Polishing head structure and polishing head driving device

Abstract

The utility model discloses a polishing head structure and polishing head drive device, wherein the polishing head structure includes bearing piece, flexible film and N pressure adjustment subassembly, N > = 2, the bearing piece includes side plate and transverse plate, side plate encloses to form the hollow cavity, transverse plate cover is provided the hollow cavity one side, flexible film and side plate inner side wall fixed connection, and the pressure adjustment subassembly is provided with the pressure adjustment subassembly. The flexible film is provided with a first surface and a second surface which are oppositely arranged, and the first surface is suitable for being attached to a to-be-polished part; any pressure adjusting assembly comprises at least one piezoelectric actuator and at least one pressure detection piece, the piezoelectric actuators are distributed on the second surface, the pressure detection pieces are located between the piezoelectric actuators and the flexible film, and the pressure detection pieces are used for obtaining pressure information generated by the corresponding piezoelectric actuators on the flexible film. Through cooperative use of the piezoelectric actuator and the pressure detection piece, the accuracy of the value of the pressure applied to the flexible film is improved, so that the planarization effect of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a polishing head structure and a polishing head driving device. Background Art

[0002] Chemical mechanical polishing is a method for flattening or polishing semiconductor materials. Chemical mechanical polishing removes micron or nanometer-level materials from the wafer surface through a combination of surface chemical action and mechanical grinding, thereby flattening the wafer surface. During the flattening process, the polishing head structure directly affects the polishing efficiency, uniformity and surface quality.

[0003] There is an existing polishing head structure, including a base, a flexible film, a plurality of thin sheets, a detection module and a control module. The upper surface of the flexible film and the base are enclosed to form a sealed cavity. The plurality of thin sheets are distributed in the sealed cavity at intervals to divide the sealed cavity into a plurality of independent sub-chambers. Any sub-chamber is connected to an external gas supply source, and the gas supply source can deliver gas to each sub-chamber separately. The detection module is used to detect the air pressure value in each sub-chamber. The control module adjusts the gas delivery amount in the corresponding sub-chamber according to the detected air pressure value. During the flattening process, the lower surface of the flexible film contacts the wafer, and the control module adjusts the pressure in the corresponding chamber according to the air pressure value fed back by the detection module to achieve the polishing rate of the corresponding area on the wafer.

[0004] However, in the above-mentioned polishing head structure, since the gas is compressible, the gas pressure value in the sub-chamber cannot accurately reflect the pressure value acting on the wafer, which can easily lead to deviations in the pressure value acting on the wafer by the sub-chamber, resulting in poor flattening effect of the wafer. Utility Model Content

[0005] In view of this, the utility model provides a polishing head structure and a polishing device to solve the problem that the existing gas is compressible, so the gas pressure value in the sub-chamber cannot accurately reflect the pressure value acting on the wafer, which can easily cause the pressure value of the sub-chamber on the wafer to deviate, thereby resulting in poor flattening effect of the wafer.

[0006] The utility model provides a polishing head structure, comprising:

[0007] A bearing member, the bearing member comprises a side plate and a transverse plate, the side plates enclose a hollow cavity, and the transverse plate cover is arranged on one side of the hollow cavity;

[0008] A flexible film is fixedly connected to the inner side wall of the side plate, the flexible film has a first surface and a second surface arranged opposite to each other, and the first surface is suitable for fitting the workpiece to be polished;

[0009] N pressure adjustment components, any one of which includes at least one piezoelectric actuator and at least one pressure detection component, the piezoelectric actuators are distributed on the second surface, the pressure detection component is located between the piezoelectric actuator and the flexible film, and the pressure detection component is used to obtain pressure information generated by the corresponding piezoelectric actuator on the flexible film;

[0010] Where N≥2;

[0011] Any of the piezoelectric actuators has a polishing state in which a first pressure is generated on the flexible film and a region on the flexible film corresponding to the pressure applied by the piezoelectric actuator is deformed to generate a second pressure on the workpiece to be polished;

[0012] Any of the piezoelectric actuators has an adjustment state for adjusting the pressure acting on the flexible film according to the corresponding pressure information.

[0013] Optionally, in the above-mentioned polishing head structure, any one of the pressure adjustment components further includes a pressure plate, and the pressure plate is arranged between the flexible film and the pressure detection component; or the pressure plate is arranged between the pressure detection component and the piezoelectric actuator.

