Optical packaging device and electronic equipment

Abstract

The embodiment of the utility model provides an optical packaging device and electronic equipment. The optical packaging device comprises a light sensing core particle, a packaging substrate and a packaging layer, and the light sensing core particle is arranged on the packaging substrate and is electrically connected with the packaging substrate through an electric connection structure; the surface, deviating from the packaging substrate, of the light-sensitive core particle is provided with a light-sensitive area and a non-light-sensitive area, and a detector of the light-sensitive core particle is located in the light-sensitive area; the packaging layer comprises a light-transmitting packaging layer and a light-isolating packaging layer, the light-transmitting packaging layer is attached to the light-sensing area of the light-sensing core particle, the light-isolating packaging layer is attached to the non-light-sensing area of the light-sensing core particle and the side portion of the light-sensing core particle, and the electric connection structure is embedded in the light-isolating packaging layer. According to the arrangement, the light sensing core particle detection function is achieved based on the arrangement of the light-transmitting packaging layer, the light-isolating packaging layer wrapping the peripheries of the light-transmitting packaging layer, the light sensing core particles and the electric connection structure is utilized, crosstalk light outside the light sensing area can be effectively isolated, and the size of the device can be effectively reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic device packaging, and in particular to an optical packaging device and an electronic device. Background Art

[0002] With the development and evolution of mobile phones, full-screen design has become a development trend of mobile phones, resulting in a smaller and smaller ink area on the screen, limiting the configurable position of proximity optical devices. When the proximity optical device is set under the screen module, due to the low transmittance of the screen module, there is a large energy loss in the emission and reception of the proximity light. The signal attenuation is large after passing through the screen twice, and the signal reaching the proximity light receiving end is very weak. At the same time, based on the light-guiding characteristics of each layer of the screen module, part of the energy emitted by the proximity light will crosstalk to the receiving end. The greater the crosstalk, the greater the noise of the crosstalk signal, and as the screen transmittance tends to decrease, the actual signal amount becomes lower and lower. In addition to improving the signal-to-noise performance of the device itself, the suppression of crosstalk light has become an important processing direction for improving the proximity light signal-to-noise ratio. Utility Model Content

[0003] The embodiments of the present application provide an optical packaging device and an electronic device, and the height of the device can be reasonably controlled through structural optimization.

[0004] In a first aspect, an embodiment of the present application provides an optical packaging device, which includes a photosensitive core, a packaging substrate and a packaging layer, wherein the photosensitive core is arranged on the packaging substrate and is electrically connected to the packaging substrate through an electrical connection structure; the surface of the photosensitive core facing away from the packaging substrate has a photosensitive area and a non-photosensitive area, and the detector of the photosensitive core is located in the photosensitive area; the packaging layer includes a light-transmitting packaging layer and a light-isolating packaging layer, wherein the light-transmitting packaging layer is attached to the photosensitive area of ​​the photosensitive core, the light-isolating packaging layer is attached to the non-photosensitive area of ​​the photosensitive core and the side of the photosensitive core, and the electrical connection structure connected between the photosensitive core and the packaging substrate is embedded in the light-isolating packaging layer.

[0005] In this way, the photosensitive core particle detection function is realized based on the setting of the light-transmitting packaging layer, and the light-isolating packaging layer coated on the light-transmitting packaging layer, the photosensitive core particles and the outer periphery of the electrical connection structure is used to effectively isolate the crosstalk light outside the photosensitive area. The packaging layer formed by the light-transmitting packaging layer and the light-isolating packaging layer is coated on the outer periphery of the photosensitive core particles and their electrical connection structures, and the photosensitive core particles are seamlessly encapsulated on the packaging substrate to form a gapless packaging body; that is, the packaging layer and the photosensitive core particles and the electrical connection structure are fully fitted. On the one hand, the light-isolating packaging layer is arranged on the surface of the photosensitive core particles, and the device packaging height can be effectively reduced. Compared with the implementation scheme of using a black plastic cover to cover the barrier, for the photosensitive core particles of the same size, the device height size can be controlled to the maximum extent; on the other hand, the light-isolating packaging layer is coated on the side of the photosensitive core particles and the outer periphery of the electrical connection structure, which can further reasonably control the size of the device within the packaging format. Overall, the device size can be effectively reduced.

