Cooling mechanism for integrated circuit semiconductor processing

Abstract

The utility model discloses a cooling mechanism for integrated circuit semiconductor processing, which is characterized in that the cooling mechanism comprises a cooling box, a filter box can slide and lift in the cooling box by means of a first driving mechanism, a second magnetic column can move by means of a second driving mechanism, and a push plate can move by means of a guide mechanism. The integrated circuit semiconductors can be pushed and discharged, then the cooled integrated circuit semiconductors can be discharged conveniently, the cooling efficiency of the integrated circuit semiconductors can be improved, water in a cooling box can be cooled through a machine box and a cooling plate, the water in the cooling box can be stirred through a third driving mechanism, and the cooling efficiency of the integrated circuit semiconductors can be improved. And water in the cooling box can be discharged into the cooling box through the first water pump, water in the cooling box can be discharged into the cooling box through the second water pump, then cooling can be conveniently replaced and recycled, and water resources can be saved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit semiconductor processing, in particular to a cooling mechanism for integrated circuit semiconductor processing. Background Art

[0002] Integrated circuits are a way of miniaturizing circuits (mainly semiconductor devices, but also passive components, etc.). They use certain processes to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, and then make them on a small piece or several small pieces of semiconductor wafers or dielectric substrates. These are then packaged in a tube shell to become a miniature structure with the required circuit functions. All the components have been structurally integrated into a whole, making a major step forward in the direction of miniaturization, low power consumption, intelligence and high reliability of electronic components.

[0003] A cooling mechanism is needed during the cooling process of integrated circuit semiconductor processing. The existing cooling mechanism for integrated circuit semiconductor processing requires staff to use tools to take out the integrated circuit semiconductor during the unloading process of the cooled integrated circuit semiconductor, which is time-consuming and troublesome and easily affects the cooling efficiency of the integrated circuit semiconductor. The cooling water needs to be frequently discharged and replaced during the cooling process of the integrated circuit semiconductor, which easily causes a waste of water resources. Utility Model Content

[0004] In view of the problems mentioned in the background technology, the purpose of the utility model is to provide a cooling mechanism for integrated circuit semiconductor processing to solve the problems mentioned in the background technology.

[0005] The above technical objectives of the utility model are achieved through the following technical solutions:

[0006] A cooling mechanism for integrated circuit semiconductor processing comprises a cooling box, a mounting frame is fixedly connected to the cooling box, two mounting frames are provided with a first driving mechanism, the output ends of the two sets of the first driving mechanisms are drivingly connected to a filter box, a box cover is hingedly connected to the side of the filter box, the box cover is detachably connected to the filter box through a fixed mechanism, a push plate is slidably connected to the filter box through two sets of guide mechanisms, a first magnetic column is fixedly connected to the side of the push plate, a support plate is fixedly connected to the cooling box, a second driving mechanism is provided on the support plate, and the output of the second driving mechanism The output end is transmission connected with the second magnetic column, the first magnetic column and the second magnetic column are magnetically connected, the top of the cooling box is fixedly connected with a blanking plate, the side of the cooling box is fixedly installed with a first water pump and a second water pump, the output end of the first water pump is fixedly connected with a cooling box, the input end of the second water pump is fixedly connected with the cooling box, the cooling box is fixedly connected with a support frame, the bottom of the support frame is provided with a third driving mechanism, the output end of the third driving mechanism is transmission connected with a stirring frame, the inner wall of the cooling box is fixedly connected with a cooling plate, and the outer side of the cooling box is fixedly installed with a chassis.

[0007] By adopting the above technical solution, through the first driving mechanism arranged on the two mounting frames, the push plate slidably connected by the two sets of guide mechanisms in the filter box, the second magnetic column transmission-connected to the output end of the second driving mechanism, and the first magnetic column fixedly connected to the side of the push plate, the filter box can be slid and raised in the cooling box by relying on the first driving mechanism, the second magnetic column can be moved by relying on the second driving mechanism, the push plate can be moved by relying on the magnetic connection between the second magnetic column and the first magnetic column, and the guide mechanism can be used to push the integrated circuit semiconductor to be unloaded, and the box cover can be opened by relying on the fixing mechanism, so that it is convenient to Cooling the integrated circuit semiconductor for unloading can improve the cooling efficiency of the integrated circuit semiconductor, through the chassis fixedly installed on the outside of the cooling box, the cooling plate fixedly connected to the inner wall of the cooling box, and the third driving mechanism arranged at the bottom of the support frame, the water inside the cooling box can be cooled down by relying on the chassis and the cooling plate, the water inside the cooling box can be stirred by relying on the third driving mechanism, the water inside the cooling box can be discharged into the interior of the cooling box by relying on the first water pump, and the water inside the cooling box can be discharged into the interior of the cooling box by relying on the second water pump, so that the cooling can be easily replaced and recycled, and the utilization of water resources can be saved.