[0014] Optionally, the above-mentioned polishing head structure further includes a control module, which is arranged in the hollow cavity, and any piezoelectric actuator and any pressure detection component are electrically connected to the control module.

[0015] Optionally, the above-mentioned polishing head structure further includes a common electrode, the first electrode of any piezoelectric actuator is connected to the common electrode, the second electrode of any piezoelectric actuator is electrically connected to the control module, and the common electrode is electrically connected to the control module.

[0016] Optionally, the above-mentioned polishing head structure further includes N control modules, any one of which is arranged in the hollow cavity, and any one of which is electrically connected to all pressure detection components and all piezoelectric actuators in the corresponding pressure adjustment assembly.

[0017] Optionally, in the above-mentioned polishing head structure, the carrier also includes a partition plate, which is fixedly connected to the inner wall of the side plate to separate the hollow cavity into a first accommodating cavity and a second accommodating cavity, any one of the control modules is located in the first accommodating cavity, and any one of the control modules is fixedly connected to the partition plate, the N adjustment components and the workpiece to be polished are located in the second accommodating cavity, and any one of the piezoelectric actuators is fixedly connected to the partition plate.

[0018] Optionally, in the above-mentioned polishing head structure, the pressure detection component is a piezoelectric sensor.

[0019] Optionally, in the above-mentioned polishing head structure, the N pressure adjustment assemblies are distributed around the central axis of the hollow cavity at different angular positions; or the N pressure adjustment assemblies are distributed sequentially along the radial direction of the hollow cavity.

[0020] Optionally, in the above-mentioned polishing head structure, multiple pressure adjustment assemblies are distributed around the central axis of the hollow cavity at different angular positions to form a first pressure adjustment combination area, N pressure adjustment assemblies form M first pressure adjustment combination areas, and the M first pressure adjustment combination areas are distributed in sequence along the radial direction of the hollow cavity; wherein 2≤M<N.

[0021] The utility model also provides a polishing head driving device, comprising the above-mentioned polishing head structure, and further comprising:

[0022] A driving member, the driving member is fixedly connected to the transverse plate, and the driving member can drive the bearing member to rotate;

[0023] A rotating electrical connector, the rotating electrical connector comprising a fixed portion and a rotating portion, the fixed portion is fixedly connected to the driving member, and the rotating portion is fixedly connected to the transverse plate;

[0024] The circuit system, any control module is electrically connected to the circuit system through the rotating electrical connector.

[0025] The technical solution provided by the utility model has the following advantages:

[0026] 1. The polishing head structure provided by the utility model comprises a bearing member, a flexible film and N pressure adjustment components, wherein N≥2, the bearing member comprises a side plate and a transverse plate, the side plate encloses a hollow cavity, the transverse plate cover is arranged on one side of the hollow cavity, the flexible film is fixedly connected to the inner wall of the side plate, the flexible film has a first surface and a second surface arranged opposite to each other, the first surface is suitable for fitting the workpiece to be polished; any pressure adjustment component comprises at least one piezoelectric actuator and at least one pressure detection component, the second surface is distributed with piezoelectric actuators, the pressure detection component is located between the piezoelectric actuator and the flexible film, and the pressure detection component is used to obtain the pressure information generated by the corresponding piezoelectric actuator on the flexible film; any piezoelectric actuator has a polishing state in which a first pressure is generated on the flexible film and a region on the flexible film corresponding to the pressure applied by the piezoelectric actuator is deformed to generate a second pressure on the workpiece to be polished; any piezoelectric actuator has an adjustment state in which the pressure acting on the flexible film is adjusted according to the corresponding pressure information. The piezoelectric actuator can generate corresponding pressure according to the applied electric field. The piezoelectric actuator can also adjust the pressure applied to the flexible film in real time according to the pressure information detected by the pressure detection device. Through the coordinated use of the piezoelectric actuator and the pressure detection device, the accuracy of the pressure value applied to the flexible film is improved, thereby improving the accuracy of the pressure value applied to the wafer by the polishing head structure, thereby improving the flattening effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 It is a structural schematic diagram of the polishing head driving device provided by the utility model;

[0029] Figure 2 It is a schematic diagram of the structure in which a plurality of piezoelectric actuators provided by the utility model are electrically connected to a common electrode;

[0030] Figure 3 It is a top view of the first distribution mode of the side plate, multiple piezoelectric actuators, and N pressure-bearing plates provided by the utility model;

[0031] Figure 4 It is a top view of the second distribution mode of the side plate, multiple piezoelectric actuators, and N pressure-bearing plates provided by the utility model;

[0032] Figure 5A top view of a third distribution mode of the side plates, multiple piezoelectric actuators, and N pressure-bearing plates provided by the utility model;

[0033] Figure 6 A top view of a fourth distribution mode of the side plates, the plurality of piezoelectric actuators, and the N pressure-bearing plates provided by the utility model.

