Three-dimensional vapor chamber liquid cooling heat dissipation structure

Abstract

The utility model discloses a liquid cooling heat dissipation structure of a three-dimensional vapor chamber. The three-dimensional uniform temperature plate liquid cooling heat dissipation structure comprises a middle liquid cooling part and a three-dimensional uniform temperature plate part, a liquid cooling cavity and a heat dissipation structure located in the liquid cooling cavity are formed in the middle liquid cooling part, a liquid inlet and a liquid outlet which are communicated with the liquid cooling cavity are formed in the middle liquid cooling part, and the three-dimensional uniform temperature plate part comprises a first shell, a second shell and a capillary layer. The first shell and the second shell are respectively matched with the middle liquid cooling part to form a first cavity and a second cavity, a communicating channel is arranged on the middle liquid cooling part, the first cavity, the communicating channel and the second cavity form a temperature equalizing cavity, and the capillary layer is arranged on the inner wall surface of the temperature equalizing cavity. The first liquid cooling working medium flows through the heat dissipation structure through the liquid inlet and then is discharged from the liquid outlet; and the second liquid cooling working medium can be sealed in the temperature equalizing cavity. The middle liquid cooling part is wrapped in the three-dimensional uniform-temperature plate, and the high thermal conductivity of the three-dimensional uniform-temperature plate is utilized, so that the effective heat dissipation area of the heat dissipation structure is increased, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, and in particular to a three-dimensional temperature equalizing plate liquid cooling heat dissipation structure. Background Art

[0002] With the improvement of computer algorithm capabilities, high integration, high performance and high power have become the development trend of computer chips, accompanied by more heat generated during computer operation. The existing liquid cooling heat dissipation structure is generally composed of a lower plate, an upper cover plate and a micro heat dissipation structure. The lower plate and the upper cover plate are combined into a cavity. The micro heat dissipation structure is arranged on the side of the lower plate facing the upper cover plate. A water inlet and a water outlet are opened somewhere in the cavity. The cooling liquid flows into the micro heat dissipation structure from one side through the water inlet and flows out from the other side of the micro heat dissipation structure. The computer chip is in contact with the upper cover plate, and the heat generated by the chip is transferred to the micro heat dissipation structure in the cavity through the upper cover plate by conduction convection and other methods. The cooling liquid flows through the micro heat dissipation structure and takes away the heat after heat exchange with it.

[0003] Since the heat transfer rate of the material of the shell composed of the lower plate and the upper cover is fixed, simply increasing the height of the micro heat dissipation structure or improving the material of the shell can no longer achieve a higher heat flow exchange. Therefore, the existing liquid cooling structure has become increasingly unable to meet the increasingly high heat dissipation requirements of computers.

[0004] How to propose a heat dissipation device with a large heat exchange area and high heat dissipation efficiency is a technical problem that urgently needs to be solved. Utility Model Content

[0005] The utility model aims to provide a three-dimensional temperature averaging plate liquid cooling heat dissipation structure, which has a large heat exchange area and high heat dissipation efficiency.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure comprises: an intermediate liquid-cooling component, a liquid-cooling cavity and a heat dissipation structure located in the liquid-cooling cavity are formed in the intermediate liquid-cooling component, a liquid inlet and a liquid outlet connected to the liquid-cooling cavity are provided on the intermediate liquid-cooling component; a three-dimensional temperature-averaging plate, the three-dimensional temperature-averaging plate comprising a first shell, a second shell and a capillary layer, the first shell cover is arranged on one side of the intermediate liquid-cooling component in a first direction and forms a first cavity, the second shell cover is arranged on the other side of the intermediate liquid-cooling component in the first direction and forms a second cavity, the intermediate liquid-cooling component is provided with a connecting channel connecting the first cavity and the second cavity, the first cavity, the connecting channel and the second cavity form a temperature-averaging cavity, the temperature-averaging cavity and the liquid-cooling cavity are independent of each other, and the capillary layer is arranged on the inner wall surface of the temperature-averaging cavity; wherein a first liquid-cooling medium enters the liquid-cooling cavity through the liquid inlet and is discharged from the liquid outlet after flowing through the heat dissipation structure; and a second liquid-cooling medium can be sealed in the temperature-averaging cavity.

[0008] Preferably, the three-dimensional temperature uniform distribution plate also includes a first support member, which is located in the first shell, one end of the first support member abuts against the inner wall surface of the first shell, and the other end abuts against the first surface of the intermediate liquid cooling member in the first direction; and / or, the three-dimensional temperature uniform distribution plate also includes a second support member, which is located in the second shell, one end of the second support member abuts against the inner wall surface of the second shell, and the other end abuts against the second surface of the intermediate liquid cooling member in the first direction.

[0009] Preferably, the first shell and the second shell are both metal shells, and the first support member, the second support member and the intermediate liquid cooling member are all metal members.

[0010] Preferably, the three-dimensional temperature-averaging plate is provided with a through hole connected to the temperature-averaging cavity and capable of being opened and closed, and the temperature-averaging cavity can be evacuated and / or a second liquid-cooling medium can be injected into the temperature-averaging cavity through the through hole.

