Manipulator tin soldering and glue dispensing device

By designing a robot solder dispensing device that integrates solder and dispensing components, the problem of separation of solder and dispensing operations in common mode filter production is solved, and the automation and efficiency of the production process is achieved.

CN222818106UActive Publication Date: 2025-05-02广东成蔚电子科技有限公司
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Patent Information

Application Number
CN202421517065.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-29
Publication Date
2025-05-02
Estimated Expiration
2034-06-29

AI Technical Summary

Technical Problem

During the production process of existing common mode filters, solder and dispensing operations are separated, resulting in unauthorized production processes and inefficient efficiency.

Method used

A robot solder dispensing device is designed, integrating solder assembly and dispensing assembly into one device, including a tin furnace, flux tank, dispensing base, injection valve and glue storage cylinder, and automated operation is achieved through the robot and jaw cylinder.

Benefits of technology

The common mode filter soldering and dispensing operations are automated, which improves production efficiency and simplifies the production process.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222818106U_ABST
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Abstract

The utility model relates to a manipulator tin soldering and glue dispensing device which comprises a machine frame, a manipulator, a clamping jaw air cylinder, a tin soldering assembly and a glue dispensing assembly, the manipulator, the clamping jaw air cylinder, the tin soldering assembly and the glue dispensing assembly are arranged on the machine frame, and the clamping jaw air cylinder is connected with the manipulator through a rotating air cylinder; the tin soldering assembly comprises a tin furnace and a soldering flux groove, the soldering flux groove is located on the outer side of the tin furnace, the glue dispensing assembly comprises a glue dispensing base, an injection valve and a glue storage barrel, the glue dispensing base is arranged on the rack, the injection valve and the glue storage barrel are both arranged on the glue dispensing base, and the glue storage barrel is connected with the injection valve. According to the utility model, tin soldering and dispensing operations of the common-mode filter are integrated in one device, so that the production automation is facilitated and the production efficiency is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of common mode filter production, and more specifically, to a robot solder dispensing device. Background Art

[0002] Common mode filters usually use ferrite cores and are wound in parallel with two wires. After the copper wire is wound, the excess copper wire needs to be cut, and then soldering is required. The so-called soldering refers to the soldering of the copper wire wrapped around the end of the base for subsequent processing. In addition, the product that has been soldered needs to be processed by glue dispensing. At present, the devices for soldering and glue dispensing are separated. If the soldering process and glue dispensing process can be unified in one device, it will be conducive to the overall automation of the common mode filter production process. Therefore, it is necessary to propose an automated solder dispensing device. Utility Model Content

[0003] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a robot solder dispensing device, which integrates the soldering and dispensing operations of the common mode filter in one device, which is conducive to production automation and improved production efficiency.

[0004] The above technical objectives of the utility model are achieved through the following technical solutions:

[0005] A robot solder dispensing device comprises a frame and a robot arranged on the frame, a clamping cylinder, a solder assembly and a dispensing assembly, wherein the clamping cylinder is connected to the robot through a rotating cylinder;

[0006] The soldering assembly includes a tin furnace and a flux tank, wherein the flux tank is located outside the tin furnace; the glue dispensing assembly includes a glue dispensing base, an injection valve and a glue storage cylinder, wherein the glue dispensing base is arranged on a frame, the injection valve and the glue storage cylinder are both arranged on the glue dispensing base, and the glue storage cylinder is connected to the injection valve.

[0007] In one embodiment, the soldering assembly also includes a tin scraper plate, a horizontal tin scraper cylinder, a vertical lifting cylinder and a waste liquid recovery tank. The flux tank and the waste liquid recovery tank are arranged outside the tin furnace, the vertical lifting cylinder is on one side of the tin furnace, the horizontal tin scraper cylinder is connected to the piston part at the top of the vertical lifting cylinder, the piston part of the horizontal tin scraper cylinder is provided with a tin scraper plate, and the tin scraper plate is above the tin furnace.

[0008] In one embodiment, the waste liquid recovery box is located between the tin furnace and the vertical lifting cylinder, and the flux tank is located outside the tin furnace and away from the horizontal tin scraping cylinder.

[0009] In one embodiment, the solder assembly also includes a detection probe and a probe lifting cylinder. The probe lifting cylinder is located outside the tin furnace, the top end of the detection probe is connected to the piston of the probe lifting cylinder, and the bottom end of the detection probe is in contact with the tin liquid surface in the tin furnace to detect the height of the tin liquid.

[0010] In one of the embodiments, a liquid level sensor is also provided in the flux tank for detecting the liquid level height of the flux.

