High-speed chip mounter for SMT processing

Abstract

The utility model provides a high-speed chip mounter for SMT processing, which comprises a main body, the top of the main body is fixedly connected with a driving mechanism, the bottom end of the driving mechanism is fixedly connected with an upper fitting structure, the bottom of the main body is fixedly connected with a lower fitting structure, and the lower fitting structure and the upper fitting structure are oppositely distributed up and down. And the upper fitting structure is slidably connected with the inner wall of the main body. The supporting frame is matched with the limiting table, so that the effect of conveniently limiting and fixing the placement seat is achieved, the effect of blocking and limiting the supporting frame from the back face position of the supporting frame is achieved through the baffle, and the effect of limiting the position of an external patch is achieved through the placement seat and the placement grooves in the surface of the placement seat; and the placement groove at the edge position of the surface of the placement seat is additionally provided with a ventilation channel, so that the situation that the placement seat moves in the patch suction process can be effectively avoided, and the stability of the placement seat is ensured.

Description

Technical Field

[0001] The utility model relates to the field of SMT processing, and more specifically to a high-speed chip mounter for SMT processing. Background Art

[0002] The placement machine is also called the placement machine and surface mount system. It is configured after the dispensing machine or screen printing machine in the production line. It is a device that accurately places surface mount components on the PCB pads by moving the placement head. It is divided into manual and fully automatic types.

[0003] However, most of the existing devices cannot operate in batches, have low work efficiency, and are not easy to collect finished products. Workers are required to move back and forth, which increases workload and reduces work efficiency. It cannot meet people's current requirements for this product. In response to this problem, the Chinese utility model with application number 202121389801.3 proposes a high-speed placement machine for SMT processing, including a chassis and a frame, the frame is fixedly arranged at the bottom of the chassis, and a storage box is fixedly arranged on one side of the frame, a connecting cavity is provided inside the chassis, cylinders are fixedly arranged at both ends of the top of the inner cavity of the connecting cavity, and a connecting shell is provided on the inner side of the chassis, the output ends of the cylinders are fixedly connected to the top of the connecting shell, a conveying mechanism is provided under the connecting shell, a PLC controller is fixedly arranged in the inner cavity of the chassis, and a control panel is fixedly arranged on one side of the chassis. This type of high-speed placement machine for SMT processing has strong flexibility, can perform fast placement, has a high degree of automation, can quickly fix the workpiece, can operate in batches, effectively improve work efficiency, and is convenient for storing finished products and taking them out. Workers do not need to move back and forth, which reduces the workload of workers and further improves work efficiency. The problems that exist when using this device are:

[0004] The limiting plate is supported by the guide roller after the patch is placed. In actual operation, the bonding stability needs to be ensured during the bonding process. Although the limiting plate is supported by the roller structure, it is convenient for subsequent material discharge, but lacks stability.

[0005] When the suction pipe sucks up the patch from the limit plate and fixes it inside the cavity, it cannot well ensure that the patch will not deviate during the adsorption process, which will easily lead to the deviation of the patch and the pad. The quality of the patch needs to be improved.

[0006] When the patch in the limit plate is sucked up by the suction pipe, it is easy for the limit plate to move on the guide roller.

[0007] Therefore, the utility model provides a high-speed chip mounter for SMT processing. Utility Model Content

[0008] The utility model aims to solve the technical problems raised by the above-mentioned background technology and provide a high-speed placement machine for SMT processing, which can solve:

[0009] When the existing placement machine is in use, the limit plate is supported by the roller structure, which is convenient for subsequent material discharge, but lacks stability.

[0010] When the suction pipe sucks up the patch from the limit plate and fixes it inside the cavity, it cannot well ensure that the patch will not deviate during the adsorption process, which may cause the patch and the pad to have a fitting deviation problem;

[0011] In the process of sucking up the patch in the limit plate through the suction pipe, it is easy to cause the limit plate to move on the guide roller.