[0011] Preferably, the intermediate liquid cooling component includes a third shell, a first middle frame and a fourth shell stacked in the first direction, the third shell, the first middle frame and the fourth shell are arranged to form the liquid cooling chamber, the third shell is penetrated by a first channel, the first middle frame is penetrated by a second channel, the fourth shell is penetrated by a third channel, the first channel, the second channel and the third channel are connected in sequence to form the connecting channel; and / or, two connecting channels are provided, and the two connecting channels are spaced apart in the second direction.

[0012] Preferably, the third shell includes a first plate and a plurality of first heat sinks protruding from the first plate at intervals, and the plurality of first heat sinks form at least a portion of the heat dissipation structure; and / or, the fourth shell includes a second plate and a plurality of second heat sinks protruding from the second plate at intervals, and the plurality of second heat sinks form at least a portion of the heat dissipation structure.

[0013] Preferably, the liquid inlet is arranged on one side of the first middle frame in the third direction, and the liquid outlet is arranged on the other side of the first middle frame in the third direction; or, the liquid inlet is arranged through the first shell and the third shell; or, the liquid inlet is arranged through the second shell and the fourth shell; or, the liquid outlet is arranged through the first shell and the third shell; or, the liquid outlet is arranged through the second shell and the fourth shell.

[0014] Preferably, a plurality of the first middle frames are arranged at intervals in the first direction, and the intermediate liquid-cooling component further comprises at least one partition, which is sandwiched between two adjacent first middle frames, and at least one of the partitions divides the liquid-cooling cavity into a curved flow channel, and the liquid inlet and the liquid outlet are respectively arranged at two ends of the curved flow channel; or, at least one of the partitions is arranged on the inner side of the first middle frame, and at least one of the partitions divides the liquid-cooling cavity into a curved flow channel, and the liquid inlet and the liquid outlet are respectively arranged at two ends of the curved flow channel.

[0015] Preferably, at least two intermediate liquid cooling members are stacked in the first direction, and the communication channels of two adjacent intermediate liquid cooling members are connected to each other.

[0016] Preferably, the three-dimensional temperature equalizing plate liquid cooling structure also includes at least one second middle frame, which is sandwiched between two adjacent intermediate liquid cooling components. The second middle frame is provided with an intermediate channel connected to the connecting channel. The second middle frame and the two intermediate liquid cooling components on both sides adjacent to it surround and form part of the temperature equalizing cavity.

[0017] Preferably, the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure further includes a third support member, and the third support member is located on the inner side of the second middle frame and supported between two adjacent intermediate liquid cooling members.

[0018] Beneficial effects of the utility model:

[0019] The three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure provided by the utility model includes an intermediate liquid cooling part and a three-dimensional temperature-averaging plate, a liquid cooling cavity and a heat dissipation structure located in the liquid cooling cavity are formed in the intermediate liquid cooling part, a liquid inlet and a liquid outlet connected to the liquid cooling cavity are provided on the intermediate liquid cooling part, and the three-dimensional temperature-averaging plate includes a first shell, a second shell and a capillary layer, the first shell cover is arranged on one side of the intermediate liquid cooling part in the first direction and forms a first cavity, the second shell cover is arranged on the other side of the intermediate liquid cooling part in the first direction and forms a second cavity, the intermediate liquid cooling part is provided with a connecting channel connecting the first cavity and the second cavity, the first cavity, the connecting channel and the second cavity form a temperature-averaging cavity, the temperature-averaging cavity and the liquid cooling cavity are independent of each other, and the capillary layer is arranged on the inner wall surface of the temperature-averaging cavity. Among them, the first liquid cooling medium enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet after flowing through the heat dissipation structure; the second liquid cooling medium can be sealed in the temperature-averaging cavity. The three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure wraps the intermediate liquid cooling component in the three-dimensional temperature-averaging plate component and utilizes the high thermal conductivity of the three-dimensional temperature-averaging plate component to increase the effective heat dissipation area of ​​the heat dissipation structure and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is an exploded view of the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure provided in the first embodiment of the present utility model;

[0021] Figure 2 This is a top perspective view of a three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure provided in the first embodiment of the present utility model;

[0022] Figure 3 It is a cross-sectional view of the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure provided in the first embodiment of the utility model in the AA direction;

[0023] Figure 4 It is a cross-sectional view of the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure provided in the first embodiment of the present utility model in the BB direction;

[0024] Figure 5 is a schematic diagram of a first supporting member provided in Embodiment 1 of the present utility model;

[0025] Figure 6 is a schematic diagram of a second support member provided in Embodiment 1 of the present utility model;

[0026] Figure 7 It is a cross-sectional view of the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure provided in the second embodiment of the present utility model in the BB direction;

[0027] Figure 8 It is a cross-sectional view of the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure provided in the third embodiment of the present utility model in the AA direction;

[0028] Fig. 9It is a cross-sectional view of the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure provided in the third embodiment of the present utility model in the BB direction;

[0029] Fig.10 It is a cross-sectional view of the three-dimensional temperature equalizing plate liquid cooling heat dissipation structure provided in the fourth embodiment of the present utility model in the AA direction.

