Air conditioner

Abstract

The utility model discloses an air conditioner, and belongs to the technical field of air treatment. The air conditioner comprises an electrical box; a driving plate assembly is mounted in the electrical box; the driving plate assembly comprises a base, a driving plate and a driving plate, wherein an accommodating cavity is formed in the base; the driving plate is connected in the accommodating cavity, the front surface of the driving plate is connected with a heating element, and the heating element comprises a power device and a low heating element; the module radiator is attached to and connected with the power device; the refrigerant radiator is connected to the position, opposite to the power device, of the module radiator in an attached mode; wherein the module radiator, the base and the driving plate define a first sealed space, the heating element is located in the first sealed space, and the first sealed space is filled with a non-curing heat dissipation material. The electric box of the air conditioner can avoid the condensation risk.

Description

Technical Field

[0001] The present application relates to the technical field of air treatment, and in particular to an air conditioner. Background Art

[0002] As the control center of air-conditioning products, the electrical box mainly includes a main control board and a driver board. There is no power device on the main control board and no heat dissipation requirement. However, the driver board is highly integrated with the compressor drive and fan drive, generates a lot of heat, and requires a heat dissipation structure.

[0003] At present, there are two ways of heat dissipation in the electrical box: air cooling and refrigerant cooling. In refrigerant cooling, due to blockage of the air conditioning system pipeline or drop in the exhaust pressure of the compressor, the refrigerant temperature reaches above the dew point and condensation occurs, which can easily cause the power device to short-circuit and burn. Utility Model Content

[0004] The present application provides an air conditioner whose electrical box can avoid the risk of condensation.

[0005] In one aspect of the present application, an air conditioner comprises: an electrical box; a drive board assembly is installed in the electrical box; the drive board assembly comprises: a base, in which a receiving cavity is provided; a drive board connected in the receiving cavity, a heating element connected to the front of the drive board, the heating element comprising a power device and a low-heating element; a module heat sink, attached to the power device; a refrigerant heat sink, attached to the module heat sink at a position opposite to the power device;

[0006] The module heat sink, the base and the driving board form a first sealed space, the heating element is located in the first sealed space, and the first sealed space is filled with non-solidified heat dissipation material.

[0007] In some embodiments, a second sealed space is formed between the back side of the driving board and the base, and the second sealed space is filled with non-solidified heat dissipation material.

[0008] In some embodiments, a front side of the driving board is connected to a wiring port, and the wiring port is located outside the first sealed space.

[0009] In some embodiments, the driving board assembly includes: a baffle connected to the driving board to separate the heating element and the wiring port; the baffle, the module heat sink and the base, and the driving board form a first sealed space.

[0010] In some embodiments, a groove is provided on the module heat sink, the refrigerant heat sink is connected in the groove, and the refrigerant heat sink is in contact with the bottom wall and the side wall of the groove.

[0011] In some embodiments, the surface of the power device is coated with a thermal interface material, and the surface of the low-heat-generating component is connected with a low-viscosity non-curing heat dissipation material.

[0012] In some embodiments, a plurality of injection ports staggered from each other are provided on two opposite side walls of the base that enclose the first sealed space.

[0013] In some embodiments, low heat generating components are distributed on both sides of the power device.

[0014] In some embodiments, a sealing gasket is connected between the baffle plate and the driving plate.

[0015] Another aspect of the present application is an air conditioner, comprising: an electrical box; a drive board assembly and a main control board assembly arranged side by side are installed in the electrical box; the drive board assembly comprises: a base, in which a receiving cavity is provided; a drive board connected in the receiving cavity, a heating element connected to the front of the drive board, the heating element comprising a power device and a low-heating element; a module heat sink, connected in contact with the power device; a refrigerant heat sink, connected in contact with the module heat sink at a position opposite to the power device;

[0016] The module heat sink, the base and the driving board form a first sealed space, the heating element is located in the first sealed space, and the first sealed space is filled with non-solidified heat dissipation material. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A diagram showing the internal structure of an electrical box assembly in an air conditioner according to some embodiments;

[0018] Figure 2 shows a perspective view of a driving plate assembly in an air conditioner according to some embodiments;

[0019] Figure 3 A cross-sectional view of a drive plate assembly in an air conditioner according to some embodiments is shown. Figure 1 ;

[0020] Figure 4 A cross-sectional view of a drive plate assembly in an air conditioner according to some embodiments is shown. Figure 2 ;

[0021] Figure 5 A diagram showing a driving plate and a base in an air conditioner according to some embodiments;

[0022] Figure 6 shows a perspective view of a base in an air conditioner according to some embodiments;

[0023] Figure 7 A diagram is shown of a module heat sink and base in an air conditioner according to some embodiments.

