Heat conduction and heat dissipation device for notebook computer

Abstract

The utility model relates to a heat conduction and heat dissipation device for a notebook computer. The heat conduction and heat dissipation device comprises a heat dissipation substrate, a heat conduction pipe and a plurality of heat dissipation fins, the heat conduction pipe is of a flat structure and is provided with a first pipe section and a second pipe section, the heat dissipation substrate is arranged on the upper surface of the first pipe section, and a plurality of parallel heat dissipation fins are arranged on the upper surface of the second pipe section. The length direction of the first pipe section is perpendicular to the length direction of the second pipe section. The lower edge of each heat dissipation fin is provided with a first bent edge, and the first bent edges and the second pipe section are welded together. Second bent edges are arranged on the upper edges of the heat dissipation fins. The heat conduction and heat dissipation device for the notebook computer has the advantages that due to the adoption of the structure, the heat conduction and heat dissipation device for the notebook computer is simple in structure, reasonable in layout and small in occupied space, and meanwhile the heat conduction and heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of notebook computers, in particular to a heat conduction and heat dissipation device for notebook computers. Background Art

[0002] With the continuous development of electronic technology, laptop computers are constantly updated and replaced, their operating speed and work efficiency are getting higher and higher, and the heat generated is also getting higher and higher.

[0003] Chinese patent document CN205450940U discloses a computer heat conduction and heat dissipation device, comprising a heat sink assembly, a heat conductive sheet, a heat conductive bracket, a substrate and a heat pipe, wherein the heat conductive sheet is arranged on the heat sink assembly, the heat conductive bracket is arranged on the heat conductive sheet, the substrate is arranged on the heat conductive bracket, one end of the heat pipe is connected to the heat sink assembly, and the other end of the heat pipe is connected to the substrate, the heat sink assembly comprises a plurality of heat sinks, the heat sinks are arranged in parallel, the heat sink comprises a fin body and a fixed fin, there are a plurality of fixed fins, the plurality of fixed fins are arranged on the edge of the fin body, the fixed fins are arranged in parallel with the fin body, the fixed fins are provided with a protruding structure, the protruding structure is arranged perpendicular to the fixed fins, a fixing hole is opened at a position of the fin body corresponding to the protruding structure, and a plurality of heat sinks cooperate with the fixing hole through the protruding structure to form a heat sink assembly. The defects and shortcomings of the computer heat conduction and heat dissipation device are as follows: (1) the heat sink assembly, the heat conductive sheet, the heat conductive bracket and the substrate are stacked together, occupying a large space, and are not suitable for notebook computers; (2) the structure of the computer heat conduction and heat dissipation device is complex and not easy to conduct heat.

[0004] Therefore, there is an urgent need to provide a heat conduction and heat dissipation device for a notebook computer that occupies a small space and has high heat dissipation efficiency. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the above-mentioned shortcomings and deficiencies of the prior art, the utility model provides a heat conduction and heat dissipation device for a notebook computer, which solves the technical problems that the prior heat conduction and heat dissipation devices occupy a large space and have low heat dissipation efficiency.

[0007] (II) Technical solution

[0008] In order to achieve the above-mentioned purpose, the main technical solutions adopted by the utility model include:

[0009] The utility model provides a heat conduction and heat dissipation device for a notebook computer, comprising a heat dissipation substrate, a heat conduction pipe and a plurality of heat dissipation fins;

[0010] The heat conducting pipe is a flat structure, and has a first pipe section and a second pipe section. The heat dissipation substrate is arranged on the upper surface of the first pipe section, and a plurality of parallel heat dissipation fins are arranged on the upper surface of the second pipe section.

[0011] Optionally, the length direction of the first pipe segment is perpendicular to the length direction of the second pipe segment.

[0012] Optionally, a first bent edge is provided at a lower edge of the heat dissipation fin, and the first bent edge is welded to the second pipe section.

[0013] Optionally, the upper edge of the heat dissipation fin is provided with a second bent edge.

[0014] Optionally, the heat dissipation fin comprises a fin body, and an air outlet side of the fin body extends toward a direction close to an air outlet of a notebook computer to form a raised portion.

[0015] Optionally, the lower surface of the heat-conducting and heat-dissipating device and the outer surface of the raised portion are coated with a black baking varnish layer.

