Electronic device

Abstract

The utility model provides an electronic device. The electronic device comprises a shell, an adapter bracket and a baffle plate, the housing has a first opening. The adapter support is assembled to the casing and is provided with a first portion and a second portion which are perpendicularly connected with each other, the first portion extends in the direction away from the casing, the second portion is provided with a second opening, and the second opening corresponds to the first opening. The baffle is arranged corresponding to the second opening and is provided with an assembling part and a protruding part which are connected with each other, the assembling part is correspondingly embedded in the second opening, and the protruding part extends in the direction away from the machine shell and is provided with a plurality of open holes. According to the utility model, the baffle plate is changed into a 3D design under the condition that the assembly specification of the electronic device is not influenced, so that the aperture ratio can break through the limitation of a plane, and the heat dissipation effect is effectively improved.

Description

Technical Field

[0001] This case relates to a device, and more particularly to an electronic device. Background Art

[0002] The area of ​​the air inlet / outlet for heat dissipation of electronic devices, such as servers or desktop computer hosts, cannot be effectively increased due to the structural strength of the bracket of the PCIE card and safety requirements.

[0003] Specifically, within the size specifications of the PCIE card, it is necessary to design the "maximum plane opening" without affecting the structural strength and safety specifications.

[0004] In the prior art, the opening area of ​​the bracket of the PCIE card is converted into an opening rate of about 23%.

[0005] However, as the computing capabilities of processors become more powerful, current designs are no longer sufficient. Utility Model Content

[0006] The present invention provides an electronic device which effectively improves the opening rate.

[0007] An electronic device of the present invention includes a housing, an adapter bracket and a baffle. The housing has a first opening. The adapter bracket is assembled to the housing, and the adapter bracket has a first portion and a second portion that are vertically connected to each other, wherein the first portion extends in a direction away from the housing, and the second portion has a second opening, and the second opening corresponds to the first opening. The baffle is arranged corresponding to the second opening, and has an assembly portion and a protrusion that are connected to each other, the assembly portion is correspondingly embedded in the second opening, and the protrusion extends in a direction away from the housing and has a plurality of openings.

[0008] In an embodiment of the present invention, the protrusion has a plurality of surfaces, which are interconnected to form a hollow shell.

[0009] In an embodiment of the present invention, the above-mentioned openings are randomly or orderly arranged on the hollow shell.

[0010] In an embodiment of the present invention, the surface of the protrusion has a battlement-like structure.

[0011] In an embodiment of the present invention, the surface of the protrusion has a wavy structure.

[0012] In an embodiment of the present invention, the surface of the protrusion has a cone-shaped structure.

[0013] In an embodiment of the present invention, there is a distance between the protruding portion and the first portion.

[0014] Based on the above, without affecting the assembly specifications of the electronic device, the baffle is changed to a 3D stereoscopic design so that the opening rate can break through the limitation of the plane, thereby effectively improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1A A partial schematic diagram of an electronic device according to a first embodiment of the present invention;

[0016] Figure 1B for Figure 1A An exploded schematic diagram of the baffle and the adapter bracket;

[0017] Figure 2A A partial schematic diagram of an electronic device according to a second embodiment of the present invention;

[0018] Figure 2B for Figure 2A Schematic diagram of the AA section line;

[0019] Figure 3 is a partial schematic diagram of a protrusion in the third embodiment of the present case;

[0020] Figure 4 is a schematic cross-sectional view of a protrusion of a fourth embodiment of the present invention;

[0021] Figure 5 It is a cross-sectional schematic diagram of the protrusion of the fifth embodiment of the present case.

