Display panel and display device

Abstract

The display panel and the display device are applied to the display device, the display device comprises the display panel and a back plate, the display panel comprises a light emitting side and a backlight side opposite to the light emitting side, and the back plate is in contact with the backlight side through at least one elastic piece structure at a preset position; the display panel further comprises at least one stress structure which is arranged on the backlight side and at least partially corresponds to the at least one elastic piece structure, and the projection of the stress structure on the back plate at least partially covers the at least one elastic piece structure.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] When designing the structure of the entire system of a mobile phone product, it is necessary to conduct electricity between the backplane where the system end is located and the display panel where the display module is located, so as to effectively conduct and connect the mobile phone product.

[0003] In the related art, metal materials are generally used for contact to achieve conductive connection. However, the metal contact method will cause a certain amount of pressure on the display panel, and this pressure will cause local mold defects to be seen on the front side of the display panel. Utility Model Content

[0004] In view of this, the present application proposes a display panel and a display device to solve or partially solve the above problems.

[0005] Based on the above purpose, the present application provides a display panel, which is applied to a display device, wherein the display device includes the display panel and a back plate, wherein the display panel includes a light emitting side and a backlight side opposite to the light emitting side, and the back plate contacts the backlight side through at least one spring structure at a preset position; the display panel also includes:

[0006] At least one stress structure is disposed on the backlight side and is disposed at least partially corresponding to the at least one spring structure.

[0007] In some exemplary embodiments, the spring structure includes a protrusion; the stress structure is configured to be disposed corresponding to the protrusion, and a projection on the back plate at least partially covers the at least one spring structure.

[0008] In some exemplary embodiments, the stress structure includes a stainless steel sheet;

[0009] The hardness of the stainless steel sheet is less than or equal to 400 Hv, and the yield strength is greater than or equal to 1000 MPa.

[0010] In some exemplary embodiments, the backlight side includes a heat dissipation film layer, which includes a stacked adhesive layer, a conductive layer and a copper surface layer, and the at least one stress structure is arranged on a side of the copper surface layer away from the light output side.

[0011] In some exemplary embodiments, the compressive force deformation value of the conductive layer is greater than or equal to 0.3.

[0012] In some exemplary embodiments, the copper surface layer is specifically a rolled copper layer.

[0013] In some exemplary embodiments, the backlight side further includes a PET layer, which is disposed on a side of the copper surface layer away from the light-emitting side, and a groove structure corresponding to the at least one stress structure is disposed at a position corresponding to the at least one stress structure.

[0014] In some exemplary embodiments, the display device includes a display area and a non-display area; the at least one stress structure is arranged in a one-to-one correspondence with the spring structure of the back plate arranged in the display area.

[0015] In some exemplary embodiments, the at least one stress structure comprises a conductive foam structure.

[0016] Based on the same concept, the present application also provides a display device, comprising a backplane and a display panel as described in any one of the above items.

[0017] As can be seen from the above, a display panel and a display device provided by the present application are applied to a display device, wherein the display device includes a display panel and a backplane, wherein the display panel includes a light-emitting side and a backlight side opposite to the light-emitting side, and the backplane contacts the backlight side through at least one spring structure at a preset position; the display panel also includes: at least one stress structure, which is arranged on the backlight side and is arranged at least partially corresponding to the at least one spring structure, and the projection on the backplane at least partially covers the at least one spring structure. The present application arranges a stress structure at a position corresponding to the spring structure of the backplane on the backlight side of the display panel, and the force applied by the spring structure to the backlight side of the display panel can be dispersed and buffered by the stress structure, so as to reduce or prevent local poor mold printing of the display panel caused by the pressure of the spring structure, thereby improving the overall yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of the product imprinting mechanism analysis in the related technology provided in the embodiment of the present application.

[0020] Figure 2 A schematic diagram of the partial structure of a display panel provided in an embodiment of the present application.

[0021] Figure 3 A schematic diagram of the design structure of the backlight side of the display panel provided in an embodiment of the present application.

