Loop heat pipe type chip water-cooling heat dissipation system applied to server

Abstract

The utility model relates to a loop heat pipe type chip water-cooling heat dissipation system applied to a server in the technical field of heat dissipation of data centers. The loop heat pipe type chip water-cooling heat dissipation system comprises N loop heat pipes, a water collector, a water segregator, a water pump, a cooling tower, N cooling water inlet pipelines, N cooling water outlet pipelines, a water collector water outlet pipeline and a water segregator water inlet pipeline. The loop heat pipe comprises an evaporator, a heat exchanger, a steam pipeline, a liquid pipeline, a first quick connector and a second quick connector. The water collector comprises N first water inlets and at least one first water outlet; the water segregator comprises a second water inlet and at least one N second water outlets; the cooling tower comprises a third water inlet and a third water outlet. According to the utility model, the N chips of the cabinet in the data center are cooled through the N two-phase backflow loop heat pipes, so that the heat dissipation performance is higher, more energy is saved, the PUE value of the data center is low, and the construction cost is low because the loop heat pipes perform indirect heat dissipation and do not have extra requirements on a server.

Description

Technical Field

[0001] The utility model relates to the technical field of data center heat dissipation, and in particular to a loop heat pipe chip water cooling heat dissipation system applied to a server. Background Art

[0002] Data centers are the infrastructure in information construction. With the advancement and development of science and technology, the computing power required for information construction is also increasing rapidly, which makes the amount of data computing that data centers need to undertake continue to soar. At the same time, AI computing power has also put forward higher requirements on the cooling system of data centers, and the cooling demand of data centers is also surging.

[0003] According to statistics, the computing power of global computing devices in 2021 is 615EFlops, and it is expected to reach 56,000 / 52,500EFlops by 2030. The growth rates in ten years are 90 times and 226 times respectively. Faced with the explosive growth rate of computing power, liquid cooling has become the mainstream choice for data centers due to its unique advantages.

[0004] At present, the liquid cooling technology used in data center servers can be divided into three categories: cold plate, spray and immersion liquid cooling technology. According to the different contact methods, liquid cooling technology can be divided into direct contact and indirect contact. The most common indirect contact liquid cooling technology is cold plate liquid cooling technology, and the most common direct contact liquid cooling technology is immersion liquid cooling technology. However, the heat dissipation capacity of current technology still cannot keep up with the continuous innovation of chips, and the immersion liquid cooling system has higher requirements for servers and is expensive. The cold plate liquid cooling technology is a single-phase flow, and the circulating water flow required to dissipate the large heat in the data center is large. Correspondingly, the power consumption of the circulating water pump and the cooling tower is high, and the energy efficiency index PUE of the data center is relatively high.

[0005] Therefore, the market urgently needs a technical solution that can solve the shortcomings of traditional liquid cooling technology. Summary of the invention

[0006] In order to solve the above technical problems, the utility model discloses a loop heat pipe chip water cooling system applied to a server. The technical solution of the utility model is implemented as follows:

[0007] A loop heat pipe chip water cooling and heat dissipation system applied to a server comprises N loop heat pipes, a water collector, a water distributor, a water pump, a cooling tower, N cooling water inlet pipelines, N cooling water outlet pipelines, a water collector outlet pipeline and a water distributor inlet pipeline.

[0008] The loop heat pipe comprises an evaporator, a heat exchanger, a steam pipeline, a liquid pipeline, a first quick connector and a second quick connector;

[0009] The evaporator is connected to the heat exchanger through the steam pipeline and the liquid pipeline, and the first quick connector and the second quick connector are arranged on one side of the heat exchanger;

[0010] The water collector comprises N first water inlets and at least one first water outlet;

[0011] The water distributor comprises at least one second water inlet and N second water outlets;

[0012] The cooling tower comprises a third water inlet and a third water outlet;

[0013] The N cooling water outlet pipes are respectively connected to the N first water inlets and the N second quick connectors, the N cooling water inlet pipes are respectively connected to the N second water outlets and the N first quick connectors, the collector outlet pipe is connected to the first water outlet and the third water inlet, the water distributor inlet pipe is connected to the second water inlet and the third water outlet, and the water pump is installed on the collector outlet pipe and connected to the cooling tower.

