Gas uniform distribution structure and chemical vapor deposition equipment
By designing a gas uniform distribution structure in the chamber of the chemical vapor deposition device, using a plurality of first air vents and fewer second air vents, the problem of uneven gas distribution is solved, and the uniformity and quality of the coating layer are improved.
Patent Information
- Application Number
- CN202421786360.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-25
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-25
AI Technical Summary
In the existing chemical vapor deposition equipment, the gas distribution in the reaction chamber is uneven, resulting in poor uniformity of the coating layer.
A gas uniform distribution structure is designed, by evenly distributing the branch pipe body in the chamber, and more first air outlets are provided on one side of the branch pipe body facing the air outlet, and fewer second air outlets are provided on the opposite side to ensure that the flow rate and distribution of the gas in the chamber are evenly distributed.
By improving the uniformity of gas distribution, the uniformity and quality of the coating layer are improved, and the problem of poor uniformity of the coating layer caused by uneven gas distribution is solved.
Smart Images
Figure CN222821642U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of material preparation, and in particular to a gas uniform distribution structure and a chemical vapor deposition device. Background Art
[0002] Catalytic chemical vapor deposition equipment uses a special metal wire heated by direct current in a vacuum chamber to maintain the temperature of the metal wire within a preset range and introduce reaction gas. The reaction gas contacts the high-temperature metal wire and undergoes a catalytic cracking reaction, generating a variety of highly active "uncharged" groups. These active groups are randomly emitted from the surface of the hot wire to the surroundings and react on the surface of the substrate to form a thin film. In conventional chemical vapor deposition equipment, the reaction gas is generally introduced from one side of the chamber, and the reacted gas in the chamber is then extracted through a vacuum device, resulting in uneven gas distribution between the gas introduction area and the exhaust area in the chamber, which leads to poor uniformity of the deposited film. Utility Model Content
[0003] The main purpose of the present application is to propose a gas uniform distribution structure and a chemical vapor deposition device, aiming to solve the problem of poor uniformity of the coating layer produced by the existing chemical vapor deposition device.
[0004] To achieve the above objectives, the gas uniform distribution structure proposed in this application includes:
[0005] A chamber, wherein a gas extraction port is provided on one side of the chamber;
[0006] A plurality of branch tube bodies are evenly distributed in the chamber, and one end of each branch tube body is used to connect with an external gas supply device; a plurality of first air outlet holes are provided on the side of the branch tube body facing the air suction port, and a second air outlet holes are provided on the side of the branch tube body away from the air suction port, and the number of the first air outlet holes is greater than the number of the second air outlet holes.
[0007] In one embodiment, the plurality of first air outlet holes are evenly distributed along the length direction of the branch pipe body; and / or,
[0008] The plurality of second air outlet holes are evenly distributed along the length direction of the branch pipe body.
[0009] In one embodiment, the number of the first air outlet holes is twice the number of the second air outlet holes; and / or,
[0010] The inner wall of one side of the chamber provided with the air extraction port is used for mounting the first substrate, and the inner wall of one side of the chamber away from the air extraction port is used for fixing the second substrate.
[0011] In one embodiment, the gas uniform distribution structure also includes a main body, one end of the branch body is connected to the main body; a plurality of branch bodies are arranged along the length direction of the branch body; one end of the main body extends out of the chamber and is connected to the external gas supply device.
[0012] In one embodiment, the main pipe body is arranged outside the chamber, and one end of the branch pipe body is connected to the main pipe body through a connecting pipe.
[0013] In one embodiment, the main pipe body and the branch pipe body are perpendicular to each other; and / or,
[0014] The first air outlet hole and the second air outlet hole are both circular holes.
[0015] In one embodiment, one end of the main pipe body away from the branch pipe body is connected to a plurality of air supply pipes, and the air supply pipes are respectively connected to different external air supply devices.
[0016] In one embodiment, a first valve body is disposed on the main pipe; and / or,
[0017] A second valve body is provided on the air supply pipe.
[0018] In one embodiment, the gas uniform distribution structure further includes a plurality of heating wires, and the heating wires are arranged between adjacent branch pipe bodies.
[0019] The present application also proposes a chemical vapor deposition device, comprising the gas uniform distribution structure described above.
[0020] The technical solution of the present application is to evenly distribute a plurality of branch tube bodies in the chamber, and set a plurality of first air outlet holes on the side of the branch tube body facing the exhaust port, and set a second air outlet hole on the side of the branch tube body away from the exhaust port. By making the number of the first air outlet holes greater than the number of the second air outlet holes, the gas outlet on the side of the branch tube body facing the exhaust port is greater than the gas outlet on the opposite side. Therefore, when the exhaust port is connected to the exhaust device to extract the gas in the wall, the gas flow speed on the side of the chamber where the exhaust port is provided is relatively large. By increasing the number of the first air outlet holes on the side of the branch tube body facing the exhaust port, the situation of poor gas distribution uniformity caused by unilateral exhaust can be improved, and the uniformity of gas distribution in the chamber can be improved. When the gas uniform distribution structure is used in chemical vapor deposition equipment, it is beneficial to improve the uniformity of the coated layer and improve the quality of the coated layer. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.