[0022] Figure 4A schematic diagram of another design structure of the backlight side of the display panel provided in an embodiment of the present application. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0024] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of this specification should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements and objects appearing in front of the word cover the elements, objects and their equivalents listed after the word, without excluding other elements and objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0025] As described in the background technology section, in order to realize the conductive design between the back plate and the display panel of the mobile phone product, the conductive material selected in the related technology is generally conductive glue, conductive foam or metal material for conductive connection.

[0026] Among them, conductive glue is an adhesive that has a certain degree of conductivity after curing or drying. It can connect a variety of conductive materials together to form an electrical path between the connected materials. According to the type of conductive particles in the conductive glue, conductive glue can be divided into silver conductive glue, gold conductive glue, copper conductive glue and carbon conductive glue, etc. The most widely used is silver conductive glue. In the process of production and manufacturing, conductive glue has the problems of low conductivity, long curing time, relatively low bonding strength and high cost, and thus the application scenarios are gradually reduced.

[0027] Conductive foam refers to a flame retardant sponge wrapped with conductive cloth. After a series of treatments, it has good surface conductivity and can be easily fixed on the device to be shielded with adhesive tape. Due to its excellent cushioning performance, conductive foam can not only play a role in conductivity, but also play a role in shock absorption and buffering, and increase the mechanical properties of the product. At present, there are a large number of applications in the whole system that use conductive foam as a conductive carrier.

[0028] The method of direct conduction of metal materials has also been adopted by some complete machine customer designs. In the relevant technology, the design of the complete machine adopts the conduction method of metal shrapnel in local areas. In the complete machine, a shrapnel structure design of a metal shrapnel can be made above the metal shielding cover above the speaker or other electronic device area. After the OLED display module is assembled, the metal shrapnel will contact the copper surface layer (cooper) of the SCF on the back of the display panel to achieve conduction of different departments, enhance the overall grounding area of ​​the mobile phone system, and achieve better anti-static (ESD, Electro-Static discharge) and shielding performance. Specifically, in some specific display device products, it can generally include a display panel 100 and a backplane 200, and a plurality of shrapnel structures 210 are arranged on the backplane 200. During assembly, the display panel 100 is buckled on the backplane 200, and the shrapnel structure 210 on the backplane 200 can contact the backlight side of the display panel 100 to achieve conduction.

[0029] However, in this spring sheet structure solution, after the spring sheet structure 210 contacts the backlight side of the display panel 100, the spring sheet has a certain pressure when in contact, which will cause a certain amount of compression. This compression will cause local mold defects to be seen on the front side of the display panel 100 (that is, the light emitting side or the display side). The specific principle is as follows: Figure 1 As shown, the pressure from the back will cause the cover glass (CG) on the light-emitting side of the display panel 100 to deform, and the deformation will cause the light reflection angle to change, thereby forming a mold defect on the light-emitting side of the display panel 100. CG represents cover glass; TOCA represents top optically clear adhesive; PST represents polarizer sensor touch structure; BOCA represents bottom optically clear adhesive; panel represents display panel.

[0030] In view of this, the embodiment of the present application provides a display panel, which is applied to a display device, wherein the display device includes a display panel and a back plate, wherein the display panel includes a light-emitting side and a backlight side opposite to the light-emitting side, and the back plate contacts the backlight side through at least one spring structure at a preset position; the display panel also includes: at least one stress structure, which is arranged on the backlight side, at least partially corresponding to the at least one spring structure, and the projection on the back plate at least partially covers the at least one spring structure. The present application arranges a stress structure at a position corresponding to the spring structure of the back plate on the backlight side of the display panel, and the stress structure can be used to disperse and buffer the force applied by the spring structure to the backlight side of the display panel, so as to reduce or prevent the local poor stenciling of the display panel caused by the pressure of the spring structure, and improve the overall yield. It can be seen that the fundamental principle of improving this problem is to optimize the stenciling problem. The stenciling occurs because the pressure on the back of the display panel 100 is transmitted to the OCA (Optical Clear Adhesive) material of the cover plate (CG) after the stress is applied, and the OCA material is deformed, thereby causing the user to observe the stenciling phenomenon from the front.

[0031] after, Figure 2 A partial structural schematic diagram of a display panel provided in an embodiment of the present application is shown.

