, a copper tube and heat dissipation fins, the copper tube includes a heat conduction section and a heat dissipation section, the heat conduction section is fixed to the base and forms a heat conduction surface for fitting the hot end, the heat dissipation section extends away from the heat conduction section, and a plurality of heat dissipation fins are arranged at intervals along the length direction of the heat dissipation section; the interior of the copper tube is in a vacuum state and contains a refrigerant, and the refrigerant can change from liquid to gas after absorbing heat or change from gas to liquid after dissipating heat.
[0013] In the semiconductor refrigeration module as described above, a capillary structure is provided in the copper tube.
[0014] The utility model also provides a semiconductor dehumidifier, comprising a dehumidifier body, wherein the semiconductor refrigeration module is arranged in the dehumidifier body.
[0015] Implementing the embodiments of the utility model has the following beneficial effects:
[0016] The utility model provides a condensing element for a refrigeration module, which is a fin-type structure. A condensing substrate is used as a contact with the semiconductor condensing plate and the low temperature is transferred to each condensing plate, so that the condensing plate is in contact with the airflow, and the moisture in the airflow is liquefied into water droplets and attached to the condensing plate. During use, the airflow mainly flows through the gaps between the condensing fins. This scheme ensures the condensation effect of the condensing fins in contact with the airflow by rationally arranging and designing multiple condensing fins on the condensing substrate with a reasonable spacing width, thereby facilitating the outflow of condensed water and having a low flow obstruction to the airflow. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0018] Figure 1 A schematic diagram of a condensing element for a refrigeration module provided in an embodiment of the utility model;
[0019] Figure 2 for Figure 1 Side view of;
[0020] Figure 3 It is a schematic diagram of a semiconductor refrigeration module;
[0021] Figure 4 for Figure 3 Exploded diagram of
[0022] Figure 5 for Figure 3 Schematic diagram of the heat dissipation component. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] like Figure 1 , Figure 2 As shown, an embodiment of the utility model provides a condensing element for a refrigeration module, including a condensing substrate 21 and a plurality of condensing fins 22 arranged on the condensing substrate 21, one side of the condensing substrate 21 is a connecting side for connecting to the cold end of a semiconductor refrigeration sheet 1, and the condensing fins 22 are arranged on the other side opposite to the connecting side. The condensing element of this scheme also adopts a fin-type structure, and the condensing substrate is used as a contact with the semiconductor condensing sheet and transfers the low temperature to each condensing sheet, so that the condensing sheet is in contact with the airflow, and the moisture in the airflow is liquefied into water droplets and attached to the condensing sheet.
[0025] In the present solution, the condensing fins 22 are sheet-shaped fins extending from the upper side to the lower side of the condensing substrate 21 and extending in the direction opposite to the connecting side surface. A plurality of condensing fins 22 are arranged in parallel and spaced apart along the length direction of the condensing substrate 21. During use, the airflow mainly flows through the gaps between the condensing fins. The present solution ensures the condensation effect of the condensing fins in contact with the airflow by designing a plurality of condensing fins with a reasonable layout on the condensing substrate and a reasonable spacing width, thereby facilitating the outflow of condensed water and having a low flow obstruction to the airflow.
[0026] In actual use, the air flow generally passes through the gap from the lower side of the condensing fin 22 and flows out from the upper side of the condensing fin 22. The condensed water droplets adhere to the condensing fin 22, that is, are located in the gap. When the spacing D is less than 5.5 mm, the water droplets on the condensing fins 22 on both sides are closer and merged into large water droplets, which can be understood as blocking the air flow channel, thereby becoming an obstacle and making it difficult for the air to flow away. In this solution, the number of condensing fins 22 set per unit length is 10 to 15, and the spacing D between two adjacent condensing fins 22 is 5.5 mm to 8 mm, that is, in this solution, a reasonable number of fins is set per unit length of 100 mm through reasonable spacing. Under the setting of this spacing and number density, the distance between two adjacent condensing fins 22 ensures that the airflow has little effect on the flow rate when it flows through, and the condensed water attached to the condensing fins 22 can easily flow downward along with the condensing fins 22, and is not easy to be retained in the condensing fins 22 or the gap, which also ensures that under the condition of the same size, a reasonable number of condensing fins 22 can be set as much as possible, thereby ensuring the condensation effect. In the embodiment of the utility model, as a preferred embodiment, the spacing D between two adjacent condensing fins 22 is 6 mm.