[0006] In practical applications, the photosensitive core particle can be electrically connected to the solder balls or pads of the packaging substrate by wire bonding, flip chip or tape automated bonding.

[0007] Exemplarily, the electrical connection structure may be a bonding wire.

[0008] Based on the first aspect, the embodiment of the present application further provides a first implementation of the first aspect: the light-transmitting encapsulation layer and the light-isolating encapsulation layer are formed by an injection molding process. For example, but not limited to, a two-color injection molding process can be used. Specifically, better processability and a better encapsulation yield can be obtained.

[0009] Based on the first aspect, or the first implementation of the first aspect, the embodiment of the present application also provides a second implementation of the first aspect: the light-transmitting encapsulation layer is formed by injection molding of a light-transmitting material, and the light-isolating encapsulation layer is formed by injection molding of a light-isolating material. In practical applications, the light-transmitting encapsulation layer can be formed by injection molding of a transparent epoxy resin, or a transparent silicone resin; the light-isolating encapsulation layer can be formed by injection molding of a black epoxy resin, or a black silicone resin.

[0010] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, the embodiment of the present application also provides a third embodiment of the first aspect: in the longitudinal section of the optical packaging device, the thickness dimension B of the light-isolating packaging layer and the distance L between the boundary position of the photosensitive area and the boundary position of the detector satisfy the following condition: B = L / tanθ, where θ is the optical field angle formed by the detector, and 40°<θ<65°. In this way, the height dimension of the device can be reasonably controlled on the basis of obtaining better detection accuracy, which meets the design requirements of the trend of product miniaturization.

[0011] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, or the third implementation of the first aspect, the embodiment of the present application also provides a fourth implementation of the first aspect: the detector of the photosensitive core particle is a proximity light detector.

[0012] Based on the fourth implementation of the first aspect, the embodiment of the present application also provides a fifth implementation of the first aspect: the light-transmitting encapsulation layer is a convex lens structure. Based on the light-transmitting encapsulation layer in the form of a lens, the received light is better focused on the detector surface, the overall light input is increased, and thus the sensitivity of the device is improved.

[0013] Based on the fourth implementation of the first aspect, the embodiment of the present application also provides a sixth implementation of the first aspect: it also includes a bandpass filter film, which is at least coated on the surface of the transparent packaging layer. In this way, the influence of interference light of non-signal wavelengths on the proximity light detector can be further isolated, such as but not limited to the influence of external ambient light; in addition, compared with the implementation method using a glass filter, directly coating the bandpass filter film on the surface of the packaging layer will not increase the overall height of the device, and the cost is controllable.

[0014] In practical applications, the bandpass filter film can be only covered on the light-transmitting packaging layer, and the bandpass filter film can also be extended to cover the light-isolating packaging layer, with better processing performance and better appearance consistency.

[0015] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, or the third implementation of the first aspect, the embodiment of the present application further provides a seventh implementation of the first aspect: the detector of the photosensitive core particle includes a first detector and a second detector, and the two are arranged in a photosensitive area at intervals. Exemplarily, the first detector is a proximity light detector, and the second detector is an ambient light detector.

[0016] Based on the seventh implementation of the first aspect, the embodiment of the present application further provides an eighth implementation of the first aspect: further comprising an anti-reflection film, the anti-reflection film at least covering the surface of the light-transmitting packaging layer. In this way, the reflection loss of the received light at the packaging interface can be further reduced, thereby reducing the attenuation of the effective signal and enhancing the effective light signal.

[0017] In practical applications, the anti-reflection film can be only covered on the light-transmitting packaging layer, and the anti-reflection film can also be extended to cover the light-isolating packaging layer, which has better processing performance and better appearance consistency.

[0018] A second aspect of an embodiment of the present application provides an electronic device, which includes an optical packaging device, and the optical packaging device adopts the optical packaging device described above.