[0030] In the figure:

[0031] 10. Three-dimensional temperature plate liquid cooling structure;

[0032] 100, intermediate liquid cooling member; 110, third housing; 111, first plate; 112, first heat sink; 113, second positioning hole; 114, first channel; 115, first slot; 120, fourth housing; 121, second plate; 122, second heat sink; 123, third channel; 130, first middle frame; 131, second channel; 140, partition; 141, fourth channel; 142, via hole; 101, liquid cooling chamber; 102, heat dissipation structure; 103, liquid inlet; 104, liquid outlet; 105, connecting channel;

[0033] 200, three-dimensional temperature-averaging plate; 210, first shell; 220, second shell; 221, third positioning hole; 230, capillary layer; 240, first support member; 241, first positioning column; 242, second positioning column; 243, first support body; 250, second support member; 251, third positioning column; 252, fourth positioning column; 253, second support body; 201, temperature-averaging chamber; 2011, first chamber; 2012, second chamber; 202, through hole; 300, second middle frame; 400, third support member. DETAILED DESCRIPTION

[0034] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0035] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0037] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0038] Embodiment 1:

[0039] like Figure 1 and Figure 2 As shown, the utility model discloses a three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure 10, which can be used in a heating device to quickly dissipate the heat generated by a heating element in the heating device. The heating device can be a computer, and the heating element can be a chip of the computer, such as a CPU. Of course, in addition to a computer, the heating device can also be any device with a heat dissipation requirement, which will not be listed here one by one.

[0040] like Figures 1 to 4As shown, the three-dimensional temperature averaging plate liquid cooling heat dissipation structure 10 includes an intermediate liquid cooling member 100 and a three-dimensional temperature averaging plate 200. The intermediate liquid cooling member 100 is located in the middle of the three-dimensional temperature averaging plate liquid cooling heat dissipation structure 10, and the three-dimensional temperature averaging plate 200 is wrapped around the outside of the intermediate liquid cooling member 100. Specifically, a liquid cooling cavity 101 and a heat dissipation structure 102 located in the liquid cooling cavity 101 are formed in the intermediate liquid cooling member 100, and a liquid inlet 103 and a liquid outlet 104 communicating with the liquid cooling cavity 101 are provided on the intermediate liquid cooling member 100. The three-dimensional temperature-averaging plate 200 includes a first shell 210, a second shell 220 and a capillary layer 230. The first shell 210 is covered on one side of the intermediate liquid cooling member 100 in the first direction and forms a first chamber 2011. The second shell 220 is covered on the other side of the intermediate liquid cooling member 100 in the first direction and forms a second chamber 2012. The intermediate liquid cooling member 100 is provided with a connecting channel 105 connecting the first chamber 2011 and the second chamber 2012. The first chamber 2011, the connecting channel 105 and the second chamber 2012 form a temperature-averaging chamber 201. The temperature-averaging chamber 201 and the liquid cooling chamber 101 are independent of each other. The capillary layer 230 is provided on the inner wall surface of the temperature-averaging chamber 201. It should be noted that the first direction is as shown in FIG. Figure 1 As shown in direction a, optionally, the first direction is the up-down direction of the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure 10.

[0041] Compared with the single-chamber heat dissipation structure in the prior art, the three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure 10 provided by the utility model is formed with two independent chambers, namely, a liquid-cooling chamber 101 and a temperature-averaging chamber 201. Liquid-cooling medium is provided in both the liquid-cooling chamber 101 and the temperature-averaging chamber 201. The two liquid-cooling mediums can be the same, for example, both liquid-cooling mediums can be cooling water. Of course, the two liquid-cooling mediums can also be different. In order to facilitate the introduction of the heat dissipation process of the three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure 10, in the following description, the liquid-cooling medium provided in the liquid-cooling chamber 101 is defined as the first liquid-cooling medium, and the liquid-cooling medium provided in the temperature-averaging chamber 201 is defined as the second liquid-cooling medium.

[0042] The process of heat dissipation of the heat generating element by the three-dimensional temperature equalizing plate liquid cooling structure 10 is as follows: since the three-dimensional temperature equalizing plate 200 is in direct contact with the heat generating element, the heat generated by the heat generating element is directly transferred to the temperature equalizing chamber 201 through the first shell 210 or the second shell 220 of the three-dimensional temperature equalizing plate 200, and the second liquid cooling medium sealed in the temperature equalizing chamber 201 absorbs heat and changes from liquid to gas, and the generated gas flows in the temperature equalizing chamber 201 and becomes liquid again after being pre-cooled at the intermediate liquid cooling element 100. Since the capillary layer 230 has the function of returning water, the liquid flows back to the position close to the heat generating element through the capillary layer 230 again. Such a cycle can realize all-round heat transfer between the three-dimensional temperature equalizing plate 200 and the intermediate liquid cooling element 100. The first liquid-cooling medium can enter the liquid-cooling cavity 101 through the liquid inlet 103 . The first liquid-cooling medium entering the liquid-cooling cavity 101 is discharged from the liquid outlet 104 after flowing through the heat dissipation structure 102 . During this process, the first liquid-cooling medium can take away the heat transferred to the heat dissipation structure 102 .

[0043] The three-dimensional temperature equalizing plate liquid cooling heat dissipation structure 10 wraps the intermediate liquid cooling component 100 in the three-dimensional temperature equalizing plate 200, and the three-dimensional temperature equalizing plate 200 forms a three-dimensional heat conducting component. The high thermal conductivity of the three-dimensional temperature equalizing plate 200 is utilized to transfer the heat generated by the heating component to the entire intermediate liquid cooling component 100 in all directions, thereby effectively increasing the effective heat dissipation area of ​​the heat dissipation structure 102, thereby improving the heat dissipation efficiency.