[0016] Optionally, a mounting bracket is provided on the lower surface of the heat dissipation substrate, and a plurality of through holes are formed on the mounting bracket.

[0017] Optionally, the first tube section and the heat dissipation substrate, the heat dissipation substrate and the mounting bracket, and the second tube section and the heat dissipation fins are all soldered together by lead-free low-temperature solder paste.

[0018] (III) Beneficial effects

[0019] The beneficial effects of the utility model are as follows: the heat conduction and heat dissipation device for a notebook computer of the utility model comprises a heat dissipation substrate, a heat conduction pipe and a plurality of heat dissipation fins; the heat conduction pipe is a flat structure, having a first pipe section and a second pipe section, the heat dissipation substrate is arranged on the upper surface of the first pipe section, and a plurality of parallel heat dissipation fins are arranged on the upper surface of the second pipe section. Compared with the prior art, the utility model simplifies the structure and has a reasonable layout, thereby occupying less space and having higher heat conduction and heat dissipation efficiency.

[0020] The utility model discloses a heat-conducting and heat-dissipating device for a notebook computer. Since the lower surface of the heat-conducting and heat-dissipating device and the outer surface of the tilted portion are coated with a black baking varnish layer, and the black baking varnish layer has very good thermal conductivity characteristics and can efficiently absorb and radiate heat, compared with the prior art, the black baking varnish layer coated on the lower surface of the heat-conducting and heat-dissipating device can quickly absorb the heat generated on the circuit board, while the black baking varnish layer coated on the outer surface of the tilted portion can quickly release the heat, which significantly improves the thermal conductivity and heat dissipation efficiency of the heat-conducting and heat-dissipating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional schematic diagram of a heat conduction and heat dissipation device for a notebook computer according to the utility model;

[0022] Figure 2 for Figure 1 A three-dimensional schematic diagram of the heat sink fins;

[0023] Figure 3 The utility model is a bottom view schematic diagram of a heat conduction and heat dissipation device for a notebook computer.

[0024] [Description of Reference Numerals]

[0025] 1: Heat dissipation substrate;

[0026] 2: heat conducting pipe; 21: first pipe section; 22: second pipe section;

[0027] 3: heat dissipation fin; 301: fin body; 302: raised portion; 303: first bending edge; 304: second bending edge;

[0028] 4: mounting bracket; 401: through hole. DETAILED DESCRIPTION

[0029] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below in conjunction with the accompanying drawings through specific implementation methods. Figure 1 The orientation is used as a reference.

[0030] Reference Figure 1 and Figure 3 This embodiment provides a heat conduction and heat dissipation device for a notebook computer, including a heat dissipation substrate 1, a heat pipe 2 and a plurality of heat dissipation fins 3.

[0031] The heat pipe 2 is a flat structure, having a first pipe section 21 and a second pipe section 22 connected to each other. The heat dissipation substrate 1 is arranged on the upper surface of the first pipe section 21 , and a plurality of parallel heat dissipation fins 3 are arranged on the upper surface of the second pipe section 22 .

[0032] It should be noted that the heat dissipation substrate 1 is a steel substrate, the heat conducting pipe 2 is a flattened copper pipe, and the heat dissipation fin 3 is a copper sheet.

[0033] In this embodiment, the length direction of the first pipe section 21 is perpendicular to the length direction of the second pipe section 22, that is, the heat pipe 2 is L-shaped. The purpose of such a setting is to control the total length of the heat pipe 2, thereby reducing the occupied space.

[0034] In this embodiment, a mounting bracket 4 is provided on the lower surface of the heat dissipation substrate 1, and a plurality of through holes are provided on the mounting bracket 4. During installation, a plurality of fixing screws are passed through the plurality of through holes one by one and screwed with the circuit board of the laptop computer, thereby fixing and connecting the heat conduction and heat dissipation device to the circuit board.

[0035] Combination Figure 2As shown, the lower edge of the heat dissipation fin 3 is provided with a first bending edge 303 , and the first bending edge 303 is welded to the second pipe section 22 .

[0036] Furthermore, a second bent edge 304 is provided on the upper edge of the heat dissipation fin 3 , and the second bent edge 304 is used for heat dissipation.