[0019] Exemplarily, the electronic device may be a mobile phone, a tablet computer, a laptop computer, or a wearable smart device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0021] Figure 2 A top view of an optical packaging device provided in an embodiment of the present application;

[0022] Figure 3 for Figure 2 AA section view in;

[0023] Figure 4 A molding process flow chart of an optical packaging device provided in an embodiment of the present application;

[0024] Figure 5 A side cross-sectional view of another optical packaging device provided in an embodiment of the present application;

[0025] Figure 6 A side cross-sectional view of another optical packaging device provided in an embodiment of the present application;

[0026] Figure 7 A side cross-sectional view of another optical packaging device provided in an embodiment of the present application;

[0027] Figure 8 A side cross-sectional view of another optical packaging device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The embodiments of the present application provide an optical packaging device with an optimized structure, which can reasonably control the height of the device while effectively reducing the influence of crosstalk light.

[0029] Photoelectric sensing chips can achieve corresponding outputs as the illumination changes, and are widely used in different scenarios. In practical applications, they need to have good anti-interference characteristics to ensure signal detection accuracy. Taking the proximity light sensor in a mobile phone as an example, the traditional implementation method is to place the proximity light device under the ink area of ​​the screen module. Based on the lower visible light transmittance and higher proximity light (such as infrared light) transmittance of the screen ink area, it can be ensured that the energy loss of both transmission and reception is relatively low. In order to adapt to the full-screen design, the ink area at the top of the screen is getting smaller and smaller, squeezing the configurable position of the proximity light device, so that the proximity light device needs to be placed under the screen module.

[0030] See also Figure 1, which is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Exemplarily, the electronic device 100 shown in the figure is a mobile phone, and the proximity light sensor 10 of the mobile phone is placed on the main board 30 below the screen module 20, and the existence or distance of the object is determined by detecting the reflected light. On the one hand, affected by the light-guiding characteristics of each layer of the screen module, part of the energy of the proximity light emission will crosstalk to the receiving end. The greater the amount of crosstalk, the greater the noise of the crosstalk signal; on the other hand, with the trend of lower and lower screen transmittance, the signal attenuation after transmitting and receiving through the screen twice is large, and the signal amount gradually decreases. On the whole, the proximity light signal-to-noise ratio cannot be effectively improved. The above problems also exist in other electronic devices with screen modules.

[0031] In the related art, in order to suppress the influence of crosstalk light, a black plastic cover structure is used for isolation. In the specific implementation, a light-transmitting material is used to encapsulate the photosensitive core and its bonding leads on the packaging substrate to form a light-transmitting plastic package; here, the photosensitive core (Chip) refers to a bare chip formed by processing and cutting the wafer, and the bare chip is integrated with a photosensitive integrated circuit with corresponding functions. A black plastic cover is made of black light-shielding material, and then the black plastic cover is installed on the outside of the light-transmitting plastic package to form a photosensitive package device. The black plastic cover has a light inlet hole, which can block crosstalk light while realizing the detection function. However, the black plastic cover mounted on the packaging substrate outside the light-transmitting plastic package increases the overall packaging height of the device and cannot meet the design requirements of the trend of product miniaturization.

[0032] Based on this, an embodiment of the present application provides an optical packaging device, including a photosensitive core, a packaging substrate and a packaging layer. The photosensitive core is arranged on the packaging substrate and is electrically connected to the packaging substrate through an electrical connection structure. The surface of the photosensitive core facing away from the packaging substrate has a photosensitive area and a non-photosensitive area; here, the "photosensitive area" refers to the position area corresponding to the detector of the photosensitive core, that is, the area for receiving the light information signal. The photosensitive area at least includes the detector. In order to meet the requirements of the field of view angle, the photosensitive area may be larger than the area corresponding to the detector. The "non-photosensitive area" refers to the area other than the "photosensitive area" on the surface of the photosensitive core facing away from the packaging substrate. The packaging layer includes a light-transmitting packaging layer and a light-isolating packaging layer. The light-transmitting packaging layer is covered on the photosensitive area of ​​the photosensitive core by an injection molding process, and the light-isolating packaging layer is covered on the non-photosensitive area of ​​the photosensitive core, the side of the photosensitive core and the periphery of the electrical connection structure by an injection molding process to form a packaging body.

