Field effect transistor and electronic equipment

Abstract

The embodiment of the utility model provides a field effect transistor. The field effect transistor comprises a field effect transistor body and a bottom plate, wherein the bottom plate comprises a first side and a second side which are arranged in a manner of deviating from each other along a first direction, and the field effect transistor body is connected to the first side of the bottom plate; the second side of the bottom plate is provided with a bonding pad and a strip-shaped bulge arranged by avoiding the bonding pad, and the bonding pad is used for being connected with a circuit board in a welding manner; the bottom plate comprises a first end and a second end which are oppositely arranged along a second direction, the second direction is perpendicular to the first direction, the strip-shaped bulges extend from the first end to the second end, and the strip-shaped bulges are used for guiding glue. According to the field effect transistor provided by the invention, the strip-shaped bulges are arranged on the bottom plate, so that glue uniformly moves in the gluing process, bubbles are reduced, and the problems that the field effect transistor is unstable in gluing and fixation due to the bubbles and the reliability is reduced are solved.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic components, and specifically relates to a field effect transistor and an electronic device. Background Art

[0002] With the development of science and technology, field effect transistors have been widely used in the field of electronic equipment technology.

[0003] In the production process of electronic equipment, the corresponding field effect tube needs to be welded to the circuit board of the electronic equipment, and then further fixed by gluing. During the gluing and fixing process, glue needs to be injected between the bottom plate of the field effect tube and the circuit board. In this process, due to the difference in the material of the bottom plate of the field effect tube and the surface of the circuit board, the flow rate of glue on the bottom plate of the field effect tube and the surface of the circuit board is different.

[0004] The difference in glue flow rate makes it very easy for bubbles to appear in the glue between the field effect tube base plate and the circuit board surface, resulting in unstable gluing and fixation of the field effect tube and reduced reliability. Utility Model Content

[0005] The present application aims to provide a field effect tube and an electronic device to solve the problem that during the gluing and fixing process of the existing field effect tube, the flow rate of glue on the field effect tube base plate and the circuit board surface is different, bubbles are easily generated, and the gluing and fixing of the field effect tube is unstable and the reliability is reduced.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] In a first aspect, the present application discloses a field effect transistor, which includes: a field effect transistor body and a base plate; wherein the base plate includes a first side and a second side arranged in opposition to each other along a first direction, and the field effect transistor body is connected to the first side of the base plate; a soldering pad and a strip-shaped protrusion arranged away from the soldering pad are arranged on the second side of the base plate, and the soldering pad is used for welding and connecting with a circuit board; the base plate includes a first end and a second end arranged in opposition to each other along a second direction, the second direction is perpendicular to the first direction, the strip-shaped protrusion extends from the first end to the second end, and the strip-shaped protrusion is used to guide glue.

[0008] Optionally, there are a plurality of strip-shaped protrusions, and the plurality of strip-shaped protrusions are arranged at intervals along a third direction, and the third direction intersects with the second direction.

[0009] Optionally, a plurality of the strip-shaped protrusions are arranged in pairs, and a groove is formed between two of the strip-shaped protrusions arranged in a pair, and the groove is used to guide the glue.

[0010] Optionally, the second side of the base plate includes a pad area and a glue flow area arranged on both sides of the pad area along a third direction, and the third direction intersects with the second direction; wherein the pad is arranged in the pad area, and the strip-shaped protrusion is arranged in the glue flow area.

[0011] Optionally, there are multiple strip-shaped protrusions in each of the glue flow areas, and the multiple strip-shaped protrusions are arranged in pairs, and a groove is formed between two of the strip-shaped protrusions arranged in pairs, and the groove is used to guide the glue.

[0012] Optionally, each pad area includes a plurality of pads, and the plurality of pads are arranged at intervals along most of the second directions.

[0013] Optionally, the strip-shaped protrusions are ink protrusions.

[0014] Optionally, a protrusion height of the strip-shaped protrusion is lower than a protrusion height of the pad.

[0015] Optionally, the strip-shaped protrusions are sawtooth-shaped protrusions.

[0016] In a second aspect, the present application further discloses an electronic device, which includes the field effect transistor described in any one of the above items.