[0024] In the above figures, 10, electrical box; 100, drive board assembly; 101, first sealed space; 102, second sealed space; 103, injection port; 110, drive board; 120, power device; 130, low-heat element; 140, base; 141, first bottom wall; 142, second side wall; 143, third side wall; 144, fourth side wall; 145, fifth side wall; 146, baffle; 147, support column; 150, module radiator; 151, groove; 160, refrigerant radiator; 161, radiator body; 162, refrigerant pipeline; 170, wiring port; 180, baffle; 190, non-curing heat dissipation material; 200, main control board assembly. DETAILED DESCRIPTION

[0025] In order to make the purpose and implementation method of the present application clearer, the exemplary implementation method of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0026] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0027] The terms "first", "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0028] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] The air conditioner in this application performs a refrigeration cycle of the air conditioner by using a compressor, a condenser, an expansion valve and an evaporator. The refrigeration cycle includes a series of processes involving compression, condensation, expansion and evaporation, and supplies refrigerant to the air that has been conditioned and heat-exchanged.

[0030] The compressor compresses the refrigerant gas in a low temperature and low pressure state and discharges the compressed refrigerant gas. The discharged refrigerant gas flows into the condenser. The condenser condenses the compressed refrigerant into a liquid phase, and the heat is released to the surrounding environment through the condensation process.

[0031] The expansion valve expands the high-temperature and high-pressure liquid refrigerant condensed in the condenser into a low-pressure liquid refrigerant. The evaporator evaporates the refrigerant expanded in the expansion valve and returns the refrigerant gas in a low-temperature and low-pressure state to the compressor. The evaporator can achieve a refrigeration effect by utilizing the latent heat of evaporation of the refrigerant to exchange heat with the material to be cooled. In the entire cycle, the air conditioner can adjust the temperature of the indoor space.

[0032] The outdoor unit of the air conditioner refers to a portion of a refrigeration cycle including a compressor and an outdoor heat exchanger, the indoor unit of the air conditioner includes an indoor heat exchanger, and an expansion valve may be provided in the indoor unit or the outdoor unit.

[0033] The indoor heat exchanger and the outdoor heat exchanger function as a condenser or an evaporator. When the indoor heat exchanger functions as a condenser, the air conditioner functions as a heater in a heating mode, and when the indoor heat exchanger functions as an evaporator, the air conditioner functions as a cooler in a cooling mode.

[0034] The air conditioner of the present application may be a split-type air conditioner in which the outdoor unit and the indoor unit are separated, or may be an integrated air conditioner in which the outdoor unit and the indoor unit are integrated into one.

[0035] Reference Figure 1 According to an embodiment of the present application, the air conditioner includes an electrical box assembly for realizing the electrical control function of the air conditioner.

[0036] The electrical box assembly includes an electrical box 10. The electrical box 10 may be in the shape of a rectangular parallelepiped box, forming the general appearance of the electrical box assembly.

[0037] The electrical box assembly includes a main control board assembly 200. The main control board assembly 200 is connected in the electrical box 10, and the main control board assembly 200 usually does not need heat dissipation.

[0038] The electrical box assembly includes a drive board assembly 100, which is connected to the electrical box 10. The drive board assembly 100 needs to be cooled to ensure normal operation.

[0039] Reference Figures 2 to 6The driving board assembly 100 includes a driving board 110, which is a PCB board. A heating element is connected to the front of the driving board 110. The heating element needs to dissipate heat.

[0040] The heating elements include power devices 120 (IPM, CIB, IGBT, diode, etc.) and other electronic components (cement resistors, capacitors, reactance, etc.).

[0041] The power device 110 is mainly used to drive the compressor and the fan, and has a relatively high heat generation, while other electronic components have a relatively low heat generation compared to the power device 110. For the convenience of description, other electronic components are referred to as low-heat generation components 130 in this application.

[0042] The driving board assembly 100 includes a base 140 . The base 140 is provided with a receiving cavity for receiving the driving board 110 .

[0043] The base 140 is in a box shape with one end open. For example, the base 140 is in a rectangular box shape with one end open.

[0044] The driving plate 110 is installed in the accommodating cavity of the base 140. The front side of the driving plate 110 faces the open end of the base 140.

[0045] The driving board assembly 100 includes a module heat sink 150 . The module heat sink 150 is connected to the power device 120 so that the heat generated by the power device 120 can be transferred to the module heat sink 150 .

[0046] The module heat sink 150 is made of metal, such as an aluminum block, which is beneficial to heat transfer.