[0033] In this way, the light-sensitive core particle detection function is realized based on the setting of the light-transmitting packaging layer, and the light-isolating packaging layer coated on the light-transmitting packaging layer, the light-sensitive core particles and the outer periphery of the electrical connection structure is used to effectively isolate the crosstalk light outside the photosensitive area. The packaging layer formed by the light-transmitting packaging layer and the light-isolating packaging layer is coated on the outer periphery of the photosensitive core particles and their electrical connection structures, and the photosensitive core particles are encapsulated on the packaging substrate without gaps to form a gapless packaging body; that is, by utilizing the characteristics of the injection molding packaging process, the packaging layer and the photosensitive core particles and the electrical connection structure are fully fitted. On the one hand, the light-isolating packaging layer is arranged on the surface of the photosensitive core particles, and the device packaging height can be effectively reduced. Compared with the implementation scheme of using a black plastic cover body to cover the barrier, for the photosensitive core particles of the same size, the device height size can be controlled to the maximum extent; on the other hand, the light-isolating packaging layer is coated on the side of the photosensitive core particles and the outer periphery of the electrical connection structure, which can further reasonably control the size of the device within the packaging format. Overall, the device size can be effectively reduced.

[0034] In order to better understand the technical solution and technical effects of the present application, without losing generality, the specific embodiments will be described in detail below in conjunction with the accompanying drawings. Figure 2 and Figure 3 ,in, Figure 2 A top view of an optical packaging device provided in an embodiment of the present application, Figure 3 for Figure 2 AA section view in.

[0035] Figure 2 The optical package device 10 shown is a proximity light sensor, and its detector 11 is a proximity light detector for detecting whether an object is approaching the mobile phone. For example but not limited to, the proximity light detector can be an infrared light photoelectric detector or an ultraviolet light detector. Figure 3 As shown, the optical packaging device 10 includes a photosensitive core particle 1, a packaging substrate 2 and a packaging layer 3. The photosensitive core particle 1 is bonded to the pad of the packaging substrate 2 through a lead 12 to achieve electrical connection.

[0036] In a specific implementation, the encapsulation layer 3 includes a light-transmitting encapsulation layer 31 and a light-isolating encapsulation layer 32. The encapsulation layer 3 formed by the injection molding process can encapsulate the photosensitive core particle 1 in the encapsulation substrate 2. The external pins (not shown in the figure) of the optical packaging device 10 are located on the encapsulation substrate 2 and can be electrically connected to the mainboard to realize the connection between the photosensitive core particle 1 and the external circuit.

[0037] The encapsulation layer 3 includes a light-transmitting encapsulation layer 31 and a light-isolating encapsulation layer 32. The light-transmitting encapsulation layer 31 is formed by injection molding of a light-transmitting material and covers the photosensitive area S1 of the photosensitive core particle 1. Here, the format size of the photosensitive area S1 is larger than the size of the detector 11 to form an optical field angle θ that meets the signal collection requirements. The detector 11 of the photosensitive core particle 1 is roughly located in the middle of the photosensitive area S1, and can receive reflected light through the light-transmitting encapsulation layer 31 and obtain sealed protection.

[0038] In other possible implementations, according to the parameter selection of the photosensitive core 1 in different scenarios, the format size of the photosensitive area S1 may also be substantially the same as the size of the detector 11 (not shown in the figure). This embodiment of the present application is not limited.

[0039] In a specific implementation, the light-transmitting encapsulation layer 31 can be made of a transparent resin material, for example, a resin material with a high transmittance (transmittance greater than 90%) at a wavelength of 380nm to 1200nm, preferably, a resin material with a high transmittance at a wavelength of 800nm ​​to 1200nm. For example but not limited to, the resin material can be an epoxy resin or a silicone resin.

[0040] The light-isolating encapsulation layer 32 is formed by injection molding of a light-isolating material and covers the non-photosensitive region S2 of the photosensitive core particle 1, the side of the photosensitive core particle 1 and the periphery of the lead 12, effectively isolating the crosstalk light outside the photosensitive region. In a specific implementation, the light-isolating encapsulation layer 32 can be made of black epoxy resin or silicone resin, and the non-photosensitive region S2 can be located on the periphery of the photosensitive region S1.