[0014] Preferably, the evaporator is a flat-plate evaporator, and the heat exchanger is a plate heat exchanger.

[0015] Preferably, the evaporator comprises a bottom shell, a liquid reservoir shell, a capillary wick, a steam pipeline connecting pipe and a liquid pipeline connecting pipe;

[0016] The capillary core is arranged in the bottom shell, the liquid reservoir shell seals the bottom shell, the steam pipeline connecting pipe is arranged on one side of the bottom shell, and the liquid pipeline connecting pipe is arranged on one side of the liquid reservoir shell.

[0017] Preferably, the bottom shell includes a bottom groove, a plurality of bottom bosses are provided in the bottom groove, and a steam pipeline interface for connecting the steam pipeline connecting pipe is provided on one side of the bottom shell.

[0018] Preferably, a porous metal powder layer is sintered on the bottom groove and the bottom boss.

[0019] Preferably, the porous metal powder in the porous metal powder layer is copper powder, the thickness of the porous metal powder layer is 0.4 mm-0.6 mm, and the mesh size of the porous metal powder is 300-1000 mesh.

[0020] Preferably, the capillary core is a nickel sintered porous material, the porosity of the capillary core is greater than 70%, the pore size is less than 50 μm, and the equivalent thermal conductivity is less than 5 W / (mK).

[0021] Preferably, the heat exchanger comprises a primary side inlet, a primary side outlet, a secondary side inlet and a secondary side outlet;

[0022] The steam pipeline connects the steam pipeline connecting pipe and the primary side inlet, the liquid pipeline connects the liquid pipeline connecting pipe and the primary side outlet, the secondary side inlet is connected to the first quick connector, and the secondary side outlet is connected to the second quick connector.

[0023] Preferably, the liquid reservoir housing, the steam pipeline connecting pipe, the steam pipeline, and the liquid pipeline are all made of stainless steel.

[0024] Preferably, the bottom surface of the reservoir housing is processed with sealing teeth.

[0025] Preferably, the working medium in the loop heat pipe is water.

[0026] The utility model has the following advantages:

[0027] 1. Compared with the traditional single-phase cold plate water cooling system, the two-phase reflux loop heat pipe chip cooling system has higher heat dissipation performance;

[0028] 2. The traditional single-phase cold plate water cooling system requires a larger amount of circulating water, and the water pump cooling tower consumes a lot of power and water; while the loop heat pipe chip cooling system is more energy-efficient and has a low PUE value for the data center;

[0029] 3. Compared with the traditional immersion liquid cooling system, the loop heat pipe chip cooling system is an indirect cooling system, has no additional requirements for the server, and has low construction cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only one embodiment of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] The same parts are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "bottom" and "top", "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0032] Figure 1 The structure diagram of an embodiment of a loop heat pipe chip water cooling system applied to a server is shown in FIG. Figure 1 A and B are the air inlets of the cooling tower, and C and D are the air outlets of the cooling tower;

[0033] Figure 2It is a schematic diagram of the structure of a loop heat pipe in an embodiment of a loop heat pipe chip water cooling and heat dissipation system applied to a server;

[0034] Figure 3 It is a structural cross-sectional view of an evaporator in an embodiment of a loop heat pipe chip water cooling and heat dissipation system applied to a server;

[0035] Figure 4 It is a structural schematic diagram of a bottom shell in an embodiment of a loop heat pipe chip water cooling and heat dissipation system applied to a server;

[0036] Figure 5 The diagram is a structural diagram of a plate heat exchanger in an embodiment of a loop heat pipe chip water cooling system applied to a server.