[0034] Description of reference numerals:

[0035] 1. Carrying member; 11. Side plate; 111. Hollow cavity; 1111. First accommodating cavity; 1112. Second accommodating cavity; 12. Horizontal plate; 13. Partition plate;

[0036] 21. piezoelectric actuator; 211. common electrode; 212. second electrode; 213. piezoelectric ceramic; 22. pressure detection element; 23. pressure bearing plate;

[0037] 3. Flexible film;

[0038] 4. Parts to be polished;

[0039] 5. Control module;

[0040] 6. driving member; 61. driving shaft;

[0041] 7. Rotating electrical connector;

[0042] 81. Power supply; 82. Host computer; 83. First cable; 84. Second cable; 85. Third cable; 86. Fourth cable. DETAILED DESCRIPTION

[0043] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0044] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0045] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0047] Example 1

[0048] The polishing head structure provided in this embodiment is as follows: Figures 1 to 6 As shown, it includes a carrier 1, a flexible film 3 and N pressure adjustment components, wherein N ≥ 2, the carrier 1 includes a side plate 11 and a transverse plate 12, the side plate 11 surrounds a hollow cavity 111, and the transverse plate 12 is covered on one side of the hollow cavity 111; the flexible film 3 is fixedly connected to the inner wall of the side plate 11, and the flexible film 3 has a first surface and a second surface arranged oppositely, and the first surface is suitable for fitting the workpiece 4 to be polished; any pressure adjustment component includes at least one piezoelectric actuator 21 and at least one pressure detection component 22, and the second surface is distributed with piezoelectric actuators 21, the pressure detection member 22 is located between the piezoelectric actuator 21 and the flexible film 3, and the pressure detection member 22 is used to obtain the pressure information generated by the corresponding piezoelectric actuator 21 on the flexible film 3; any piezoelectric actuator 21 has the function of generating a first pressure on the flexible film 3, and causing the area on the flexible film 3 corresponding to the pressure applied by the piezoelectric actuator 21 to deform, so as to generate a polishing state of a second pressure on the polishing workpiece 4; any piezoelectric actuator 21 has the function of adjusting the pressure acting on the flexible film 3 according to the corresponding pressure information.

[0049] Specifically, the workpiece 4 to be polished is a filler layer on a wafer or a substrate (semiconductor). In this embodiment, the workpiece 4 to be polished can be a wafer; the side plate 11 is annular, and the shape of the side plate 11 is adapted to the shape of the wafer. The side plate 11 is a retaining ring, and the retaining ring is used to limit the wafer. Preferably, the side plate 11 is annular, that is, the hollow cavity 111 is cylindrical, and the cross plate 12 is located above the side plate 11, and the cross plate 12 covers the opening on one side of the hollow cavity 111. Preferably, the side plate 11 is connected to the top of the cross plate 12, and the connection method can be one-piece molding, welding, bolt connection, gluing or other fixed connection, and the cross plate The shape of 12 is adapted to the shape of the wafer, and the preferred horizontal plate 12 is circular. The pressure detection member 22 can be a strain gauge or a piezoelectric sensor or other common pressure detection devices. The flexible film 3 is made of a flexible material, and the flexible film 3 is fixedly connected to the inner wall of the side plate 11. The shape of the flexible film 3 is adapted to the cross-sectional shape of the hollow cavity. The preferred flexible film 3 is circular, and the flexible film 3 blocks the hollow cavity; when the polishing head structure is working, the workpiece 4 to be polished is placed from the opening on the side of the hollow cavity 111 away from the horizontal plate 12. At this time, the first surface of the flexible film 3 is in contact with the workpiece 4 to be polished. Figure 1 Taking the perspective of as an example, the first surface is the upper surface of the flexible film 3, and the second surface is the lower surface of the flexible film 3, that is, the lower surface of the flexible film 3 is in contact with the upper surface of the workpiece 4 to be polished, and N pressure adjustment components are distributed on the upper surface of the flexible film 3. The N pressure adjustment components are used to adjust the pressure of different areas of the workpiece 4 to be polished. By providing an electric field to the piezoelectric actuator 21, the piezoelectric material in the piezoelectric actuator 21 is deformed to generate pressure. The piezoelectric actuator 21 directly applies pressure after applying the electric field. The piezoelectric actuator 21 transmits the pressure through an electrical signal instead of air pressure, thereby improving the pressure response speed of the polishing head structure, and the pressure output by the piezoelectric actuator 21 has high precision. The piezoelectric actuator 21 can also adjust the pressure output by the corresponding pressure detection component 22, further improving the pressure precision acting on the workpiece 4 to be polished, so that the polishing head structure can accurately and quickly adjust the pressure of different areas of the workpiece 4 to be polished, so as to improve the polishing precision and uniformity, and then the polishing head structure can adapt to the surface conditions of different workpieces 4 to be polished, and can quickly achieve the set polishing effect. The flexible film 3 can buffer the pressure generated by the piezoelectric actuator 21 , thereby preventing the piezoelectric actuator 21 from generating a drastic change in the pressure on the workpiece 4 to be polished, thereby preventing the polishing effect from being poor.