[0047] The driving board assembly 100 includes a refrigerant radiator 160. The refrigerant radiator 160 is attached to the module radiator 150 at a position opposite to the power device 120. That is, the refrigerant radiator 160 and the power device 120 are located on both sides of the module radiator 150, respectively.

[0048] The heat generated by the power device 120 is transferred to the coolant radiator 160 through the module radiator 150 .

[0049] The module heat sink 150, the driving board 110 and the base 140 form a first sealed space 101. The power device 120 and the low-heat-generating component 130 are both located in the first sealed space 101. The first sealed space 101 is filled with a non-curing heat dissipation material 190.

[0050] The non-solidified heat dissipation material 190 has high thermal conductivity, and the thermal conductivity is 2W / m·K to 10W / m·K, which can meet the heat transfer requirements of the low-heat-generating element 130. The heat generated by the low-heat-generating element 130 will be transferred to the module heat sink 150 and the refrigerant heat sink 160 through the non-solidified heat dissipation material 190, so that the refrigerant in the refrigerant heat sink 160 will take away the heat, thereby improving the heat dissipation capacity of the heating element.

[0051] The present application transfers heat to the refrigerant radiator 160 through the non-solidified heat dissipation material 190 to dissipate heat from the low-heat-generating element 130, which can reduce the number of fans and other components of air-cooled heat dissipation in the related art and improve assembly efficiency.

[0052] The non-curing heat dissipation material 190 has soft clay-like properties, can follow the shape of electronic components, and discharge internal air to achieve sealing of the electronic components on the drive board assembly 100, completely avoiding the generation of condensation and improving the safety of the electrical box assembly.

[0053] In addition, compared to potting glue filling, the non-curing heat dissipation material 190 in the present application has long-lasting effect, has an application temperature of -40°C to 200°C, does not contain silicone oil, and does not solidify after long-term application. Since it is not solidified, there is no thermal stress problem, it can be repeatedly disassembled and repaired, and has the advantage of convenient disassembly and assembly.

[0054] The consistency of the non-curable heat dissipation material 190 is 100 to 400. In this embodiment, a low-consistency non-curable heat dissipation material with a consistency of 100 to 200 is used. The heat dissipation material with a low consistency has a slightly higher hardness and can better fit the module heat sink 150 .

[0055] During the assembly process, a thermal interface material is coated on the surface of the power device 120, thereby improving the thermal conductivity of the power device 120 to the module heat sink 150; a low-viscosity non-curing heat dissipation material is coated or installed on the outer surface of the low-heat-generating element 130, thereby ensuring a tight connection between the low-heat-generating element 130 and the non-curing heat dissipation material 190, and then a low-viscosity heat dissipation material is installed on the inner surface of the module heat sink 150, and then the module heat sink 150 is connected to the base 140.

[0056] In some embodiments, the back of the driving board 110 and the base 140 form a second sealed space 102. The second sealed space 102 is filled with a non-curing heat dissipation material 190. Thus, the back of the driving board 110 can be sealed, avoiding the risk of condensation on the back of the driving board 110.

[0057] According to an embodiment, the back side of the driving board 110 is supported by the support column 147 so that the second sealed space 102 is formed between the driving board 110 and the first bottom wall 141 of the base 140. The support column 147 may be connected to the first bottom wall 141 of the base 140.

[0058] In some embodiments, in conjunction with reference Figure 3 and Figure 6 The wall forming the first sealed space 101 and the second sealed space 102 is provided with an injection port 103. The non-curing heat dissipation material 190 can be injected into the sealed space from the injection port 103.

[0059] Specifically, a group of opposite walls forming the first sealed space 101 and the second sealed space 102 are each provided with injection ports 103. The injection ports 103 on the two walls are arranged in a staggered manner.

[0060] According to an embodiment, the base 140 includes a first bottom wall 141 opposite to the open end of the accommodating cavity, and four side walls connected to the edge of the first bottom wall 141, and the four side walls are respectively a second side wall 142, a third side wall 143, a fourth side wall 144 and a fifth side wall 145 connected end to end.

[0061] The second side wall 142 and the third side wall 143 are both provided with a plurality of injection ports 103. The injection ports 103 on the second side wall 142 are staggered with the injection ports 103 on the third side wall 143, so as to ensure the efficiency and uniformity of injection.

[0062] Combination Figure 2 and Figure 6 The driving plate assembly 100 may include a blocking piece 146, which is covered and connected to the injection port 103 to block the injection port 103 after the injection operation is completed.

[0063] The area of ​​the blocking piece 146 is larger than the injection port 103 and can be connected to the base 140 by means of screws or buckles.