[0017] In an embodiment of the present application, a field effect tube is provided, which may at least include a field effect tube body and a base plate, wherein the base plate includes a first side and a second side disposed away from each other in a first direction, the first side is connected to the field effect tube body, and a pad and a strip-shaped protrusion are disposed on the second side, and the strip-shaped protrusion is disposed away from the pad; the pad is used for welding with a circuit board; the base plate includes a first end and a second end disposed away from each other in a second direction, and the strip-shaped protrusion extends from the first end to the second end along the second direction. When installing the field effect tube, the base plate of the field effect tube is first welded and fixed to the corresponding position on the circuit board through the pad, and then glue is applied along the strip-shaped protrusion between the base plate and the circuit board, and the injected glue moves evenly along the strip-shaped protrusion due to the wall climbing effect, thereby reducing the generation of bubbles. The field effect tube provided in the present application is provided with a strip-shaped protrusion on the base plate, so that the glue moves evenly during the gluing process, thereby reducing the generation of bubbles, thereby avoiding the problem that the field effect tube is unstable and fixed due to the generation of bubbles in the glue, and the reliability is reduced.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 is a side view of a bottom plate of a field effect tube described in the present application;

[0021] Figure 2 is a schematic diagram of a base plate of a field effect tube described in the present application;

[0022] Figure 3 is a schematic diagram of a second side of a bottom plate of a field effect tube described in the present application;

[0023] Figure 4 It is a schematic diagram of the second side of the bottom plate of the field effect tube described in the present application without the strip-shaped protrusion installed;

[0024] Figure 5 It is a schematic diagram of adding a strip-shaped protrusion to the second side of the bottom plate of the field effect tube described in this application.

[0025] Figure numerals: 1, bottom plate; 11, first side; 12, second side; 121, pad area; 122, glue flow area; 13, first end; 14, second end; 2, first direction; 3, pad; 4, strip-shaped protrusion; 41, groove; 5, second direction; 6, third direction. DETAILED DESCRIPTION

[0026] The embodiments of the utility model will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0027] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this utility model, unless otherwise specified, "multiple" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] The embodiment of the present application provides at least one of a field effect transistor and an electronic device. The embodiment of the present application may not limit the specific type of the electronic device.

[0031] Reference Figure 1 and Figure 2 , shows a schematic diagram of the base plate of the field effect tube described in the present application, the field effect tube may at least include a field effect tube body and a base plate 1, wherein the base plate 1 at least includes a first side 11 and a second side 12 arranged away from each other along a first direction 2, the first side 11 is used to connect the field effect tube body, the second side 12 is provided with a soldering pad 3 and a strip protrusion 4 arranged away from the soldering pad 3, the soldering pad 3 is used to be welded and connected to the circuit board, the base plate 1 also includes a first end 13 and a second end 14 arranged away from each other along a second direction 5; the second direction 5 is perpendicular to the first direction 2, the strip protrusion 4 extends from the first end 13 to the second end 14 along the second direction 5, and the strip protrusion 14 is used to guide the glue.

[0032] In an embodiment of the present application, a field effect tube is provided, which may at least include a field effect tube body and a bottom plate 1, the bottom plate 1 includes a first side 11 and a second side 12 arranged away from each other along a first direction 2, the first side 11 is connected to the field effect tube body, a pad 3 and a strip protrusion 4 are arranged on the second side 12, and the strip protrusion 4 is arranged away from the pad 3; the pad 3 is used for welding with a circuit board; the bottom plate 1 also includes a first end 13 and a second end 14 away from each other along a second direction 5, and the strip protrusion 4 extends from the first end 13 to the second end 14 along the second direction 5. Specifically, when installing the field effect tube, the field effect tube bottom plate 1 is first welded and fixed to the corresponding position on the circuit board through the pad 3, and then glue is applied along the strip protrusion 4 between the bottom plate 1 and the circuit board, and the injected glue moves evenly along the strip protrusion 4 between the bottom plate 1 and the circuit board due to the wall climbing effect, thereby reducing the generation of bubbles during the glue application process.

[0033] The field effect tube provided in the present application is provided with a strip protrusion 4 on the base plate 1, so that the glue moves evenly along the strip protrusion 4 during the gluing process, thereby reducing the generation of bubbles, thereby avoiding the problem of unstable gluing and reduced reliability of the field effect tube due to bubbles generated in the glue.

[0034] Optionally, there are multiple strip-shaped protrusions 4 described in the present application, and the multiple strip-shaped protrusions 4 are arranged at intervals along the third direction 6, and the third direction 6 intersects with the second direction 5. Preferably, the third direction 6 and the second direction 5 can be perpendicular.

[0035] In the embodiment of the present application, the number of the strip protrusions 4 on the bottom plate 1 is multiple, and the multiple strip protrusions 4 are arranged at intervals on the second side 12 along the third direction 6. The field effect tube provided in the present application has multiple strip protrusions 4 arranged at intervals on the bottom plate. In a specific application, the multiple strip protrusions 4 are used to realize that during the gluing process of the field effect tube, the glue moves along the strip protrusions 4 between the bottom plate 1 and the circuit board, thereby improving the gluing stability of the field effect tube on the circuit board.