[0050] In the polishing head structure provided in this embodiment, the piezoelectric actuator 21 can generate corresponding pressure according to the applied electric field. The piezoelectric actuator 21 can also adjust the pressure applied to the flexible film 3 in real time according to the pressure information detected by the pressure detection component 22. Through the coordinated use of the piezoelectric actuator 21 and the pressure detection component 22, the accuracy of the pressure value applied to the flexible film 3 is improved, thereby improving the accuracy of the pressure value applied to the wafer by the polishing head structure, thereby improving the flattening effect of the wafer.

[0051] like Figure 1 , Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown, the polishing head structure provided in this embodiment, each pressure adjustment component includes a pressure plate 23, the pressure plate 23 is a rigid material, the pressure plate 23 can move up and down in the hollow cavity 111, the pressure plate 23 is arranged between the flexible film 3 and the pressure detection member 22, the lower surface of the pressure plate 23 is in contact with the upper surface of the flexible film 3, the sum of the areas of the lower surfaces of N pressure plates 23 is less than or equal to the area of ​​the upper surface of the flexible film 3, the upper surface of the pressure plate 23 is distributed with the pressure detection member 22, and the piezoelectric actuator 21 and the pressure detection member 22 are arranged one by one. The piezoelectric actuator 21 can be fixedly connected or abutted with the corresponding pressure detecting component 22. The pressure generated by the piezoelectric actuator 21 acts on the corresponding pressure detecting component 22, so that the pressure detecting component 22 generates pressure on the pressure plate 23, thereby causing the lower surface of the pressure plate 23 to generate pressure on the upper surface of the flexible film 3. The area on the flexible film 3 corresponding to the pressure applied by the pressure plate 23 is deformed, so as to apply pressure to the area on the polishing part 4 corresponding to the deformation of the flexible film 3. The deformation of the flexible film 3 can buffer the pressure and avoid drastic changes in pressure between adjacent pressure plates 23. The entire lower surface of the pressure plate 23 is a pressure surface, and the pressure surface of the pressure plate 23 is larger than the pressure surface of a single piezoelectric actuator 21. Therefore, by setting the pressure plate 23, the number of piezoelectric actuators 21 can be reduced, thereby reducing costs and improving the economic benefits of the polishing head structure. Of course, the number of piezoelectric actuators 21 distributed on the pressure plate 23 can be adjusted as needed, and the pressure plate 23 can be provided with multiple piezoelectric actuators 21 to increase the uniformity of the pressure applied by the pressure plate 23 to the flexible film 3.

[0052] In an alternative implementation, the pressure plate 23 is arranged between the pressure detection member 22 and the piezoelectric actuator 21, and a pressure detection member 22 is distributed on the lower surface of the pressure plate 23. Of course, multiple pressure detection members 22 can also be arranged on the lower surface of the pressure plate 23. A piezoelectric actuator 21 is distributed on the upper surface of the pressure plate 23. Of course, multiple piezoelectric actuators 21 can also be arranged on the upper surface of the pressure plate 23. The piezoelectric actuator 21 generates pressure on the pressure plate 23, so that the pressure plate 23 generates pressure on the pressure detection member 22, so that the pressure detection member 22 generates pressure on the flexible film 3, and the area on the flexible film 3 corresponding to the pressure detection member 22 is deformed, so as to apply pressure to the area on the polishing part 4 corresponding to the deformation of the flexible film 3.