[0008] Preferably, the two groups of the first driving mechanisms respectively include a first servo motor and a threaded rod, the first servo motor is fixedly mounted on the bottom of the mounting frame, the threaded rod is transmission-connected to the output end of the first servo motor via a coupling, and the threaded rod is threadedly connected to the filter box.

[0009] By adopting the above technical solution, the threaded rod is driven to rotate by the first servo motor, and the threaded rod is threadedly connected to the filter box, so that the filter box can be raised and lowered.

[0010] Preferably, the two groups of guide mechanisms respectively include guide rails and guide blocks, the guide rails are fixedly connected to the inner wall of the cooling box, the guide blocks are fixedly connected to the side of the push plate, and the guide blocks are slidably connected in the guide rails.

[0011] By adopting the above technical solution, the push plate can be moved parallely by the guide block being slidably connected in the guide rail.

[0012] Preferably, the fixing mechanism includes a first magnet and a second magnet, the first magnet is fixedly connected to a side of the box cover, the second magnet is fixedly connected to a side of the filter box, and the first magnet and the second magnet are magnetically connected.

[0013] By adopting the above technical solution, the filter box and the box cover can be detachably connected through the magnetic connection between the first magnet and the second magnet.

[0014] Preferably, the second driving mechanism includes a servo electric cylinder and a support rod, the servo electric cylinder is fixedly mounted on the support plate, the support rod is transmission-connected to the output end of the servo electric cylinder via a coupling, and the support rod is fixedly connected to the second magnetic column.

[0015] By adopting the above technical solution, the support rod is driven to extend and retract by the servo electric cylinder, so that the second magnetic column can be moved and the first magnetic column and the second magnetic column can be magnetically connected.

[0016] Preferably, the third driving mechanism includes a second servo motor and a connecting rod, the second servo motor is fixedly mounted on the bottom of the support frame, the connecting rod is transmission-connected to the output end of the second servo motor via a coupling, and the connecting rod is fixedly connected to the stirring frame.

[0017] By adopting the above technical solution, the stirring frame can be rotated by driving the connecting rod to rotate through the second servo motor.

[0018] Preferably, the stirring frame is provided with a plurality of flow holes.

[0019] By adopting the above technical solution and setting the flow holes, the fluidity of water on the stirring rack can be improved.

[0020] Preferably, one side of the blanking plate is provided with a chamfer.

[0021] By adopting the above technical solution and setting the chamfer, it is convenient to slide and cut the integrated circuit semiconductor.

[0022] In summary, the utility model mainly has the following beneficial effects:

[0023] First, the utility model uses a first driving mechanism arranged on two mounting frames, a push plate slidably connected by two sets of guide mechanisms in the filter box, a second magnetic column transmission-connected to the output end of the second driving mechanism, and a first magnetic column fixedly connected to the side of the push plate. The filter box can be slid and lifted in the cooling box by relying on the first driving mechanism, the second magnetic column can be moved by relying on the second driving mechanism, the push plate can be moved by relying on the magnetic connection between the second magnetic column and the first magnetic column, and the guide mechanism can be used to push and unload the integrated circuit semiconductor. The box cover can be opened by relying on the fixing mechanism, so that the cooling integrated circuit semiconductor can be easily unloaded, and the cooling efficiency of the integrated circuit semiconductor can be improved.