[0036] Optionally, the multiple strip-shaped protrusions 4 described in the present application are arranged in pairs, and a groove 41 is formed between two strip-shaped protrusions 4 arranged in a pair, and the groove 41 is used to guide the glue.

[0037] In the embodiment of the present application, a plurality of strip-shaped protrusions 4 are arranged in pairs to form grooves 41, and the grooves 41 are used to guide the glue. Specifically, when installing the field effect tube, the field effect tube base plate 1 is first welded and fixed to the corresponding position on the circuit board through the pad 3, and then the grooves 41 are glued between the base plate 1 and the circuit board, and the injected glue moves along the grooves 41 between the base plate 1 and the circuit board. Since the field effect tube provided in the present application forms the grooves 41 through the strip-shaped protrusions 4, the injected glue moves along the grooves 41 during the gluing process, avoiding the different flow rates of the glue on the side close to the strip-shaped protrusions 4 and the side away from the strip-shaped protrusions 4, thereby further reducing the generation of bubbles during the gluing process, and improving the stability and reliability of the gluing and fixing of the field effect tube.

[0038] Optionally, the second side 12 of the base plate 1 described in the present application includes a solder pad area 121 and a glue flow area 122 arranged on both sides of the solder pad area 121 along a third direction 6, and the third direction 6 is perpendicular to the second direction 5; wherein the solder pad 3 is arranged in the solder pad area 121, and the strip-shaped protrusion 4 is arranged in the glue flow area 122.

[0039] In the embodiment of the present application, the second side 12 of the bottom plate 1 may include a pad area 121 and a glue flow area 122, the glue flow area 122 is arranged on both sides of the pad area 121 along the third direction 6, and the third direction 6 is perpendicular to the second direction 5; the pad 3 is arranged in the pad area 121, and the strip-shaped protrusion 4 is arranged in the glue flow area 122. In the present application, the pad area 121 and the glue flow area 122 are arranged on the second side 12, and the pad 3 and the strip-shaped protrusion 4 are divided into different areas, which is convenient for welding and gluing operations on the field effect tube.

[0040] Optionally, the number of the strip-shaped protrusions 4 in the glue flow area 122 described in the present application is multiple, and the multiple strip-shaped protrusions 4 are arranged in pairs, and a groove 41 is formed between two strip-shaped protrusions 4 arranged in pairs, and the groove 41 is used to guide the glue.

[0041] In the embodiment of the present application, the number of the strip-shaped protrusions 4 in the glue flow area 122 is multiple, and the multiple strip-shaped protrusions 4 are arranged in pairs, and a groove 41 is formed between the two strip-shaped protrusions 4 arranged in pairs, and the groove 41 is used to guide the glue. Specifically, the groove 41 is formed by arranging the multiple strip-shaped protrusions 4 in pairs. During the installation of the field effect tube, the pad 3 is first welded to the circuit board, and then the groove 41 is injected with glue. The glue moves along the groove 41, so that the flow rate of the glue during movement is more uniform, thereby further reducing the generation of bubbles during the gluing process, and improving the stability and reliability of the gluing and fixing of the field effect tube.

[0042] Optionally, each pad area 121 described in the present application may include a plurality of pads 3 , and the plurality of pads 3 are arranged at intervals along the second direction 5 .

[0043] In the embodiment of the present application, a plurality of pads 3 are disposed in each pad area 121, and the pads 3 are disposed at intervals along the second direction 5. The plurality of pads 3 disposed at intervals make the field effect tube more stable during the installation and welding process.

[0044] Optionally, the strip-shaped protrusions 4 described in the present application are ink protrusions.

[0045] In the embodiment of the present application, the strip-shaped protrusion 4 made of ink material can be the same as the ink material on the surface of the circuit board. By using the same material, the flow rate of the glue when moving along the strip-shaped protrusion 4 is the same as the flow rate of the glue when moving on the surface of the circuit board, thereby further reducing the generation of bubbles and improving the stability and reliability of the gluing of the field effect tube installation.

[0046] Specifically, in the process of manufacturing the field effect tube provided in the present application, the bottom plate pad can be first manufactured according to the traditional process, such as Figure 4 As shown; then the ink is attached to the surface of the second side 12 of the bottom plate 1 by any method of spraying, screen printing or 3D printing, and then cured by baking to form strip-shaped protrusions, such as Figure 5 shown.