[0032] like Figure 2 As shown, the display panel 100 of this embodiment is applied to a display device, which includes the display panel 100 and a back panel 200, the display panel 100 includes a light-emitting side 110 and a backlight side 120 opposite to the light-emitting side 110, and the back panel 200 is in contact with the backlight side 120 through at least one spring structure 210 at a preset position; the display panel 100 also includes: at least one stress structure 130, which is arranged on the backlight side 120, is at least partially corresponding to the at least one spring structure 210, and the projection on the back panel 200 at least partially covers the at least one spring structure 210.

[0033] Among them, the display panel 100 is mainly used for displaying pictures, etc. Therefore, its structure generally requires a light-emitting side 110 for emitting light. The light-emitting structures such as pixels in the display panel 100 will transmit the corresponding light through the light-emitting side 110, so that the user can see the picture displayed by the display panel 100. Then the backlight side 120 is the opposite side of the light-emitting side 110, and some control chips, signal lines, drive circuits and other structures are generally set on this side. Afterwards, the backplane 200 is generally used to carry batteries, whole machine control systems, etc. In addition to being connected to each other through centralized control data lines, the backplane 200 and the display panel 100 will also be designed to be conductive at some specific positions, such as through the spring structure 210 for conduction. These set positions are generally determined when the overall design of the corresponding display device is performed. At the same time, the backplane 200 may be designed to be conductive at more than one place, and in this embodiment, there may be more than one spring structure 210 set at the preset position.

[0034] like Figure 3 , which is a schematic diagram of the design structure of the backlight side of the display panel provided in an embodiment of the present application, wherein 210 is the projection position of the spring structure 210 on the back plate 200 on the backlight side 120 of the display panel 100. It can be seen that in this embodiment, the spring structure 210 is designed at multiple positions, distributed in the display area 300 and the non-display area 400 of the entire display device.

[0035] Afterwards, if Figure 2 As shown, in this embodiment, on the backlight side 120 of the display panel 100, at the position corresponding to the spring structures 210, a stress structure 130 corresponding to the spring structure 210 can be arranged. These stress structures 130 can correspond to these spring structures 210 one by one, that is, for each spring structure 210, a corresponding stress structure 130 is arranged on the backlight side 120 of the corresponding display panel 100. It is also possible to select only some spring structures 210 according to specific application scenarios, and arrange corresponding stress structures 130 on the backlight side 120 of the corresponding display panel 100, for example, only for the spring structures 210 located in the display area 300, a corresponding stress structure 130 is arranged. That is, at least one stress structure 130 is arranged at least partially corresponding to the at least one spring structure 210. In a specific embodiment, the stress structure 130 can be arranged using a high modulus conductive material, that is, the high modulus conductive material is used to conduct electricity and disperse stress at the contact position between the spring structure 210 and the backlight side 120. Among them, the high modulus conductive material can be a stainless steel sheet (SUS steel sheet) or a stainless steel sheet with gold plating on the surface. The point stress of the spring structure 210 can be converted into surface stress by contacting the stainless steel sheet. Under the effect of the surface stress, the corresponding structure (such as SCF material) of the backlight side 120 of the display panel 100 can well reduce the effect of the front stencil.

[0036] In some embodiments, since the non-display area 400 is generally not used for display work, and the area is generally a pad bending area or an FPC area, and the area has materials such as bending sapcer, IC COVER TAPE or FPC, even if the design of the spring sheet is selected, the material stacking in these areas is thicker, and the stress applied by the spring sheet to the module is converted into a very slight deformation of the OCA material, which cannot be recognized by people on the front of the module. At the same time, since the non-display area 400 does not need to be used for display, even if there is a slight deformation, it will not be noticed. Therefore, the spring sheet structure 210 in the non-display area 400 may not be provided with a stress structure 130 at its relative position to the backlight side 120 of the display panel 100. Figure 4 As shown, Figure 3 Similarly, 210 is the projection position of the spring structure 210 on the back plate 200 on the backlight side 120 of the display panel 100. In this embodiment, the stress structure 130 is only provided in the display area 300, and no stress structure 130 is provided in the non-display area 400. That is, in some embodiments, the display device includes a display area 300 and a non-display area 400; the at least one stress structure 130 is provided in a one-to-one correspondence with the spring structure 210 provided on the back plate 200 in the display area 300.

