Water-cooling heat dissipation device capable of increasing flow speed

Abstract

The utility model relates to a water-cooling heat dissipation device capable of increasing the flow speed. The water-cooling heat dissipation device comprises a water-cooling row, a water-cooling head, a first pumping unit, a circulation loop and a second pumping unit. The circulation loop is connected with the water-cooling bar, the water-cooling head and the first pumping unit in a surrounding manner; the second pumping unit is connected in series with the circulation loop. Therefore, the flow speed of the water flowing in the circulation loop can be accelerated, and the effect of improving the heat dissipation efficiency is further achieved.

Description

Technical Field

[0001] The present application relates to water cooling and heat dissipation, and in particular to a water cooling and heat dissipation device capable of increasing flow rate. Background Art

[0002] The existing water-cooled radiator mainly includes a water-cooling row, a pumping unit and a water-cooling head. The water-cooling row, the pumping unit and the water-cooling head are connected to each other in a head-to-tail manner by a water pipe ring (or a surrounding shape).

[0003] Although the existing water-cooled radiator can achieve the purpose of heat dissipation, the flow rate of water as the heat dissipation medium in the water-cooled radiator cannot be increased, so that the heated water with heat absorbed cannot reach the water cooling row more quickly for heat exchange, and the cooled water after heat exchange cannot return to the water cooling head more quickly, resulting in poor heat dissipation efficiency.

[0004] Therefore, how to overcome the above-mentioned deficiencies of the prior art is a major issue that the inventors of this application are eager to solve. Utility Model Content

[0005] The purpose of the present application is to provide a water-cooling heat dissipation device capable of increasing the flow rate, which can be connected in series with a second pumping unit in addition to the existing components to increase the flow rate of water in the circulation loop, thereby improving the heat dissipation efficiency.

[0006] In order to achieve the above-mentioned objectives, the present application provides a water-cooling heat dissipation device capable of increasing the flow rate, comprising: a water-cooling radiator; a water-cooling head; a first pumping unit; a circulation loop, surrounding and connecting the water-cooling radiator, the water-cooling head and the first pumping unit; and a second pumping unit, connected in series to the circulation loop.

[0007] In one embodiment, the first pumping unit and the water cooling head are stacked with each other, and the first pumping unit is in communication with the water cooling head.

[0008] In one embodiment, the circulation loop has two pumping water paths, both of which are connected between the water-cooling row and the water-cooling head, and the second pumping unit is connected in series to any of the pumping water paths.

[0009] In one embodiment, the water-cooling head has two first pumping water holes, the water-cooling row has two water delivery holes, and each pumping water path is connected between each first pumping water hole and each water delivery hole.

[0010] In one embodiment, the second pumping unit has two second pumping water holes, and the second pumping unit is connected to the first pumping water hole and the water delivery hole respectively through the two second pumping water holes in any pumping water path.

[0011] In one embodiment, the pumping water path connected in series with the second pumping unit has a first pumping direction, and the second pumping unit has a second pumping direction, and the second pumping direction is the same as the first pumping direction.

[0012] In one embodiment, the first pumping unit may be installed on the water-cooling row in communication with each other.

[0013] Compared with the prior art, the present application has the following effects: it can speed up the flow rate of water flowing in the circulation loop, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of a three-dimensional exploded view of the first embodiment of the present application.

[0015] Figure 2 This is a three-dimensional combination schematic diagram of the first embodiment of the present application.

[0016] Figure 3 This is a three-dimensional assembly schematic diagram of the second embodiment of the present application.

[0017] Figure 4 It is a schematic diagram of a three-dimensional exploded view of the second pumping unit and the shell in the present application.

[0018] Figure 5 It is a plan view of the water cooling radiator and the first pumping unit after installation in the third embodiment of the present application.

[0019] Description of reference numerals:

[0020] 1: Water cooling radiator;

[0021] 11,12: water delivery holes;

[0022] 2: Water cooling head;

[0023] 201, 202: first pumping water hole;

[0024] 3: first pumping unit;

[0025] 301, 302: third pumping water hole;

[0026] 4: second pumping unit;

[0027] 4a: pumping connector;

[0028] 41, 42: second pumping water hole;

[0029] 5: Shell;

[0030] 5a: half shell;

[0031] 51: accommodating portion;

[0032] 52: positioning unit;

[0033] 521: first perforation;

[0034] 522: second perforation;

[0035] D1: first pumping direction;

[0036] D2: second pumping direction;

[0037] D3: third pumping direction;

[0038] L: circulation loop;

[0039] R1, R2: pumping water circuit;

[0040] W1: first water pipe;

[0041] W2: The second water pipe. DETAILED DESCRIPTION

[0042] The detailed description and technical contents of the present application are described as follows in conjunction with the accompanying drawings. However, the attached drawings are only provided for reference and illustration and are not intended to limit the present application.

[0043] The present application provides a water cooling device (hereinafter referred to as water cooling device) capable of increasing the flow rate, which is used to dissipate the heat of an electronic heating component (not shown) with water. Figure 1 to Figure 2 The first embodiment of the present application is shown. Figure 3 and Figure 5 The second and third embodiments of the present application are shown respectively. Figure 4 Shown is a three-dimensional exploded schematic diagram of the second pumping unit and the shell in the present application.