[0011] In one of the embodiments, the top surface of the dispensing base is tilted, and the injection valve is obliquely disposed on the dispensing base.

[0012] In one embodiment, the number of the dispensing components is one or two.

[0013] In summary, the utility model has the following beneficial effects:

[0014] The utility model integrates the soldering and glue dispensing operations of the common mode filter in one device, which is beneficial to production automation and improved production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the utility model;

[0016] Figure 2 It is a schematic diagram of the utility model from another angle;

[0017] Figure 3 is a schematic diagram of soldering components.

[0018] In the figure: 1. frame, 2. manipulator, 3. gripper cylinder, 4. tin furnace, 5. flux tank, 6. horizontal scraper cylinder, 7. vertical lifting cylinder, 8. scraper plate, 9. waste liquid recovery box, 10. probe lifting cylinder, 11. dispensing base, 12. injection valve, 13. glue storage cylinder, 14. detection probe. DETAILED DESCRIPTION

[0019] The utility model is described in detail below in conjunction with the accompanying drawings and embodiments.

[0020] It is worth noting that the directional words such as "upper" and "lower" involved in this article are all relative to the viewing angle of the drawings and are only for the convenience of description and cannot be understood as limitations on the technical solution.

[0021] The utility model provides a robot solder dispensing device, in which a robot 2 controls the soldering and dispensing of a common mode filter. The utility model comprises a frame 1 and a robot 2, a gripper cylinder 3, a soldering component and a dispensing component arranged on the frame 1. Figure 1-3As shown, the manipulator 2, the soldering assembly and the glue dispensing assembly are all arranged on the frame 11, and the clamping cylinder 3 is connected to the manipulator 2 through a rotating cylinder. The clamping cylinder 3 clamps and fixes the common mode filter, and the manipulator 2 drives the clamping cylinder 3 to move, thereby driving the common mode filter to move.

[0022] The soldering assembly includes a tin furnace 4 and a flux tank 5, wherein the flux tank 5 is located outside the tin furnace 4, and the glue dispensing assembly includes a glue dispensing base 11, an injection valve 12 and a glue storage cylinder 13, wherein the glue dispensing base 11 is arranged on the frame 11, the injection valve 12 and the glue storage cylinder are both arranged on the glue dispensing base 11, and the glue storage cylinder 13 is connected to the injection valve 12.

[0023] Preferably, the solder assembly also includes a tin scraper plate 8, a horizontal tin scraper cylinder 6, a vertical lifting cylinder 7 and a waste liquid recovery box 9, the flux tank 5 and the waste liquid recovery box 9 are arranged outside the tin furnace 4, the vertical lifting cylinder 7 is on one side of the tin furnace 4, the horizontal tin scraper cylinder 6 is connected to the piston member at the top of the vertical lifting cylinder 7, the piston member of the horizontal tin scraper cylinder 6 is provided with a tin scraper plate 8, and the tin scraper plate 8 is above the tin furnace 4. It is easy to understand that the role of the horizontal tin scraper cylinder 6 is to drive the tin scraper plate 8 to scrape the liquid surface of the tin liquid outward or inward, which is related to the setting position of the waste liquid recovery box 9, and the role of the vertical lifting cylinder 7 is to drive the tin scraper plate 8 to descend close to the liquid surface of the tin liquid or rise away from the liquid surface of the tin liquid. The horizontal tin scraper cylinder 6 and the vertical lifting cylinder 7 cooperate to make the tin scraper plate 8 remove the oxide layer on the surface of the tin liquid.

[0024] Preferably, the waste liquid recovery box 9 is located between the tin furnace 4 and the vertical lifting cylinder 7, and the flux tank 5 is located outside the tin furnace 4 and away from the horizontal scraping cylinder 6. This arrangement can avoid conflicts between the oxide layer removal operation and the flux wetting operation, and the oxide layer on the surface of the tin liquid is scraped off in the retraction direction by the tin scraping plate 8, and the common mode filter pin can be soaked in flux in this process.

[0025] Preferably, the solder assembly further comprises a detection probe 14 and a probe lifting cylinder 10, such as Figure 1-2 As shown, the probe lifting cylinder 10 is outside the tin furnace 4, the top end of the detection probe 14 is connected to the piston of the probe lifting cylinder 10, and the bottom end of the detection probe 14 contacts the tin liquid surface in the tin furnace 4 to detect the height of the tin liquid.