[0037] In some other embodiments, the stress structure 130 may completely cover the spring structure 210, that is, the projection of the stress structure 130 on the back plate 200 completely covers the entire spring structure 210; Figure 2 or Figure 4 As shown, only part of the spring sheet structure 210 is covered, for example, only the protrusion 211 of the spring sheet structure 210 is corresponding, because the back plate 200 itself only needs the protrusion 211 to contact the backlight side 120 of the display panel 100, thereby reducing the area of ​​the stress structure 130. That is, the projection of at least one stress structure 130 on the back plate 200 at least partially covers the at least one spring sheet structure 210. That is, in some embodiments, the spring sheet structure 210 includes the protrusion 211; the stress structure 130 is configured to be arranged corresponding to the protrusion 211.

[0038] Afterwards, in order to further consider the risk of reducing the assembly mold printing in the assembly of the display panel 100 at the position of the whole machine spring piece, according to Figure 2 and Figure 4As shown, it can be seen that the main reason for the poor mold printing problem may be that when the raised portion 211 of the spring structure 210 contacts the backlight side 120 of the display panel 100, the stress is too concentrated due to the small contact area. When designing the stress structure 130, a solution to disperse the stress can be considered. Furthermore, in some embodiments, the stress structure 130 can be designed as a sheet structure. At the same time, in order to take into account the hardness, conductivity and other characteristics, it can be considered to be designed as a stainless steel sheet structure. The size of the stainless steel (Steel Use Stainless, SUS) sheet can be designed according to the specific design requirements and the degree of stress dispersion. For example, it can be designed into a sheet structure of 2.5mm*2.5mm.

[0039] Further, as shown in Table 1, it is a schematic diagram of some parameters of different stainless steel materials. In order to solve the technical problems of the present application, it is mainly necessary to pay attention to the hardness, yield strength and other parameters of the stainless steel material. The higher the yield strength, the greater the deformation it can withstand or the stress that can be buffered. In some embodiments, the yield strength of the selected stainless steel material needs to be greater than or equal to 1000MPa. Afterwards, in order to improve the dimensional accuracy of the stainless steel sheet, the corresponding structure on the backlight side of the display panel can be processed when die-cutting and cutting, so that the overall molding can be achieved. The dimensional accuracy reaches a very high degree. For example, when the heat dissipation film layer SCF (super clean foam, SCF) layer on the backlight side is processed and cut, the stainless steel sheet is directly bonded, so that the bonding alignment benchmark can be consistent. The lower the hardness of the stainless steel sheet, the smaller the risk of die printing on the edge of the SUS sheet during the SCF Roller bonding process. Thus, in some embodiments, there are certain requirements for the hardness of the stainless steel sheet, such as requiring the hardness of the stainless steel sheet to be less than or equal to 400Hv. Combined with Table 1, it can be seen that the hardness and yield strength of SUS 316L stainless steel material have met the corresponding requirements compared with SUS 301 and SUS 304, and can be better applied to different application scenarios. The risk of mold imprint on the edge of the stainless steel sheet during the SCF Roller bonding process is small.

[0040]

[0041] Table 1. Comparison of some parameters of different stainless steel materials

[0042] Furthermore, in the above embodiment, the heat dissipation film layer SCF layer (such as Figure 2 As shown in FIG. 1 , a stress structure 130 is arranged on the heat dissipation film layer 140. Figure 2As shown, if there is only the stress structure 130, then during the whole machine processing, local raised islands will be formed on the backlight side 120, which may have a certain impact on the overall processing. Figure 2 As shown, a PET layer 150 can be further added on the backlight side. The PET layer 150, like the stress structure 130, can be arranged on the side of the heat dissipation film layer 140 away from the light-emitting side 110. For the heat dissipation film layer 140, its specific structure can be divided into a laminated adhesive layer 141, a conductive layer 142 and a copper surface layer 143. Among them, the adhesive layer 141 can be an embo adhesive layer, and its main function is to bond the heat dissipation film layer 140 to the backlight side 120 of the display panel 100. The conductive layer 142 can be a conductive foam layer for conduction and buffering. The copper surface layer 143 is the outermost copper or copper-plated film or copper alloy film on one side, which is used for shaping, protection and conduction. After that, the conductive layer 142 and the copper surface layer 143 are sequentially laminated outward. In other words, the stress structure 130 is arranged on the side of the copper surface layer 143 away from the light-emitting side 110. That is, in some embodiments, the backlight side 120 includes a heat dissipation film layer 140, and the heat dissipation film layer 140 includes a stacked adhesive layer 141, a conductive layer 142 and a copper surface layer 143, and the at least one stress structure 130 is arranged on the side of the copper surface layer 143 away from the light output side 110.