[0022] Figure 1 A schematic diagram of the structure of an embodiment of a gas equal distribution structure provided in the present application;
[0023] Figure 2 A schematic diagram of the structure of the branch pipe body, the main pipe body, and the heating wire of an embodiment of the gas equal distribution structure provided in the present application;
[0024] Figure 3 This is a schematic diagram of the structure of the branch pipe of an embodiment of the gas equal distribution structure provided in the present application.
[0025] Description of Figure Numbers:
[0026] 1. Chamber; 11. Vacuum port; 2. Branch pipe body; 21. First air outlet; 22. Second air outlet; 3. Main pipe body; 4. Connecting pipe; 5. Air supply pipe; 6. First valve body; 7. Second valve body; 8. Heating wire; 9. First substrate; 10. Second substrate.
[0027] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0029] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0030] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.
[0031] The present application proposes a gas uniform distribution structure.
[0032] See also Figures 1 to 3 In one embodiment of the present application, the gas uniform distribution structure includes a chamber 1 and a plurality of branch tube bodies 2, a gas extraction port 11 is provided on one side of the chamber 1; the plurality of branch tube bodies 2 are evenly distributed in the chamber 1, and one end of the branch tube body 2 is used to connect to an external gas supply device; a plurality of first gas outlet holes 21 are provided on the side of the branch tube body 2 facing the gas extraction port 11, and a second gas outlet hole 22 is provided on the side of the branch tube body 2 away from the gas extraction port 11, and the number of the first gas outlet holes 21 is greater than the number of the second gas outlet holes 22.
[0033] In the above structure, a plurality of branch tube bodies 2 are evenly distributed in the chamber 1, and a plurality of first air outlet holes 21 are provided on the side of the branch tube body 2 facing the exhaust port 11, and a second air outlet hole 22 is provided on the side of the branch tube body 2 away from the exhaust port 11. By making the number of the first air outlet holes 21 greater than the number of the second air outlet holes 22, the gas outlet volume on the side of the branch tube body 2 facing the exhaust port 11 is greater than the gas outlet volume on the opposite side. Therefore, when the exhaust port 11 is connected to the exhaust device to extract the gas in the wall, the gas flow velocity on the side of the chamber 1 where the exhaust port 11 is provided is relatively large. By increasing the number of the first air outlet holes 21 on the side of the branch tube body 2 facing the exhaust port 11, the situation of poor gas distribution uniformity caused by unilateral exhaust can be improved, and the uniformity of gas distribution in the chamber 1 can be improved. When the gas uniform distribution structure is used in chemical vapor deposition equipment, it is beneficial to improve the uniformity of the deposited film layer and improve the quality of the deposited film layer.
[0034] In one embodiment, a plurality of first gas outlet holes 21 are evenly distributed along the length direction of the branch tube body 2, and a plurality of second gas outlet holes 22 are evenly distributed along the length direction of the branch tube body 2. By evenly distributing a plurality of first gas outlet holes 21 along the length direction of the branch tube body 2, the uniformity of gas inputted into the chamber 1 from the side of the branch tube body 2 toward the gas extraction port 11 can be improved; similarly, by evenly distributing the second gas outlet holes 22 along the length direction of the branch tube body 2, the uniformity of gas inputted into the chamber 1 from the side of the branch tube body 2 away from the gas extraction port 11 can be improved.
[0035] In one embodiment, the number of the first air outlets 21 is twice the number of the second air outlets 22. When the number of the first air outlets 21 is N, the number of the second air outlets 22 is N / 2; illustratively, when the number of the first air outlets is 10, the number of the second air outlets 22 is 5, and by increasing the number of air outlets on the side of the branch tube body 2 facing the air inlet 11, the amount of gas on the side of the branch tube body 2 facing the air inlet 11 is increased, and gas is replenished around the air inlet 11 in the chamber 1 in time, so that the gas density around the air inlet 11 is kept close to the gas density on the other side, thereby improving the uniformity of the gas in the chamber 1.
[0036] In one embodiment, the inner wall of the chamber 1 provided with the gas extraction port 11 is used to mount the first substrate, and the inner wall of the chamber 1 away from the gas extraction port 11 is used to fix the second substrate. By improving the uniformity of the gas in the chamber 1, the uniformity of the thickness of the film formed on the first substrate 9 and the second substrate 10 can be improved.