[0027] In addition, in the embodiment of the utility model, in order to facilitate the manufacture of the product, the thickness B of the single condensing fin 22 is 0.8mm to 2mm. This thickness will affect the efficiency of temperature transfer and the difficulty of manufacturing. When the thickness B of a single condensing fin 22 is less than 0.8mm, it will be difficult to ensure the quality of multiple condensing fins 22 per unit length, and the yield rate will be low. Moreover, if the thickness is too thin, it will be easily damaged during the installation process. When the thickness exceeds 2mm, the efficiency of cold end temperature transfer will be reduced due to excessive thickness, and the overall weight and cost will be increased. Preferably, in the embodiment of the utility model, the thickness B of the single condensing fin 22 is 1.5mm.
[0028] Similarly, in order to ensure the effect of temperature transfer, the width of the condensing fin 22 and the length in the up-down direction directly determine the area of the condensing fin 22, that is, the area in contact with the airflow. In this embodiment, the length of the condensing fin 22 in the up-down direction is consistent with the condensing substrate, so the width of the condensing fin 22 is a key dimension affecting its area. The width d of the condensing fin 22 extending in the direction opposite to the connecting side is 15mm to 22mm. If the width d is too small, that is, less than 15mm, the condensing area of the condensing fin 22 is insufficient, resulting in poor condensation effect, and if the width d is too large, that is, greater than 22mm, the end of the condensing fin is too far from the condensing substrate, resulting in low efficiency of temperature transfer. Preferably, in the embodiment of the utility model, the width d of the condensing fin 22 is 19mm.
[0029] In the embodiment of the utility model, in order to facilitate the water droplets to fall after being attached to the condensing fins 22, the upper end surface and the lower end surface of the condensing fins 22 are respectively inclined downward. The formation of an inclined shape from top to bottom is conducive to the water droplets to gather at the inclined tip along the inclined surface, thereby condensing into larger water droplets and dripping. Specifically, the angle K of the inclination of the condensing fins 22 is 20° to 45°. Preferably, in the embodiment of the utility model, the angle K is 30°.
[0030] In the embodiment of the utility model, the condensation substrate 21 and the condensation fins 22 are integrally formed. The structure is simple, the manufacturing is convenient, and the reasonable fin layout design can improve the condensation effect.
[0031] In addition, in the embodiment of the utility model, the length dimension of the condensation substrate 21 is 99 mm, and the dimension in the up and down direction is 75 mm. Within this area, 14 condensation fins 22 are arranged, and the interval between two adjacent condensation fins 22 is 6 mm. While ensuring that there are enough condensation fins 22, the ventilation and condensation effects are met at the same time.
[0032] like Figures 3 to 5 As shown, the utility model also provides a semiconductor refrigeration module, comprising a semiconductor refrigeration sheet 1, a heat dissipation component 3 arranged on the hot end of the semiconductor refrigeration sheet 1, and the above-mentioned condensation element is arranged on the cold end of the semiconductor refrigeration sheet 1. Since the semiconductor refrigeration module has the above-mentioned condensation element, the semiconductor refrigeration module also has the same beneficial effects.
[0033] Specifically, in the semiconductor refrigeration module, the heat dissipation component 3 includes a base 31, a copper tube 32 and a heat dissipation fin 33. The copper tube 32 includes a heat conduction section 321 and a heat dissipation section 322. The heat conduction section 321 is fixed to the base 31 and forms a heat conduction surface 3211 for attaching to the hot end. The heat dissipation section 322 extends away from the heat conduction section 321. A plurality of heat dissipation fins 33 are arranged at intervals along the length direction of the heat dissipation section 322.