[0044] The first shell 210 includes a first shell plate and a first ring edge, the first ring plate is convexly arranged at the edge of the first shell plate along the circumference of the first shell plate, and the first ring edge abuts against the first surface of the intermediate liquid cooling member 100 in the first direction. The second shell 220 includes a second shell plate and a second ring edge, the second ring plate is convexly arranged at the edge of the second shell plate along the circumference of the second shell plate, and the second ring edge abuts against the second surface of the intermediate liquid cooling member 100 in the first direction.

[0045] In a specific embodiment, the first shell plate and the second shell plate are both rectangular plates, and the intermediate liquid cooling element 100 is in a cubic shape. Of course, in other specific embodiments, the shapes of the first shell plate and the second shell plate can also be adjusted to other shapes according to needs, preferably the same as the shape of the heating surface of the heating element, and the heat transfer area of ​​the first shell plate or the second shell plate abutting against the heating element is not less than the area of ​​the heating surface of the heating element.

[0046] Continue to refer to Figure 1 As shown, the three-dimensional temperature-averaging plate 200 further includes a first support member 240, which is located in the first shell 210, and one end of the first support member 240 abuts against the inner wall surface of the first shell 210, and the other end abuts against the first surface of the intermediate liquid cooling member 100 in the first direction. The first support member 240 can improve the stability between the first shell 210 and the intermediate liquid cooling member 100.

[0047] In a specific embodiment, a plurality of first support members 240 are provided, and the plurality of first support members 240 are arranged at intervals in the first housing 210. Optionally, the plurality of first support members 240 are arranged in rows and columns in the first housing 210. Of course, in addition to being arranged in rows and columns, the plurality of first support members 240 may also be arranged in other forms such as annular distribution and radial arrangement.

[0048] In a specific embodiment, Figure 5 As shown, the first support member 240 includes a first positioning column 241 and a second positioning column 242 located at both ends, a first positioning hole is formed on the inner wall surface of the first shell 210, and a second positioning hole 113 is formed on the first surface of the intermediate liquid cooling member 100. The first positioning column 241 is inserted into the first positioning hole, and the second positioning column 242 is inserted into the second positioning hole 113.

[0049] Optionally, the first positioning column 241 and the second positioning column 242 are both cylinders, and the first positioning hole and the second positioning hole 113 are both round holes; or, the first positioning column 241 and the second positioning column 242 are both square columns, and the first positioning hole and the second positioning hole 113 are both square holes. It should be noted that the shapes of the first positioning column 241 and the second positioning column 242 can be the same or different; correspondingly, the shapes of the first positioning hole and the second positioning hole 113 can be the same or different, as long as the shapes of the first positioning column 241 and the first positioning hole match, and the shapes of the second positioning column 242 and the second positioning hole 113 match.

[0050] Furthermore, the first support member 240 further includes a first support body 243 disposed between the first positioning column 241 and the second positioning column 242. In a direction perpendicular to the axial direction of the first support member 240, the cross-sectional area of ​​the first support body 243 is greater than the cross-sectional area of ​​the first positioning column 241, and greater than the cross-sectional area of ​​the second positioning column 242. In this way, the support stability of the first support member 240 on the first housing 210 can be further improved. The shape of the first support body 243 can be the same as or different from the shape of the first positioning column 241 and the second positioning column 242, and is not limited here.

[0051] Optionally, the first support member 240 is made of a material with good thermal conductivity, so that the first support member 240 has both support and thermal conductivity. The heat transferred from the heat generating element to the first shell plate can be quickly transferred to the intermediate liquid cooling element 100 through the first support member 240, thereby improving the thermal conductivity efficiency.

[0052] In a specific embodiment, the first shell 210 and the first support member 240 are both metal parts, and the intermediate liquid cooling member 100 is also a metal part. Optionally, the first shell 210, the first support member 240 and the intermediate liquid cooling member 100 are all copper parts. Of course, in addition to copper, other metals with good thermal conductivity can also be used to make the first shell 210, the first support member 240 and the intermediate liquid cooling member 100.

[0053] Continue to refer to Figure 1 As shown, the three-dimensional temperature plate 200 further includes a second support member 250, which is located in the second shell 220, and one end of the second support member 250 abuts against the inner wall surface of the second shell 220, and the other end abuts against the second surface of the intermediate liquid cooling member 100 in the first direction. The second support member 250 can improve the stability between the second shell 220 and the intermediate liquid cooling member 100.

[0054] In a specific embodiment, a plurality of second support members 250 are provided, and the plurality of second support members 250 are arranged at intervals in the second housing 220. Optionally, the plurality of second support members 250 are arranged in rows and columns in the second housing 220. Of course, in addition to being arranged in rows and columns, the plurality of second support members 250 may also be arranged in other forms such as annular distribution and radial arrangement.

[0055] In a specific embodiment, Figure 6 As shown, the second support member 250 includes a third positioning column 251 and a fourth positioning column 252 located at both ends, a third positioning hole 221 is formed on the inner wall surface of the second shell 220, and a fourth positioning hole is formed on the second surface of the intermediate liquid cooling member 100. The third positioning column 251 is inserted into the third positioning hole 221, and the fourth positioning column 252 is inserted into the fourth positioning hole.