[0037] In one embodiment, the gas uniform distribution structure further includes a main body 3 and an external gas supply device, one end of the branch body 2 is connected to the main body 3; a plurality of branch bodies 2 are arranged along the length direction of the branch body 2; one end of the main body 3 extends out of the chamber 1 and is connected to the external gas supply device. The main body 3 is used as the main passage for gas to be input from the external gas supply device into the chamber 1, wherein the main body 3 is responsible for receiving gas from the external gas supply device and delivering the gas to each branch body 2, and the branch body 2 is a diversion pipe extending into the chamber 1; each branch body 2 is arranged along the length direction of the branch body 2, and is used to distribute gas from the main body 3 to different areas in the chamber 1, thereby improving the uniformity of gas distribution in the chamber 1. The external gas supply device is the source of gas, which can be a gas cylinder, an air compressor or other gas generation or storage equipment.
[0038] In one embodiment, the main body 3 is arranged outside the chamber 1, and one end of the branch body 2 is connected to the main body 3 through a connecting pipe 4. One end of the branch body 2 is connected to the main body 3 through the connecting pipe 4, and the other end of the main body 3 is connected to the external gas supply device to ensure that the gas can flow smoothly. The main body 3 is arranged outside the chamber 1, which helps to reduce the structural complexity in the chamber 1. And because the main body 3 and the connecting pipe 4 are located outside the chamber 1, inspection and maintenance work are easier to operate. By using the connecting pipe 4, the number of branch bodies 2 can be increased or decreased as needed, thereby adjusting the gas distribution density and distribution range.
[0039] In one embodiment, the main body 3 and the branch body 2 are perpendicular to each other. The main body 3 and the branch body 2 are arranged vertically, which helps the gas to flow evenly from the main body 3 to each branch body 2, thereby achieving more effective gas distribution. The main body 3 and the branch body 2 are arranged to be vertically connected, so that the branch body 2 can be more easily connected to or disconnected from the main body 3, thus having the advantage of easier installation and maintenance. In addition, the vertical layout of the main body 3 and the branch body 2 can make more compact use of the space in the chamber 1.
[0040] In one embodiment, the first gas outlet 21 and the second gas outlet 22 are both circular holes. The circular first gas outlet 21 and the second gas outlet can provide a more uniform gas flow, which helps the gas to be evenly distributed in the target area in the chamber 1, and is easy to perform standardized production during processing, and is convenient for batch processing and maintenance.
[0041] In one embodiment, the end of the main body 3 away from the branch body 2 is connected to a plurality of gas supply pipes 5, and the gas supply pipes 5 are respectively connected to different external gas supply devices. The branch body 2 can be connected to the reaction gas through a plurality of different external gas supply devices to provide different types of reaction gases for the chamber 1; when the types of gases to be supplied increase, it can be achieved by increasing the number of gas supply pipes 5 and configuring corresponding external gas supply devices, thereby improving the flexibility of the gas uniform distribution structure.
[0042] In one embodiment, a first valve body 6 is provided on the main body 3; and a second valve body 7 is provided on the gas supply pipe 5. The first valve body 6 can control the gas flow through the main body 3, and the second valve body 7 can control the gas flow through the gas supply pipe 5, so as to adjust the amount of gas flowing in the main body 3 and the gas supply pipe 5. The first valve body 6 and the second valve body 7 can also be used to adjust the pressure of the gas in the pipe to ensure the stable transmission of the gas in the system. When maintaining or replacing the gas supply equipment, the gas flow can be safely isolated by closing the corresponding valve body. In an emergency, the gas supply can be quickly cut off by controlling the first valve body 6 and the second valve body 7 to prevent accidents.
[0043] In one embodiment, the gas uniform distribution structure further includes a plurality of heating wires 8, which are arranged between adjacent branch tube bodies 2. The heating wires 8 can activate chemical reactions in the gas, especially in a chemical vapor deposition system that requires thermal activation to promote the reaction, where the temperature uniformity of the gas directly affects the quality, consistency and uniformity of the deposited film layer; by arranging the heating wires 8 between adjacent branch tube bodies 2, the heating wires 8 can ensure that the gas reaches a uniform temperature after entering the chamber 1, which helps the gas to uniformly contact the heating wires 8 and react. After the adjacent heating wires 8 are connected, they can be connected to an external power source to improve the power connection efficiency of the heating wires.
[0044] The chamber 1 may be formed by surrounding the plate structure, and the chamber 1 may be a vacuum chamber. When the gas uniform distribution structure is used in a catalytic chemical vapor deposition device, a heating wire 8 with direct current is used in the vacuum chamber 1 to contact with the reaction gas for catalytic cracking, thereby forming a film layer on the first substrate 9 or the second substrate 10. For example, the heating wire 8 may be made of tungsten material or tantalum material.
