Radio frequency tag, commodity and commodity outer package

Abstract

The utility model provides a radio frequency tag, a commodity and a commodity outer package, the radio frequency tag comprises a radio frequency antenna and a chip, and the chip is electrically connected with a bonding pad part on the radio frequency antenna; the radio frequency antenna comprises a base material, a fragile coating, a composite adhesive layer and an etching circuit, the etching circuit part comprises the bonding pad part, the fragile coating is connected to the local position of the surface of the base material, and the etching circuit is connected with the base material and the fragile coating at the same time through the composite adhesive layer; and the fragile coating does not coincide with the projection of the bonding pad part on the etching circuit. The anti-transfer and fragile label has conduction points and chip fastness of a traditional etching label, and meanwhile, the anti-transfer and fragile functions of the label can be realized.

Description

Technical Field

[0001] The present application belongs to the field of anti-counterfeiting technology, and relates to a method of destroying a radio frequency identification tag structure, and specifically relates to a radio frequency tag, a commodity, and a commodity outer packaging. Background Art

[0002] Radio Frequency Identification (RFID) technology has a unique global code on its chip, stable information, extremely high cost of imitation, can store a large amount of information, and can be easily read and written. It allows consumers to easily identify the identity of goods through the special identification device provided by the merchant, and can be used to achieve full tracking of goods in circulation. It is often used in the anti-counterfeiting of liquid product packaging such as bottle caps.

[0003] Traditional fragile RFID tags are usually coated on the RFID substrate, and then the RFID antenna is processed. After the processed RFID tag is attached to the product through an adhesive, if the criminals want to peel it off the product, the coating will separate from the substrate, and the RFID structure attached to the coating will separate from the substrate, leaving the RFID structure on the surface of the product, achieving the purpose of preventing transfer.

[0004] However, this structure requires a low peeling force between the coating and the substrate, which needs to be smaller than the bonding force between the adhesive used and the product surface. The adhesive usually used is a pressure-sensitive adhesive, which itself has a low bonding force with the product surface, which requires that the peeling force between the coating and the substrate cannot be too high.

[0005] This results in a very low peeling force between the aluminum foil at the RF chip pad and the substrate. When this position is affected by external force, the aluminum foil at the pad is prone to breakage, resulting in a short circuit between the RF chip and the RF antenna, causing the entire RF tag to fail unexpectedly.

[0006] At the same time, double-sided electronic tags include high-frequency tags and some ultra-high-frequency tags with double-sided structures. Due to their design principles, high-frequency tags must adopt a double-sided structure. The front and back sides of the double-sided electronic tags are electrically connected through conduction points (also called bridge points). Industry tests have shown that if the peeling force between the coating and the substrate is less than 2N / 25mm, the conduction point structure is more likely to form a short circuit, thereby affecting the product yield and weather resistance.

[0007] It can be seen that how to make the coating and the substrate easy to peel off while avoiding the pad position or even the conductive point structure from accidentally breaking due to too low peeling force is a dilemma currently faced. Utility Model Content

[0008] In view of the defects in the prior art, the purpose of the utility model is to provide a radio frequency tag, a commodity, and a commodity outer packaging.

[0009] According to the utility model, a radio frequency tag is provided, comprising: a radio frequency antenna and a chip, wherein the chip is electrically connected to a pad portion on the radio frequency antenna;

[0010] The radio frequency antenna comprises a substrate, a fragile coating, a composite adhesive layer and an etching circuit, wherein the etching circuit portion contains the pad portion, the fragile coating is connected to a local position on the surface of the substrate, and the etching circuit is connected to the substrate and the fragile coating at the same time through the composite adhesive layer;

[0011] The fragile coating does not overlap with the pad portion on the etched circuit;

[0012] If the radio frequency tag is a double-sided structure, the radio frequency tag further includes a conduction point, and the fragile coating does not overlap with the pad portion and the conduction point.

[0013] Furthermore, the etching circuit is represented on the high frequency tag as a coil part, a bridge part and a pad part, the coil part is located on one side of the substrate, and the bridge part is located on the other side of the substrate;

[0014] The pad portion is electrically connected to the coil portion, or the pad portion is electrically connected to the bridge portion;

[0015] The coil part and the bridge part are electrically connected via a conduction point.