[0053] like Figure 1As shown, the polishing head structure provided in this embodiment further includes a control module 5 , which is a microcontroller. The control module 5 is disposed in the hollow cavity 111 , and any piezoelectric actuator 21 and any pressure detection component 22 are electrically connected to the control module 5 .

[0054] like Figure 1 and Figure 2 As shown, the polishing head structure provided in this embodiment also includes a common electrode 211, and any piezoelectric actuator 21 also includes a piezoelectric ceramic 213, a first electrode and a second electrode 212. The first electrode and the second electrode 212 are respectively located at the two ends of the piezoelectric ceramic 213, and are respectively electrically connected to the two ends of the piezoelectric ceramic 213; the first electrode of any piezoelectric actuator 21 is connected to the common electrode 211, and the second electrode 212 of any piezoelectric actuator 21 is electrically connected to the control module 5, and the common electrode 211 is electrically connected to the control module 5. By setting the common electrode 211, the complexity of wiring is reduced. Of course, multiple pressure detection components 22 can also be electrically connected to the control module 5 in the form of a common electrode.

[0055] In an alternative implementation, it includes N control modules 5, any one of which is disposed in the hollow cavity 111, the N control modules 5 correspond one-to-one to the N pressure adjustment components, and any one of which is electrically connected to all pressure detection components 22 and all piezoelectric actuators 21 in the corresponding pressure adjustment component.

[0056] like Figure 1 As shown, the polishing head structure provided in this embodiment, the carrier 1 also includes a partition plate 13, the partition plate 13 is located in the hollow cavity 111, the partition plate 13 is fixedly connected to the inner wall of the side plate 11, so as to separate the hollow cavity 111 into a first accommodating cavity 1111 and a second accommodating cavity 1112, any one of the control modules 5 is located in the first accommodating cavity 1111, and any one of the control modules 5 is fixedly connected to the upper surface of the partition plate 13, N adjustment components and the workpiece 4 to be polished are located in the second accommodating cavity 1112, and any one of the piezoelectric actuators 21 is fixedly connected to the lower surface of the partition plate 13.

[0057] like Figure 3 As shown, in the polishing head structure provided in this embodiment, N pressure adjustment components are distributed around the central axis of the hollow cavity 111 at different angular positions. Figure 3 Taking the perspective of as an example, the N pressure plates 23 are all fan-shaped, and the N pressure plates 23 are distributed around the center of the flexible film 3 at different angular positions to cover the upper surface of the flexible film 3. Of course, the pressure plates 23 can also be arc-shaped or other shapes to achieve pressure control on a large area of ​​the polishing workpiece 4.

[0058] In an alternative embodiment, Figure 4As shown, N pressure adjustment components are distributed in sequence along the radial direction of the hollow cavity 111, wherein each pressure plate 23 is in a circular shape, and the N circular rings are distributed in the radial direction of the flexible film 3. The centers of the N circular rings are all points on the central axis of the hollow cavity 111, and the N circular rings are concentric, and the surface areas of the N pressure plates 23 increase in sequence along the radial direction of the flexible film 3. By distributing the N pressure adjustment components in the above manner, the radial pressure control and the removal speed control on the workpiece 4 to be polished can be achieved.

[0059] In another alternative implementation, Figure 5 Taking the perspective of as an example, six pressure adjustment components are distributed around the central axis of the hollow cavity 111 at different angular positions to form a first pressure adjustment combination area. The number of pressure adjustment components in each first pressure adjustment combination area can be adjusted as needed. The number of pressure adjustment components in each first pressure adjustment combination area is the same. N pressure adjustment components form M first pressure adjustment combination areas. At this time, M is N / 6. The M first pressure adjustment combination areas are distributed in sequence along the radial direction of the hollow cavity 111. The area of ​​the M first pressure adjustment combination areas gradually increases along the radial direction of the hollow cavity 111; that is, the area of ​​each pressure plate increases along the radial direction. In the first pressure adjustment combination area located in the center, the pressure plates 23 corresponding to each pressure adjustment component are all fan-shaped, and the six fan-shaped ones are surrounded by a circle. In the remaining first pressure adjustment combination areas, the pressure plates 23 corresponding to each pressure adjustment component are all arc-shaped. The six pressure plates in the same first pressure adjustment combination area are surrounded by a ring shape, and the shape of each pressure plate 23 is also adjusted as needed. The polishing head structure can realize pressure control on a small area of ​​the workpiece 4 to be polished, and has a good effect on uneven surface thickness of the workpiece 4 to be polished.