[0064] In some embodiments, specific reference is made to Figure 4 and Figure 5 The power device 120 is located in the middle of the driving board 110 , and the low heat generating components 130 are distributed on both sides of the power device 120 .

[0065] In this way, the coolant radiator 160 is located in the middle corresponding to the power device 120 , which can reduce the heat transfer path from the low-heat-generating component 130 to the coolant radiator 160 , thereby ensuring the heat dissipation efficiency of the low-heat-generating component 130 .

[0066] Exemplarily, the electrical box assembly is vertically installed in the air conditioner, and the compressor drive and the fan drive of the power device 120 are arranged up and down in the middle of the drive plate 110. The low-heat-generating element 130 is located on the left and right sides of the power device 120. The path from the low-heat-generating element 130 to the refrigerant radiator 160 is relatively short.

[0067] According to the embodiment, the components with relatively high heat generation in the low heat generation components 130 are arranged closer to the power device 120 , so that the heat dissipation efficiency of the low heat generation components 130 can be further improved.

[0068] In some embodiments, specific reference is made to Figure 3 and Figure 7 The module radiator 150 is provided with a groove 151. The refrigerant radiator 160 is connected in the groove 151. The refrigerant radiator 160 fits with the groove bottom wall and groove side wall of the groove 151, which increases the contact area between the refrigerant radiator 160 and the module radiator 150, thereby improving the heat transfer efficiency from the module radiator 150 to the refrigerant radiator 160 and accelerating the heat dissipation speed.

[0069] In the present example, the refrigerant radiator 160 has three-plane contact with the module radiator 150. In other embodiments, the refrigerant radiator 160 may also have four or five-plane contact with the module radiator 150.

[0070] According to the embodiment, specifically refer to Figure 2 The refrigerant radiator 160 includes a radiator body 161 and a refrigerant pipeline 162. The refrigerant pipeline 162 may be in a "U" shape and installed in the radiator body 161. The two ports of the refrigerant pipeline 162 are connected to the refrigerant system of the air conditioner. In combination with the control system, the low-temperature refrigerant flows through the refrigerant pipeline 162. While the low-temperature refrigerant flows in the refrigerant pipeline 162, it takes away the heat on the radiator body 161, thereby achieving the effect of heat dissipation.

[0071] The radiator body 161 is connected to the module radiator 150 by screws, which can ensure that the refrigerant radiator 160 and the module radiator 150 are closely fitted, thereby ensuring the heat transfer effect.

[0072] In some embodiments, the driving board 110 may be connected to a connection port 170 , such as a connection terminal block.

[0073] The driving board assembly 100 includes a baffle 180 . The baffle 180 is connected to the driving board 110 and can separate the heating element from the wiring port 170 .

[0074] Reference Figure 3 The module heat sink 150, the baffle 180, the driving board 110, and the base 140 form a first sealed space 101, and the heating element is located in the first sealed space 101; the wiring port 170 is separated from the first sealed space 101 by the baffle 180, and the wiring port 170 is exposed to the outside, which can facilitate wiring operations.

[0075] The second side wall 142 is opposite to the fourth side wall 144 , and the third side wall 143 is opposite to the baffle 180 .

[0076] The module heat sink 150 can be connected to the base 140 and the baffle 180 by screws. The connection gap of the module heat sink 150 can be coated with three-proof glue to ensure sealing and prevent the heat dissipation material from overflowing.

[0077] The baffle 180 can be connected to the driving board 110 by means of buckles or screws. A sealing gasket can be provided between the baffle 180 and the driving board 110. For example, the sealing gasket can be a soft gasket made of insulating rubber material to ensure the sealing of the baffle 180 and the driving board 110 at the connection to prevent the heat dissipation material from overflowing.

[0078] According to an embodiment, the connection port 170 is located near an edge of the driving board 110 and between the blocking plate 180 and the fifth side wall 145 .

[0079] The edge of the fifth side wall 145 is flush with the driving board 110 , or the edge of the fifth side wall 145 slightly protrudes from the driving board 110 , which can facilitate the wiring operation from the fifth side wall 145 to the wiring port.

[0080] The following is an introduction to the assembly process of the drive board assembly 100: connect the drive board 110 to the base 140, coat the thermal interface material on the surface of the power device 120, paint or install a low-viscosity non-solidifying heat dissipation material of a certain thickness and size on the surface of the low-heat generating element 130, install the baffle 180 on the drive board 110, install the module heat sink 150 on the base 140, inject a slightly higher viscosity non-solidifying heat dissipation material into the sealed space from the injection port 103, install the drive board assembly to the electrical box 10, and finally install the refrigerant radiator 160 on the module heat sink 150 and connect the external wires.