[0016] Furthermore, the etching circuit is manifested as a matching ring, an antenna arm and a pad portion on the UHF tag, and the matching ring is electrically connected to the antenna arm and the pad portion respectively.

[0017] Furthermore, the fragile coating is one layer or more than two layers;

[0018] and / or, the single layer thickness of the fragile coating is 0.1 to 50 microns;

[0019] And / or, when the fragile coating layer has two or more layers, the materials of each fragile coating layer are the same or different.

[0020] Furthermore, the 90-degree peeling force between the fragile coating and the substrate is between 0.01 N / 25 mm and 2 N / 25 mm, or the 90-degree peeling force between the fragile coating and the composite adhesive layer is between 0.01 N / 25 mm and 2 N / 25 mm.

[0021] Furthermore, if the RFID tag is a single-sided structure, the horizontal distance between the fragile coating and the pad portion is greater than 0.5 mm;

[0022] If the radio frequency tag is a double-sided structure, the horizontal distance between the fragile coating and the pad portion and the conduction point is greater than 0.5 mm.

[0023] Further, if the RFID tag is a single-sided structure, the fragile coating is located on the side of the substrate where the chip is located;

[0024] The fragile coating is connected to the substrate, and the etching circuit, except for the pad part, is fully or partially connected to the fragile coating and / or the substrate through the composite adhesive layer, and the pad part is connected to the substrate through the composite adhesive layer.

[0025] Furthermore, if the RFID tag is a double-sided structure, the fragile coating is located on the side of the substrate where the chip is located, or on the other side of the substrate where the chip is located, or on both sides of the substrate;

[0026] The etching circuit, except for the conducting point and the pad part, is fully or partially connected to the fragile coating through the composite adhesive layer, and the remaining part is connected to the substrate through the composite adhesive layer.

[0027] Furthermore, the material of the substrate includes film material;

[0028] and / or, the fragile coating material is a coatable resin material;

[0029] And / or, the composite adhesive layer is a single-component or multi-component curable glue;

[0030] And / or, the etching circuit is made of aluminum foil or copper foil;

[0031] And / or, the etching circuit is prepared by an etching process.

[0032] A commodity or commodity outer packaging provided by the utility model includes the radio frequency tag.

[0033] Compared with the prior art, the utility model has the following beneficial effects:

[0034] The utility model provides a fragile coating in the radio frequency tag and ensures that the position of the pad part of the chip on the substrate does not overlap with the projection of the fragile coating. The obtained radio frequency tag has the fastness of the traditional etched tag chip and can realize the anti-transfer and fragile functions of the tag, solves the problem of poor mechanical strength of the pad position of the existing fragile radio frequency tag, improves the yield rate in the production process of the fragile radio frequency tag, and reduces the accidental damage rate of the existing fragile tag during use.

[0035] Similarly, the conductive structure can also be designed in the same way as the pad portion of the chip, so that the conductive structure can also have higher mechanical strength, thereby improving the yield rate in the production process of fragile RFID tags and reducing the accidental damage rate during the use of existing fragile tags. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0037] Figure 1 is a cross-sectional view of a radio frequency tag according to an embodiment;

[0038] Figure 2 is a cross-sectional view of a radio frequency tag according to another embodiment;

[0039] Figure 3 A top view of a radio frequency tag according to an embodiment;

[0040] Figure 4 A top view of a radio frequency tag according to another embodiment;

[0041] Figure 5 Typesetting diagram for fragile coating;

[0042] Figure 6 Layout diagram for RF antenna;

[0043] Figure 7 Schematic diagram of covering with aluminum foil;

[0044] Figure 8 The present invention is a flow chart of a method for preparing a radio frequency tag.

[0045] Reference numerals:

[0046] DETAILED DESCRIPTION

[0047] The utility model is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the utility model, but do not limit the utility model in any form. It should be pointed out that for those of ordinary skill in the art, several changes and improvements can be made without departing from the concept of the utility model. These all belong to the protection scope of the utility model.