[0056] Optionally, the third positioning column 251 and the fourth positioning column 252 are both cylinders, and the third positioning hole 221 and the fourth positioning hole are both round holes; or, the third positioning column 251 and the fourth positioning column 252 are both square columns, and the third positioning hole 221 and the fourth positioning hole are both square holes. It should be noted that the shapes of the third positioning column 251 and the fourth positioning column 252 can be the same or different; correspondingly, the shapes of the third positioning hole 221 and the fourth positioning hole can be the same or different, as long as the shapes of the third positioning column 251 and the third positioning hole 221 are compatible, and the shapes of the fourth positioning column 252 and the fourth positioning hole are compatible.

[0057] Furthermore, the second support member 250 further includes a second support body 253 disposed between the third positioning column 251 and the fourth positioning column 252. In a direction perpendicular to the axial direction of the second support member 250, the cross-sectional area of ​​the second support body 253 is greater than the cross-sectional area of ​​the third positioning column 251, and greater than the cross-sectional area of ​​the fourth positioning column 252. In this way, the support stability of the second support member 250 on the second housing 220 can be further improved. The shape of the second support body 253 can be the same as or different from the shape of the third positioning column 251 and the fourth positioning column 252, and is not limited here.

[0058] Optionally, the second support member 250 is made of a material with good thermal conductivity, so that the second support member 250 has both support type and thermal conductivity. The heat transferred from the heat generating element to the second shell plate can be quickly transferred to the intermediate liquid cooling element 100 through the second support member 250, thereby improving the thermal conductivity efficiency.

[0059] In a specific embodiment, the second shell 220 and the second support member 250 are both metal parts, and the intermediate liquid cooling member 100 is also a metal part. Optionally, the second shell 220, the second support member 250 and the intermediate liquid cooling member 100 are all copper parts. Of course, in addition to copper, other metals with good thermal conductivity can also be used to make the second shell 220, the second support member 250 and the intermediate liquid cooling member 100.

[0060] It should be noted that in order to improve the return water capacity, Figure 3 and Figure 4 As shown, in addition to coating the inner wall surface of the first shell 210, the inner wall surface of the second shell 220, and the inner wall surface of the connecting channel 105, the capillary layer 230 may also be coated on the side wall surface of the first support body 243 of the first support member 240, and coated on the side wall surface of the second support body 253 of the second support member 250. The capillary layer 230 is fixed by sintering.

[0061] Continue to refer to Figure 1 As shown, the three-dimensional temperature-averaging plate 200 is provided with a through hole 202 that is connected to the temperature-averaging chamber 201 and can be opened and closed. The temperature-averaging chamber 201 can be evacuated and / or a second liquid-cooling medium can be injected into the temperature-averaging chamber 201 through the through hole 202. The number of through holes 202 can be set to one or two. When the through hole 202 is set to one, the temperature-averaging chamber 201 can be evacuated and injected with liquid at the same time through the through hole 202; when the through holes 202 are set to two, one of the through holes 202 can be used to evacuate the temperature-averaging chamber 201, and the other through hole 202 can be used to inject liquid into the temperature-averaging chamber 201. In order to ensure the sealing of the temperature-averaging chamber 201 to the greatest extent possible, it is preferred to set one through hole 202.

[0062] Continue to refer to Figure 1 , Figure 3 and Figure 4 As shown, in some specific embodiments, the intermediate liquid cooling component 100 includes a third shell 110, a first middle frame 130 and a fourth shell 120 stacked in a first direction, the third shell 110, the first middle frame 130 and the fourth shell 120 are arranged to form a liquid cooling chamber 101, a first channel 114 is penetrated through the third shell 110, a second channel 131 is penetrated through the first middle frame 130, and a third channel 123 is penetrated through the fourth shell 120, and the first channel 114, the second channel 131 and the third channel 123 are sequentially connected to form a connecting channel 105.

[0063] Optionally, two connecting channels 105 are provided, and the two connecting channels 105 are spaced apart in the second direction, and the two connecting channels 105 respectively realize the connection between the two ends of the first chamber 2011 and the second chamber 2012 in the second direction, so that the temperature-averaging chamber 201 is formed into an annular channel. Such a setting is conducive to improving the smoothness of the second liquid working medium flowing in the temperature-averaging chamber 201 and accelerating heat conduction. Figure 1 As shown in direction b, optionally, the second direction is the left-right direction of the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure 10.

[0064] In one embodiment, the third housing 110 includes a first plate 111 and a plurality of first heat sinks 112 spaced apart and protruding from the first plate 111, and the plurality of first heat sinks 112 form at least a portion of the heat dissipation structure 102. Optionally, the first heat sink 112 is a heat dissipation fin or a heat dissipation column.

[0065] In one embodiment, the third housing 110 is disposed on a side of the first middle frame 130 close to the first housing 210, that is, a first surface is formed on the third housing 110. Optionally, a first slot 115 is formed inwardly on the first surface of the third housing 110, and the provision of the first slot 115 increases the volume of the first chamber 2011, so that more second liquid working medium can be accommodated in the first chamber 2011. Optionally, the first channel 114 passes through the bottom of the first slot 115, the second positioning hole 113 is provided at the bottom of the first slot 115, and the second positioning hole 113 is a blind hole.

[0066] In one embodiment, the fourth housing 120 includes a second plate 121 and a plurality of second heat sinks 122 spaced apart and protruding from the second plate 121, and the plurality of second heat sinks 122 form at least a portion of the heat dissipation structure 102. Optionally, the second heat sink 122 is a heat dissipation fin or a heat dissipation column.

