Laser structure

Abstract

The utility model discloses a laser structure, relates to the optical fiber communication technology field, the laser structure comprises a laser, a refrigerator, a heat sink and a lens, the refrigerator is arranged between the laser and the heat sink, the laser is pasted on one side of the refrigerator departing from the heat sink, the heat sink is bonded on one side of the refrigerator departing from the laser, and the lens is arranged on the side of the refrigerator departing from the laser. In this way, the laser can be optically coupled with the lens. According to the technical scheme of the utility model, the laser is mounted on the upper surface of the refrigerator, the heat sink is adhered to the lower surface of the laser, the heat sinks with different thicknesses are utilized to adapt to the optical coupling heights of lasers and lenses with different batches and sizes, the thickness size of the heat sink can be adjusted according to actual requirements, the design is flexible and convenient, and the cost is low. The structure for adjusting the height of the laser is effectively simplified, the overall process assembly is simpler, the total heat conduction resistance is reduced, the heat conduction speed is higher, the production cost is effectively reduced, and the single-mode optical module is suitable for all single-mode optical module products applying refrigerators.

Description

Technical Field

[0001] The utility model relates to the technical field of optical fiber communication, in particular to a laser structure. Background Art

[0002] At present, the sizes of incoming laser materials are different due to processing in different batches. In order to achieve optical coupling between the laser and the lens, the height of the laser needs to be continuously adjusted until the laser can be adapted to optical coupling with the lens. However, the existing laser height adjustment structure is complex, the total thermal resistance is large, the overall process assembly is complex, and the cost is high.

[0003] Therefore, how to simplify the structure of laser height adjustment is a problem that needs to be solved urgently. Utility Model Content

[0004] The main purpose of the utility model is to provide a laser structure, aiming to solve the problem of how to simplify the structure of laser height adjustment.

[0005] To achieve the above-mentioned purpose, the utility model proposes a laser structure, which includes a laser, a refrigerator, a heat sink and a lens, wherein the refrigerator is located between the laser and the heat sink, the laser is mounted on a side of the refrigerator away from the heat sink, and the heat sink is bonded to a side of the refrigerator away from the laser, so that the laser can be optically coupled with the lens.

[0006] In one embodiment, the laser structure further includes a PCBA board, the lens is connected to the PCBA board, and the laser is electrically connected to the PCBA board.

[0007] In one embodiment, a through hole is provided on the PCBA board, and the heat sink, the cooler and the laser are all arranged in the through hole.

[0008] In one embodiment, the laser structure further includes a housing having an installation cavity, the laser, the refrigerator, the heat sink, the lens and the PCBA board are all arranged in the installation cavity, and the heat sink is connected to the cavity wall of the installation cavity.

[0009] In one implementation, the heat sink is connected to the cavity wall of the mounting cavity via a first conductive silver paste layer.

[0010] In one implementation, the lens is connected to the PCBA board via a glue layer.

[0011] In one implementation, the laser is connected to the PCBA board via a gold wire.

[0012] In one embodiment, the heat sink comprises a tungsten copper heat sink.

[0013] In one embodiment, the laser is connected to the upper surface of the refrigerator via a second conductive silver paste layer.

[0014] In one embodiment, the heat sink is connected to the lower surface of the refrigerator via a third conductive silver paste layer.

[0015] In an embodiment of the utility model, the laser is mounted on the upper surface of the refrigerator, and the cooling is used to provide high-temperature cooling and low-temperature heating to the laser, so that the laser can maintain a constant temperature; due to process manufacturing reasons, the sizes of lasers from different batches are different, while the position and height of the lens remain fixed. In order to achieve optical coupling between the laser and the lens, the position of the laser is adjusted by bonding a heat sink to the lower surface of the refrigerator to change the height of the refrigerator until the laser moves to optically couple with the lens. The thickness of the heat sink can be adjusted according to actual needs, and the design is flexible and convenient. The use of a heat sink can also increase the heat conduction rate on the laser conduction path, effectively ensuring the constant temperature of the laser structure. The embodiment of the utility model mounts the laser on the upper surface of the refrigerator and adheres the heat sink to the lower surface of the laser, and uses heat sinks of different thicknesses to adapt to the optical coupling height of lasers and lenses of different batch sizes. The thickness of the heat sink can be adjusted according to actual needs, and the design is flexible and convenient. Compared with the existing structure, there is no need to set an alumina ceramic pad between the laser and the refrigerator, and to set a heat sink under the refrigerator. The height of the laser optical coupling is adapted by adjusting the thickness of the alumina ceramic pad, which effectively simplifies the structure of adjusting the height of the laser, makes the overall process assembly simpler, reduces the overall thermal resistance, and increases the heat conduction speed. It also effectively reduces the production cost and is suitable for all single-mode optical module products using refrigerators. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the laser structure of the utility model;

[0018] Figure 2 This is a schematic structural diagram from another perspective of an embodiment of the laser structure of the utility model.