[0048] This application is implemented through the following technical solutions:

[0049] like Figure 1 and Figure 2As shown, the RFID tag includes an RFID antenna 1 and a chip 2, and the chip 2 is electrically connected to a pad portion 1031 on the RFID antenna 1. The RFID antenna 1 includes a substrate 101, a fragile coating 102, a composite adhesive layer 104, and an etched circuit 103. The etched circuit 103 contains a pad portion 1031 for encapsulating the RFID chip. If the RFID tag is a double-sided structure, it also includes a conduction point 3. The fragile coating 102 and the pad portion 1031 on the etched circuit 103 do not overlap in projection on the substrate 101. If it is a double-sided structure, the fragile coating 102 and the pad portion 1031 and the conduction point 3 do not overlap in projection on the substrate 101. The non-projection overlap in this application means that the orthographic projections of the fragile coating 102 and the pad portion 1031 on the substrate 101 do not overlap. Similarly, the orthographic projections of the fragile coating 102 and the conduction point 3 on the substrate 101 do not overlap.

[0050] The etching circuit 103 refers to a metal loop on the radio frequency tag that performs a conductive function.

[0051] like Figure 4 As shown, the etching circuit 103 is represented as a coil portion 1035, a bridge portion 1034 and a pad portion 1031 on a high frequency tag. For the sake of clarity, the bridge structure 1034, which was originally located on the other side and could not be displayed, is processed with perspective to make it appear on the Figure 4 middle.

[0052] like Figure 4 As shown, if on the UHF tag, it is represented by a matching ring 1033, an antenna arm 1032 and a pad portion 1031. The matching ring 1033 and the antenna arm 1032 can be located on the same side of the substrate 101, or can be arranged on both sides of the substrate 101, and are electrically connected through the conduction point 3. Similarly, it is sufficient to ensure that the electrical connection position of the matching ring 1033 and the chip (i.e., the pad portion 1031) and the position of the conduction point 3 do not overlap with the fragile coating 102.

[0053] The pad part 1031 is also called the binding point, the chip filling point, and is the location where the chip 2 is connected to the RFID tag. The bridge part 1034 is a structure on the high-frequency RFID tag that is located on the back of the coil part 1035 and serves to connect the coils. It is also called a bridging surface, a bridge surface, or a bridge surface. The coil part 1035 and the bridge part 1034 are electrically connected via the conduction point 3. The pad part 1031 can be electrically connected to the same side as the coil part 1035, or it can be electrically connected to the same side as the bridge part 1034. The conduction point 3 is an electrical connection structure formed by a conduction process, which is common knowledge in the field of RFID tags and will not be elaborated in this application.

[0054] The fragile coating 102 is at least one layer or multiple layers. The thickness of the single layer of the fragile coating is 0.1 to 50 microns. Preferably, the thickness of the composite adhesive layer 104 is greater than the thickness of the fragile coating 102. When the fragile coating 102 is greater than one layer, the materials of each fragile coating can be the same or different. The fragile coating 102 is a resin material selected according to different substrates, so that the 90-degree peeling force between the fragile coating 102 and the substrate 101 is between 0.01N / 25mm and 2N / 25mm. Or the 90-degree peeling force between the fragile coating 102 and the composite adhesive layer 104 is between 0.01N / 25mm and 2N / 25mm. The measurement method refers to Method 4 of "Test Method for Peel Strength of Adhesive Tape GB / T2792-2014": Test Method for 180° Peel Strength of Adhesive Tape and Anti-adhesive Material and Appendix B Test Method for 90° Peel Strength of Adhesive Tape. The horizontal distance between the fragile coating 102 and the pad portion 1031 and the conducting point 3 is greater than 0.5 MM.

[0055] Figure 1 As shown, if the RFID tag is an ultra-high frequency tag, the fragile coating 102 is connected to the substrate 101. According to the need for fragility, all or part of the etched circuit 103 except the pad portion 1031 is connected to the fragile coating 102 and / or the substrate 101 through the composite adhesive layer 104. The pad portion 1031 is connected to the substrate 101 through the composite adhesive layer 104, and the fragile coating 102 and the pad portion 1031 do not overlap in projection on the substrate 101.

[0056] like Figure 2 As shown, if the radio frequency antenna is a high frequency antenna. The fragile coating 102 can be located on one side of the coil portion 1035 of the etching circuit 103 of the substrate 101, or on one side of the bridge portion 1034 of the etching circuit 103 of the substrate 101, or on both sides of the substrate 101 at the same time. The fragile coating 102 is connected to the substrate 101, and the fragile coating 102 is at least one layer or multiple layers. The conduction point 3 of the etching circuit 103 is connected to the substrate 101 through the composite adhesive layer 104. The pad portion 1031 of the etching circuit 103 is connected to the substrate 101 through the composite adhesive layer 104. The etching circuit 103 is connected to the fragile coating 102 in whole or in part through the composite adhesive layer 104 except the conduction point 3 and the pad portion 1031; the remaining portion is connected to the substrate 101 through the composite adhesive layer 104.