[0026] The working process of the soldering assembly is: the pins of the common mode filter pins first enter the flux tank 5, attach the flux, and then enter the tin furnace 4, the pin part is immersed in the tin liquid for soldering, and the copper wire of the pin part is protected. Before the common mode filter pins enter the tin furnace 4, the horizontal tin scraping cylinder 6 and the vertical lifting cylinder 7 cooperate to scrape the oxide layer on the surface of the tin liquid into the waste liquid recovery box 9 through the tin scraping plate 8, and then the detection probe 14 also descends to detect the position of the tin liquid level, so that the manipulator 2 can control the height of the common mode filter descent.

[0027] Preferably, a liquid level sensor is also provided in the flux tank 5 for detecting the liquid level of the flux to prevent the common mode filter from entering the tin furnace 4 without contacting the flux.

[0028] The working process of the glue dispensing assembly is: the common mode filter moves to the front of the injection valve 12, and the injection valve 12 sprays the glue in the glue storage cylinder 13 between the coil and the base. The common mode filter that has completed the glue dispensing enters the subsequent drying process to dry the glue.

[0029] The manipulator 2 of the present invention cooperates with the gripper cylinder 3. It is easy to understand that the manipulator 2 is not the innovation of the present invention, but is a common manipulator 2. As long as the manipulator 2 can achieve the functions required by the present invention, the present invention will not repeat its structure. For example, as shown in the attached figure, Figure 1-2 As shown, the manipulator 2 has two degrees of freedom of plane rotation and the part connected to the gripper cylinder 3 has the degrees of freedom of lifting and rotating. Therefore, in the preferred embodiment of the present invention, the manipulator 2 has four degrees of freedom and is a four-axis manipulator 2.

[0030] Preferably, the top surface of the glue dispensing base 11 is tilted, and the injection valve 12 is obliquely arranged on the glue dispensing base 11 .

[0031] Preferably, the number of the dispensing components is one or two. When there is only one dispensing component, the manipulator 2 is required to control the common mode filter to rotate 180° to achieve complete dispensing. When there are two dispensing components, the two dispensing components are arranged on both sides of the common mode filter movement path. It is most preferred that the two dispensing components are arranged opposite to each other to improve production efficiency.

[0032] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A robot solder dispensing device, characterized in that: It comprises a frame (1), a manipulator (2) arranged on the frame (1), a clamping cylinder (3), a soldering assembly and a dispensing assembly, wherein the clamping cylinder (3) is connected to the manipulator (2) via a rotating cylinder; The soldering assembly comprises a tin furnace (4) and a flux tank (5), wherein the flux tank (5) is located outside the tin furnace (4); the glue dispensing assembly comprises a glue dispensing base (11), an injection valve (12) and a glue storage cylinder (13), wherein the glue dispensing base (11) is arranged on a frame (1), the injection valve (12) and the glue storage cylinder are both arranged on the glue dispensing base (11), and the glue storage cylinder (13) is connected to the injection valve (12).

2. The robot solder dispensing device according to claim 1, characterized in that: The soldering assembly also includes a tin scraping plate (8), a transverse tin scraping cylinder (6), a vertical lifting cylinder (7) and a waste liquid recovery box (9); the flux tank (5) and the waste liquid recovery box (9) are arranged outside the tin furnace (4); the vertical lifting cylinder (7) is located on one side of the tin furnace (4); the transverse tin scraping cylinder (6) is connected to a piston member at the top of the vertical lifting cylinder (7); the piston member of the transverse tin scraping cylinder (6) is provided with a tin scraping plate (8); and the tin scraping plate (8) is located above the tin furnace (4).

3. The robot solder dispensing device as claimed in claim 2, characterized in that: The waste liquid recovery box (9) is located between the tin furnace (4) and the vertical lifting cylinder (7), and the soldering flux tank (5) is located outside the tin furnace (4) and away from the horizontal tin scraping cylinder (6).

4. The robot solder dispensing device according to claim 1, characterized in that: The solder assembly further comprises a detection probe (14) and a probe lifting cylinder (10). The probe lifting cylinder (10) is located outside the tin furnace (4). The top end of the detection probe (14) is connected to the piston of the probe lifting cylinder (10), and the bottom end of the detection probe (14) is in contact with the liquid surface of the tin liquid in the tin furnace (4) to detect the height of the tin liquid.

5. The robot solder dispensing device according to claim 1, characterized in that: A liquid level sensor is also provided in the soldering flux tank (5) for detecting the liquid level height of the soldering flux.

6. The robot solder dispensing device according to claim 1, characterized in that: The top surface of the glue dispensing base (11) is arranged at an inclination, and the injection valve (12) is arranged at an inclination on the glue dispensing base (11).

7. The robot solder dispensing device according to claim 1, characterized in that: The number of the dispensing components is one or two.