Chip testing equipment

Abstract

The utility model discloses chip testing equipment, and relates to the technical field of chip testing. Comprising a heating module, a temperature control module and a tray, the heating module comprises a silica gel heating wire; the temperature control module comprises a ceramic temperature switch; the tray comprises a plurality of aluminum foil boxes; the ceramic temperature switch is connected in series with the heating module and is used for disconnecting the heating module when the temperature reaches a set upper limit value; the tray comprises a normal-temperature test state and a high-temperature test state, and the tray in the high-temperature test state comprises an aluminum foil thermal insulation cover; the silica gel heating wire is used for adjusting the state of the silica gel heating wire according to the temperature distribution condition to carry out temperature compensation; the state of the silica gel heating wire comprises the length, the layout position and the length. According to the utility model, the external heating function is added to meet the requirement of 70-85 DEG C in a high-temperature test, and the DC 12V heating wire is adopted for heating, so that not only is the safety realized, but also the power consumption is extremely low, and certain advantages are realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip testing, and specifically relates to a chip testing device. Background Art

[0002] There are two conventional methods for flash memory chip testing in the prior art: one is room temperature testing, which has the advantages of low cost, low difficulty in construction, and simple operation. The disadvantage is that it only relies on chip self-heating, and when the temperature is below 70°C, it cannot screen out temperature-sensitive defects; it cannot accelerate aging, and the test time is long.

[0003] The other is high-temperature testing. Its advantage is that it can accurately test the temperature, accelerate aging and screen out high-temperature sensitive properties. Its disadvantage is that it is expensive and requires a high-temperature box (furnace). Compared with ordinary normal temperature testing, the cost for the same unit test volume increases by more than 1 times. Due to the safety regulations of high-temperature boxes (furnaces), they need to be isolated with solid cement walls, which takes up a lot of space. The operation of high-temperature boxes (furnaces) carries the risk of burns and high-temperature operations.

[0004] In view of the above problems, there is an urgent need for a low-cost chip testing equipment that can be quickly assembled, disassembled and modularized, is easy to operate and has complete safety measures. Utility Model Content

[0005] In order to overcome the deficiencies of the prior art, the utility model provides a chip testing device that can be quickly assembled and disassembled, is simple to operate, has low cost, and has safety measures such as flame retardancy and high-temperature power-off.

[0006] The technical solution adopted by the utility model to solve its technical problems is: a chip testing device, which is improved in that it includes a heating module, a temperature control module and a tray; the heating module includes a silicone heating wire; the temperature control module includes a ceramic temperature switch; the tray includes a plurality of aluminum foil boxes; the ceramic temperature switch is connected in series with the heating module, and is used to disconnect the heating module when the temperature reaches a set upper limit; the tray includes a normal temperature test state and a high temperature test state, and the tray in the high temperature test state includes an aluminum foil temperature insulation cover; the silicone heating wire is used to adjust the state of the silicone heating wire according to the temperature distribution to perform temperature compensation; the state of the silicone heating wire includes length, layout position and length.

[0007] The silicone heating wire in the above technical solution is arranged in a bow shape at the bottom of the tray.

[0008] The silicone heating wires in the above technical solution are arranged in four corners at the bottom of the tray.

[0009] When the pallet in the above technical solution is in a normal temperature test state, the aluminum foil box adopts a stepped layout.

[0010] The aluminum foil thermal insulation cover described in the above technical solution is packaged by glass fiber cloth aluminum foil tape.

[0011] The heating module in the above technical solution adopts an industrial power supply with a power of 400W, a voltage of 12V and a current of 33A.

[0012] The circuits of the heating module and the temperature control module in the above technical solution use silicone flat cables.