[0057] like Figure 3 and Figure 4 As shown, the fragile coating 102 and the pad portion 1031 do not overlap in projection on the substrate 101. The fragile coating 102 and the conductive point 3 do not overlap in projection on the substrate 101.

[0058] The substrate 101 is a common substrate for radio frequency antennas, including but not limited to film materials such as PET and PI.

[0059] The fragile coating 102 is made of a commonly used coatable resin material, including but not limited to one or a mixture of acrylated epoxy resin, polyacrylic acid, polypropylene alcohol, polyacrylate, polyvinyl butyral ester, unsaturated polyester, polyurethane, polythiol / polyene resin, polymethacrylate, fluorine-containing resin and silicon-containing resin. The fragile coating can also be composed of two or more layers of the above-mentioned coatings.

[0060] The composite adhesive layer 104 is a single-component or multi-component curable adhesive, generally a polyurethane composite adhesive.

[0061] The etching circuit 103 is made of aluminum foil or copper foil.

[0062] When the radio frequency tag provided by the utility model is used, an adhesive is coated on one side of the radio frequency tag and then attached to the surface of the commodity or the outer packaging of the commodity. When the radio frequency tag is to be peeled off, the fragile coating 102 is damaged, so it is difficult to reuse.

[0063] Example 1

[0064] like Figure 1 As shown, the RFID tag is a single-sided structure. An example of a single-sided RFID tag is as follows Figure 3 UHF tag shown.

[0065] The radio frequency tag includes a substrate 101, a fragile coating 102 is provided on one side of the substrate 101, and a composite adhesive layer 104 is provided on the other side of the substrate 101, and the composite adhesive layer 104 also covers the fragile coating 102. An etching circuit 103 is provided on the outer side of the composite adhesive layer 104, and the etching circuit 103 has a pad portion 1031 for connecting a chip.

[0066] The fragile coating 102 and the pad portion 1031 do not overlap in projection on the substrate 101, that is, the orthographic projections of the fragile coating 102 and the pad portion 1031 on the substrate 101 do not overlap, in order to prevent the fragile coating 102 from accidentally breaking, resulting in a poor connection between the pad portion 1031 and the chip and a circuit break. When criminals attempt to tear off the RFID tag, the fragile coating 102 is easily damaged during the tearing process due to the presence of the fragile coating 102, making it difficult to reuse.

[0067] Example 2

[0068] like Figure 2 As shown, the RFID tag is a double-sided structure. An example of a double-sided RFID tag is as follows Figure 4The RFID tag includes a substrate 101, a fragile coating 102 is provided on one or both sides of the substrate 101, and both sides are covered with a composite adhesive layer 104, an etching circuit 103 is provided on the outer side of the composite adhesive layer 104, and the etching circuit 103 has a pad part 1031 for connecting the chip, and at the same time, the etching circuits 103 on both sides are electrically connected by passing through the composite adhesive layer 104 and the conducting point 3 of the substrate 101.

[0069] The fragile coating 102 does not overlap with the pad portion 1031 and the conducting point 3 on the substrate 101, that is, the orthographic projections of the fragile coating 102, the pad portion 1031 and the conducting point 3 on the substrate 101 do not overlap, in order to avoid the fragile coating 102 from accidentally breaking, resulting in a poor connection between the pad portion 1031 and the chip and a circuit break, and to avoid the conducting point 3 from being damaged and causing a circuit break. When criminals attempt to tear off the RFID tag, due to the presence of the fragile coating 102, the fragile coating 102 is easily damaged during the tearing process, making it difficult to reuse.

[0070] Example 3

[0071] The radio frequency tag has a double-sided structure, and the radio frequency tag with a double-sided structure can also be an ultra-high frequency tag.

[0072] An example of a double-sided UHF tag may be: a double-sided UHF tag includes a substrate 101, and a fragile coating 102 is partially provided on one or both sides of the substrate 101. A matching ring 1033 and an antenna arm 1032 are respectively located on both sides of the substrate 101, and the two are electrically connected through a conducting point 3. The pad portion 1031 may be located on one side of the matching ring 1033, and is directly electrically connected to the matching ring 1033.

