Heat dissipation structure, system and testing device

Abstract

The utility model provides a heat dissipation structure, a heat dissipation system and a testing device. The heat dissipation structure comprises a heat dissipation block, M pin holes and a first threaded hole, wherein M is a natural number greater than 1; the pin holes and the first threaded hole are formed in the heat dissipation block in a penetrating mode, and the pin holes are formed in the circumferential direction of the first threaded hole. According to the utility model, the probe formed by the sealed silicon photomultiplier is arranged on the heat dissipation structure, and the bottom of the tube socket of the probe is in direct contact with the heat dissipation block, so that the contact area between the bottom of the tube socket of the probe and the heat dissipation block is increased; and a first threaded hole is formed to be matched with a stud on the tube seat, so that the probe is fixedly connected with the heat dissipation block. The heat of the probe is conducted out through the heat dissipation block, the internal temperature of the probe is controlled to be-25 DEG C or below, the probe can stably work for a long time in an actual application environment (the temperature is 40 DEG C), and the performance of the photoelectric detector is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of weak light detectors, in particular to a heat dissipation structure, system and testing device. Background Art

[0002] With the increase in the incidence of diseases and the intensification of the aging population, the importance of early disease detection has become increasingly prominent. Early disease detection requires the use of in vitro detection instruments, such as hematology analyzers, biochemical analyzers, chemiluminescence analyzers, and fluorescent immunoassay analyzers. The core components of in vitro diagnostic instruments include optical detectors, that is, most in vitro diagnostic instruments complete detection by detecting the strength or intensity changes of characteristic light signals. Among them, silicon photomultiplier tubes are favored in the field of weak light detection because of their low cost, high detection efficiency, ability to distinguish single photons, small size, easy integration, and insensitivity to magnetic fields.

[0003] However, the dark count of silicon photomultiplier tubes is high at room temperature, they are sensitive to temperature and the package is fragile and brittle. Therefore, in practical applications, silicon photomultiplier tubes are sealed to form probes to reduce the working environment temperature of silicon photomultiplier tubes and further reduce dark counts. However, after the silicon photomultiplier tubes are sealed, the heat dissipation effect of the silicon photomultiplier tubes is not obvious, so that the silicon photomultiplier tubes cannot work stably for a long time in the actual application environment (temperature is about 40°C); and the achievable cooling temperature is limited (about -20°C), and it cannot be cooled to obtain a lower working temperature, and it is also impossible to further reduce the dark count of the silicon photomultiplier tube.

[0004] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present application. Utility Model Content

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a heat dissipation structure, system and test device, which are used to solve the problems in the prior art that after the silicon photomultiplier tube is sealed, the heat dissipation effect of the silicon photomultiplier tube is not obvious, so that the silicon photomultiplier tube cannot work stably for a long time in an actual application environment; and the achievable refrigeration temperature is limited, and refrigeration cannot be used to obtain a lower operating temperature, and at the same time, the dilemma and technical difficulties of further reducing the dark count of the silicon photomultiplier tube cannot be solved.

[0006] To achieve the above-mentioned purpose and other related purposes, the utility model provides a heat dissipation structure, system and testing device, wherein the heat dissipation structure comprises: a heat dissipation block, M pin holes and a first threaded hole; wherein M is a natural number greater than 1:

[0007] Each pin hole and the first threaded hole are both arranged through the heat dissipation block, and each pin hole is arranged in the circumferential direction of the first threaded hole.

[0008] Optionally, the length of the pin hole ranges from 0.4 mm to 8 mm.

[0009] Optionally, the diameter of the first threaded hole ranges from 1.0 mm to 3.0 mm.

[0010] Optionally, the first threaded hole is arranged at a center position of the heat dissipation block.

[0011] Optionally, the heat dissipation block is provided with N second threaded holes, each of which is arranged through an edge of the heat dissipation block, wherein N is a natural number greater than 1.

[0012] Optionally, the heat dissipation structure also includes X fin components, each fin component is arranged on the upper surface of the heat dissipation block and extends downward, the depth of each fin component is less than the height of the heat dissipation block; each fin component extends along the edge of the heat dissipation block toward the center of the heat dissipation block; wherein X is a natural number greater than 1.

[0013] The utility model also provides a heat dissipation system, which at least comprises: a probe and the above heat dissipation structure;

[0014] The probe is arranged on the upper surface of the heat sink, the bottom of the probe contacts the upper surface of the heat sink and is fixed on the heat sink through the first threaded hole; each pin on the probe passes through the corresponding pin hole.