[0067] In one embodiment, the fourth housing 120 is disposed on a side of the first middle frame 130 close to the second housing 220, that is, a second surface is formed on the fourth housing 120. Optionally, a second groove body is formed inwardly on the second surface of the fourth housing 120, and the provision of the second groove body increases the volume of the second chamber 2012, so that more second liquid working medium can be accommodated in the second chamber 2012. Optionally, the second channel 131 passes through the bottom of the second groove body, the second positioning hole 113 is provided at the bottom of the second groove body, and the second positioning hole 113 is a blind hole.

[0068] Optionally, the third housing 110, the first middle frame 130 and the fourth housing 120 are all made of materials with good thermal conductivity to improve the thermal conductivity of the intermediate liquid cooling element 100. The third housing 110, the first middle frame 130 and the fourth housing 120 can be made of the same material or different materials.

[0069] In a specific embodiment, the third housing 110, the first middle frame 130 and the fourth housing 120 are also metal parts. Optionally, the third housing 110, the first middle frame 130 and the fourth housing 120 are all copper parts. Of course, in addition to copper, other metals with good thermal conductivity can also be used to make the third housing 110, the first middle frame 130 and the fourth housing 120.

[0070] Continue to refer to Figure 4 As shown, the liquid inlet 103 is arranged on one side of the first middle frame 130 in the third direction, and the liquid outlet 104 is arranged on the other side of the first middle frame 130 in the third direction. Figure 1 As shown in the direction c, optionally, the third direction is the front-to-back direction of the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure 10.

[0071] It should be noted that there may be one or more liquid inlet 103 ; there may be one or more liquid outlet 104 .

[0072] In this embodiment, the manufacturing method of the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure 10 is as follows:

[0073] Step 1: Weld the third shell 110, the first middle frame 130 and the fourth shell 120 together to form the intermediate liquid cooling unit 100.

[0074] Step 2: Sintering the capillary layer 230 on the inner cavity surfaces of the first shell 210 and the second shell 220 , and also sintering the capillary layer 230 at the position of the intermediate liquid cooling member 100 that assists in forming the temperature-averaging cavity 201 .

[0075] Step 3: Weld the first shell 210, the intermediate liquid cooling component 100, and the second shell 220 into a whole. The first shell 210 and the second shell 220 form a three-dimensional temperature equalizing plate 200 wrapped outside the intermediate liquid cooling component 100, and the joints that connect with the liquid cooling pipe can be welded at the liquid inlet 103 and the liquid outlet 104.

[0076] Step 4: Perform conventional temperature-averaging plate processing such as evacuating, injecting water, and sealing the temperature-averaging chamber 201 through the through hole 202 provided on the three-dimensional temperature-averaging plate 200 .

[0077] Embodiment 2:

[0078] The present embodiment provides a three-dimensional temperature equalizing plate liquid-cooling heat dissipation structure 10, which is substantially the same as the three-dimensional temperature equalizing plate liquid-cooling heat dissipation structure 10 provided in the first embodiment, with the only difference being the different locations of the liquid inlet 103 and the liquid outlet 104.

[0079] Specifically, if Figure 7 As shown, the liquid inlet 103 is provided through the first shell 210 and the third shell 110, and the liquid outlet 104 is provided through the first shell 210 and the third shell 110. Optionally, the extension direction of the liquid inlet 103 is the first direction, and the extension direction of the liquid outlet 104 is also the first direction.

[0080] Of course, in other embodiments, the liquid inlet 103 may be provided through the first shell 210 and the third shell 110, and the liquid outlet 104 may be provided through the second shell 220 and the fourth shell 120. Alternatively, the liquid inlet 103 may be provided through the second shell 220 and the fourth shell 120, and the liquid outlet 104 may be provided through the first shell 210 and the third shell 110. Alternatively, the liquid inlet 103 may be provided through the second shell 220 and the fourth shell 120, and the liquid outlet 104 may be provided through the second shell 220 and the fourth shell 120.

[0081] Embodiment three:

[0082] The present embodiment provides a three-dimensional temperature averaging plate liquid cooling heat dissipation structure 10, which is substantially the same as the three-dimensional temperature averaging plate liquid cooling heat dissipation structure 10 provided in the first embodiment, except that the shape of the liquid cooling cavity 101 is different. In the first embodiment, the liquid cooling cavity 101 is a straight cylinder, while in the present embodiment, the liquid cooling cavity 101 is a curved shape. Compared with the straight cylinder-shaped liquid cooling cavity 101, the curved liquid cooling cavity 101 prolongs the flow time of the first liquid working medium in the liquid cooling cavity 101, thereby increasing the heat exchange time and improving the heat exchange efficiency.

[0083] like Figure 8 and Fig. 9As shown, a plurality of first middle frames 130 are spaced apart in the first direction, and the intermediate liquid cooling member 100 further includes at least one partition 140, which is sandwiched between two adjacent first middle frames 130. At least one partition 140 divides the liquid cooling cavity 101 into a curved flow channel, and the liquid inlet 103 and the liquid outlet 104 are respectively arranged at both ends of the curved flow channel.