[0081] In the present application, a low-viscosity heat dissipation material is installed on the surface of the low-heat-generating element 130. Since the hardness of the low-viscosity heat dissipation material is slightly higher, the heat dissipation material can be closely fitted to the low-heat-generating element 130. A slightly higher-viscosity heat dissipation material is filled in the sealed space. Since the hardness of the high-viscosity heat dissipation material is slightly lower, the material has better fluidity and can follow the shape of the sealed space, so that the sealed space can be completely filled, thereby ensuring the sealing of the driving board assembly 100, thereby ensuring that no condensation is generated on the driving board assembly 100.

[0082] As described above, according to the air conditioner of the embodiment of the present application, the driving plate 110 is installed in the base 140, and is connected to the base 140 through the module radiator 150 to form a sealed space enclosing the driving plate 110. The sealed space is filled with non-curing heat dissipation material 190, which can seal the driving plate 110, completely avoid the generation of condensation, and improve the safety of the electrical box assembly.

[0083] In addition, compared with potting glue filling, the non-curing heat dissipation material in this application does not solidify after long-term use. Since it does not solidify, there is no thermal stress problem, it can be repeatedly disassembled and repaired, and has the advantage of convenient disassembly and assembly.

[0084] In addition, the low heat generating components 130 are distributed on both sides of the power device 120 , which can reduce the heat transfer path from the low heat generating components 130 to the coolant radiator 160 , thereby ensuring the heat dissipation efficiency of the low heat generating components 130 .

[0085] In addition, a groove 151 for accommodating the refrigerant radiator 160 is provided on the module radiator 150, and the refrigerant radiator 160 is in contact with the bottom wall and side wall of the groove 151, thereby increasing the contact area between the refrigerant radiator 160 and the module radiator 150, thereby improving the heat transfer efficiency from the module radiator 150 to the refrigerant radiator 160 and accelerating the heat dissipation speed.

[0086] In addition, part of the driving board 110 is located outside the sealed space, and the wiring port 170 can be connected to this part, so as to facilitate the wiring operation.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0088] For the convenience of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. An air conditioner, characterized in that: include: Electrical box; A drive board assembly is installed in the electrical box; The drive plate assembly comprises: A base having a receiving cavity therein; A driving board connected in the accommodating cavity, a front surface of the driving board is connected with a heating element, and the heating element includes a power device and a low-heating element; A module heat sink is connected to the power device; A refrigerant radiator is attached to the module radiator at a position opposite to the power device; The module heat sink, the base and the driving board form a first sealed space, the heating element is located in the first sealed space, and the first sealed space is filled with non-solidified heat dissipation material.

2. The air conditioner according to claim 1, characterized in that: A second sealed space is formed between the back side of the driving board and the base, and the second sealed space is filled with the non-curing heat dissipation material.

3. The air conditioner according to claim 1, characterized in that: The front side of the driving board is connected with a wiring port, and the wiring port is located outside the first sealed space.

4. The air conditioner according to claim 3, characterized in that: The drive plate assembly comprises: a baffle, connected to the driving board to separate the heating element from the wiring port; The baffle, the module heat sink, the base and the driving board form the first sealed space.

5. The air conditioner according to claim 1, characterized in that: The module radiator is provided with a groove, the refrigerant radiator is connected in the groove, and the refrigerant radiator is in contact with the groove bottom wall and the groove side wall of the groove.

6. The air conditioner according to claim 1, characterized in that: The surface of the power device is coated with a thermal interface material, and the surface of the low-heat-generating element is connected with a non-curing heat dissipation material.

7. The air conditioner according to claim 1, characterized in that: A plurality of injection ports staggered from each other are arranged on two opposite side walls of the base that enclose the first sealed space.

8. The air conditioner according to claim 1, characterized in that: The low heat generating components are distributed on both sides of the power device.

9. The air conditioner according to claim 4, characterized in that: A sealing gasket is connected between the baffle plate and the driving plate.

10. An air conditioner, characterized in that: include: Electrical box; The electrical box is provided with a drive board assembly and a main control board assembly arranged side by side; The drive plate assembly comprises: A base having a receiving cavity therein; A driving board connected in the accommodating cavity, a front surface of the driving board is connected with a heating element, and the heating element includes a power device and a low-heating element; A module heat sink is connected to the power device; A refrigerant radiator is attached to the module radiator at a position opposite to the power device; The module heat sink, the base and the driving board form a first sealed space, the heating element is located in the first sealed space, and the first sealed space is filled with non-solidified heat dissipation material.

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