[0073] Another example of a double-sided UHF tag may be: a double-sided UHF tag includes a substrate 101, and a fragile coating 102 is partially provided on one or both sides of the substrate 101. A matching ring 1033 and an antenna arm 1032 are located on the same side of the substrate 101, and a pad portion 1031 is located on the other side of the substrate 101 and is electrically connected to the matching ring 1033 through a conductive point 3.

[0074] Of course, there are many other ways to design a double-sided UHF tag, which will not be described in detail in this embodiment. However, no matter which design method is used, the fragile coating 102 does not overlap with the pad portion 1031 and the conduction point 3 in terms of the upper and lower position relationship, that is, the orthographic projections of the fragile coating 102, the pad portion 1031, and the conduction point 3 on the substrate 101 do not overlap, and the purpose is to avoid the fragile coating 102 from accidentally rupturing, resulting in a poor connection between the pad portion 1031 and the chip and a circuit break, and to avoid damage to the conduction point 3 and a circuit break. When criminals attempt to tear off the RFID tag, due to the presence of the fragile coating 102, the fragile coating 102 is easily damaged during the tearing process, making it difficult to reuse.

[0075] like Figure 8 As shown, in order to realize the above structure, the utility model provides the following preparation process:

[0076] 1. Plate making.

[0077] As per the design, the fragile coating and RF antenna are typeset.

[0078] like Figure 5 As shown, the fragile coating is typed and plated. When the fragile coating is typed, blanks are left at the corresponding positions of the conduction points and pads as required. Preferably, the blank size is larger than the corresponding conduction point size and pad size. The position of the fragile coating corresponds to the subsequent antenna position one by one. At the same time, a positioning line A1 and / or a positioning mark B1 are reserved at the edge of the substrate.

[0079] like Figure 6 As shown, the RF antenna is typesetting and platemaking. When making the plate, a positioning line A2 and / or positioning mark B2 corresponding to the positioning line A1 and / or positioning mark position are reserved. The RF antenna pad position and the conduction point position correspond to the blank position of the fragile coating one by one. The RF antenna typesetting width is smaller than the fragile coating typesetting width, and blank space is left at the position of the positioning line A1 and the positioning mark B1. The positioning line A2 and the positioning mark B2 are on the side of the positioning line A1 and the positioning mark B1 close to the antenna direction.

[0080] The shapes and sizes of the positioning line A1A2 and the positioning mark B1B2 can be selected arbitrarily.

[0081] The printing plate for the fragile coating and the radio frequency antenna can be made by selecting one or more of gravure printing plate, offset printing plate, flexographic printing plate and silk screen printing plate.

[0082] Preferably, the fragile coating and the radio frequency antenna etching circuit are made using the same plate making method.

[0083] 2. Processing technology of substrate and fragile coating:

[0084] 2.1 Substrate pretreatment.

[0085] According to the actual situation, the corona treatment of the substrate is selectively performed to ensure that the ideal peeling force between the fragile coating and the substrate is finally obtained (it is well known in the industry that a high corona value can increase the peeling force, and a low corona value can reduce the peeling force).

[0086] 2.2 Fragile coating printing.

[0087] According to the designed thickness, the fragile printing method is corresponding to the plate making method, using the printing plate to position and print on one or both sides of the substrate. If the fragile coating material needs to be printed on both sides of the substrate at the same time, a double-sided flip printing process or a secondary overprint printing process can be used. The printing process includes a curing process for the fragile coating material used. The curing process can be selected according to the material of the fragile coating, such as heat curing, heat drying, electron beam curing, UV curing, etc.

[0088] 2.3 Cutting.

[0089] According to the processing size requirements, the printed material is cut, and the positioning line A1 and positioning mark B1 must be retained during cutting. The cutting width is L1.

[0090] 3. RF antenna processing technology:

[0091] 3.1 Aluminum foil / copper foil composite.