[0015] The utility model also provides a testing device, which comprises a box body, a cover plate and the above-mentioned heat dissipation system;

[0016] The upper surface of the heat dissipation block contacts the lower surface of the cover plate, and the lower surface of the heat dissipation block contacts the box body.

[0017] Optionally, at least one side surface of the box is provided with a heat dissipation groove.

[0018] Optionally, the box body is made of aluminum, and the cover plate is made of aluminum.

[0019] Optionally, N second threaded holes are provided on the heat sink; N third threaded holes and stepped holes are provided on the cover plate; each third threaded hole corresponds to each second threaded hole; the position of the stepped hole corresponds to the position of the first threaded hole; the diameter of the stepped hole on the upper surface of the cover plate is greater than the diameter of the stepped hole on the lower surface of the cover plate.

[0020] Optionally, the diameter of the stepped hole ranges from 2.5 mm to 20 mm.

[0021] As described above, the utility model provides a heat dissipation structure, system and testing device, which have the following beneficial effects:

[0022] 1. The utility model sets the probe formed by the sealed silicon photomultiplier tube on the heat dissipation structure, and makes the bottom of the probe tube seat directly contact with the upper surface of the heat dissipation block, thereby increasing the contact area between the bottom of the probe tube seat and the heat dissipation block;

[0023] The probe is fixedly connected to the heat sink by setting a first threaded hole to cooperate with the stud on the tube holder. The heat of the probe is conducted through the heat sink, and the internal temperature of the probe is controlled at -25°C or below. The probe can work stably for a long time in the actual application environment (temperature is 40°C), further improving the performance of the photoelectric detector. At the same time, the heat sink can be mass-produced, with low material cost and simple manufacturing process.

[0024] 2. The utility model further increases the heat dissipation area by arranging fin components on the heat dissipation block. And by arranging an aluminum box and an aluminum cover plate to be closely connected with the heat dissipation block and the probe, the heat dissipation function of the entire structure is improved, the performance of the probe is improved, and the electromagnetic shielding function is also played, the anti-interference ability of the test device is increased, and the performance of the test device is significantly optimized.

[0025] 3. The heat dissipation system of the utility model can make the probe work stably for a long time in a low temperature environment, significantly reduce the dark count of the probe, improve the linear dynamic range of the probe, and broaden the application range of the probe. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Shown is a schematic structural diagram of the heat dissipation block of the present utility model.

[0027] Figure 2 Shown is a schematic diagram of the structure of the heat dissipation system of the utility model

[0028] Figure 3 Shown is a schematic structural diagram of the probe of the utility model.

[0029] Figure 4 Shown is a structural schematic diagram of the testing device of the present utility model.

[0030] Component number description

[0031] 1. Heat dissipation structure

[0032] 10 Heat sink

[0033] 11 Pin hole

[0034] H1 Pin hole length

[0035] H2 Width of the pin hole

[0036] 12 First threaded hole

[0037] L1 Diameter of the first threaded hole

[0038] 13 Fin parts

[0039] H3 Depth of fin assembly

[0040] H4 Length of the fin assembly

[0041] 14 Second threaded hole

[0042] 2 Cooling system

[0043] 20 Probe

[0044] 200 Tube socket

[0045] 201 pipe cap

[0046] 202 Semiconductor Refrigerator

[0047] 203 substrate

[0048] 204 Silicon Photomultiplier Tube

[0049] 205 Thermistor

[0050] 206 Gold Thread

[0051] 3 Test setup

[0052] 30 Cabinet

[0053] 300 grooves

[0054] 31 Cover

[0055] 310 Third threaded hole

[0056] 311 Stepped hole

[0057] L2 Diameter of stepped hole

[0058] A Area 1

[0059] B Area 2

[0060] C Area 3

[0061] D Area 4

[0062] E Area 5

[0063] F Area 6 DETAILED DESCRIPTION

[0064] The following is a specific example to illustrate the implementation of the present invention. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0065] See also Figures 1 to 4 . It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no substantial technical significance. Any structural decoration, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed by the utility model without affecting the effects and purposes that can be achieved by the utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the utility model. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the utility model without substantially changing the technical content.

[0066] like Figure 1 As shown, this embodiment provides a heat dissipation structure 1, including: a heat dissipation block 10, M pin holes 11 and a first threaded hole 12; wherein M is a natural number greater than 1; each pin hole 11 and the first threaded hole 12 are arranged through the heat dissipation block 10, and each pin hole 11 is arranged on the circumference of the first threaded hole 12.