[0047] Optionally, the protrusion height of the strip-shaped protrusion 4 described in the present application is lower than the protrusion height of the pad 3 .

[0048] In the embodiment of the present application, the protrusion height of the strip-shaped protrusion 4 is lower than the protrusion height of the pad 3, so as to avoid the decrease in the stability of the soldering connection between the pad 3 and the circuit board due to the strip-shaped protrusion 4 contacting the surface of the circuit board during the soldering connection between the pad 3 and the circuit board. Specifically, the protrusion height of the strip-shaped protrusion 4 can be set to be between 0.001 mm and 0.005 mm lower than the protrusion height of the pad 3.

[0049] It should be noted that, in a specific application, those skilled in the art can select the protrusion height of the strip protrusion 4 and the protrusion height of the pad 3 according to actual production needs, and this is not specifically limited in the present application.

[0050] Optionally, the strip-shaped protrusions 4 described in the present application are sawtooth-shaped protrusions.

[0051] In an embodiment of the present application, the strip-shaped protrusion 4 can be set as a serrated protrusion. Specifically, the top of the strip-shaped protrusion 4 in the first direction 2 can be set as a serrated protrusion. The serrated strip-shaped protrusion 4 forms a height difference, thereby enhancing the wall climbing effect of the glue, further reducing the generation of bubbles during the gluing process, and avoiding the problem of unstable gluing and reduced reliability of the field effect tube due to bubbles generated in the glue.

[0052] In another aspect, the present application also provides an electronic device, the electronic device includes any of the above-mentioned field effect tubes. It should be noted that in the embodiments of the present application, the specific structure of the field effect tube is the same as the structure of the field effect tube in the above-mentioned embodiments, and its beneficial effects are similar, which will not be described in detail here. In the embodiments of the present application, the electronic device provided avoids the problem of unstable gluing and reduced reliability of the field effect tube due to bubbles.

[0053] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0054] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A field effect transistor, characterized in that: The field effect tube comprises: a field effect tube body and a bottom plate (1); wherein: The base plate (1) comprises a first side (11) and a second side (12) which are arranged in opposite directions along a first direction (2), and the field effect transistor body is connected to the first side (11) of the base plate (1); The second side (12) of the base plate (1) is provided with a soldering pad (3) and a strip-shaped protrusion (4) arranged away from the soldering pad (3), wherein the soldering pad (3) is used for being connected to the circuit board by welding; the base plate (1) comprises a first end (13) and a second end (14) arranged in opposite directions along a second direction (5), wherein the second direction (5) is perpendicular to the first direction (2), and the strip-shaped protrusion (4) extends from the first end (13) to the second end (14), and the strip-shaped protrusion (4) is used for guiding glue.

2. The field effect transistor according to claim 1, characterized in that: There are a plurality of strip-shaped protrusions (4), and the plurality of strip-shaped protrusions (4) are arranged at intervals along a third direction (6), and the third direction (6) intersects with the second direction (5).

3. The field effect transistor according to claim 2, characterized in that: The plurality of strip-shaped protrusions (4) are arranged in pairs, and a groove (41) is formed between two of the strip-shaped protrusions (4) arranged in pairs, and the groove (41) is used to guide the glue.

4. The field effect transistor according to claim 1, characterized in that: The second side (12) of the base plate (1) comprises a pad area (121) and glue flow areas (122) arranged on both sides of the pad area (121) along a third direction (6), and the third direction (6) intersects with the second direction (5); wherein: The pad (3) is arranged in the pad area (121), and the strip-shaped protrusion (4) is arranged in the glue flow area (122).

5. The field effect transistor according to claim 4, characterized in that: The number of the strip-shaped protrusions (4) in each of the glue flow areas (122) is multiple, and the multiple strip-shaped protrusions (4) are arranged in pairs, and a groove (41) is formed between the two strip-shaped protrusions (4) arranged in pairs, and the groove (41) is used to guide the glue.

6. The field effect transistor according to claim 5, characterized in that: The number of the pads (3) in each pad area (121) is multiple, and the multiple pads (3) are arranged at intervals along most of the second directions (5).

7. The field effect transistor according to claim 1, characterized in that: The strip-shaped protrusions (4) are ink protrusions.

8. The field effect transistor according to claim 1, characterized in that: The protrusion height of the strip-shaped protrusion (4) is lower than the protrusion height of the pad (3).

9. The field effect transistor according to any one of claims 1 to 8, characterized in that: The strip-shaped protrusions (4) are sawtooth-shaped protrusions.

10. An electronic device, characterized in that: The electronic device comprises the field effect transistor according to any one of claims 1 to 9.

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