[0022] Description of Reference Numerals

[0023] 100: Electronic devices

[0024] 110: Chassis

[0025] 112: First Opening

[0026] 120: Adapter bracket

[0027] 122: Part 1

[0028] 122a: first surface

[0029] 124: Part 2

[0030] 124a: Second opening

[0031] 124b: Second surface

[0032] 130: Baffle

[0033] 132: Assembly Department

[0034] 134, 134', 134", 134'': protrusion

[0035] 134a: Third surface

[0036] 134b: Fourth surface

[0037] 134c: Fifth surface

[0038] 134d: Sixth surface

[0039] 134e: Seventh Surface

[0040] 135: Opening

[0041] N1, N2: normal direction

[0042] W: Width direction DETAILED DESCRIPTION

[0043] Figure 1A is a partial schematic diagram of an electronic device according to a first embodiment of the present invention, and Figure 1B for Figure 1A Please also refer to the exploded diagram of the baffle and adapter bracket in Figure 1A and Figure 1B The electronic device 100 of this embodiment is, for example, a server, but is not limited thereto. The electronic device 100 may also be a host of a desktop computer.

[0044] The electronic device 100 mentioned above includes a housing 110 , an adapter bracket 120 and a baffle 130 .

[0045] The housing 110 has a first opening 112 .

[0046] The adapter bracket 120 is assembled to the housing 110, and has a first portion 122 and a second portion 124 that are perpendicularly connected to each other, wherein the first portion 122 extends in a direction away from the housing 110, and the second portion 124 has a second opening 124a, and the second opening 124a corresponds to the first opening 112. The first portion 122 has a first surface 122a and the second portion 124 has a second surface 124b, and a normal direction N1 of the first surface 122a is perpendicular to a normal direction N2 of the second surface 124b.

[0047] The baffle 130 is disposed corresponding to the second opening 124a of the second portion 124, wherein the baffle 130 has an assembly portion 132 and a protrusion 134 connected to each other. The assembly portion 132 is correspondingly engaged with the second opening 124a, and the protrusion 134 extends in a direction away from the housing 110 and protrudes from the assembly portion 132 in the same direction as the first portion 122 and has a plurality of openings 135. In one embodiment, there is a gap between the protrusion 134 and the first portion 122.

[0048] Typically, the second opening 124a exposes a slot (not shown) of a PCIE card (not shown) of a mainboard (not shown) disposed in the housing 110, and a connector (not shown) of the PCIE card (not shown) passes through the second opening 124a and the first opening 112 to be plugged into the slot (not shown) to electrically connect the PCIE card (not shown) to the mainboard (not shown). When the PCIE card (not shown) is removed from the slot (not shown), the baffle 130 is engaged with the second opening 124a to shield the second opening 124a and the first opening 112.

[0049] When the PCIE card (not shown) is removed from the slot (not shown), the second opening 124a of the second portion 124 of the adapter bracket 120 can serve as a heat dissipation path for the electronic device 100. Specifically, the accumulated heat generated by the operation of the electronic components (not shown) in the housing 110 can be dissipated through the first opening 112 and the second opening 124a of the second portion 124 and through the opening 135 of the protrusion 134 of the baffle 130.

[0050] In this embodiment, the protrusion 134 of the baffle 130 has a plurality of surfaces, and these surfaces are connected to each other to form a hollow shell. Specifically, the protrusion 134 has a third surface 134a and a fourth surface 134b, a fifth surface 134c, a sixth surface 134d and a seventh surface 134e surrounding the third surface 134a. The third surface 134a is parallel to the second surface 124b, and the fourth surface 134b and the sixth surface 134d are two opposite surfaces parallel to the first surface 122a, wherein the fourth surface 134b is located between the first surface 122a and the sixth surface 134d. The fifth surface 134c and the seventh surface 134e are two opposite surfaces connected between the fourth surface 134b and the sixth surface 134d. The above-mentioned openings 135 can be randomly or orderly arranged on each of the third surface 134a to the seventh surface 134e forming the hollow shell.

[0051] Incidentally, the third surface 134 a to the seventh surface 134 e of the protrusion 134 are not on the same plane, and each of the third surface 134 a to the seventh surface 134 e can serve as an air inlet / outlet surface.

