Fingerprint module and electronic equipment

Abstract

The utility model discloses a fingerprint module and an electronic device, and the fingerprint module comprises a pedestal which is internally provided with a chip; the cover plate is arranged above the chip; the cover plate is arranged in the base; a positioning ring is arranged on one side, facing the chip, of the cover plate; the positioning ring is located in the center of the cover plate. According to the fingerprint module, the positioning ring is arranged on the side, facing the chip, of the cover plate, the positioning ring is located in the center of the cover plate, a user can better place a finger in the middle of the fingerprint module through the positioning ring, and the recognition success rate of the fingerprint module is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to a fingerprint module and electronic equipment. Background Art

[0002] Nowadays, smart terminal products usually have fingerprint recognition function, which is to encrypt or unlock by contacting the fingerprint module with the user's finger and identifying the fingerprint. However, in daily use, it is often necessary to press the finger several times to recognize the fingerprint. One of the reasons is that the finger is not placed in the middle of the fingerprint cover, so the fingerprint module cannot correctly recognize the fingerprint.

[0003] How to remind users to place their fingers accurately in the middle of the fingerprint cover has become a technical problem that needs to be solved urgently in the industry. Summary of the invention

[0004] In order to at least solve the above-mentioned technical problems, the purpose of the utility model is to provide a fingerprint module, by providing a positioning ring on the side of the cover plate facing the chip, the positioning ring is located in the center of the cover plate, so that the user can better place the finger in the middle position of the fingerprint module through the positioning ring, thereby improving the recognition success rate of the fingerprint module.

[0005] In order to achieve the above purpose, the fingerprint module provided by this application includes:

[0006] A base, wherein a chip is arranged in the base;

[0007] A cover plate, arranged above the chip;

[0008] The cover plate is arranged in the base;

[0009] A positioning ring is provided on the side of the cover plate facing the chip;

[0010] The locating ring is located in the center of the cover.

[0011] Furthermore, the positioning ring is ring-shaped.

[0012] Furthermore, the color of the positioning ring is inconsistent with the color of the cover plate.

[0013] Furthermore, the center of the positioning ring coincides with the center point of the cover plate.

[0014] Furthermore, the radius of the positioning ring is half of the distance between the short sides of the cover plates.

[0015] Furthermore, an FPC is provided below the chip.

[0016] Furthermore, the FPC is arranged below the base.

[0017] Further, the FPC is provided with an extension portion;

[0018] The extension part is provided with a component area;

[0019] Components are arranged on the component area.

[0020] Furthermore, a reinforcing plate is provided below the FPC.

[0021] To achieve the above objectives, the present application also provides an electronic device, including: the above fingerprint module.

[0022] The fingerprint module of the embodiment of the present application includes: a base, in which a chip is arranged; a cover plate, which is arranged above the chip; the cover plate is arranged in the base; a positioning ring is arranged on the side of the cover plate facing the chip; the positioning ring is located at the center of the cover plate. By arranging a positioning ring on the side of the cover plate facing the chip, and the positioning ring is located at the center of the cover plate, the user can better place the finger in the middle of the fingerprint module through the positioning ring, thereby improving the recognition success rate of the fingerprint module; the positioning ring is arranged on the back of the cover plate, thereby avoiding direct contact between the finger and the positioning ring, and extending the service life of the positioning ring; BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings:

[0024] Figure 1 It is a schematic diagram of the fingerprint module structure of an embodiment of the present application;

[0025] Figure 2 It is a cross-sectional view of the fingerprint module of an embodiment of the present application.

[0026] Description of reference numerals:

[0027] 101-base; 102-cover; 103-positioning ring; 104-reinforcement plate; 105-FPC; 106-component area; 107-chip. DETAILED DESCRIPTION

[0028] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not intended to limit the scope of protection of the present application.

[0029] It should be understood that the various steps described in the method implementation of the present application can be performed in different orders and / or performed in parallel. In addition, the method implementation may include additional steps and / or omit the steps shown. The scope of the present application is not limited in this respect.

[0030] The term "including" and its variations used herein are open inclusions, i.e., "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0031] It should be noted that the modifications of "one" and "plurality" mentioned in this application are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more". "Plurality" should be understood as two or more.

[0032] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0033] The present application provides a fingerprint module, including:

[0034] A base, wherein a chip is arranged in the base;

[0035] A cover plate, arranged above the chip;

[0036] The cover plate is arranged in the base;

[0037] A positioning ring is provided on the side of the cover plate facing the chip;

[0038] The locating ring is located in the center of the cover.

[0039] Example 1

[0040] Figure 1 is a schematic diagram of the fingerprint module structure of an embodiment of the present application, Figure 2 This is a cross-sectional view of the fingerprint module of the embodiment of the present application. Figure 1-2 , the fingerprint module structure of the embodiment of the present application is described in detail.

[0041] In an exemplary implementation, the fingerprint module of the embodiment of the present application includes a base 101 .

[0042] In an exemplary embodiment, as required, the base 101 is made of, for example, stainless steel.

[0043] In an exemplary embodiment, the shape of the base 101 is set as needed, for example, the base 101 is set to be oval or circular. Of course, if necessary, the shape of the base 101 can also be set to be rectangular.

[0044] In an exemplary embodiment, a chip 107 is disposed within the base 101 .

[0045] In an exemplary embodiment, a cover plate 102 is further disposed in the base 101 .

[0046] In an exemplary embodiment, the cover plate 102 is disposed above the chip 107 .

[0047] In an exemplary embodiment, the cover plate 102 is disposed within the base 101 .