[0037] In the above drawings, the figure numbers represent:

[0038] 1. Loop heat pipe;

[0039] 1-1, flat plate evaporator;

[0040] 1-1-1, bottom shell;

[0041] 1-1-1-1, bottom groove;

[0042] 1-1-1-2, bottom boss;

[0043] 1-1-1-3, steam pipeline interface;

[0044] 1-1-2, liquid reservoir housing;

[0045] 1-1-2-1, sealing teeth;

[0046] 1-1-3, capillary wick;

[0047] 1-1-4, connect the steam pipeline;

[0048] 1-1-5, connect the liquid pipeline;

[0049] 1-2, Plate heat exchanger;

[0050] 1-2-1, primary side inlet;

[0051] 1-2-2, primary side outlet;

[0052] 1-2-3, secondary side inlet;

[0053] 1-2-4, secondary side outlet;

[0054] 1-3, steam pipeline;

[0055] 1-4. Liquid pipeline;

[0056] 1-5, first quick connector;

[0057] 1-6, second quick connector;

[0058] 2. Water collector;

[0059] 2-1, the first water inlet;

[0060] 2-2, first water outlet;

[0061] 3. Water distributor;

[0062] 3-1, the second water inlet;

[0063] 3-2, the second water outlet;

[0064] 4. Water pump;

[0065] 5. Cooling tower;

[0066] 5-1, the third water inlet;

[0067] 5-2, the third water outlet;

[0068] 6. Cooling water inlet pipeline;

[0069] 7. Cooling water outlet pipeline;

[0070] 8. Water outlet pipe of water collector;

[0071] 9. Water inlet pipeline of water distributor;

[0072] 10. Cabinet. DETAILED DESCRIPTION

[0073] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0074] Example

[0075] In a specific embodiment, Figure 1As shown, a loop heat pipe chip water cooling and heat dissipation system applied to a server includes four loop heat pipes 1, a water collector 2, a water distributor 3, a water pump 4, a cooling tower 5, four cooling water inlet pipes 6, four cooling water outlet pipes 7, a water collector outlet pipe 8 and a water distributor inlet pipe 9. The cabinet 10 of the data center corresponding to this embodiment includes four chips, so four sets of loop heat pipes 1 are required. In actual applications, the number of loop heat pipes 1 can be increased or decreased according to the number of chips in the cabinet 10.

[0076] In this embodiment, four loop heat pipes 1 are installed in a cabinet 10 of a data center, each loop heat pipe 1 corresponds to a chip, and a water collector 2 and a water distributor 3 are installed on the cabinet 10 .

[0077] like Figure 2 As shown, the loop heat pipe 1 includes a flat plate evaporator 1-1, a plate heat exchanger 1-2, a steam pipeline 1-3, a liquid pipeline 1-4, a first quick connector 1-5 and a second quick connector 1-6.

[0078] The water collector 2 includes four first water inlets 2-1 and one first water outlet 2-2.

[0079] The water distributor 3 includes one second water inlet 3 - 1 and four second water outlets 3 - 2 .

[0080] The cooling tower 5 includes a third water inlet 5-1 and a third water outlet 5-2.

[0081] The cooling water inlet pipeline 6 and the cooling water outlet pipeline 7 are flexible pipelines.

[0082] The four cooling water outlet pipes 7 are respectively connected to the four first water inlets 2-1 and the four second quick connectors 1-6, the four cooling water inlet pipes 6 are respectively connected to the four second water outlets 3-2 and the four first quick connectors 1-5, the collector outlet pipe 8 is connected to the first water outlet 2-2 and the third water inlet 5-1, the water distributor inlet pipe 9 is connected to the second water inlet 3-1 and the third water outlet 5-2, and the water pump 4 is installed on the collector outlet pipe 8 and is located between the cabinet 10 and the cooling tower 5.

[0083] like Figure 3 As shown, the flat plate evaporator 1-1 includes a bottom shell 1-1-1, a liquid storage shell 1-1-2, a capillary wick 1-1-3, a steam pipeline connecting pipe 1-1-4 and a liquid pipeline connecting pipe 1-1-5.

[0084] like Figure 4As shown, the material of the bottom shell 1-1-1 is copper, and the bottom shell 1-1-1 includes a bottom groove 1-1-1-1, and a plurality of bottom bosses 1-1-1-2 are machined on the bottom groove 1-1-1-1. A layer of copper powder with a thickness of about 0.5 mm is sintered on the bottom groove 1-1-1-1 and the bottom boss 1-1-1-2 (the copper powder layer is not marked in the figure), and the mesh number of the copper powder is 300 to 1000 meshes. A steam pipe interface 1-1-1-3 is opened on one side of the bottom shell 1-1-1.