[0043] Afterwards, since the PET layer 150 and the stress structure 130 are both disposed on the side of the copper surface layer 143 away from the light-emitting side 110, a hole structure or a groove structure corresponding to the stress structure 130 can be dug out on the PET layer 150 at the position corresponding to the stress structure 130 to support the stress structure 130. Figure 2As shown, a corresponding groove structure is dug on the PET layer 150 at the position corresponding to the stress structure 130. In specific applications, the PET layer 150 can cover the stress structure 130, thereby forming a "concave" groove structure, and if it is flush with the stress structure 130, a "hole-shaped" groove structure will be formed. Of course, the description here is based on the appearance after the structure is formed. During the processing, since the PET layer 150 can be post-processed, the filling design of PET can be performed after the stress structure 130 and the heat dissipation film layer 140 are completed, so as to solve the mold printing problem caused by the height difference during the vacuum bonding (D-lami process) of the stainless steel sheet of the stress structure 130 in the specific application scenario. It should be noted that the mold printing problem here is different from the mold printing problem to be solved by the core of this application. The mold printing problem of this application is formed by the compression of the spring structure 210, while the mold printing problem here is due to the addition of the stress structure 130 (stainless steel sheet), which may be formed at the edge of the stress structure 130 (stainless steel sheet). In this way, the PET filling design can be used to ensure that the entire surface is approximately aligned when the overall alignment is completed (i.e., the flatness is guaranteed). The mold printing is reduced to the lightest level during the module D-lami process. That is, in some embodiments, the backlight side 120 also includes a PET layer 150, which is arranged on the side of the copper surface layer 143 away from the light-emitting side 110, and a groove structure corresponding to the at least one stress structure 130 is arranged at a position corresponding to the at least one stress structure 130.

[0044] According to the above-mentioned embodiment, a heat dissipation film layer 140 is provided on the backlight side 120 of the display panel 100, and its corresponding structure is specifically introduced. Furthermore, the material of the heat dissipation film layer 140 can be improved to further reduce the mold printing phenomenon. In some embodiments, the conductive layer 142 can be further restricted, for example, selecting a foam with a higher compression force deformation (CFD) value can reduce the contact mold printing. Specifically, a material with a compression force deformation value greater than or equal to 0.3 (such as a conductive foam that meets the requirements) can be selected to form the conductive layer 142. In other embodiments, the copper surface layer 143 can also be further restricted, for example, a copper layer material with a high modulus and high yield strength is selected to reduce the contact mold printing. In a specific scenario, since electrolytic copper is generally used to make the copper surface layer 143 in the related art, in order to improve the modulus and yield strength, its manufacturing process can be adjusted to rolled copper, so that the rolled copper produced as the copper surface layer 143 meets the corresponding requirements and reduces the contact mold printing. That is, in some embodiments, the copper surface layer 143 is specifically a rolled copper layer.

[0045] Finally, in some embodiments, Figure 4 As shown, the stress structure 130 may be a conductive foam structure 160 in addition to a stainless steel sheet. Figure 4 , which is an example in which part of the stress structure 130 is a stainless steel sheet, and part of the stress structure 130 is a conductive foam structure 160. Specifically for the conductive foam structure 160, it can be a buffer foam material with a conductive function added at the position corresponding to the spring structure 210. Through the material compression buffering function of the conductive foam structure 160, the force effect of the spring structure 210 on the backlight side 120 of the display panel 100 (for example, the force on the SCF layer) can be reduced, thereby reducing the contact mold print. Since the conductive foam structure 160 itself has a conductive effect and can also play a considerable buffering role, in some embodiments, the corresponding spring structure 130 can be cancelled, that is, at this position, the display panel 100 and the backplane 200 can be contacted and connected only through the conductive foam structure 160. That is, in the design of the whole machine, the conductive foam structure 160 is used in a part of the module area to conduct between the module (display panel 100) and the system (backplane 200) of the product. With this arrangement, the structure of this area is unlikely to cause poor mold printing during the assembly of the whole machine. Of course, due to the material limitation of the conductive foam structure 160 itself, its conductivity will be lower than the metal contact solution (i.e. the solution of the stainless steel sheet and the spring structure in contact), and its specific application can be selected according to the requirements of the specific scene.