[0024] Second, the utility model has a chassis fixedly installed on the outside of the cooling box, a cooling plate fixedly connected to the inner wall of the cooling box, and a third driving mechanism arranged at the bottom of the support frame. The chassis and the cooling plate can be used to cool the water inside the cooling box, the third driving mechanism can be used to stir the water inside the cooling box, the first water pump can be used to discharge the water inside the cooling box into the interior of the cooling box, and the second water pump can be used to discharge the water inside the cooling box into the interior of the cooling box, thereby facilitating the replacement and recycling of the cooling, and saving the utilization of water resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is one of the structural schematic diagrams of the utility model;

[0026] Figure 2 This is the second structural diagram of the utility model;

[0027] Figure 3 This is one of the structural schematic diagrams of the filter box of the utility model;

[0028] Figure 4 This is the second structural schematic diagram of the filter box of the utility model;

[0029] Figure 5 yes Figure 2 A is an enlarged schematic diagram;

[0030] Figure 6 yes Figure 3 The enlarged schematic diagram of point B in FIG.

[0031] Figure 7 yes Figure 4 The enlarged schematic diagram of point C in FIG.

[0032] Figure numerals: 1. cooling box; 2. mounting frame; 3. first driving mechanism; 301. first servo motor; 302. threaded rod; 4. filter box; 5. box cover; 6. fixing mechanism; 601. first magnet; 602. second magnet; 7. guiding mechanism; 701. guide rail; 702. guide block; 8. push plate; 9. first magnetic column; 10. support plate; 11. second driving mechanism; 111. servo electric cylinder; 112. support rod; 12. second magnetic column; 13. unloading plate; 14. first water pump; 15. second water pump; 16. cooling box; 17. support frame; 18. third driving mechanism; 181. second servo motor; 182. connecting rod; 19. stirring frame; 20. cooling plate; 21. chassis; 22. flow hole; 23. chamfer. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] Example 1

[0035] refer to Figure 1-7A cooling mechanism for integrated circuit semiconductor processing includes a cooling box 1, a mounting frame 2 is fixedly connected to the cooling box 1, and first driving mechanisms 3 are arranged on the two mounting frames 2. The two sets of first driving mechanisms 3 respectively include a first servo motor 301 and a threaded rod 302. The first servo motor 301 is fixedly installed at the bottom of the mounting frame 2. The threaded rod 302 is connected to the output end of the first servo motor 301 through a coupling. The threaded rod 302 is threadedly connected to a filter box 4. The threaded rod 302 is driven to rotate by the first servo motor 301. The threaded rod 302 is threadedly connected to the filter box 4, so that the filter box 4 can be lifted and lowered. The output ends of the two sets of first driving mechanisms 3 are connected to the filter box 4. A box cover 5 is hinged on the side of the filter box 4. The box cover 5 is detachably connected to the filter box 4 through a fixing mechanism 6, and the fixing mechanism 6 includes a first magnet 601 and a second magnet 602. The first magnet 601 is fixedly connected to the side of the box cover 5, and the second magnet 602 is fixedly connected to the side of the filter box 4. The first magnet 601 and the second magnet 602 are magnetically connected. The filter box 4 and the box cover 5 can be detachably connected through the magnetic connection between the first magnet 601 and the second magnet 602. The filter box 4 is slidably connected with a push plate 8 through two sets of guide mechanisms 7 provided in the filter box 4. The two sets of guide mechanisms 7 respectively include a guide rail 701 and a guide block 702. The guide rail 701 is fixedly connected to the inner wall of the cooling box 1, and the guide block 702 is fixedly connected to the side of the push plate 8. The guide block 702 is slidably connected to the guide In the rail 701, the guide block 702 is slidably connected in the guide rail 701, so that the push plate 8 can move in parallel. The side of the push plate 8 is fixedly connected with the first magnetic column 9. The cooling box 1 is fixedly connected with the support plate 10. The support plate 10 is provided with a second driving mechanism 11. The second driving mechanism 11 includes a servo electric cylinder 111 and a support rod 112. The servo electric cylinder 111 is fixedly installed on the support plate 10. The support rod 112 is connected to the output end of the servo electric cylinder 111 through a coupling. The support rod 112 is fixedly connected to the second magnetic column 12. The support rod 112 is driven to extend and retract by the servo electric cylinder 111, so that the second magnetic column 12 can be moved. The first magnetic column 9 and the second magnetic column 12 can be magnetically connected. The output end of the second driving mechanism 11 is driven A second magnetic column 12 is connected, and the first magnetic column 9 and the second magnetic column 12 are magnetically connected. A blanking plate 13 is fixedly connected to the top of the cooling box 1, and a first water pump 14 and a second water pump 15 are fixedly installed on the side of the cooling box 1. The output end of the first water pump 14 is fixedly connected to a cooling box 16, and the input end of the second water pump 15 is fixedly connected to the cooling box 16. A support frame 17 is fixedly connected to the cooling box 16, and a third driving mechanism 18 is arranged at the bottom of the support frame 17. The third driving mechanism 18 includes a second servo motor 181 and a connecting rod 182. The second servo motor 181 is fixedly installed at the bottom of the support frame 17, and the connecting rod 182 is transmission-connected to the output end of the second servo motor 181 through a coupling, and the connecting rod 182 is fixedly connected to the stirring frame 19.The connecting rod 182 is driven to rotate by the second servo motor 181, so that the stirring frame 19 can be rotated, the output end of the third driving mechanism 18 is connected to the stirring frame 19, the inner wall of the cooling box 16 is fixedly connected to the cooling plate 20, and the outer side of the cooling box 16 is fixedly installed with the chassis 21, through the first driving mechanism 3 arranged on the two mounting frames 2, the push plate 8 slidably connected by the two sets of guide mechanisms 7 in the filter box 4, the second magnetic column 12 connected to the output end of the second driving mechanism 11, and the first magnetic column 9 fixedly connected to the side of the push plate 8, the filter box 4 can be slid and raised in the cooling box 1 by relying on the first driving mechanism 3, the second magnetic column 12 can be moved by relying on the second driving mechanism 11, the second magnetic column 12 and the first magnetic column 9 are magnetically connected, and the push plate 8 can be moved by relying on the guide mechanism 7. The integrated circuit semiconductor can be pushed and unloaded. The box cover 5 can be opened by the fixing mechanism 6, so that the cooling integrated circuit semiconductor can be unloaded conveniently, and the cooling efficiency of the integrated circuit semiconductor can be improved. The chassis 21 fixedly installed on the outside of the cooling box 16, the cooling plate 20 fixedly connected to the inner wall of the cooling box 16, and the third driving mechanism 18 set at the bottom of the support frame 17 can be used to cool the water inside the cooling box 16 by the chassis 21 and the cooling plate 20. The water inside the cooling box 16 can be stirred by the third driving mechanism 18. The water inside the cooling box 16 can be discharged into the cooling box 16 by the first water pump 14, and the water inside the cooling box 16 can be discharged into the cooling box 1 by the second water pump 15. Therefore, the cooling can be easily replaced and recycled, and the utilization of water resources can be saved.