[0019] Description of Figure Numbers:

[0020] 100. Laser structure; 1. Laser; 2. Cooler; 3. Heat sink; 4. Lens; 5. PCBA board; 51. Through hole; 6. Housing; 61. Mounting cavity; 7. First conductive silver glue layer; 8. Glue layer; 9. Gold wire; 10. Second conductive silver glue layer; 11. Third conductive silver glue layer.

[0021] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, and back), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0025] At present, the sizes of incoming laser materials are different due to processing in different batches. In order to achieve optical coupling between the laser and the lens, the height of the laser needs to be continuously adjusted until the laser can be adapted to optical coupling with the lens. However, the existing laser height adjustment structure is complex, the total thermal resistance is large, the overall process assembly is complex, and the cost is high.

[0026] The main purpose of the utility model is to provide a laser structure, aiming to solve the problem of how to simplify the structure of laser height adjustment.

[0027] See also Figure 1 and Figure 2 In one embodiment of the utility model, the laser structure 100 includes a laser 1, a refrigerator 2, a heat sink 3 and a lens 4. The refrigerator 2 is located between the laser 1 and the heat sink 3. The laser 1 is mounted on a side of the refrigerator 2 away from the heat sink 3. The heat sink 3 is bonded to a side of the refrigerator 2 away from the laser 1, so that the laser 1 can be optically coupled with the lens 4.

[0028] In the embodiment of the utility model, the laser 1 is mounted on the upper surface of the refrigerator 2, and the refrigerator 2 is used to cool the laser 1 at high temperature or heat the laser 1 at low temperature, so that the laser 1 can maintain a constant temperature; due to process manufacturing reasons, the sizes of lasers 1 in different batches are different, while the position and height of the lens 4 remain fixed. In order to achieve optical coupling between the laser 1 and the lens 4, the position of the laser 1 is adjusted by bonding the heat sink 3 to the lower surface of the refrigerator 2 to change the height of the refrigerator 2 until the laser 1 moves to optically couple with the lens 4. The thickness of the heat sink 3 can be adjusted according to actual needs, and the design is flexible and convenient. The use of the heat sink 3 can also increase the heat conduction speed on the conduction path of the laser 1, effectively ensuring the constant temperature of the laser structure 100.

[0029] The technical solution of the utility model is to mount the laser 1 on the upper surface of the refrigerator 2, adhere the heat sink 3 to the lower surface of the laser 1, and use the heat sinks 3 of different thicknesses to adapt the optical coupling height of the lasers 1 and the lenses 4 of different batch sizes. The thickness of the heat sink 3 can be adjusted according to actual needs, and the design is flexible and convenient. Compared with the existing structure, there is no need to set an alumina ceramic pad between the laser 1 and the refrigerator 2, and to set the heat sink 3 under the refrigerator 2. The height of the optical coupling of the laser 1 is adapted by adjusting the thickness of the alumina ceramic pad, which effectively simplifies the structure of adjusting the height of the laser 1, makes the overall process assembly simpler, reduces the overall thermal resistance, and increases the heat conduction speed. It also effectively reduces the production cost, and is suitable for all single-mode optical module products using the refrigerator 2.

[0030] In this embodiment, the thickness of the refrigerator 2 can be designed with the minimum size, and the thickness of the heat sink 3 is designed with a larger size accordingly, which can not only reduce the total thermal resistance on the conduction path of the laser 1, but also make the heat conduction speed faster.

[0031] In one embodiment, the laser structure 100 further includes a PCBA board 5, the lens 4 is connected to the PCBA board 5, and the laser 1 is electrically connected to the PCBA board 5; specifically, the lens 4 is connected to the PCBA board 5 so that the position and height of the lens 4 remain fixed, and the laser 1 is electrically connected to the PCBA board 5 so that the laser 1 can emit light.

[0032] In one embodiment, a through hole 51 is provided on the PCBA board 5, and the heat sink 3, the refrigerator 2 and the laser 1 are all arranged in the through hole 51; specifically, in order to realize the installation of the laser structure 100, the heat sink 3, the refrigerator 2 and the laser 1 are all arranged in the through hole 51 on the PCBA board 5, and the shape of the through hole 51 can be rectangular, triangular or other irregular shapes, which is not limited in this embodiment; and the heat sink 3 can be designed with corresponding special shapes according to the shapes of different through holes 51, while the alumina ceramic pad in the existing structure is usually a rectangular structure, which is not convenient to make corresponding adjustments according to the shape of the through hole 51. The heat sink 3 is used to adjust the height of the optical coupling of the laser 1, so that the application range of the laser structure 100 is wider.