[0044] like Figure 1 to Figure 2 As shown, the first embodiment of the water-cooling heat dissipation device of the present application includes: a water-cooling row 1, a water-cooling head 2, a first pumping unit 3, a circulation loop L and a second pumping unit 4.

[0045] The water-cooling radiator 1 is used to heat exchange the input hot water and cool it before outputting it. The water-cooling head 2 is used to attach to the electronic heating component to dissipate heat. The first pumping unit 3 (pump) is used to suck the water output by the water-cooling radiator 1, and then pump it back to the water-cooling radiator 1 after heating. The circulation loop L surrounds and connects the water-cooling radiator 1, the water-cooling head 2 and the first pumping unit 3, so that the water sucked and pumped by the first pumping unit 3 can circulate between the water-cooling radiator 1 and the water-cooling head 2 through the circulation loop L.

[0046] The second pumping unit 4 is connected in series to the circulation loop L. Specifically, the pumping direction of the second pumping unit 4 is the same as the pumping direction of the first pumping unit 3, so that the flow rate of the water flowing in the circulation loop L is accelerated.

[0047] In this way, since the flow rate of water flowing in the circulation loop L can be accelerated, the heated water that absorbs heat in the water-cooling head 2 can be sent to the water-cooling radiator 1 more quickly to be converted into cooled water for thermal efficiency, and then sent back to the water-cooling head 2 more quickly. Therefore, the present application has the effect of improving the heat dissipation efficiency.

[0048] Specifically, the first pumping unit 3 and the water cooling head 2 are stacked and connected to each other. The circulation loop L has two pumping water paths R1 and R2. One side of the water cooling radiator 1 has two water delivery holes 11 and 12, and the water cooling radiator 1 includes a pipe assembly and a water tank assembly, both of which are not marked with component symbols. The pipe assembly is connected to the water tank assembly and includes a plurality of hollow pipes (not shown in the figure) and a plurality of heat dissipation fins (not marked with component symbols) arranged on the hollow pipes. The water tank assembly is provided with the two water delivery holes 11 and 12.

[0049] The water-cooling head 2 also has two first pumping water holes 201 and 202, and both of the first pumping water holes 201 and 202 are connected to the first pumping unit 3. One of the first pumping water holes 201 is connected to one of the water delivery holes 11 to form one of the pumping water paths R1, and the other first pumping water hole 202 is connected to the other of the water delivery holes 12 to form another of the pumping water paths R2.

[0050] The second pumping unit 4 (pump) is connected in series to any pumping water path R1, R2 or in series between any pair of water holes (the first pumping water holes 201, 202 and the water delivery holes 11, 12). The present application does not limit which pair of water holes the second pumping unit 4 should be connected in series between, as long as it can increase the flow rate of water in the circulation loop L, as illustrated in the following paragraph:

[0051] The pumping water path R2 connected in series with the second pumping unit 4 has a first pumping direction D1, the second pumping unit 4 itself has a second pumping direction D2, and the pumping water path R1 not connected in series with the second pumping unit 4 has a third pumping direction D3. The first pumping direction D1 and the third pumping direction D3 are opposite to each other, so that the water can be sucked and pumped as described above; the second pumping direction D2 of the second pumping unit 4 itself is the same as the first pumping direction D1, so that the flow rate of water in the circulation loop L can be increased.

[0052] Specifically, the second pumping unit 4 has two second pumping holes 41, 42. Thus, the second pumping unit 4 can be connected to the first pumping hole 202 and the water delivery hole 12 in the pumping water path R2 through the two second pumping holes 41, 42, that is, the second pumping unit 4 is connected in series to the pumping water path R2.

[0053] In one embodiment, the water-cooling heat dissipation device of the present application further includes a first water pipe W1 and two second water pipes W2. The first water pipe W1 and the two second water pipes W2 are connected in the following manner: the first water pipe W1 is bridged between one of the first pumping water holes 201 and one of the water delivery holes 11, and the water can form a pumping water path R1 using the first water pipe W1; one of the second water pipes W2 is bridged between another of the first pumping water holes 202 and one of the second pumping water holes 41, and another of the second water pipes W2 is bridged between another of the water delivery holes 12 and another of the second pumping water holes 42, and the water can form a pumping water path R2 using the two second water pipes W2.

[0054] In this way, when the first pumping unit 3 and the second pumping unit 4 are started, the cooling water output by the water-cooling row 1 can be sucked through the pumping water path R2, and the cooling water flows through the water-cooling head 2 and is heated to become heated water, and the heated water is pumped back to the water-cooling row 1 through the pumping water path R1 for heat exchange and then cooled to become cooling water, and so on. Therefore, the present application connects the second pumping unit 4 in series to any of the pumping water paths R1 and R2, and the second pumping direction D2 of the second pumping unit 4 itself is in the same direction as the first pumping direction D1 of the pumping water path R2 connected in series, so that the first pumping unit 3 and the second pumping unit 4 jointly output water, thereby increasing the flow rate of water in the circulation loop L, thereby improving the heat dissipation efficiency of the water-cooling heat dissipation device of the present application.