[0084] It should be noted that if Figure 8 As shown, the partition 140 is provided with a fourth channel 141, and the fourth channel 141 is connected to the second channel 131 on the first middle frame 130 on both sides thereof, so that the setting of the partition 140 does not affect the flow of the second liquid working medium in the temperature-averaging chamber 201. Fig. 9 As shown, the partition plate 140 is provided with a through hole 142 for allowing the first liquid working medium to flow between two adjacent first middle frames 130 .

[0085] In a specific embodiment, two first middle frames 130 are provided, and one partition 140 is provided, and a U-shaped curved flow channel can be formed by the partition 140, and the liquid inlet 103 and the liquid outlet 104 are located on the same side of the intermediate liquid cooling unit 100. When the number of the first middle frames 130 exceeds two, and the number of the partition 140 exceeds one, a serpentine curved flow channel can be formed by multiple partitions 140, and the liquid inlet 103 and the liquid outlet 104 can be located on the same side of the intermediate liquid cooling unit 100, or on opposite sides.

[0086] In addition, the thickness of the first middle frame 130 may be increased, and at least one partition 140 may be provided inside the first middle frame 130, so as to divide the liquid cooling chamber 101 into a curved flow channel by at least one partition 140. The liquid inlet 103 and the liquid outlet 104 are respectively provided at both ends of the curved flow channel, and in this case, the liquid inlet 103 and the liquid outlet 104 may be located on the same side of the intermediate liquid cooling member 100, or may be located on opposite sides.

[0087] It should be noted that the liquid inlet 103 and the liquid outlet 104 can be arranged on the first middle frame 130 as shown in the first embodiment, or can be arranged as shown in the second embodiment, as long as they are located at both ends of the curved flow channel. In the first step of the manufacturing method of the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure 10, the partition 140 can be welded to the first middle frame 130.

[0088] Embodiment 4:

[0089] The present embodiment provides a three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure 10, which is substantially the same as the three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure 10 provided in the first to third embodiments, and the difference is only in the number of intermediate liquid cooling parts 100. Providing a plurality of intermediate liquid cooling parts 100 can not only effectively utilize the space of the three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure 10 in the first direction, but also can increase the number of heat dissipation structures 102 exponentially, thereby exponentially increasing the effective heat exchange area of ​​the heat dissipation structure 102 and improving the heat dissipation efficiency.

[0090] In this embodiment, at least two intermediate liquid cooling members 100 are stacked in the first direction, and the communication channels 105 of two adjacent intermediate liquid cooling members 100 are connected to each other. Fig.10 As shown, two intermediate liquid cooling components 100 are provided, and the two intermediate liquid cooling components 100 form two independent liquid cooling chambers 101 , and the three-dimensional temperature equalizing plate 200 is wrapped around the two intermediate liquid cooling components 100 .

[0091] Furthermore, if Fig.10 As shown, the three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure 10 also includes a second middle frame 300, which is sandwiched between two adjacent intermediate liquid cooling parts 100. The second middle frame 300 is provided with an intermediate channel connected to the connecting channel 105, and the second middle frame 300 and the two intermediate liquid cooling parts 100 on both sides thereof are surrounded to form a partial temperature-averaging cavity 201. Such a setting can increase the volume of the temperature-averaging cavity 201, so that more second liquid working medium can be accommodated in the temperature-averaging cavity 201, and the second liquid working medium can fully wrap each intermediate liquid cooling part 100. It should be noted that the number of the second middle frame 300 can be set to one or more according to the number of the intermediate liquid cooling parts 100.

[0092] Furthermore, if Fig.10 As shown, the three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure 10 also includes a third support member 400, which is located on the inner side of the second middle frame 300 and supported between two adjacent intermediate liquid cooling members 100. The structure of the third support member 400 can be the same as or different from the structure of the first support member 240 and the second support member 250. The material of the third support member 400 can be the same as or different from the material of the first support member 240 and the second support member 250, as long as it has good supporting performance and thermal conductivity.

[0093] Embodiment five:

[0094] On the basis of the first to fourth embodiments, this embodiment discloses a heating device, which includes a heating element and a three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure 10, and the first shell 210 and / or the second shell 220 abut against the heating element. The heating device improves the heat dissipation efficiency and heat dissipation effect of the heating device by using the three-dimensional temperature-averaging plate liquid-cooling heat dissipation structure 10.

[0095] Optionally, the heat generating device is a computer and the heat generating element is a chip. When the heat generating element is a CPU of a computer, if the CPU is a multi-core design, the heat of a small core with higher power can be quickly dispersed through the high thermal conductivity of the three-dimensional temperature evaporating plate liquid cooling heat dissipation structure 10, avoiding heat accumulation and efficiency reduction of the small core.

[0096] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A three-dimensional temperature plate liquid cooling heat dissipation structure, characterized in that: include: An intermediate liquid cooling component (100), wherein a liquid cooling cavity (101) and a heat dissipation structure (102) located in the liquid cooling cavity (101) are formed in the intermediate liquid cooling component (100), and a liquid inlet (103) and a liquid outlet (104) which are in communication with the liquid cooling cavity (101) are provided on the intermediate liquid cooling component (100); A three-dimensional temperature-averaging plate (200), the three-dimensional temperature-averaging plate (200) comprising a first shell (210), a second shell (220) and a capillary layer (230), the first shell (210) being arranged on one side of the intermediate liquid-cooling component (100) in the first direction and forming a first chamber (2011), the second shell (220) being arranged on the other side of the intermediate liquid-cooling component (100) in the first direction and forming a second chamber (2012), the intermediate liquid-cooling component (100) being provided with a connecting channel (105) connecting the first chamber (2011) and the second chamber (2012), the first chamber (2011), the connecting channel (105) and the second chamber (2012) forming a temperature-averaging chamber (201), the temperature-averaging chamber (201) and the liquid-cooling chamber (101) being independent of each other, and the capillary layer (230) being arranged on the inner wall surface of the temperature-averaging chamber (201); The first liquid cooling medium enters the liquid cooling chamber (101) through the liquid inlet (103) and is discharged from the liquid outlet (104) after flowing through the heat dissipation structure (102); and the second liquid cooling medium can be sealed in the temperature equalizing chamber (201).