[0012] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-speed placement machine for SMT processing, comprising a main body, a driving mechanism fixedly connected to the top of the main body, an upper bonding structure fixedly connected to the bottom end of the driving mechanism, a lower bonding structure fixedly connected to the bottom of the main body, the lower bonding structure and the upper bonding structure are relatively distributed in upper and lower positions, and the upper bonding structure is slidably connected to the inner wall of the main body.

[0013] A further preferred solution: the lower fitting structure includes a support frame arranged in a rectangular shape and a limit platform arranged in an inverted "T" shape on the top surface thereof, and a laterally arranged baffle is fixedly connected to the back side of the support frame.

[0014] A further preferred solution is that the support frame is fixedly connected to the inner wall of the main body, and the end corners of the support frame are extended vertically upward, the back end corners of the support frame at both ends of the baffle are fixedly connected, the limit platform is arranged longitudinally, and two groups are arranged transversely.

[0015] A further preferred solution: the lower fitting structure also includes a rectangular placement seat, a surface of which is fixed with a plurality of rectangular placement grooves, the end corners of the placement seat are fixedly connected with vertically arranged positioning supports, and the top edge of the placement seat is also provided with a first positioning groove and a second positioning groove.

[0016] A further preferred solution is that multiple groups of placement grooves are opened along the surface of the placement seat, and they are connected to each other at the same time. The placement grooves located at the edge of the placement seat surface and the edge of the placement seat are also provided with ventilation channels, and limiting grooves are opened on both sides of the bottom end of the placement seat corresponding to the limit platform.

[0017] A further preferred solution is that the first positioning groove is rectangular and located at the top of the positioning support and at the top corner of the placement seat, while the second positioning groove is strip-shaped and located on the lateral sides of the top surface of the placement seat.

[0018] A further preferred solution: the upper bonding structure includes a first adsorption seat, a first guide rod, a first guide seat, a second adsorption seat, a positioning wing plate, a second guide seat and a positioning head. The first guide rod and the two sides of the top end of the first adsorption seat are fixedly connected. The second adsorption seat is a rectangular protrusion opened on the bottom surface of the adsorption seat. The positioning wing plate is a trapezoidal plate fixedly connected to the bottom edge position of the first adsorption seat and is located at the outer side of the second adsorption seat. The positioning head is a rectangular head arranged at the bottom corner position of the first adsorption seat.

[0019] A further preferred solution is that the first guide seat and the first guide rod are slidably sleeved and fixedly connected to the inner wall of the main body, and the second guide seat has a second guide rod vertically slidably sleeved inside, and the second guide rod is fixedly connected to the inner wall of the main body.

[0020] A further preferred solution is that a plurality of second adsorption seats are arranged along the bottom surface of the first adsorption seat and are co-distributed corresponding to the placement grooves, the positioning wing plates are arranged corresponding to the second positioning grooves, and the positioning heads are arranged corresponding to the first positioning grooves.

[0021] A further preferred solution is that an inner cavity is provided inside the first adsorption seat, an adsorption cavity which is in communication with the second adsorption seat is fixedly provided inside the inner cavity, and an outer end of the adsorption cavity is connected to an external negative pressure mechanism at the same time.

[0022] Beneficial effects:

[0023] 1. The support frame cooperates with the limit table to achieve the effect of limiting and fixing the placement seat, and the baffle plate is used to block and limit the back of the support frame.

[0024] 2. The placement seat and the placement grooves on the surface can achieve the effect of limiting the placement of external patches. Since multiple groups of placement grooves are connected and the placement grooves at the edge of the placement seat surface are provided with ventilation channels, the placement seat can be effectively prevented from moving during the process of absorbing the patch, thereby ensuring the stability of the placement seat.

[0025] 3. The first guide seat cooperates with the first guide rod and the second guide seat cooperates with the second guide rod to ensure that the entire upper bonding structure can be stably raised and lowered under the control of the driving mechanism, thereby enhancing the stability of subsequent patching and ensuring the accuracy of patching.