[0085] The material of the liquid reservoir shell 1-1-2 is stainless steel, a circle of sealing teeth 1-1-2-1 is machined on the bottom surface of the liquid reservoir shell 1-1-2, and a liquid pipeline connecting pipe 1-1-5 is arranged on one side of the liquid reservoir shell 1-1-2.

[0086] The capillary core 1-1-3 is a nickel sintered porous material with a porosity greater than 70%, a pore size less than 50 μm, and an equivalent thermal conductivity less than 5 W / (mK).

[0087] The material of the steam pipeline connecting pipe 1-1-4 is stainless steel, and the steam pipeline connecting pipe 1-1-4 is brazed and connected to the bottom shell 1-1-1 through the steam pipeline interface 1-1-1-3.

[0088] The capillary core 1-1-3 is assembled into the bottom shell 1-1-1, and the liquid reservoir shell 1-1-2 is covered and pressed tightly. Since the hardness of the porous material capillary core 1-1-3 is much lower than that of stainless steel, the sealing teeth 1-1-2-1 are pressed into the capillary core 1-1-3 to seal the flat evaporator 1-1, so as to prevent the steam generated at the bottom of the flat evaporator 1-1 from entering the liquid reservoir cavity to form heat leakage. The capillary core 1-1-3 is interference fit with the copper powder layer sintered on the bottom plate 1-1-1, and the bottom shell 1-1-1 is connected to the liquid reservoir shell 1-1-2 by brazing.

[0089] like Figure 5 As shown, the plate heat exchanger 1-2 includes a primary side inlet 1-2-1, a primary side outlet 1-2-2, a secondary side inlet 1-2-3 and a secondary side outlet 1-2-4. The primary side inlet 1-2-1 and the primary side outlet 1-2-2 are located on one side of the plate heat exchanger 1-2, and the secondary side inlet 1-2-3 and the secondary side outlet 1-2-4 are located on the other side of the plate heat exchanger 1-2.

[0090] The steam pipeline 1-3 is a flexible pipeline made of stainless steel. The steam pipeline 1-3 is welded to connect the steam pipeline connecting pipe 1-1-4 and the primary side inlet 1-2-1.

[0091] The liquid pipeline 1-4 is a flexible pipeline made of stainless steel. The liquid pipeline 1-4 is welded to connect the liquid pipeline connecting pipe 1-1-5 and the primary side outlet 1-2-2.

[0092] The secondary side inlet 1-2-3 is welded to the first quick connector 1-5, and the secondary side outlet 1-2-4 is welded to the second quick connector 6.

[0093] In this embodiment, the working medium filled in the loop heat pipe 1 is water.

[0094] In this embodiment, the bottom shell 1-1-1 of the four flat plate evaporators 1-1 is mounted with the four chips, and the bottom boss 1-1-1-2 is used to increase the heating area. When the working medium receives the heat generated by the chip, water evaporates on the surface of the copper powder layer of the bottom shell 1-1-1, and the porous copper powder layer provides capillary driving force for the entire loop heat pipe 1. The steam is collected along the steam channel formed between the bottom bosses 1-1-1-2 to the steam pipeline interface 1-1-1-3. The steam enters the plate heat exchanger 1-2 through the primary side inlet 1-2-1 from the steam pipeline 1-3. The steam condenses into liquid after heat exchange with the working medium on the secondary side, and enters the liquid pipeline 1-4 from the primary side outlet 1-2-2. The liquid working medium flows back to the liquid reservoir shell 1-1-2 through the liquid pipeline connection 1-1-5, and continuously supplies liquid to the copper powder layer of the bottom shell 1-1-1 through the capillary core 1-1-3, thereby forming a self-circulating two-phase fluid loop.

[0095] The working medium circulating on the secondary side of the four plate heat exchangers 1-2 (i.e., the side corresponding to the secondary side inlet 1-2-3 and the secondary side outlet 1-2-4) is water. The circulating water on the secondary side enters the cooling tower 5 under the action of the water pump 4 to exchange heat with the air and then cool down. The water distributor 3 evenly distributes the low-temperature circulating water to the plate heat exchanger 1-2. The circulating water absorbs the heat from the chip and then heats up. After the high-temperature water is converged by the water collector 2, it is pumped to the cooling tower 5 by the water pump 4 to cool down, thus forming a secondary side water circulation.