[0013] The beneficial effects of the utility model are as follows: the utility model meets the requirement of high temperature test of 70℃-85℃ by adding an external heating function. Since the self-heating of the chip at normal temperature can reach about 40℃-65℃, it is only necessary to heat to compensate for the temperature difference, and the heating capacity is lower than 70℃. It adopts DC12V heating wire for heating, which is not only safe, but also has extremely low power consumption and has the characteristics of energy saving and safety. The length, layout position, length, etc. of the heating wire can be adjusted according to the temperature distribution, and the temperature can be accurately compensated to meet the requirement of 70℃-85℃. By connecting a ceramic temperature switch in series in the highest temperature area, when the temperature upper limit reaches the set value, the ceramic temperature switch is disconnected, and the heating compensation is stopped. An aluminum foil insulation cover is added for insulation to prevent temperature loss. It is light, safe and low in cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is a structural schematic diagram of the front side of the utility model;

[0016] Figure 3 It is a schematic diagram of the bow-shaped layout of the heating module in the utility model;

[0017] Figure 4 It is a schematic diagram of the four corner layout of the heating module in the utility model;

[0018] Figure 5 It is a schematic diagram of the ladder layout of the aluminum foil box under normal temperature testing state in the utility model.

[0019] Figure numbers: heating module 1, temperature control module 2, tray 3, aluminum foil box 4, silicone heating wire 5, aluminum foil temperature insulation cover 6. DETAILED DESCRIPTION

[0020] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0021] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technicians in this field without creative work are all within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the formation of a better connection structure by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the invention can be combined interchangeably without conflicting with each other.

[0022] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0023] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0024] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] Reference Figure 1 As shown, the utility model provides a chip testing device, including a heating module 1, a temperature control module 2 and a tray 3, the heating module 1 includes a silicone heating wire 5, and the temperature control module 2 includes a ceramic temperature switch.

[0026] Specifically, the temperature control module 2, namely the ceramic temperature switch, is connected in series with the heating module 1, and is used to disconnect the heating module when the temperature reaches a set upper limit value.

[0027] In the above process, the utility model can achieve more precise temperature control by combining the silicone heating wire and the ceramic temperature switch. The silicone heating wire can provide accurate heating effect, and the ceramic temperature switch can be used as a feedback mechanism to disconnect the circuit and stop heating when the preset temperature is reached to prevent the temperature from continuing to rise. This can ensure that the chip can work stably within a smaller temperature range and avoid damage to the chip due to high temperature.

[0028] In addition, the set temperature of the ceramic temperature switch is generally around 85°C. When the ambient temperature or chip temperature reaches this threshold, the temperature control module will immediately disconnect the circuit, avoiding the risk of overheating of the chip or equipment and providing a safety protection mechanism for the testing process.

[0029] The silicone heating wire used is flexible and portable, and can be customized in design and layout according to different chips or test requirements. The length, thickness and layout of the heating wire can be adjusted to accommodate chips of different sizes, improving the applicability of the equipment.

[0030] Furthermore, the utility model combines external heating with chip self-heating, so that the operator can perform tests and operations more comfortably. Compared with direct contact with high-temperature chips, this method allows the operator to work at a more comfortable temperature, thereby enhancing the user experience.

[0031] Compared with other complex high-temperature testing equipment, the utility model has a simple structure, low component prices, and is easy to integrate and customize, so it has certain advantages in terms of economy. It takes into account precise temperature control, safety, flexibility and cost-effectiveness, and provides an economical and feasible solution for chip testing.

[0032] like Figure 2 As shown, the pallet 3 includes multiple aluminum foil boxes 4, and the pallet includes a normal temperature test state and a high temperature test state. The pallet in the high temperature test state includes an aluminum foil insulation cover 6. In order to insulate and prevent temperature loss and ensure that the operating environment is at normal temperature, an aluminum foil insulation cover is added, which is light, safe and low cost.

[0033] In the above process, the tray is designed to contain multiple aluminum foil boxes, and provides normal temperature test state and high temperature test state according to different test temperatures. The aluminum foil boxes and aluminum foil insulation covers can effectively isolate heat and separate the chip test area from the external environment, ensuring that the operating environment can be maintained at normal temperature, providing the operator with a comfortable and safe working environment and avoiding direct contact at high temperatures.