[0067] Specifically, in the present embodiment, the heat sink 10 is configured as a copper heat sink or a graphene heat sink with high thermal conductivity, so that the heat can be quickly conducted out, effectively improving the heat dissipation efficiency, thereby reducing the operating temperature of the device. In actual use, any material of the heat sink that can improve the heat dissipation efficiency is suitable for the present utility model, which will not be described one by one here. The shape of the heat sink 10 includes but is not limited to a rectangle. In actual use, the shape of the heat sink can be arbitrarily set as needed, which will not be described one by one here. Four pin holes 11 are provided on the heat sink 10, and the shape of each pin hole 11 includes but is not limited to a rectangle; and the four pin holes 11 are arranged opposite to each other on the circumference of the first threaded hole 12. In actual use, the number and shape of the pin holes are arbitrarily set as needed, not limited to this embodiment. In actual use, the position of each pin hole can be set according to the position of the pin of the probe, not limited to this embodiment. Each pin hole 11 runs through the heat sink 10 to facilitate the pin of the probe to be led out through the heat sink 10. The length H1 of each pin hole 11 ranges from 0.4mm to 8mm, including but not limited to 1mm, 3mm, 4.3mm, and 6mm; the width H2 of the pin hole 11 ranges from 0.4mm to 3.5mm, including but not limited to 0.8mm, 1.5mm, 2.3mm, and 3mm. In actual use, the length and width of each pin hole can be set arbitrarily according to needs, and will not be repeated here. The first threaded hole 12 passes through the heat sink 10 and is set at the center of the heat sink 10, so that the stud on the tube holder cooperates with the first threaded hole 12 to fix the tube holder and the heat sink 10, and at the same time, the purpose of uniform heat dissipation can be achieved. The diameter L1 of the first threaded hole 12 ranges from 1.0mm to 3.0mm, including but not limited to 0.8mm, 1.6mm, 2.3mm, and 2.9mm. In actual use, the diameter of the first threaded hole can be set arbitrarily according to needs, and will not be repeated here. In actual use, the position of the first threaded hole on the heat sink can be set arbitrarily according to needs, and is not limited to this embodiment.

[0068] like Figure 1 As shown, the heat dissipation structure 1 also includes X fin components 13, each fin component 13 is arranged on the upper surface of the heat dissipation block 10 and extends downward, and the depth H3 of each fin component 11 is less than the height of the heat dissipation block 10; each fin component 13 extends along the edge of the upper surface of the heat dissipation block 10 toward the pin hole 11; wherein X is a natural number greater than 1.

[0069] Specifically, in this embodiment, each fin component 13 is evenly arranged on the upper surface of the heat sink 10 and extends downward, and the depth H3 of each fin component 13 is less than the height of the heat sink 10 to prevent each fin component 13 from penetrating the heat sink 10, further increasing the contact area with the box. At the same time, the length H4 of each fin component 13 extends along the edge of the upper surface of the heat sink 10 toward the pin hole 11, and the length H4 of each fin component 13 can be set to different lengths. The length H4 of each fin component 13 is set to a range of 5 to 15 mm, including but not limited to 5.8 mm, 6.6 mm, 7.3 mm, 9.9 mm, and 13 mm; the depth H3 of each fin component 13 is set to a range of 1 mm to 9 mm, including but not limited to 1.8 mm, 4.6 mm, 7.8 mm, and 8.9 mm; in actual use, the length and depth of each fin component can be arbitrarily set as needed, and will not be repeated here. By setting the fin component 13, the contact area between the heat dissipation structure 1 and the air is further increased, and the heat dissipation performance is improved. In actual use, any device that can improve the heat dissipation capacity of the heat dissipation structure is applicable to the present invention, and will not be described in detail here.

[0070] like Figure 1 As shown, the heat dissipation block 10 is provided with N second threaded holes 14 , each of which is arranged through the edge of the heat dissipation block 10 , wherein N is a natural number greater than 1.

[0071] Specifically, in this embodiment, four second threaded holes 14 are provided on the heat sink 10, and the four second threaded holes 14 are respectively penetrated at the four vertices of the rectangular heat sink 10, so that the heat sink 10 can be fixed to the box body by screws cooperating with the second threaded holes 14. In actual use, the number and positions of the second threaded holes that can fix the heat sink to the box body are applicable to the present utility model, and are not described one by one here.

[0072] like Figure 2 As shown, the utility model further provides a heat dissipation system 2, which is used to fix the probe 20 on the heat dissipation structure 1 to improve the heat dissipation efficiency. The heat dissipation system 2 includes the probe 20 and the heat dissipation structure 1.

[0073] like Figure 2 As shown, the probe 20 is disposed on the upper surface of the heat sink 10 , the bottom of the probe 20 contacts the upper surface of the heat sink 10 , and is fixed to the heat sink 10 through a first threaded hole 12 ; each pin on the probe 20 passes through a corresponding pin hole 11 .