[0026] 4. The second adsorption seat cooperates with the adsorption cavity to facilitate the adsorption and fixation of the patch, and the positioning wing plate and the positioning head are used to ensure that the upper bonding structure and the lower bonding structure are accurately connected. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a front view of the overall structure of the utility model;

[0028] Figure 2 This is an exploded view of the lower fitting structure connection of the utility model;

[0029] Figure 3 For the utility model Figure 2 A magnified view of the structure at center;

[0030] Figure 4 This is a front view of the upper fitting structure connection of the utility model;

[0031] Figure 5 For the utility model Figure 4 Enlarged view of the structure at point B in the middle.

[0032] Figure 1-5 In: 1. Main body; 2. Driving mechanism; 3. Upper fitting structure; 4. Lower fitting structure; 5. Support frame; 6. Limiting platform; 7. Baffle; 8. Placement seat; 9. Placement groove; 10. First positioning groove; 11. Second positioning groove; 12. Positioning support; 13. First guide seat; 14. First adsorption seat; 15. First guide rod; 16. Inner cavity; 17. Second adsorption seat; 18. Positioning wing plate; 19. Second guide seat; 20. Second guide rod; 21. Adsorption cavity; 22. Positioning head. DETAILED DESCRIPTION

[0033] The following will be combined with the attached embodiment of the present utility model Figure 1-Figure 5 , clearly and completely describe the technical solutions in the embodiments of the utility model.

[0034] See also Figure 1-5 In the embodiment of the utility model, a high-speed placement machine for SMT processing includes a main body 1, a driving mechanism 2 is fixedly connected to the top of the main body 1, an upper bonding structure 3 is fixedly connected to the bottom of the driving mechanism 2, and a lower bonding structure 4 is fixedly connected to the bottom of the main body 1. The lower bonding structure 4 and the upper bonding structure 3 are relatively distributed in the upper and lower positions, and the upper bonding structure 3 is slidably connected to the inner wall of the main body 1. When using the device, the user first places the external patch in the placement groove 9 on the surface of the placement seat 8, and then the driving mechanism 2 is started to drive the upper bonding structure 3 to descend as a whole to complete the absorption of the patch. Then the user replaces the placement seat 8 and places the placement seat 8 containing the external solder pad in the support frame 5, and then the upper bonding structure 3 is docked with the group of placement seats 8 to ensure the docking accuracy of the placement groove 9 and the second adsorption seat 17, and then the absorbed patch is released and placed on the solder pad to complete the patch operation. The user can pull out the group of placement seats 8 from the support frame 5.

[0035] In the embodiment of the utility model, the lower fitting structure 4 includes a support frame 5 arranged in a rectangular shape and a limit platform 6 arranged in an inverted "T" shape on the top surface thereof. A transversely arranged baffle plate 7 is fixedly connected to the back of the support frame 5. The support frame 5 is fixedly connected to the inner wall of the main body 1, and the end corners of the support frame 5 are both extended vertically upward. The ends of the baffle plate 7 are fixedly connected to the surface of the extended end corners of the back side of the support frame 5. The limit platform 6 is arranged longitudinally and two groups are arranged transversely. The support frame 5 cooperates with the limit platform 6 to achieve the effect of facilitating the limiting and fixing of the placement seat 8, and the baffle plate 7 is used to achieve the effect of blocking and limiting the support frame 5 from the back side.

[0036] The lower bonding structure 4 also includes a rectangular placement seat 8, and the surface of the placement seat 8 is fixedly provided with multiple groups of rectangular placement grooves 9, and the end corners of the placement seat 8 are fixedly connected with a vertically arranged positioning support 12. The top edge of the placement seat 8 is also provided with a first positioning groove 10 and a second positioning groove 11. Multiple groups of placement grooves 9 are provided along the surface of the placement seat 8, and are connected to each other at the same time. The placement grooves 9 located at the edge of the surface of the placement seat 8 and the edge of the placement seat 8 are further provided with ventilation channels. Limiting grooves are provided on both sides of the bottom end of the placement seat 8 corresponding to the limiting platform 6, and the placement seat 8 and the placement grooves 9 on the surface achieve the effect of limiting the placement of external patches. Since the multiple groups of placement grooves 9 are connected to each other, and the placement grooves 9 at the edge of the surface of the placement seat 8 are further provided with ventilation channels, the movement of the placement seat 8 during the absorption of the patch can be effectively avoided, thereby ensuring the stability of the placement seat 8.