[0060] In a third alternative embodiment, Figure 6Taking the perspective as an example, the first pressure adjustment combination area located in the center is formed by six pressure adjustment components distributed around the central axis of the hollow cavity 111 at different angular positions. The number of pressure adjustment components in each first pressure adjustment combination area can be adjusted as needed. The number of pressure adjustment components in each pressure adjustment combination area can be the same or different. The number of pressure adjustment components in the first pressure adjustment combination area located in the outermost circle is greater than the number of pressure adjustment components in the first pressure adjustment combination area located in the center. N pressure adjustment components form M pressure adjustment combination areas, where ≤M<N. The number of pressure adjustment components in each first pressure adjustment combination area increases along the radial direction of the hollow cavity 111 to ensure that a set number of pressure adjustment components are present in the same area. In the first pressure adjustment combination area located in the center, the pressure plates 23 corresponding to each pressure adjustment component are all fan-shaped, and the six fan-shaped components form a circle. In the remaining first pressure adjustment combination areas, the pressure plates 23 corresponding to each first pressure adjustment combination area are all arc-shaped, and all pressure plates in the same pressure adjustment combination area form a circular ring. The polishing head structure can realize pressure control in a certain area of ​​the polishing part 4, thereby realizing precise polishing of the surface of the polishing part 4.

[0061] The polishing head structure provided in this embodiment has an installation process as described below:

[0062] First, the side panel 11 and the cross panel 12 are integrally formed by injection molding or D printing, and then the control module 5 is fixedly connected to the upper surface of the partition plate 13 by bolts or gluing, and then the N first electrodes are electrically connected to the common electrode 211, and then the common motor and the N second electrodes 212 are connected to the respective ports of the control module 5 by cables, and a cable channel is provided on the partition plate 13 for the cables to pass through, and then the N piezoelectric actuators 21 are fixedly connected to the lower surface of the partition plate 13 by bolts or gluing, and then the partition plate 13 is fixedly connected to the inner wall of the side panel 11 by welding or gluing, and then the N pressure detection components 22 are pasted one by one on the piezoelectric actuator 21, and then the pressure plate 23 is pasted to the corresponding pressure detection components 22, and then the N pressure detection components 22 are distributed on the flexible film 3 to complete the installation.

[0063] Example 2

[0064] The polishing head driving device provided in this embodiment includes the above-mentioned polishing head structure, and also includes a driving member 6, a rotating electrical connection member 7 and a circuit system. The driving member 6 is a motor, and the driving member 6 is fixedly connected to the upper surface of the horizontal plate 12 through a driving shaft 61. The driving member 6 is used to drive the bearing member to rotate. The rotating electrical connection member 7 includes a fixed part and a rotating part. The rotating part is fixedly connected to the outer wall of the horizontal plate 12, and the fixed part is fixedly connected to the driving member 6. The fixing method can be a threaded connection, a bolt connection or other common fixing methods. The rotating electrical connection member 7 is made of conductive material, and the rotating The electrical connector 7 is a slip ring, and the circuit system includes a power supply 81 and a host computer 82. The control module 5 is connected to the rotating part through a first cable 83, and the fixed part is connected to the power supply 81 through a third cable 85. The control module 5 is connected to the rotating part through a second cable 84, and the fixed part is connected to the host computer 82 through a fourth cable 86. The host computer 82 communicates with the control module 5 through the second cable 84, the rotating electrical connector 7, and the fourth cable 86. The power supply 81 provides power to the control module through the first cable 83, the rotating electrical connector 7, and the third cable 85.

[0065] The polishing head driving device provided in this embodiment has high polishing accuracy and high polishing efficiency, thereby improving the planarization effect of the polishing device.