[0041] Furthermore, in order to obtain an effective optical field angle, the distance L between the boundary position of the photosensitive area S1 and the boundary position of the detector 11 and the thickness B of the light-isolating packaging layer 32 need to meet the optical field angle θ requirement formed by the detector, that is, 40°<θ<65°. Figure 3 As shown, in the longitudinal section of the optical packaging device 10, the thickness B of the light-isolating packaging layer 32 and the distance L between the boundary position of the photosensitive area S1 and the boundary position of the detector 11 need to satisfy the following condition: B = L / tanθ. In this way, the performance of the detector 11 and the reasonable control of the device height can be taken into account.

[0042] In this embodiment, the light-transmitting encapsulation layer 31 and the light-isolating encapsulation layer 32 can be formed in one step by a two-color injection molding process. Figure 4 , which is a molding process flow chart provided in an embodiment of the present application.

[0043] S41, first place the photosensitive core particle 1 and the packaging substrate 2 to be injected into the first mold cavity, in which the photosensitive area S1 of the photosensitive core particle 1 is covered, and the non-photosensitive area S2 of the photosensitive core particle 1, the side of the photosensitive core particle 1 and the lead are all exposed in the first injection mold cavity 4A, that is, the area of ​​the light-isolating packaging layer is exposed; then, the light-isolating material is injected into the first injection mold cavity 4A through the first injection hole 4a1 by hot injection molding, and the light-isolating material is coated on the non-photosensitive area of ​​the photosensitive core particle 1, the side of the photosensitive core particle 1 and the periphery of the lead.

[0044] In a specific implementation, the first injection cavity 4A can be formed between the photosensitive core particle 1, the packaging substrate 2 and the mold. The first injection hole 4a1 can be opened on the upper mold 4a as shown in the figure, or can be opened on the side wall of the mold forming the first injection cavity 4A as needed (not shown in the figure).

[0045] In order to ensure that the injection of the light-isolating material will not affect the photosensitive area S1, the injection molding aid 4c used to cover the photosensitive area S1 of the photosensitive core particle 1 can maintain a seal with the photosensitive core particle 1. In a possible implementation scheme, the injection molding aid 4c can be integrally formed with the upper mold 4a, or it can be made independently of the upper mold 4a and then assembled on the upper mold 4a. Furthermore, in order to avoid excessive pressure impact when the injection molding aid 4c is pressed against the photosensitive core particle 1, the buffering function can be further increased. For example, but not limited to, the part where the injection molding aid 4c is pressed against the photosensitive core particle 1 can be made of elastic material. This is not limited to the embodiments of the present application.

[0046] S42, pre-curing to form a light-isolating packaging layer 32.

[0047] S43, after the light-isolating encapsulation layer 32 is pre-cured, it is transferred into the second mold cavity, and the light-isolating encapsulation layer 32, the photosensitive area S1 of the photosensitive core particle 1 and the mold together form the second injection mold cavity 4B of the light-transmitting encapsulation layer; then, the light-transmitting material is injected into the second injection mold cavity 4B through the second injection hole 4b1 by hot injection molding, and the light-transmitting material is coated on the photosensitive area of ​​the photosensitive core particle 1.

[0048] In a specific implementation, the second injection hole 4b1 can be opened on the upper mold 4b as shown in the figure, and can also be opened on the side wall of the mold forming the second injection mold cavity 4B as needed (not shown in the figure).

[0049] S44, pre-curing again; and finally performing thermal curing to form a light-transmitting encapsulation layer 31 and a light-isolating encapsulation layer 32.

[0050] Understandably, Figure 4 The process shown is illustrated by taking a plurality of devices to be packaged as an example, and after the injection molding is completed, they can be cut to form independent packaging bodies.

[0051] Here, the encapsulation layer 3 formed by the light-transmitting encapsulation layer 31 and the light-isolating encapsulation layer 32 is coated on the periphery of the photosensitive core 1 and its bonding wires, and the photosensitive core 1 is seamlessly encapsulated on the encapsulation substrate 2 to form a gapless encapsulation body, and the encapsulation layer 3 is fully bonded to the photosensitive core 1 and the electrical connection structure.

[0052] In other possible implementations, after placing the photosensitive core particle 1 on the packaging substrate 2, the pins of the core particle can be electrically connected to the solder balls or pads of the packaging substrate by flip chip or automatic tape welding. That is to say, the electrical connection structure covered by the light-isolating packaging layer 32 is not limited to the wires formed by the wire bonding process shown in the figure. In specific implementation, it can be selected according to the overall design requirements of the device, and the embodiment of the present application does not limit it.