[0037] The user places the external patch in the limiting groove 9, and then makes the bottom end of the placement seat 8 corresponding to the limiting platform 6 be embedded in the support frame 5. The limiting platform 6 and the placement seat 8 are slidably connected to facilitate the subsequent rapid replacement and disassembly of the placement seat 8 while ensuring the overall placement stability of the placement seat 8.

[0038] The first positioning groove 10 is opened in a rectangular shape and is located at the top position of the positioning support 12 and at the top end corner position of the placement seat 8. The second positioning groove 11 is a strip groove opened at the lateral two side surfaces of the top of the placement seat 8. The upper fitting structure 3 includes a first adsorption seat 14, a first guide rod 15, a first guide seat 13, a second adsorption seat 17, a positioning wing plate 18, a second guide seat 19 and a positioning head 22. The first guide rod 15 is fixedly connected to both sides of the top of the first adsorption seat 14. The second adsorption seat 17 is a rectangular protrusion opened on the bottom surface of the adsorption seat 14. The positioning wing plate 18 is a trapezoidal plate fixedly connected to the bottom edge of the first adsorption seat 14. , and is located at the outer side of the second adsorption seat 17. The positioning head 22 is a rectangular head and is arranged at the bottom end corner position of the first adsorption seat 14. The first guide seat 13 and the first guide rod 15 are slidably sleeved and fixedly connected to the inner wall of the main body 1. The second guide seat 19 is vertically slidably sleeved with the second guide rod 20 inside, and the second guide rod 20 is fixedly connected to the inner wall of the main body 1. The first guide seat 13 cooperates with the first guide rod 15 and the second guide seat 19 cooperates with the second guide rod 20, so as to ensure that the entire upper bonding structure 3 can be stably lifted and lowered under the control of the driving mechanism 2, thereby enhancing the stability of subsequent patch and ensuring the accuracy of patch.

[0039] The second adsorption seat 17 is arranged in multiple groups along the bottom surface of the first adsorption seat 14, and is distributed in the same position corresponding to the placement groove 9. The positioning wing plate 18 is arranged corresponding to the second positioning groove 11, and the positioning head 22 is arranged corresponding to the first positioning groove 10. The first adsorption seat 14 is provided with an inner cavity 16. The inner cavity 16 is fixedly provided with an adsorption cavity 21 which is connected to the second adsorption seat 17. The outer end of the adsorption cavity 21 is also connected to the external negative pressure mechanism. The second adsorption seat 17 cooperates with the adsorption cavity 21 to achieve the effect of facilitating the adsorption and fixing of the patch. The positioning wing plate 18 and the positioning head 22 are used to ensure that the upper bonding structure 3 as a whole and the lower bonding structure 4 are accurately connected.

[0040] First, the driving mechanism 2 controls the upper bonding structure 3 to descend, so that the adsorption seat 14 and the placement seat 8 in the upper bonding structure 3 are connected, and the positioning head 22 and the fixed positioning wing plate 18 are connected to the first positioning groove 10 and the second positioning groove 11 to ensure the accurate connection between the adsorption seat 14 and the placement seat 8. At this time, the protruding adsorption seat 17 and the placement groove 9 are fitted to form an enclosed chamber. Then, the external negative pressure mechanism connected to the outer end of the adsorption cavity 21 is started to adsorb the patch in the placement groove 9 to the adsorption seat 17 to complete the absorption of the patch. During the process of the driving mechanism 2 controlling the lifting and lowering of the upper bonding structure 3, the first guide seat 13 and the second guide seat 19 are slidably adjusted corresponding to their respective guide rods to ensure the lifting and lowering stability of the upper bonding structure 3.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model, and they should all be included in the scope of the claims and specification of the utility model.