[0037] It should be noted that a ventilation channel is formed between adjacent heat sink fins 3, and the ventilation channel has an air inlet side and an air outlet side that are connected to each other. When dissipating heat, the wind first enters from the air inlet side of the ventilation channel, exchanges heat with the heat sink fins 3, takes away the heat on the heat sink fins 3, and is discharged from the air outlet side of the ventilation channel. The air outlet side of the heat sink fins 3 corresponds to the air outlet on the laptop computer, so the hot air is finally discharged to the outside through the air outlet on the laptop computer.

[0038] Furthermore, the heat dissipation fin 3 includes a fin body 301, and the air outlet side of the fin body 301 extends toward the air outlet of the laptop to form a raised portion 302. In practice, the air outlet of the laptop is not directly opposite to the heat dissipation fin 3, and the purpose of providing the raised portion 302 is to better adapt to the air outlet of the laptop so that the airflow in the laptop can be discharged smoothly.

[0039] In order to further improve the heat dissipation efficiency of the heat-conducting heat dissipation device, the lower surface of the heat-conducting heat dissipation device and the outer surface of the tilting portion 302 are coated with a black paint layer. The black paint layer has very good thermal conductivity and can efficiently absorb and radiate heat. The lower surface of the heat-conducting heat dissipation device is close to the circuit board of the laptop computer, so the black paint layer coated on the lower surface of the heat-conducting heat dissipation device can quickly absorb the heat generated on the circuit board; the outer surface of the tilting portion 302 is close to the air outlet of the laptop computer, so the black paint layer coated on the outer surface of the tilting portion 302 can quickly release heat, which significantly improves the heat conduction and heat dissipation efficiency.

[0040] In this embodiment, the first tube section 21 and the heat dissipation substrate 1 , the heat dissipation substrate 1 and the mounting bracket 4 , and the second tube section 22 and the heat dissipation fins 3 are all soldered by lead-free low-temperature solder paste.

[0041] In the description of the present utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0042] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In the present utility model, unless otherwise clearly specified and limited, when a first feature is “on” or “below” a second feature, it may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, when a first feature is “above”, “above” or “above” a second feature, it may be that the first feature is directly above or obliquely above the second feature, or it may simply mean that the first feature is higher in level than the second feature. When a first feature is “below”, “below” or “below” a second feature, it may be that the first feature is directly below or obliquely below the second feature, or it may simply mean that the first feature is lower in level than the second feature.

[0044] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "embodiment", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0045] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A heat conduction and heat dissipation device for a notebook computer, characterized in that: It comprises a heat dissipation substrate (1), a heat conducting pipe (2) and a plurality of heat dissipation fins (3); The heat conducting pipe (2) is a flat structure, comprising a first pipe section (21) and a second pipe section (22); the heat dissipation substrate (1) is arranged on the upper surface of the first pipe section (21), and a plurality of parallel heat dissipation fins (3) are arranged on the upper surface of the second pipe section (22); The lower edge of the heat dissipation fin (3) is provided with a first bent edge (303), and the first bent edge (303) is welded to the second pipe section (22).

2. The heat conduction and heat dissipation device according to claim 1, characterized in that: The length direction of the first pipe section (21) is perpendicular to the length direction of the second pipe section (22).

3. The heat conduction and heat dissipation device according to claim 1, characterized in that: The upper edge of the heat dissipation fin (3) is provided with a second bent edge (304).

4. The heat conduction and heat dissipation device according to claim 1, characterized in that: The heat dissipation fin (3) comprises a fin body (301), and the air outlet side of the fin body (301) extends in a direction close to the air outlet of the notebook computer to form a raised portion (302).

5. The heat conduction and heat dissipation device according to claim 4, characterized in that: The lower surface of the heat-conducting and heat-dissipating device and the outer surface of the raised portion (302) are both coated with a black baking varnish layer.

6. The heat conduction and heat dissipation device according to claim 1, characterized in that: A mounting bracket (4) is provided on the lower surface of the heat dissipation substrate (1), and a plurality of through holes are provided on the mounting bracket (4).

7. The heat conduction and heat dissipation device according to claim 6, characterized in that: The first tube section (21) and the heat dissipation substrate (1), the heat dissipation substrate (1) and the mounting bracket (4), and the second tube section (22) and the heat dissipation fins (3) are all soldered together using lead-free low-temperature solder paste.

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