[0034] In addition, aluminum foil material has good thermal conductivity, which can help retain heat in the chip test area. By adding an aluminum foil insulation cover, heat loss can be reduced, helping to maintain the target high temperature state and providing a stable and efficient environment for testing.

[0035] Among them, aluminum foil materials are usually light and will not increase the weight of the equipment, making it easy to carry and operate. The lightweight design makes the equipment easier to install and adjust.

[0036] The silicone heating wire 5 is used to adjust the state of the silicone heating wire according to the temperature distribution to perform temperature compensation. The state of the silicone heating wire includes length, layout position and length.

[0037] In the above process, the silicone heating wire can be customized according to the size and shape of different chips, as well as the required temperature distribution. By adjusting the length, layout and thickness of the heating wire, precise heating of the test area can be achieved to ensure uniform temperature distribution, thus avoiding uneven heat or waste caused by traditional heating methods. The silicone heating wire has a high thermal response speed and can quickly reach the preset temperature and maintain stability. This fast response feature ensures the efficiency of the test process and reduces waiting time. By adjusting the state of the silicone heating wire, such as the heating wire layout and density, the heating area can be controlled more finely.

[0038] Specifically, Figure 3 and Figure 4 The temperature distribution is shown on the left side. The darker the color of the thermal diagram, the higher the temperature. A ceramic temperature switch is connected in series in the highest temperature area. When the upper temperature limit reaches the set value, the ceramic temperature switch is disconnected and the heating compensation stops.

[0039] The aluminum foil thermal insulation cover 6 is packaged by glass fiber cloth aluminum foil tape.

[0040] Among them, glass fiber cloth has good strength and wear resistance.

[0041] like Figure 3 As shown, the silicone heating wire adopts a bow-shaped layout at the bottom of the tray, which is easy to assemble and can meet the requirements of 70℃-85℃.

[0042] like Figure 4 As shown, the silicone heating wire adopts a four-corner layout at the bottom of the tray. It is slightly more difficult to assemble than the bow-shaped layout, but the temperature balance is better.

[0043] like Figure 5 As shown, when the pallet is in the normal temperature test state, the aluminum foil box adopts a stepped layout for easy operation and high density.

[0044] During the above process, when the tray is under normal temperature testing, the aluminum foil box adopts a stepped layout to provide the operator with a more comfortable operating angle and space, ensuring the convenience during the test. This layout can make the equipment more user-friendly and the operator can perform the test more conveniently.

[0045] Specifically, the heating module uses an industrial power supply with a power of 400W, a voltage of 12V, and a current of 33A, and the circuits of the heating module and the temperature control module use silicone cables.

[0046] In the above process, the silicone flat cable can usually withstand high temperatures above 200 degrees Celsius and can work normally in the high temperature environment of the heating module, avoiding the problem of the wire being burned due to high temperature. The silicone flat cable has high flexibility and can be bent at will, which is easy to adapt to different layouts and installation requirements.

[0047] The utility model meets the requirement of high temperature test of 70℃-85℃ by adding an external heating function. Since the self-heating of the chip at normal temperature can reach about 40℃-65℃, it is only necessary to heat to compensate for the temperature difference, and the heating capacity can be lower than 70℃. It adopts DC12V heating wire for heating, which is not only safe, but also has extremely low power consumption and has the characteristics of energy saving and safety. The length, layout position, length, etc. of the heating wire can be adjusted according to the temperature distribution, and the temperature can be accurately compensated to meet the requirement of 70℃-85℃. A ceramic temperature switch is connected in series in the highest temperature area. When the temperature upper limit reaches the set value, the ceramic temperature switch is disconnected to stop heating compensation. An aluminum foil insulation cover is added to prevent temperature loss. The utility model is light, safe and low in cost.