[0066] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A polishing head structure, characterized in that: include: A carrier (1), the carrier (1) comprising a side plate (11) and a transverse plate (12), the side plate (11) enclosing a hollow cavity (111), and the transverse plate (12) covering one side of the hollow cavity (111); A flexible film (3) fixedly connected to the inner wall of the side plate (11), the flexible film (3) having a first surface and a second surface arranged opposite to each other, the first surface being suitable for fitting the workpiece (4) to be polished; N pressure adjustment components, any one of which comprises at least one piezoelectric actuator (21) and at least one pressure detection component (22), the piezoelectric actuator (21) being distributed on the second surface, the pressure detection component (22) being located between the piezoelectric actuator (21) and the flexible film (3), and the pressure detection component (22) being used to obtain pressure information generated by the corresponding piezoelectric actuator (21) on the flexible film (3); Where N≥2; Any of the piezoelectric actuators (21) has a polishing state in which a first pressure is generated on the flexible film (3), and a region on the flexible film (3) corresponding to the pressure applied by the piezoelectric actuator (21) is deformed, so as to generate a second pressure on the workpiece to be polished (4); Any one of the piezoelectric actuators (21) has an adjustment state for adjusting the pressure acting on the flexible film (3) according to the corresponding pressure information.

2. The polishing head structure according to claim 1, characterized in that: Any one of the pressure adjustment components further comprises a pressure-bearing plate (23), wherein the pressure-bearing plate (23) is arranged between the flexible film (3) and the pressure detection component (22); or the pressure-bearing plate (23) is arranged between the pressure detection component (22) and the piezoelectric actuator (21).

3. The polishing head structure according to claim 2, characterized in that: It also includes a control module (5) which is arranged in the hollow cavity (111), and any piezoelectric actuator (21) and any pressure detection element (22) are electrically connected to the control module (5).

4. The polishing head structure according to claim 3, characterized in that: It also includes a common electrode (211), the first electrode of any piezoelectric actuator (21) is connected to the common electrode (211), the second electrode (212) of any piezoelectric actuator (21) is electrically connected to the control module (5), and the common electrode (211) is electrically connected to the control module (5).

5. The polishing head structure according to claim 2, characterized in that: It also includes N control modules (5), any one of which is arranged in the hollow cavity (111), and any one of which is electrically connected to all pressure detection components (22) and all piezoelectric actuators (21) in the corresponding pressure adjustment assembly.

6. The polishing head structure according to any one of claims 3 to 5, characterized in that: The carrier (1) further comprises a partition plate (13), wherein the partition plate (13) is fixedly connected to the inner wall of the side plate (11) so as to separate the hollow cavity (111) into a first accommodating cavity (1111) and a second accommodating cavity (1112); any one of the control modules (5) is located in the first accommodating cavity (1111), and any one of the control modules (5) is fixedly connected to the partition plate (13); the N pressure adjustment assemblies and the workpiece to be polished (4) are located in the second accommodating cavity (1112), and any one of the piezoelectric actuators (21) is fixedly connected to the partition plate (13).

7. The polishing head structure according to claim 6, characterized in that: The pressure detection element (22) is a piezoelectric sensor.

8. The polishing head structure according to claim 7, characterized in that: The N pressure adjustment components are distributed around the central axis of the hollow cavity (111) at different angular positions; or the N pressure adjustment components are distributed in sequence along the radial direction of the hollow cavity (111).

9. The polishing head structure according to claim 7, characterized in that: The plurality of pressure adjustment components are distributed around the central axis of the hollow cavity (111) at different angular positions to form a first pressure adjustment combination area, N of the pressure adjustment components form M of the first pressure adjustment combination areas, and the M of the first pressure adjustment combination areas are distributed in sequence along the radial direction of the hollow cavity (111); wherein 2≤M<N.

10. A polishing head driving device, characterized in that: The polishing head structure according to any one of claims 1 to 9 further comprises: A driving member (6), wherein the driving member (6) is fixedly connected to the transverse plate (12), and the driving member (6) is capable of driving the bearing member (1) to rotate; A rotating electrical connector (7), the rotating electrical connector (7) comprising a fixed portion and a rotating portion, the fixed portion being fixedly connected to the driving member (6), and the rotating portion being fixedly connected to the transverse plate (12); The circuit system, any one of the control modules (5) is electrically connected to the circuit system via the rotating electrical connector (7).

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