[0053] In order to further reduce light crosstalk, a bandpass filter film may be coated on the light-transmitting encapsulation layer 31. Figure 5 , which is a side cross-sectional view of another optical packaging device provided in an embodiment of the present application. Figure 2 and Figure 3 The differences and connections between the described embodiments, and the configurations and structures with the same functions are indicated in the figures with the same symbols.

[0054] like Figure 5 As shown, the optical packaging device 10 is also a proximity light sensor. The bandpass filter film 4 is coated on the surface of the packaging layer 3 to further isolate the influence of interference light of non-signal wavelengths on the proximity light detector, such as but not limited to the influence of external ambient light. In a specific implementation, the corresponding optical bandpass filter film 4 can be selected based on the wavelength of the emitting light device used; illustratively, for a 940nm vertical cavity surface emitting laser or light emitting diode, a 940nm bandpass filter film can be selected. I will not go into details here.

[0055] Compared with the implementation method using a glass filter, in this embodiment, the bandpass filter film 4 is directly coated on the surface of the packaging layer 3, which does not increase the overall height of the device and has controllable costs.

[0056] It should be understood that the bandpass filter film 4 can achieve the filtering function by simply covering the light-transmitting packaging layer 31. As shown in the figure, the bandpass filter film 4 covers the light-transmitting packaging layer 31 and extends to cover the light-isolating packaging layer 32. It has good processing technology and good appearance consistency.

[0057] In a specific implementation, other structures and molding processes of the optical packaging device 10 may be consistent with those of the aforementioned embodiment, and thus will not be described in detail.

[0058] In order to further improve the sensitivity of the device, the light-transmitting encapsulation layer 31 may adopt a lens structure. Figure 2 and Figure 3 The differences and connections between the described embodiments, and the configurations and structures with the same functions are indicated in the figures with the same symbols.

[0059] like Figure 6 As shown, the optical package device 10 is also a proximity light sensor. Figure 6 The light-transmitting encapsulation layer 31a shown in the figure is a convex lens. Based on the light-transmitting encapsulation layer 31a in the form of a lens, the received light is better converged to the surface of the detector 11, thereby increasing the overall amount of light entering and thus improving the sensitivity of the device.

[0060] The above embodiments describe a single-function photosensitive core 1. In other implementations, the above structure can also be used for packaging a photosensitive core with dual detectors. Figure 7 , this figure is a side sectional view of another optical packaging device provided in an embodiment of the present application. In order to clearly illustrate the difference and connection between this embodiment and the aforementioned embodiment, the same functional components and structures are indicated in the figure with the same marks.

[0061] like Figure 7 As shown, the optical package 10 is a proximity light and ambient light sensor. Figure 7 The photosensitive core 1b shown in the figure is integrated with a proximity light detector 111 and an ambient light detector 112, which are arranged at intervals on the surface of the photosensitive core 1b away from the packaging substrate. Similarly, the packaging layer 3 includes a light-transmitting packaging layer 31 and a light-isolating packaging layer 32, the light-transmitting packaging layer 31 covers the photosensitive area S1 of the photosensitive core 1b; the light-isolating packaging layer 32 covers the non-photosensitive area S2 of the photosensitive core 1b, the side of the photosensitive core 1b and the periphery of the lead 12, effectively isolating the crosstalk light outside the photosensitive area.

[0062] In a specific implementation, other structures and molding processes of the optical packaging device 10 may be consistent with those of the aforementioned embodiment, and thus will not be described in detail.

[0063] For the photosensitive core 1b integrated with the first detector (proximity light detector 111) and the second detector (ambient light detector 112), an optical filter film can also be coated on the transparent resin packaging layer. Figure 8 , this figure is a side sectional view of another optical packaging device provided in an embodiment of the present application. In order to clearly illustrate the difference and connection between this implementation scheme and the aforementioned embodiments, the same functional components and structures are indicated in the figure with the same marks.