[0074] Specifically, in this embodiment, Figure 3As shown, the probe 20 includes a tube base 200 and a tube cap 201, wherein the upper surface of the tube base 200 is provided with: a semiconductor refrigerator 202, a substrate 203, a silicon photomultiplier tube 204 and a thermistor 205. The silicon photomultiplier tube 204 and the thermistor 205 are connected to the substrate 203 by welding, the substrate 203 with the silicon photomultiplier tube 204 and the thermistor 205 is fixed to the upper surface of the semiconductor refrigerator 202, and the lower surface of the semiconductor refrigerator 202 is fixed to the tube base 200. The silicon photomultiplier tube 204 needs to be placed on the central axis of the tube base 200. The semiconductor refrigerator 202, the silicon photomultiplier tube 204 and the thermistor 205 are electrically connected to the corresponding pins through the gold wire 206. Then, the upper surface of the tube base 200 and the tube cap 201 are sealed by laser spot welding in an inert gas atmosphere to form a probe. Apply thermal grease to the lower surface of the tube holder 200 to make full contact with the upper surface of the heat dissipation structure 1, and rotate and press to squeeze out the gas between the lower surface of the tube holder 200 and the upper surface of the heat dissipation structure 1. Increase the contact area between the bottom of the tube holder 200 of the probe 20 and the upper surface of the heat dissipation block 10, and fix the probe 20 to the heat dissipation block 10 by matching the stud on the tube holder 200 with the first threaded hole 12 on the heat dissipation block 10. Among them, the tube cap 201 of the probe 20 does not make any contact with the heat dissipation structure 1, that is, the tube cap 201 of the probe 20 is exposed as a whole, and the heat of the probe 20 is fully conducted backward from the heat dissipation block 10 that is in close contact with the bottom of the tube holder 200.

[0075] like Figure 4 As shown, the utility model also provides a testing device 3, which includes: a box 30, a cover plate 31 and a heat dissipation system 2, the upper surface of the heat dissipation block 10 contacts the lower surface of the cover plate 31, and the lower surface of the heat dissipation block 10 contacts the box 30.

[0076] Specifically, in this embodiment, N second threaded holes 14 are provided on the heat sink 10; N third threaded holes 310 and stepped holes 311 are provided on the cover plate 31, and each third threaded hole 310 corresponds to each second threaded hole 14; the position of the stepped hole 311 corresponds to the position of the first threaded hole 12. The diameter of the stepped hole 311 on the upper surface of the cover plate 31 is larger than the diameter of the stepped hole 311 on the lower surface of the cover plate 31, so as to ensure that the probe 20 can receive light at different angles through the stepped hole 311, and further increase the area of ​​receiving light. The diameter L2 of the stepped hole 311 ranges from 2.5mm to 20mm, including but not limited to 6.8mm, 8.6mm, 11.3mm, 16.9mm, and 19mm. In actual use, any stepped hole diameter that can ensure that the probe can receive light is applicable to the utility model, and will not be described one by one here.

[0077] More specifically, in the present embodiment, the box body 30 is made of an aluminum box body and the cover plate 31 is made of an aluminum cover plate. By providing a heat dissipation groove 300 on at least one side of the box body 30, the heat dissipation contact area is increased, and the heat dissipation efficiency of the entire test device 3 is improved. In actual use, the depth of the groove is arbitrarily set as needed and is not limited to the present embodiment. By making the upper surface of the heat dissipation block 10 contact with the cover plate 31, and the lower surface of the heat dissipation block 10 contact with the box body 30, that is, by tightly connecting the heat dissipation block 10 and the probe 20 between the box body 30 and the cover plate 31, the probe 20 can work stably for a long time in a low temperature environment, further reducing the dark count of the probe, while also achieving the effect of electromagnetic shielding, increasing the anti-interference ability of the test device 3, and significantly optimizing the performance of the test device 3.

[0078] like Figure 4 As shown, based on the test device 3, a temperature conduction simulation test is performed, the product application environment temperature (40°C), the convection heat transfer coefficient and the refrigerator power are set, and the temperature of different areas of the test device 3 is obtained when the thermal equilibrium state is reached at the application environment temperature. As an example, the temperature of six areas on the test device 3 is measured, and the temperature of area 1 A is the area where the hot surface of the semiconductor refrigerator 202 contacts the tube seat 200, which is 53.926°C, the temperature of area 2 B is the area on the fin component 13, which is 52.086°C, the temperature of area 3 C is the area of ​​the second threaded hole 14 on the heat sink 10, which is 51.976°C, the temperature of area 4 D is the area on the box 30, which is 51.906°C, the temperature of area 5 E is the area on the upper surface of the cover plate 31, which is 46.584°C, and the temperature of area 6 F is the area around the stepped hole 311 of the cover plate 31, which is 45.395°C. In actual use, any area on the test device 3 can be tested for temperature, which is not limited to this embodiment. By using the test device 3 to keep the internal environment of the probe 20 at a lower temperature, continuous simulation tests are performed to obtain that the actual test probe can stably work for more than 8 hours at an ambient temperature of about 40°C.