[0055] like Figure 4 As shown, in order to fix the second pumping unit 4, the present application also includes a shell 5, the shell 5 has a receiving portion 51 and two positioning portions 52 connected to each other, the receiving portion 51 is used to accommodate and cover the second pumping unit 4; the two positioning portions 52 are spaced apart from each other and are used to position the first water pipe W1 and the second water pipe W2, so as to fix the second pumping unit 4 on the first water pipe W1 and the second water pipe W2.

[0056] In detail, the shell 5 includes two half shells 5a that can be combined with each other. After the two half shells 5a are combined, a accommodating space (component symbol is not marked) can be formed in the accommodating portion 51, and the second pumping unit 4 can be accommodated in the accommodating space; after the two half shells 5a are combined, a first through hole 521 and a second through hole 522 can be formed in the positioning portion 52, and the first through hole 521 and the second through hole 522 are respectively inserted to position the first water pipe W1 and the second water pipe W2.

[0057] like Figure 1 to Figure 2 And with Figure 4As shown, the second pumping unit 4 has two pumping connectors 4a, and the two pumping connectors 4a respectively have the aforementioned second pumping water holes 41 and 42. The two pumping connectors 4a are respectively inserted into the first through holes 521 of the two positioning parts 52, and one end of the two second water pipes W2 is respectively sleeved on the two pumping connectors 4a; as for the first water pipe W1, the entirety of the first water pipe W1 passes through the second through holes 522 of the two positioning parts 52.

[0058] By this, Figure 2 and Figure 3 As shown, the second pumping unit 4 in the present application can be fixed on the first water pipe W1 and the second water pipe W2 by means of the shell 5, and can also have a wire management effect: the first through hole 521 and the second through hole 522 of the positioning part 52 are used to bring the first water pipe W1 and the second water pipe W2 closer to each other.

[0059] like Figure 3 As shown, it is a second embodiment of the water cooling device of the present application. The second embodiment is substantially the same as the aforementioned first embodiment, and the only difference is the serial connection position of the second pumping unit 4.

[0060] In the second embodiment, the second pumping unit 4 is connected in series to another pumping water path R1, and the second pumping direction D2 of the second pumping unit 4 is also the same as the first pumping direction D1 of the pumping water path R1. In this way, all the effects of the first embodiment can be achieved.

[0061] like Figure 5 As shown, it is a third embodiment of the water-cooling heat dissipation device of the present application. The third embodiment is substantially the same as the aforementioned first embodiment, with the difference that the first pumping unit 3 in the third embodiment is installed (or plugged in) at the installation position of the water-cooling radiator 1 (component symbol not indicated), and the water-cooling radiator 1 and the first pumping unit 3 are connected to each other at the installation position.

[0062] Specifically, the first pumping unit 3 has two third pumping water holes 301 and 302 arranged side by side. The first pumping unit 3 is directly connected to the installation position of the radiator 1 through its two third pumping water holes 301 and 302 .

[0063] The third embodiment can also achieve all the effects of the first embodiment.

[0064] In summary, the water-cooling heat dissipation device of the present application which can improve the flow rate can indeed achieve the expected purpose of use and can solve the deficiencies of the prior art, and therefore a patent application is filed.

[0065] The above is only the preferred feasible embodiment of the present application, and does not limit the scope of rights of the present application. All equivalent structural changes made by using the contents of the specification and drawings of the present application are also included in the scope of rights of the present application and are hereby stated.

Claims

1. A water cooling device capable of increasing flow rate, characterized in that: include: Water cooling radiator; Water cooling head; a first pumping unit; A circulation loop, surrounding and connecting the water cooling radiator, the water cooling head and the first pumping unit; as well as The second pumping unit is connected in series to the circulation loop.

2. The water cooling device capable of increasing flow rate as claimed in claim 1, characterized in that: The first pumping unit and the water cooling head are stacked with each other, and the first pumping unit is in communication with the water cooling head.

3. The water cooling device capable of increasing flow rate as claimed in claim 2, characterized in that: The circulation loop has two pumping water paths, both of which are connected between the water cooling row and the water cooling head, and the second pumping unit is connected in series to any of the pumping water paths.

4. The water cooling device capable of increasing flow rate as claimed in claim 3, characterized in that: The water cooling head has two first pumping water holes, the water cooling row has two water delivery holes, and each of the pumping water channels is connected between each of the first pumping water holes and each of the water delivery holes.

5. The water cooling device capable of increasing flow rate as claimed in claim 4, characterized in that: The second pumping unit has two second pumping water holes, and the second pumping unit is connected to the first pumping water hole and the water delivery hole respectively through the two second pumping water holes in any one of the pumping water channels.

6. The water cooling device capable of increasing flow rate according to any one of claims 3 to 5, characterized in that: The pumping waterway connected in series with the second pumping unit has a first pumping direction, and the second pumping unit has a second pumping direction, which is the same as the first pumping direction.

7. The water cooling device capable of increasing flow rate as claimed in claim 1, characterized in that: The first pumping unit may be installed on the radiator in communication with each other.

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