[0064] like Figure 8As shown, the optical packaging device 10 is also a proximity light and ambient light sensor. The anti-reflection film 5 is coated on the surface of the packaging layer 3 to further reduce the reflection loss of the received light at the packaging interface, thereby reducing the attenuation of the effective signal and enhancing the effective light signal. For example, the refractive index of the resin material of the transparent package is about 1.57, and there will be about 5% reflection at the interface. The setting of the optical anti-reflection film 5 can reduce the reflectivity to less than 1%.

[0065] In a specific implementation, the anti-reflection film 5 can be determined according to the overall design requirements of the product, which will not be described in detail here.

[0066] It should be understood that the anti-reflection film 5 can achieve the light filtering function by only covering the light-transmitting packaging layer 31. As shown in the figure, the anti-reflection film 5 covers the light-transmitting packaging layer 31 and extends to cover the light-isolating packaging layer 32. It has good processing technology and good appearance consistency.

[0067] In a specific implementation, other structures and molding processes of the optical packaging device 10 may be consistent with those of the aforementioned embodiment, and thus will not be described in detail.

[0068] It is understandable that in other possible implementations, different types of controller integrated circuits may be integrated on the photosensitive chip, such as but not limited to, light intensity detectors, color temperature detectors, etc. to meet the needs of different application scenarios.

[0069] The embodiment of the present application also provides an electronic device, which includes the optical packaging device described in the above embodiment. In a specific implementation, the electronic device can be a portable or mobile device such as a mobile phone, a tablet computer, a laptop computer, a desktop computer, a gaming device, an in-vehicle electronic device, or a wearable smart device. Among them, the wearable smart device can include devices such as a smart watch or smart glasses.

[0070] It should be understood that the implementation of other functional components of the electronic device can be implemented using existing technologies, so they will not be described in detail herein.

[0071] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An optical packaging device, characterized in that: The optical packaging device includes a photosensitive core, a packaging substrate and a packaging layer, wherein the photosensitive core is arranged on the packaging substrate and is electrically connected to the packaging substrate through an electrical connection structure; the surface of the photosensitive core facing away from the packaging substrate has a photosensitive area and a non-photosensitive area, and the detector of the photosensitive core is located in the photosensitive area; the packaging layer includes a light-transmitting packaging layer and a light-isolating packaging layer, the light-transmitting packaging layer is attached to the photosensitive area of ​​the photosensitive core, the light-isolating packaging layer is attached to the non-photosensitive area of ​​the photosensitive core and the side of the photosensitive core, and the electrical connection structure is embedded in the light-isolating packaging layer.

2. The optical packaging device according to claim 1, characterized in that: The light-transmitting packaging layer is made of transparent epoxy resin or transparent silicone resin, and the light-isolating packaging layer is made of black epoxy resin or black silicone resin.

3. The optical packaging device according to claim 1 or 2, characterized in that: In the longitudinal section of the optical packaging device, the thickness dimension B of the light-isolating packaging layer and the distance L between the boundary position of the photosensitive area and the boundary position of the detector satisfy the following condition: B=L / tanθ, where θ is the optical field of view formed by the detector, and 40°<θ<65°.

4. The optical packaging device according to claim 3, characterized in that: The detector of the photosensitive core particle is a proximity light detector.

5. The optical packaging device according to claim 4, characterized in that: The light-transmitting packaging layer is a convex lens structure.

6. The optical packaging device according to claim 4, characterized in that: It also includes a bandpass filter film, which is at least covered on the surface of the light-transmitting packaging layer.

7. The optical packaging device according to claim 3, characterized in that: The detector of the photosensitive core particle includes a first detector and a second detector, and the two are arranged in the photosensitive area at an interval.

8. The optical packaging device according to claim 7, characterized in that: The first detector is a proximity light detector, and the second detector is an ambient light detector.

9. The optical packaging device according to claim 8, characterized in that: It also includes an anti-reflection film, which at least covers the surface of the light-transmitting packaging layer.

10. The optical packaging device according to claim 1 or 2, characterized in that: The light-transmitting encapsulation layer and the light-isolating encapsulation layer are formed by an injection molding process.

11. An electronic device, characterized in that The electronic device comprises an optical packaging device, and the optical packaging device is the optical packaging device according to any one of claims 1 to 10.

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