[0048] In an exemplary embodiment, the cover plate 102 covers the chip 107 .

[0049] In an exemplary embodiment, an adhesive layer is provided between the cover plate 102 and the chip 107 , and the adhesive layer is formed by coating glue, for example.

[0050] In an exemplary embodiment, a positioning ring 103 is provided on the side of the cover plate 102 facing the chip 107 , which can be understood as the positioning ring 103 is arranged on the cover plate 102 , and the side provided with the positioning ring 103 is arranged facing the chip 107 .

[0051] In an exemplary embodiment, the positioning ring 103 is located at the center of the cover plate 102 .

[0052] In an exemplary embodiment, the positioning ring 103 is in a ring shape, such as a circular ring or an elliptical ring.

[0053] In an exemplary embodiment, the color of the positioning ring 103 is inconsistent with the color of the cover plate 102 , for example, the color of the cover plate 102 is colorless, and the positioning ring 103 is red, and so on.

[0054] In an exemplary embodiment, the positioning ring 103 has a color, and the color of the positioning ring 103 includes red, blue, green, purple, orange, etc.

[0055] In an exemplary embodiment, the positioning ring 103 is formed by applying colored metallic paint, such as red metallic paint, on the cover plate 102 .

[0056] In an exemplary embodiment, the positioning ring 103 uses metallic paint because metallic paint has excellent characteristics of good water resistance, corrosion resistance, long-term salt spray resistance, moisture and heat resistance, and good adhesion. These excellent characteristics can ensure that it will not fade for a long time during use and maintain bright colors.

[0057] In an exemplary embodiment, the inner and outer diameter widths of the positioning ring 103 are 0.3-0.5 mm.

[0058] In an exemplary embodiment, the positioning ring 103 is disposed on a side of the cover plate 102 facing the chip 107 . During use, the user's fingers will not directly contact the positioning ring 103 , thereby avoiding the occurrence of finger wear on the positioning ring 103 during use and further improving the service life of the positioning ring 103 .

[0059] In an exemplary embodiment, the center of the positioning ring 103 coincides with the center point of the cover plate 102 , that is, the positioning ring 103 is centrally disposed on the cover plate 102 .

[0060] In an exemplary embodiment, the radius of the positioning ring 103 is half of the distance between the short sides of the cover plate 102 .

[0061] In an exemplary embodiment, an FPC 105 is further disposed below the chip 107 .

[0062] In an exemplary embodiment, the FPC 105 is disposed below the base 101 , that is, the FPC 105 is not disposed inside the base 101 .

[0063] In an exemplary embodiment, the FPC 105 is provided with an extended portion, and the projection of the extended portion does not fall on the cover plate 102 .

[0064] In an exemplary embodiment, the extended portion is provided with a component area 106 .

[0065] In an exemplary embodiment, components are disposed on the component area 106 .

[0066] In some exemplary embodiments, the components include capacitors and / or resistors and / or diodes.

[0067] In some exemplary embodiments, the capacitor plays a role of voltage stabilization or filtering.

[0068] In some exemplary embodiments, the resistor plays a role of pull-up or electrostatic protection.

[0069] In some exemplary embodiments, the diode plays a role in electrostatic protection or preventing voltage backflow.

[0070] In an exemplary embodiment, a reinforcing plate 104 is provided below the FPC 105 .

[0071] In an exemplary embodiment, the reinforcement plate 104 is, for example, a steel sheet reinforcement plate.

[0072] In an exemplary embodiment, an adhesive layer is provided between the chip 107 and the FPC 105 , and the adhesive layer is formed by coating glue, for example.

[0073] In an exemplary embodiment, an adhesive layer is provided between the FPC 105 and the reinforcing plate 104 , and the adhesive layer is formed by coating glue, for example.

[0074] Example 2

[0075] Embodiment 2 is an electronic device including a fingerprint recognition function.

[0076] In an exemplary implementation, the electronic device according to the embodiment of the present application includes the fingerprint recognition module according to the above embodiment.

[0077] Although the implementation methods disclosed in the present invention are as above, the contents are only implementation methods adopted to facilitate the understanding of the present invention, and are not intended to limit the present invention. Any technician in the field to which the present invention belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in the present invention, but the scope of patent protection of the present invention shall still be based on the scope defined in the attached claims.

Claims

1. A fingerprint module, characterized in that: include: A base, wherein a chip is arranged in the base; A cover plate, arranged above the chip; The cover plate is arranged in the base; A positioning ring is provided on one side of the cover plate facing the chip; The positioning ring is located at the center of the cover plate.

2. The fingerprint module according to claim 1, characterized in that: The positioning ring is ring-shaped.

3. The fingerprint module according to claim 2, characterized in that: The color of the positioning ring is inconsistent with the color of the cover plate.

4. The fingerprint module according to claim 3, characterized in that: The center of the positioning circle coincides with the center point of the cover plate.

5. The fingerprint module according to claim 4, characterized in that: The radius of the positioning ring is half of the distance between the short sides of the cover plates.

6. The fingerprint module according to claim 5, characterized in that: An FPC is also provided below the chip.

7. The fingerprint module according to claim 6, characterized in that: The FPC is arranged below the base.

8. The fingerprint module according to claim 7, characterized in that: The FPC is provided with an extension portion; The extension portion is provided with a component area; Components are arranged on the component area.

9. The fingerprint module according to claim 8, characterized in that: A reinforcing plate is provided below the FPC.

10. An electronic device, characterized in that: A fingerprint module comprising any one of claims 1 to 9.

Images