[0034] The copper tube is in a vacuum state and contains a refrigerant. A capillary structure is provided in the copper tube 32. More specifically, the capillary structure covers the inner wall of the copper tube 32. The refrigerant can change from liquid to gas after absorbing heat or change from gas to liquid after dissipating heat. The refrigerant is preferably water, and of course, ethanol or naphthalene can also be selected according to the situation.
[0035] When working, the hot end of the semiconductor cooling sheet 21 contacts the heat-conducting surface 3211, and transfers the heat to the heat-conducting section 321 of the copper tube 32 in the form of heat transfer. Since the inside of the copper tube 32 is in a vacuum state, the boiling point of the refrigerant is low, and the refrigerant in the heat-conducting section 321 can turn into gas more quickly after absorbing heat. After the gaseous refrigerant reaches the heat-dissipating section 322, the temperature drops and returns to liquid under the heat dissipation effect of the heat-dissipating fins 33. The liquid refrigerant continues to return to the heat-conducting section 321 to absorb heat under the capillary effect of the capillary structure, and the cycle repeats. Among them, the multiple heat-dissipating fins achieve good heat dissipation effects through their large surface areas. With the help of the vacuum state and the capillary effect, the heat of the heat-conducting section 321 can be transferred to the heat-dissipating section 322 more quickly, and the heat of the hot end can be dissipated more quickly, thereby improving the condensation performance and thus improving the dehumidification effect.
[0036] As one of the specific embodiments but not limiting, the capillary structure is porous nanofibers arranged along the length direction of the copper tube 32. The pore structure of the porous nanofibers can enhance the capillary action, thereby enhancing the circulation effect of the refrigerant in the copper tube 32.
[0037] As one of the specific embodiments but not limiting, the capillary structure is porous nanofibers arranged along the length direction of the copper tube 32. The pore structure of the porous nanofibers can enhance the capillary action, thereby enhancing the circulation effect of the refrigerant in the copper tube 32.
[0038] As one of the specific implementations but not limitation, the capillary structure may also be a metal powder sintered structure or a groove structure.
[0039] The metal powder sintering structure is formed by washing the copper tube with dilute sulfuric acid, injecting ultra-high purity copper powder particles with a diameter of about 75-150μm into the copper tube, and then sintering it in a furnace. After the sintered copper tube is tightened and sealed with special tools, a metal powder sintering structure that can play a capillary role is formed. The groove structure is formed by integral molding with the copper tube.
[0040] In order to facilitate processing, the heat-conducting surface 3211 is a plane. Furthermore, the base 31 is provided with a mounting portion and a groove, the heat-conducting section 321 of the copper tube 32 is embedded in the groove 312, and the heat-conducting surface 3211 of the heat-conducting section 321 is flush with the notch surface of the groove, so that the heat-conducting surface 3211 and the notch surface are both close to the hot end. The base 31 mainly plays the role of installation and fixing, and its material is aluminum, and it can also play the role of auxiliary heat dissipation.
[0041] In the heat dissipation assembly 3, the spacing between two adjacent heat dissipation fins 33 is 2 mm to 4 mm. Through the layout of this structure, the contact between the airflow and the heat dissipation assembly can be increased, thereby greatly improving the heat dissipation effect and making the dehumidification effect more significant. Moreover, in order to ensure the heat dissipation effect, the thickness of a single heat dissipation fin 33 is 0.27 mm to 0.95 mm.
[0042] In the embodiment of the utility model, several of the heat dissipation fins 33 are aluminum fins. The function of the heat dissipation fins 33 is to increase the contact area with the airflow so that the heat is taken out by the airflow to achieve heat dissipation, and the cost is low. Of course, several of the heat dissipation fins 33 can be aluminum fins and copper fins. That is, there are both aluminum fins and some copper fins in the multiple fins, which is lighter in weight while ensuring the heat dissipation efficiency. It is also possible to adopt a solution of all copper fins, which can make the heat dissipation fins themselves thinner and lighter, and have better thermal conductivity.
[0043] In the above scheme where the length dimension of the condensation substrate 21 is 99mm and the dimension in the vertical direction is 75mm, the length dimension of the heat dissipation component is 114.5mm to 115.5mm, that is, the distance from the end surface of the heat conduction part to the end of the heat conduction copper tube 32, and the total length L of the multiple heat dissipation fins 33 is 84.95mm to 85.95mm. This size layout design, in conjunction with the above-mentioned condensation component application, can achieve a better heat dissipation effect, and has a low manufacturing cost and a small size, which is easy to install and use in electrical appliances.