[0048] In the above process, the embodiment of the present invention utilizes both chip self-heating and external heating to meet the requirements of high temperature testing. When the chip is working, it will generate a certain amount of heat, causing the chip temperature to rise. When most chips work at room temperature (ambient temperature is 20-25°C), the chip temperature can reach 40°C-65°C. By utilizing this point, it is only necessary to compensate for the remaining temperature difference through external heating to achieve the target temperature of 70°C-85°C. The external heating uses a heating wire with a DC12V voltage for heating. This heating method is safe and has low power consumption. By adjusting the length, layout position, thickness and other parameters of the heating wire, the heating effect can be accurately controlled to compensate for the required temperature difference and meet the test requirements. In order to further control and ensure the temperature, a ceramic temperature switch is used in the highest temperature area. When the temperature reaches the preset upper limit, the ceramic temperature switch will disconnect the circuit and stop heating to prevent the temperature from continuing to rise.

[0049] In addition, using aluminum foil material to make a thermal insulation cover outside the chip can reduce heat loss and help the chip reach and remain within the target temperature range faster.

[0050] Through the above process, the chip testing equipment of the utility model successfully applies the DC12V heating wire used for egg incubation heating in agriculture to the field of semiconductor chip testing, optimizes the aluminum foil box used for logistics temperature insulation protection, and applies it to temperature isolation protection for chip testing, upgrading normal temperature testing to high temperature testing. The operation is simple and safe, and only a simple upgrade is required. The advantages of normal temperature testing are retained, and each test port only needs to increase the cost by 1% to upgrade to high temperature testing, thereby improving the accuracy of chip testing, realizing high temperature testing and rapid aging testing, and reducing the defective rate of finished products at the back end. It is suitable for large-scale promotion and application, and has certain advantages.

[0051] The beneficial effects of the present invention include:

[0052] 1. Safety: Using low voltage DC12V for heating is safer and avoids the potential risks brought by high voltage.

[0053] 2. Low power consumption: Only a small temperature difference needs to be compensated to reach the target temperature, so the power consumption is low and more energy-saving.

[0054] 3. Customizable: By adjusting the parameters and layout of the heating wire, the heating effect can be precisely controlled to meet the temperature requirements of different chips or environments.

[0055] 4. Rapid heating: By combining chip self-heating with external heating, the target temperature can be reached faster.

[0056] 5. Low cost: The components used are cheap, and the solution is simple and feasible, so the cost is low.

[0057] The above is a specific description of the preferred implementation of the present invention, but the invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A chip testing device, characterized in that: It includes a heating module, a temperature control module and a tray; The heating module includes a silicone heating wire; the temperature control module includes a ceramic temperature switch; the tray includes a plurality of aluminum foil boxes; the ceramic temperature switch is connected in series with the heating module, and is used to disconnect the heating module when the temperature reaches a set upper limit; the tray includes a normal temperature test state and a high temperature test state, and the tray in the high temperature test state includes an aluminum foil insulation cover; the silicone heating wire is used to adjust the state of the silicone heating wire according to the temperature distribution to perform temperature compensation; the state of the silicone heating wire includes length, layout position and length.

2. The chip testing device according to claim 1, characterized in that: The silicone heating wire is arranged in a bow shape at the bottom of the tray.

3. The chip testing device according to claim 1, characterized in that: The silicone heating wires are arranged in four corners at the bottom of the tray.

4. The chip testing device according to claim 1, characterized in that: When the tray is in a normal temperature test state, the aluminum foil boxes adopt a stepped layout.

5. The chip testing device according to claim 1, characterized in that: The aluminum foil heat-insulating cover is packaged by glass fiber cloth aluminum foil tape.

6. The chip testing device according to claim 1, characterized in that: The heating module adopts an industrial power supply with a power of 400W, a voltage of 12V, and a current of 33A.

7. The chip testing device according to claim 1, characterized in that: The circuits of the heating module and the temperature control module use silicone flat cables.

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