[0046] It can be seen from the above embodiments that a display panel provided by the embodiments of the present application is applied to a display device, wherein the display device includes a display panel and a backplane, wherein the display panel includes a light-emitting side and a backlight side opposite to the light-emitting side, and the backplane contacts the backlight side through at least one spring structure at a preset position; the display panel also includes: at least one stress structure, which is arranged on the backlight side and is arranged at least partially corresponding to the at least one spring structure, and the projection on the backplane at least partially covers the at least one spring structure. The present application arranges a stress structure at a position corresponding to the spring structure of the backplane on the backlight side of the display panel, and the force applied by the spring structure to the backlight side of the display panel can be dispersed and buffered by the stress structure, so as to reduce or prevent local poor mold printing of the display panel caused by the pressure of the spring structure, thereby improving the overall yield.

[0047] Based on the same concept, the present application also provides a display device, including a backplane and a display panel as described in any of the above embodiments.

[0048] The display device of the above embodiment is used to apply the corresponding display panel in the above embodiment, and has the beneficial effects of the embodiment of the corresponding display panel, which will not be described in detail here.

[0049] It can be understood that the display device is a product with an image display function, and it is generally driven by multiple driving circuits. For example, it can be: a display, a television, a billboard, a digital photo frame, a laser printer with a display function, a telephone, a mobile phone, a personal digital assistant (PDA), a digital camera, a portable camcorder, a viewfinder, a navigator, a vehicle, a large-area wall, a home appliance, an information query device (such as business query equipment and monitors of e-government, banks, hospitals, power and other departments).

[0050] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0051] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0052] Although the present application has been described in conjunction with the specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those of ordinary skill in the art based on the foregoing description. The present application embodiments are intended to encompass all such replacements, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application embodiments should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: Applied to a display device, the display device comprises the display panel and a back plate, the display panel comprises a light emitting side and a backlight side opposite to the light emitting side, the back plate contacts the backlight side via at least one spring structure at a preset position; The display panel further includes: At least one stress structure is arranged on the backlight side and is arranged at least partially corresponding to the at least one spring structure, and its projection on the back panel at least partially covers the at least one spring structure.

2. The display panel according to claim 1, characterized in that: The spring structure includes a protruding portion; the stress structure is configured to be arranged corresponding to the protruding portion.

3. The display panel according to claim 2, characterized in that: The stress structure includes stainless steel sheets; The hardness of the stainless steel sheet is less than or equal to 400 Hv, and the yield strength is greater than or equal to 1000 MPa.

4. The display panel according to claim 1, characterized in that: The backlight side includes a heat dissipation film layer, which includes an adhesive layer, a conductive layer and a copper surface layer that are stacked, and the at least one stress structure is arranged on a side of the copper surface layer away from the light output side.

5. The display panel according to claim 4, characterized in that: The compressive force deformation value of the conductive layer is greater than or equal to 0.

3.

6. The display panel according to claim 4, characterized in that: The copper surface layer is specifically a rolled copper layer.

7. The display panel according to claim 4, characterized in that: The backlight side also includes a PET layer, which is arranged on a side of the copper surface layer away from the light-emitting side, and a groove structure corresponding to the at least one stress structure is arranged at a position corresponding to the at least one stress structure.

8. The display panel according to claim 1, characterized in that: The display device comprises a display area and a non-display area; the at least one stress structure is arranged in one-to-one correspondence with the spring structure of the back plate arranged in the display area.

9. The display panel according to claim 1, characterized in that: The at least one stress structure comprises a conductive foam structure.

10. A display device, characterized in that: include: A backplane and a display panel as claimed in any one of claims 1 to 9.

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