Claims

1. A high-speed placement machine for SMT processing, comprising a main body (1), a driving mechanism (2) fixedly connected to the top of the main body (1), characterized in that: The bottom end of the driving mechanism (2) is fixedly connected to an upper fitting structure (3), and the bottom of the main body (1) is fixedly connected to a lower fitting structure (4). The lower fitting structure (4) and the upper fitting structure (3) are relatively distributed in upper and lower positions, and the upper fitting structure (3) is slidably connected to the inner wall of the main body (1).

2. A high-speed SMT placement machine according to claim 1, characterized in that: The lower fitting structure (4) comprises a supporting frame (5) arranged in a rectangular shape and a limiting platform (6) arranged in an inverted "T" shape on the top surface thereof, and a baffle (7) arranged transversely is fixedly connected to the back side of the supporting frame (5).

3. A high-speed placement machine for SMT processing according to claim 2, characterized in that: The support frame (5) is fixedly connected to the inner wall of the main body (1), and the end corners of the support frame (5) are arranged to extend vertically upwards. The back end corners of the support frame (5) at both ends of the baffle (7) are fixedly connected to the surface of the extended positions. The limit platform (6) is arranged longitudinally and arranged in two groups transversely.

4. A high-speed SMT placement machine according to claim 2, characterized in that: The lower fitting structure (4) also includes a rectangular placement seat (8), a plurality of rectangular placement grooves (9) are fixedly provided on the surface of the placement seat (8), a vertically arranged positioning support (12) is fixedly connected to the end corner of the placement seat (8), and a first positioning groove (10) and a second positioning groove (11) are also provided at the top edge of the placement seat (8).

5. A high-speed SMT placement machine according to claim 4, characterized in that: The placement grooves (9) are provided in multiple groups along the surface of the placement seat (8) and are arranged to be interconnected. The placement grooves (9) located at the edge of the surface of the placement seat (8) and the edge of the placement seat (8) are provided with ventilation channels. Limiting grooves are provided on both sides of the bottom end of the placement seat (8) corresponding to the limiting platform (6).

6. A high-speed SMT placement machine according to claim 4, characterized in that: The first positioning groove (10) is opened in a rectangular shape and is located at the top position of the positioning support (12) and at the top end corner position of the placement seat (8), while the second positioning groove (11) is opened in a strip-shaped groove at the lateral two side surfaces of the top of the placement seat (8).

7. The high-speed SMT placement machine according to claim 1, characterized in that: The upper bonding structure (3) comprises a first adsorption seat (14), a first guide rod (15), a first guide seat (13), a second adsorption seat (17), a positioning wing plate (18), a second guide seat (19) and a positioning head (22); the first guide rod (15) and the top sides of the first adsorption seat (14) are fixedly connected; the second adsorption seat (17) is a rectangular protrusion opened on the bottom surface of the adsorption seat (14); the positioning wing plate (18) is a trapezoidal plate fixedly connected to the bottom edge position of the first adsorption seat (14) and is located at the outer side of the second adsorption seat (17); the positioning head (22) is a rectangular head arranged at the bottom corner position of the first adsorption seat (14).

8. A high-speed SMT placement machine according to claim 7, characterized in that: The first guide seat (13) and the first guide rod (15) are slidably sleeved and fixedly connected to the inner wall of the main body (1); the second guide seat (19) is vertically slidably sleeved with a second guide rod (20), and the second guide rod (20) is fixedly connected to the inner wall of the main body (1).

9. A high-speed SMT placement machine according to claim 7, characterized in that: The second adsorption seat (17) is arranged in multiple groups along the bottom surface of the first adsorption seat (14) and is co-distributed and arranged corresponding to the placement groove (9). The positioning wing plate (18) is arranged corresponding to the second positioning groove (11), and the positioning head (22) is arranged corresponding to the first positioning groove (10).

10. The high-speed placement machine for SMT processing according to claim 7, characterized in that: An inner cavity (16) is provided inside the first adsorption seat (14), and an adsorption cavity (21) which is in communication with the second adsorption seat (17) is fixedly provided inside the inner cavity (16), and the outer end of the adsorption cavity (21) is also connected to an external negative pressure mechanism.

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