[0092] like Figure 7 As shown, select aluminum foil / copper foil of appropriate thickness and width according to the RF antenna design drawing and layout drawing. The width of the aluminum foil / copper foil must be greater than the antenna layout width. The width of the aluminum foil / copper foil must be less than the cutting width L1 described in 2.3. Use a dry laminating machine to apply composite glue and perform a composite operation on the aluminum foil / copper foil and the substrate containing a fragile coating. The composite glue can be applied to one side of the aluminum foil / copper foil and then composited with the side of the substrate with a fragile coating after the solvent is evaporated; it can also be applied to the side of the substrate with a fragile coating and then composited with the aluminum foil / copper foil after the solvent is evaporated. If etching circuits are required on both sides of the substrate, composite operations need to be performed on both sides of the substrate. The aluminum foil / copper foil must cover the required position of the RF antenna. The aluminum foil / copper foil cannot cover the positioning line A1 and the positioning mark B1.

[0093] 3.2 Ripening.

[0094] The composite materials are cured according to the corresponding use conditions of the composite adhesive to fully cure the composite adhesive.

[0095] 3.3 RF antenna printing.

[0096] The photosynthetic degradable wet film ink is printed on the cured aluminum foil / copper foil surface using a radio frequency antenna plate and cured. The curing conditions are in accordance with the requirements for the photosynthetic degradable wet film ink used. The printing method matches the printing plate used.

[0097] The photosynthetic erasable wet film ink is a photocurable ink commonly used in the industry that is resistant to water and acid but soluble in alkaline aqueous solution.

[0098] When the RF antenna is printed, due to the aluminum re-aluminum process in 3.1, the fragile coating has been covered by aluminum foil / copper foil, but the positioning line A1 and / or positioning mark B1 are still visible. The relative position relationship between the fragile coating blank and the pads and conduction points on the etched circuit can be determined by the position relationship between the positioning line A2 and / or positioning mark B2 on the RF antenna printing plate and the positioning line A1 and / or positioning mark B1. Figure 6 By adjusting the above relative position relationship, the blank space of the fragile coating is made to coincide with the position of the pad and the conduction point in the printed pattern.

[0099] The horizontal distance between A1 and A2 and the horizontal distance between B1 and B2 are L2, and the vertical distance between B1 and B2 is L3. Figure 6 .

[0100] The error of L2 is less than or equal to ±2mm, and the error of L3 is less than or equal to ±2mm.

[0101] If there are etched circuits on both sides of the RF antenna substrate, repeat the above operation and perform double-sided overprinting according to conventional processes.

[0102] 3.4 RF antenna etching;

[0103] 3.4.1 Pickling and etching;

[0104] The material printed with the etched circuit pattern is passed through an acid washing tank to use acid to wash away the aluminum foil / copper foil not covered by the photosynthetic degradable wet film ink. The specific process is well known in the industry.

[0105] After pickling, the residual acid is washed away with water, and the steel sheet is dried and rolled.

[0106] The acid solution is an aqueous solution of an inorganic acid, and hydrochloric acid is commonly used in the industry.

[0107] 3.4.2 Alkaline washing and deinking;

[0108] The material with excess aluminum foil / copper foil washed off is washed off with acid and alkali solution in an alkali washing tank to remove the photosynthetic degradable wet film ink covering the etched circuit. The specific process is well known in the industry.

[0109] After alkali washing, the residual alkali solution is washed away with water, and the product is dried and rolled.

[0110] The alkali solution is an inorganic alkali aqueous solution, and a sodium hydroxide aqueous solution is commonly used in the industry.

[0111] 3.5 Conductivity processing;

[0112] If the etching circuit is a double-sided structure, it is necessary to perform a conduction operation at the conduction point, which is specifically performed according to the commonly used methods in the industry.

[0113] 3.6 Cutting;

[0114] According to the design drawing, the etched RF antenna is cut to reach the designed size.

[0115] 4. Chip packaging;

[0116] The radio frequency antenna produced by the above structure and method is used with a matching chip and packaging glue to obtain a radio frequency tag after reverse packaging through a conventional process. The specific packaging parameters vary depending on the chip model and packaging glue model.

[0117] The self-adhesive label made of the radio frequency tag produced according to the above structure and method has the conduction point and chip fastness of the traditional etched label, and at the same time can realize the anti-transfer and fragile functions of the label, solves the problem of poor mechanical strength of the conduction point and pad position of the existing fragile radio frequency tag, improves the yield rate in the production process of fragile radio frequency tags, and reduces the accidental damage rate of the existing fragile tags during use.