[0044] The utility model also provides a semiconductor dehumidifier, including a dehumidifier body, wherein the semiconductor refrigeration module is arranged in the dehumidifier body. Since the conductor dehumidifier uses the refrigeration module and condensation element, the semiconductor dehumidifier also has the same beneficial effects.
[0045] The utility model provides a condensing element for a refrigeration module, which is a fin-type structure. A condensing substrate is used as a contact with the semiconductor condensing plate and the low temperature is transferred to each condensing plate, so that the condensing plate is in contact with the airflow, and the moisture in the airflow is liquefied into water droplets and attached to the condensing plate. During use, the airflow mainly flows through the gaps between the condensing fins. This scheme ensures the condensation effect of the condensing fins in contact with the airflow by rationally arranging and designing multiple condensing fins on the condensing substrate with a reasonable spacing width, thereby facilitating the outflow of condensed water and having a low flow obstruction to the airflow.
[0046] It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but such information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information. In addition, the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0047] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the protection scope of the present invention.
Claims
1. A condensing element for a refrigeration module, characterized in that: The invention comprises a condensing substrate (21) and a plurality of condensing fins (22) arranged on the condensing substrate (21); one side of the condensing substrate (21) is a connecting side surface for connecting to a cold end of a semiconductor refrigeration plate (1); the condensing fins (22) are arranged on the other side surface opposite to the connecting side surface; the condensing fins (22) are sheet-shaped fins extending from the upper side to the lower side of the condensing substrate (21) and extending in a direction away from the connecting side surface; the plurality of condensing fins (22) are arranged in parallel and spaced apart along the length direction of the condensing substrate (21); and the spacing D between two adjacent condensing fins (22) is 5.5 mm to 8 mm.
2. A condensing element for a refrigeration module according to claim 1, characterized in that: The thickness B of the single-piece condensing fin (22) is 0.8 mm to 2 mm.
3. A condensing element for a refrigeration module according to claim 1, characterized in that: The width d of the condensing fin (22) extending in the direction away from the connecting side surface is 15 mm to 22 mm.
4. A condensing element for a refrigeration module according to claim 1, characterized in that: The upper end surface and the lower end surface of the condensing fin (22) are respectively inclined downward.
5. A condensing element for a refrigeration module according to claim 4, characterized in that: The inclination angle K of the condensing fins (22) is 20° to 45°.
6. A condensing element for a refrigeration module according to any one of claims 1 to 5, characterized in that: The condensation substrate (21) and the condensation fins (22) are integrally formed.
7. A semiconductor refrigeration module, characterized in that: It comprises a semiconductor refrigeration sheet (1), a heat dissipation component (3) arranged on the hot end of the semiconductor refrigeration sheet (1), and a condensation element as claimed in any one of claims 1 to 6 being arranged on the cold end of the semiconductor refrigeration sheet (1).
8. A semiconductor refrigeration module according to claim 7, characterized in that: The heat dissipation component (3) comprises a base (31), a copper tube (32) and heat dissipation fins (33); the copper tube (32) comprises a heat conduction section (321) and a heat dissipation section (322); the heat conduction section (321) is fixed to the base (31) and forms a heat conduction surface (3211) for fitting against a hot end; the heat dissipation section (322) extends in a direction away from the heat conduction section (321); a plurality of heat dissipation fins (33) are arranged at intervals along the length direction of the heat dissipation section (322); the interior of the copper tube is in a vacuum state and contains a refrigerant; the refrigerant can change from a liquid state to a gas state after absorbing heat or change from a gas state to a liquid state after dissipating heat.
9. A semiconductor refrigeration module according to claim 8, characterized in that: A capillary structure is provided in the copper tube (32).
10. A semiconductor dehumidifier, characterized in that: It comprises a dehumidifier body, in which a semiconductor refrigeration module as described in any one of claims 7 to 9 is arranged.