[0045] The technical solution of the present application is to evenly distribute a plurality of branch tube bodies 2 in the chamber 1, and to set a plurality of first air outlet holes 21 on the side of the branch tube body 2 facing the exhaust port 11, and to set a second air outlet hole 22 on the side of the branch tube body 2 away from the exhaust port 11. By making the number of the first air outlet holes 21 greater than the number of the second air outlet holes 22, the gas outlet volume on the side of the branch tube body 2 facing the exhaust port 11 is greater than the gas outlet volume on the opposite side. Therefore, when the exhaust port 11 is connected to the exhaust device to extract the gas in the wall, the gas flow velocity on the side of the chamber 1 where the exhaust port 11 is provided is relatively large. By increasing the number of the first air outlet holes 21 on the side of the branch tube body 2 facing the exhaust port 11, the situation of poor gas distribution uniformity caused by unilateral exhaust can be improved, and the uniformity of gas distribution in the chamber 1 can be improved. When the gas uniform distribution structure is used in chemical vapor deposition equipment, it is beneficial to improve the uniformity of the deposited film layer and improve the quality of the deposited film layer.
[0046] The present application also proposes a chemical vapor deposition device, which includes a gas uniform distribution structure. The specific structure of the gas uniform distribution structure refers to the above-mentioned embodiment. Since the chemical vapor deposition device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.
[0047] As mentioned above, the chemical vapor deposition equipment can be specifically catalytic chemical vapor deposition, also known as hot-wire CVD (HWCVD). In the vacuum chamber 1, power is supplied to heat the heating wire 8 to a specific temperature, and a reaction gas is introduced into the chamber 1. The reaction gas collides with the heated heating wire 8, and catalytic cracking occurs to generate a variety of highly active "uncharged" groups. These active groups are randomly emitted from the surface of the heating wire 8 to the surroundings, and react on the surface of the first base layer and the second base layer to form a film; wherein the first base layer and the second base layer can be silicon wafer substrates.
[0048] The above description is only an exemplary embodiment of the present application and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the present application specification and drawings under the technical concept of the present application, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present application.
Claims
1. A gas uniform distribution structure, characterized in that: include: A chamber, wherein a vacuum port is provided on one side of the chamber; the vacuum port is used to be connected to a vacuum device; A plurality of branch tube bodies are evenly distributed in the chamber, and one end of each branch tube body is used to connect with an external gas supply device; a plurality of first air outlet holes are provided on the side of the branch tube body facing the air suction port, and a second air outlet holes are provided on the side of the branch tube body away from the air suction port, and the number of the first air outlet holes is greater than the number of the second air outlet holes.
2. The gas uniform distribution structure according to claim 1, characterized in that: The plurality of first air outlet holes are evenly distributed along the length direction of the branch pipe body; and / or, The plurality of second air outlet holes are evenly distributed along the length direction of the branch pipe body.
3. The gas uniform distribution structure according to claim 1, characterized in that: The number of the first air outlet holes is twice the number of the second air outlet holes; and / or, The inner wall of one side of the chamber provided with the air extraction port is used for mounting the first substrate, and the inner wall of one side of the chamber away from the air extraction port is used for fixing the second substrate.
4. The gas uniform distribution structure according to any one of claims 1 to 3, characterized in that: The gas uniform distribution structure also includes a main pipe, one end of the branch pipe is connected to the main pipe; a plurality of branch pipes are arranged along the length direction of the branch pipe; one end of the main pipe extends out of the chamber and is connected to the external gas supply device.
5. The gas uniform distribution structure according to claim 4, characterized in that: The main pipe body is arranged outside the chamber, and one end of the branch pipe body is connected to the main pipe body through a connecting pipe.
6. The gas uniform distribution structure according to claim 4, characterized in that: The main pipe body and the branch pipe body are perpendicular to each other; and / or, The first air outlet hole and the second air outlet hole are both circular holes.
7. The gas uniform distribution structure according to claim 4, characterized in that: One end of the main pipe body away from the branch pipe body is connected with a plurality of air supply pipes, and the air supply pipes are respectively connected with different external air supply equipment.
8. The gas uniform distribution structure according to claim 7, characterized in that: The main pipe is provided with a first valve body; and / or, A second valve body is provided on the air supply pipe.
9. The gas uniform distribution structure according to any one of claims 1 to 3, characterized in that: The gas uniform distribution structure further comprises a plurality of heating wires, and the heating wires are arranged between adjacent branch pipe bodies.
10. A chemical vapor deposition device, characterized in that: It comprises the gas uniform distribution structure as claimed in any one of claims 1 to 9.