[0096] It should be pointed out that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A loop heat pipe chip water cooling system applied to a server, characterized in that: It includes N loop heat pipes, a water collector, a water distributor, a water pump, a cooling tower, N cooling water inlet pipelines, N cooling water outlet pipelines, a water collector outlet pipeline and a water distributor inlet pipeline; The loop heat pipe comprises an evaporator, a heat exchanger, a steam pipeline, a liquid pipeline, a first quick connector and a second quick connector; The evaporator is connected to the heat exchanger through the steam pipeline and the liquid pipeline, and the first quick connector and the second quick connector are arranged on one side of the heat exchanger; The water collector comprises N first water inlets and at least one first water outlet; The water distributor comprises at least one second water inlet and N second water outlets; The cooling tower comprises a third water inlet and a third water outlet; The N cooling water outlet pipes are respectively connected to the N first water inlets and the N second quick connectors, the N cooling water inlet pipes are respectively connected to the N second water outlets and the N first quick connectors, the collector outlet pipe is connected to the first water outlet and the third water inlet, the water distributor inlet pipe is connected to the second water inlet and the third water outlet, and the water pump is installed on the collector outlet pipe and connected to the cooling tower.

2. The loop heat pipe chip water cooling and heat dissipation system for a server according to claim 1 is characterized in that: The evaporator is a flat plate evaporator, and the heat exchanger is a plate heat exchanger.

3. The loop heat pipe chip water cooling and heat dissipation system for a server according to claim 1 is characterized in that: The evaporator comprises a bottom shell, a liquid reservoir shell, a capillary wick, a steam pipeline connecting pipe and a liquid pipeline connecting pipe; The capillary core is arranged in the bottom shell, the liquid reservoir shell seals the bottom shell, the steam pipeline connecting pipe is arranged on one side of the bottom shell, and the liquid pipeline connecting pipe is arranged on one side of the liquid reservoir shell.

4. The loop heat pipe chip water cooling and heat dissipation system for a server according to claim 3 is characterized in that: The bottom shell comprises a bottom groove, a plurality of bottom bosses are arranged in the bottom groove, and a steam pipeline interface for connecting the steam pipeline connecting pipe is arranged on one side of the bottom shell.

5. The loop heat pipe chip water cooling and heat dissipation system for a server according to claim 4 is characterized in that: A porous metal powder layer is sintered on the bottom groove and the bottom boss.

6. The loop heat pipe chip water cooling and heat dissipation system for a server according to claim 5, characterized in that: The porous metal powder in the porous metal powder layer is copper powder, the thickness of the porous metal powder layer is 0.4 mm-0.6 mm, and the mesh number of the porous metal powder is 300-1000 meshes.

7. The loop heat pipe chip water cooling and heat dissipation system for a server according to claim 3, characterized in that: The capillary core is a nickel sintered porous material, the porosity of the capillary core is greater than 70%, the pore size is less than 50 μm, and the equivalent thermal conductivity is less than 5 W / (mK).

8. The loop heat pipe chip water cooling and heat dissipation system for a server according to claim 1, characterized in that: The heat exchanger comprises a primary side inlet, a primary side outlet, a secondary side inlet and a secondary side outlet; The steam pipeline connects the steam pipeline connecting pipe and the primary side inlet, the liquid pipeline connects the liquid pipeline connecting pipe and the primary side outlet, the secondary side inlet is connected to the first quick connector, and the secondary side outlet is connected to the second quick connector.

9. The loop heat pipe chip water cooling and heat dissipation system for a server according to claim 3, characterized in that: The materials of the liquid storage tank shell, the steam pipeline connecting pipe, the steam pipeline and the liquid pipeline are all stainless steel.

10. The loop heat pipe chip water cooling and heat dissipation system for a server according to claim 3, characterized in that: The bottom surface of the liquid reservoir housing is processed with sealing teeth.

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