[0079] In summary, the utility model provides a heat dissipation structure, system and test device, including: a heat dissipation block, M pin holes and a first threaded hole; wherein M is a natural number greater than 1; each pin hole and the first threaded hole are arranged through the heat dissipation block, and each pin hole is arranged on the circumference of the first threaded hole. The utility model arranges the probe formed by the sealed silicon photomultiplier tube on the heat dissipation structure, directly contacts the bottom of the probe's tube seat with the heat dissipation block, and increases the contact area between the bottom of the probe's tube seat and the heat dissipation block; and arranges the first threaded hole to cooperate with the stud on the tube seat to fix the probe to the heat dissipation block. The heat of the probe is discharged through the heat dissipation block, and the internal temperature of the probe is controlled at -25°C or below, and the probe can work stably for a long time in the actual application environment (temperature is 40°C), further improving the performance of the photodetector. By arranging a fin component on the heat dissipation block, the heat dissipation area is further increased. And by setting an aluminum box and an aluminum cover plate to be closely connected with the heat sink and the probe, the heat dissipation function of the entire structure is improved, the performance of the probe is improved, and it also plays the role of electromagnetic shielding, increases the anti-interference ability of the test device, and significantly optimizes the performance of the test device. The heat dissipation system of the utility model can make the probe work stably for a long time in a low temperature environment, significantly reduce the dark count of the probe, and broaden the application range of the probe. It can also make the probe work normally in harsh environments such as high temperature, low temperature, high humidity, and strong impact. Therefore, the utility model effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0080] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A heat dissipation structure, characterized in that: The heat dissipation structure comprises: a heat dissipation block, M pin holes and a first threaded hole; wherein M is a natural number greater than 1; Each pin hole and the first threaded hole are both arranged through the heat dissipation block, and each pin hole is arranged in the circumferential direction of the first threaded hole.

2. The heat dissipation structure according to claim 1, characterized in that: The length of the pin hole ranges from 0.4 mm to 8 mm.

3. The heat dissipation structure according to claim 1, characterized in that: The diameter of the first threaded hole ranges from 1.0 mm to 3.0 mm.

4. The heat dissipation structure according to claim 1, characterized in that: The first threaded hole is arranged at the center of the heat dissipation block.

5. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation block is provided with N second threaded holes, each of which is arranged through the edge of the heat dissipation block, wherein N is a natural number greater than 1.

6. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: The heat dissipation structure also includes X fin components, each of which is arranged on the upper surface of the heat dissipation block and extends downward, and the depth of each fin component is less than the height of the heat dissipation block; each fin component extends along the edge of the heat dissipation block toward the center of the heat dissipation block; wherein X is a natural number greater than 1.

7. A heat dissipation system, characterized in that: The heat dissipation system comprises: a probe and a heat dissipation structure as claimed in any one of claims 1 to 6; The probe is arranged on the upper surface of the heat sink, the bottom of the probe contacts the upper surface of the heat sink and is fixed on the heat sink through the first threaded hole; each pin on the probe passes through the corresponding pin hole.

8. A testing device, characterized in that: The testing device comprises: a box, a cover plate and the heat dissipation system according to claim 7; the upper surface of the heat dissipation block contacts the lower surface of the cover plate, and the lower surface of the heat dissipation block contacts the box.

9. The testing device according to claim 8, characterized in that: At least one side surface of the box body is provided with a heat dissipation groove.

10. The testing device according to claim 8, characterized in that: The box body is made of aluminum, and the cover plate is made of aluminum.

11. The testing device according to claim 8, characterized in that: The heat sink is provided with N second threaded holes; the cover plate is provided with N third threaded holes and stepped holes; each third threaded hole corresponds to each second threaded hole; the position of the stepped hole corresponds to the position of the first threaded hole; the diameter of the stepped hole on the upper surface of the cover plate is greater than the diameter of the stepped hole on the lower surface of the cover plate.

12. The testing device according to claim 11, characterized in that: The diameter of the stepped hole ranges from 2.5 mm to 20 mm.

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