[0033] In one embodiment, the laser structure 100 also includes a housing 6, the housing 6 has an installation cavity 61, the laser 1, the refrigerator 2, the heat sink 3, the lens 4 and the PCBA board 5 are all arranged in the installation cavity 61, and the heat sink 3 is connected to the cavity wall of the installation cavity 61; specifically, when the temperature of the laser 1 is too high, the heat on the laser 1 is discharged from the laser structure 100 through the refrigerator 2, the heat sink 3 and the housing 6 in turn, and when the temperature of the laser 1 is too low, the refrigerator 2 transfers the heat to the laser 1, so that the temperature of the laser 1 remains constant.

[0034] In one embodiment, the heat sink 3 is connected to the cavity wall of the mounting cavity 61 through a first conductive silver adhesive layer 7; specifically, the first conductive silver adhesive layer 7 has the characteristics of high bonding strength, excellent conductivity, low resistance and high temperature resistance, which can meet the requirements of electrical conduction, thermal conduction and bonding between the heat sink 3 and the housing 6, and the process of the first conductive silver adhesive layer 7 is simple, easy to operate, and can effectively improve production efficiency.

[0035] In one embodiment, the lens 4 is connected to the PCBA board 5 through a glue layer 8; specifically, by providing the glue layer 8, the lens 4 and the PCBA board 5 can be installed and fixed, and the glue layer 8 has a simple process, stable bonding, and is easy to operate, which can effectively improve production efficiency.

[0036] In one embodiment, the laser 1 is connected to the PCBA board 5 via a gold wire 9; specifically, the gold wire 9 is provided to achieve electrical connection between the laser 1 and the PCBA board 5, so that the laser 1 can emit light. In this embodiment, the length of the gold wire 9 is not limited, and the length of the gold wire 9 can be adjusted accordingly according to lasers 1 of different batch sizes and heat sinks 3 of different thicknesses, so that lasers 1 of different batch sizes can all be electrically connected to the PCBA.

[0037] In one embodiment, the heat sink 3 includes a tungsten copper heat sink; specifically, the tungsten copper heat sink has excellent chemical stability, excellent electrical and thermal conductivity, and a low thermal expansion coefficient, and can maintain good performance in harsh environments such as high temperature and high pressure, effectively reducing the total thermal resistance on the conduction path of the laser 1 and making the heat conduction speed faster.

[0038] In one embodiment, the laser 1 is connected to the upper surface of the refrigerator 2 through a second conductive silver glue layer 10; specifically, the second conductive silver glue layer 10 has the characteristics of high bonding strength, excellent conductivity, low resistance and high temperature resistance, which can meet the electrical conductivity, thermal conductivity and bonding requirements between the laser 1 and the refrigerator 2, and the second conductive silver glue layer 10 has a simple process and is easy to operate, which can effectively improve production efficiency.

[0039] In one embodiment, the heat sink 3 is connected to the lower surface of the refrigerator 2 through a third conductive silver glue layer 11; specifically, the third conductive silver glue layer 11 has the characteristics of high bonding strength, excellent conductivity, low resistance and high temperature resistance, which can meet the electrical conductivity, thermal conductivity and bonding requirements between the heat sink 3 and the refrigerator 2, and the process of the third conductive silver glue layer 11 is simple, easy to operate, and can effectively improve production efficiency.

[0040] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A laser structure, characterized in that: The laser structure includes a laser, a cooler, a heat sink and a lens. The cooler is located between the laser and the heat sink. The laser is mounted on a side of the cooler away from the heat sink. The heat sink is bonded to a side of the cooler away from the laser, so that the laser can be optically coupled to the lens.

2. The laser structure according to claim 1, characterized in that The laser structure further comprises a PCBA board, the lens is connected to the PCBA board, and the laser is electrically connected to the PCBA board.

3. The laser structure according to claim 2, characterized in that: The PCBA board is provided with a through hole, and the heat sink, the cooler and the laser are all arranged in the through hole.

4. The laser structure according to claim 3, characterized in that: The laser structure also includes a housing having a mounting cavity, the laser, the refrigerator, the heat sink, the lens and the PCBA board are all arranged in the mounting cavity, and the heat sink is connected to a cavity wall of the mounting cavity.

5. The laser structure according to claim 4, characterized in that: The heat sink is connected to the cavity wall of the mounting cavity through a first conductive silver glue layer.

6. The laser structure according to claim 2, characterized in that: The lens is connected to the PCBA board through a glue layer.

7. The laser structure according to claim 2, characterized in that: The laser is connected to the PCBA board via a gold wire.

8. The laser structure according to any one of claims 1 to 7, characterized in that: The heat sink comprises a tungsten copper heat sink.

9. The laser structure according to any one of claims 1 to 7, characterized in that: The laser is connected to the upper surface of the refrigerator through a second conductive silver glue layer.

10. The laser structure according to any one of claims 1 to 7, characterized in that: The heat sink is connected to the lower surface of the refrigerator through a third conductive silver glue layer.

Images