[0052] As can be seen from the above, this embodiment, without affecting the assembly and safety specifications of the electronic device 100, uses the 3D designed baffle 130 to break through the limitation of the plane, increase multiple air inlet / outlet directions, and effectively improve the overall heat dissipation effect of the electronic device 100.

[0053] Figure 2A is a partial schematic diagram of an electronic device according to a second embodiment of the present invention, and Figure 2B for Figure 2A Please also refer to Figure 1A , Figure 2A and Figure 2B This embodiment is substantially the same as the aforementioned first embodiment, and the only difference therebetween is the structural design of the protrusions 134, 134'.

[0054] Specifically, in the first embodiment, the protrusion 134 of the baffle 130 is a hollow shell, while in this embodiment, the surface of the protrusion has a battlement-like structure. Specifically, the cross-section of the protrusion 134' in the width direction W of the second portion 124 is battlement-like.

[0055] In addition, the diameter and position of the opening 135 can be changed according to needs.

[0056] Figure 3 This is a partial schematic diagram of the protrusion in the third embodiment of this case. Figure 2A and Figure 3 , Figure 3 The opening 135" is smaller than Figure 2A The aperture of the opening 135' in Figure 3 The opening 135" is set in a more Figure 2A The arrangement of the openings 135" is more compact. In addition, the openings 135', 135" can also be opened at the turning junction of two adjacent surfaces, and the design is based on the needs.

[0057] Figure 4 This is a cross-sectional schematic diagram of the protrusion of the fourth embodiment of this case. Please refer to Figure 4 In this embodiment, the surface of the protrusion has a wavy structure. Specifically, the cross-section of the protrusion 134" in the width direction W of the second portion 124 is wavy.

[0058] Figure 5 This is a cross-sectional schematic diagram of the protrusion of the fifth embodiment of this case. Figure 5 In this embodiment, the surface of the protrusion has a conical structure. Specifically, the cross-section of the protrusion 134'' in the width direction W of the second portion 124 is conical.

[0059] It can be seen from the above five embodiments that in practical applications, the shape of the protrusion, the diameter of the opening, the position of the opening and the density of the opening can be changed according to actual needs.

[0060] To summarize, in the electronic device of the present invention, without affecting the assembly and safety specifications of the electronic device, the baffle used to cover the second opening of the second part of the adapter bracket is improved from a flat design to a 3D stereoscopic design. Therefore, the setting method of the opening breaks through the limitation of the plane and increases more inlet / outlet directions compared to the flat baffle. Therefore, it can effectively increase the opening rate and improve the overall heat dissipation effect of the electronic device.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present case, rather than to limit it. Although the present case has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or part or all of the technical features can be replaced by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solution to deviate from the scope of the technical solution of the embodiments of the present case.

Claims

1. An electronic device, characterized in that: include: A housing having a first opening; An adapter bracket, assembled to the housing, the adapter bracket having a first portion and a second portion vertically connected to each other, wherein the first portion extends in a direction away from the housing, and the second portion has a second opening, and the second opening corresponds to the first opening; as well as The baffle is arranged corresponding to the second opening and has an assembly portion and a protrusion that are connected to each other. The assembly portion is correspondingly embedded in the second opening, and the protrusion extends in a direction away from the housing and has a plurality of openings.

2. The electronic device according to claim 1, characterized in that: The protrusion has a plurality of surfaces, and the surfaces are connected to each other to form a hollow shell.

3. The electronic device according to claim 2, characterized in that: The openings are randomly or orderly arranged on the hollow shell.

4. The electronic device according to claim 1, characterized in that: The surface of the protrusion has a battlement-like structure.

5. The electronic device according to claim 1, characterized in that: The surface of the protrusion has a wavy structure.

6. The electronic device according to claim 1, characterized in that: The surface of the protrusion has a cone-shaped structure.

7. The electronic device according to claim 1, characterized in that: There is a distance between the protruding portion and the first portion.

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