2. The three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure according to claim 1 is characterized in that: The three-dimensional temperature-averaging plate (200) further comprises a first support member (240), wherein the first support member (240) is located in the first shell (210), one end of the first support member (240) abuts against the inner wall surface of the first shell (210), and the other end abuts against the first surface of the intermediate liquid cooling member (100) in the first direction; And / or, the three-dimensional temperature equalizing plate (200) also includes a second support member (250), the second support member (250) is located in the second shell (220), one end of the second support member (250) abuts against the inner wall surface of the second shell (220), and the other end abuts against the second surface of the intermediate liquid cooling member (100) in the first direction.

3. The three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure according to claim 2 is characterized in that: The first shell (210) and the second shell (220) are both metal shells, and the first support member (240), the second support member (250) and the intermediate liquid cooling member (100) are all metal members.

4. The three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure according to claim 1, characterized in that: The three-dimensional temperature-averaging plate (200) is provided with a through hole (202) which is connected to the temperature-averaging cavity (201) and can be opened and closed, and the temperature-averaging cavity (201) can be evacuated and / or a second liquid cooling medium can be injected into the temperature-averaging cavity (201) through the through hole (202).

5. The three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure according to claim 1 is characterized in that: The intermediate liquid cooling component (100) comprises a third shell (110), a first middle frame (130) and a fourth shell (120) stacked in the first direction, the third shell (110), the first middle frame (130) and the fourth shell (120) enclose the liquid cooling chamber (101), a first channel (114) is penetrated through the third shell (110), a second channel (131) is penetrated through the first middle frame (130), and a third channel (123) is penetrated through the fourth shell (120), and the first channel (114), the second channel (131) and the third channel (123) are sequentially connected to form the connecting channel (105); And / or, two communicating channels (105) are provided, and the two communicating channels (105) are spaced apart in the second direction.

6. The three-dimensional temperature equalizing plate liquid cooling heat dissipation structure according to claim 5, characterized in that: The third housing (110) comprises a first plate (111) and a plurality of first heat sinks (112) protrudingly arranged at intervals on the first plate (111), wherein the plurality of first heat sinks (112) form at least a portion of the heat dissipation structure (102); And / or, the fourth shell (120) comprises a second plate (121) and a plurality of second heat sinks (122) protruding from the second plate (121) at intervals, and the plurality of second heat sinks (122) form at least a portion of the heat dissipation structure (102).

7. The three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure according to claim 5, characterized in that: The liquid inlet (103) is arranged on one side of the first middle frame (130) in the third direction, and the liquid outlet (104) is arranged on the other side of the first middle frame (130) in the third direction; Alternatively, the liquid inlet (103) is provided through the first shell (210) and the third shell (110); Alternatively, the liquid inlet (103) is provided through the second shell (220) and the fourth shell (120); Alternatively, the liquid outlet (104) is provided through the first shell (210) and the third shell (110); Alternatively, the liquid outlet (104) is provided through the second shell (220) and the fourth shell (120).

8. The three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure according to claim 5, characterized in that: A plurality of the first middle frames (130) are arranged at intervals in the first direction, the intermediate liquid cooling member (100) further comprises at least one partition (140), the partition (140) is sandwiched between two adjacent first middle frames (130), at least one partition (140) divides the liquid cooling chamber (101) into a curved flow channel, and the liquid inlet (103) and the liquid outlet (104) are respectively arranged at two ends of the curved flow channel; Alternatively, at least one partition (140) is provided on the inner side of the first middle frame (130), and the at least one partition (140) divides the liquid cooling chamber (101) into a curved flow channel, and the liquid inlet (103) and the liquid outlet (104) are respectively provided at two ends of the curved flow channel.

9. The three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure according to any one of claims 1 to 8, characterized in that: At least two intermediate liquid cooling components (100) are stacked in the first direction, and the communication channels (105) of two adjacent intermediate liquid cooling components (100) are connected to each other.

10. The three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure according to claim 9, characterized in that: The three-dimensional temperature equalizing plate liquid cooling heat dissipation structure also includes at least one second middle frame (300), the second middle frame (300) is sandwiched between two adjacent intermediate liquid cooling components (100), the second middle frame (300) is provided with an intermediate channel connected to the connecting channel (105), and the second middle frame (300) and the two intermediate liquid cooling components (100) on both sides adjacent thereto are arranged to form part of the temperature equalizing chamber (201).

11. The three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure according to claim 10, characterized in that: The three-dimensional temperature homogenizing plate liquid cooling heat dissipation structure further comprises a third support member (400), wherein the third support member (400) is located on the inner side of the second middle frame (300) and is supported between two adjacent intermediate liquid cooling members (100).

Images