[0118] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0119] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other at will.

Claims

1. A radio frequency tag, characterized in that: include: A radio frequency antenna (1) and a chip (2), wherein the chip (2) is electrically connected to a pad portion (1031) on the radio frequency antenna (1); The radio frequency antenna (1) comprises a substrate (101), a fragile coating (102), a composite adhesive layer (104) and an etching circuit (103), wherein the etching circuit (103) contains the pad portion (1031), the fragile coating (102) is connected to a local position on the surface of the substrate (101), and the etching circuit (103) is connected to the substrate (101) and the fragile coating (102) simultaneously through the composite adhesive layer (104); The fragile coating (102) and the pad portion (1031) on the etched circuit (103) do not overlap in projection; If the radio frequency tag is a double-sided structure, the radio frequency tag further comprises a conducting point (3), and the fragile coating (102) does not overlap with the pad portion (1031) and the conducting point (3).

2. The radio frequency tag according to claim 1, characterized in that: The etching circuit (103) is represented on the high frequency tag as a coil portion (1035), a bridge portion (1034) and a pad portion (1031), wherein the coil portion (1035) is located on one side of the substrate (101), and the bridge portion (1034) is located on the other side of the substrate (101); The pad portion (1031) is electrically connected to the coil portion (1035), or the pad portion (1031) is electrically connected to the bridge portion (1034); The coil part (1035) and the bridge part (1034) are electrically connected via a conduction point (3).

3. The radio frequency tag according to claim 1, characterized in that: The etching circuit (103) is manifested as a matching ring (1033), an antenna arm (1032) and a pad portion (1031) on the UHF tag, and the matching ring (1033) is electrically connected to the antenna arm (1032) and the pad portion (1031) respectively.

4. The radio frequency tag according to claim 1, characterized in that: The fragile coating (102) is one layer or more than two layers; and / or, the single layer thickness of the fragile coating (102) is 0.1 to 50 micrometers; And / or, when the fragile coating (102) comprises two or more layers, the materials of each fragile coating (102) are the same or different.

5. The radio frequency tag according to claim 1, characterized in that: The 90-degree peeling force between the fragile coating (102) and the substrate (101) is between 0.01N / 25mm and 2N / 25mm, or the 90-degree peeling force between the fragile coating (102) and the composite adhesive layer (104) is between 0.01N / 25mm and 2N / 25mm.

6. The radio frequency tag according to claim 2 or 3, characterized in that: If the radio frequency tag is a single-sided structure, the horizontal distance between the fragile coating (102) and the pad portion (1031) is greater than 0.5 mm; If the radio frequency tag is a double-sided structure, the horizontal distance between the fragile coating (102) and the pad portion (1031) and the conducting point (3) is greater than 0.5 mm.

7. The radio frequency tag according to claim 3, characterized in that: If the radio frequency tag is a single-sided structure, the fragile coating (102) is located on the side of the substrate (101) where the chip (2) is located; The etching circuit (103) is connected in whole or in part to the fragile coating (102) and / or the substrate (101) through the composite adhesive layer (104) except for the pad portion (1031), and the pad portion (1031) is connected to the substrate (101) through the composite adhesive layer (104).

8. The radio frequency tag according to claim 2 or 3, characterized in that: If the radio frequency tag is a double-sided structure, the fragile coating (102) is located on the side of the substrate (101) where the chip (2) is located, or on the other side of the substrate (101) where the chip (2) is located, or on both sides of the substrate (101); The etching circuit (103) is connected in whole or in part to the fragile coating (102) via the composite adhesive layer (104) except for the conduction point (3) and the pad portion (1031), and the remaining portion is connected to the substrate (101) via the composite adhesive layer (104).

9. The radio frequency tag according to claim 1, characterized in that: The material of the substrate (101) includes a film material; and / or, the fragile coating (102) is made of a coatable resin material; And / or, the composite adhesive layer (104) is a single-component or multi-component curable adhesive; And / or, the etching circuit (103) is made of aluminum foil or copper foil; And / or, the etching circuit (103) is prepared by an etching process.

10. A commodity, characterized in that: The invention comprises the radio frequency tag as described in any one of claims 1 to 9.

11. A commodity outer packaging, characterized in that: The invention comprises the radio frequency tag as described in any one of claims 1 to 9.

Images