[0036] refer to Figure 1 and Figure 2 A plurality of flow holes 22 are provided on the stirring frame 19 . The setting of the flow holes 22 can improve the fluidity of water on the stirring frame 19 .

[0037] refer to Figure 2 A chamfer 23 is provided on one side of the blanking plate 13. The chamfer 23 can facilitate sliding blanking of integrated circuit semiconductors.

[0038] Principle and advantages of use: When in use, the integrated circuit semiconductor that needs to be cooled is introduced into the interior of the filter box 4, and the integrated circuit semiconductor is cooled by cooling water. After the cooling is completed, the threaded rod 302 is driven to rotate by the first servo motor 301, and the threaded rod 302 is threadedly connected with the filter box 4, so that the filter box 4 can be slidably connected to the interior of the cooling box 1, so that the filter box 4 rises, and the support rod 112 is driven to extend and retract by the servo electric cylinder 111, so that the second magnetic column 12 moves, and the guide block 702 can be slidably connected to the guide rail 701 by relying on the magnetic connection between the second magnetic column 12 and the first magnetic column 9, so that the push plate 8 can be moved, and the first magnet 601 and the second magnet 602 can be relied on. The box cover 5 is magnetically connected so that it can be hinged and opened. The integrated circuit semiconductor can be unloaded by relying on the push plate 8, which can improve the processing cooling efficiency of the integrated circuit semiconductor. The water inside the cooling box 1 can be discharged into the cooling box 16 by the first water pump 14, and the water inside the cooling box 16 can be discharged into the cooling box 1 by relying on the second water pump 15. The water inside the cooling box 16 can be cooled by relying on the chassis 21 and the cooling plate 20. The second servo motor 181 drives the connecting rod 182 to rotate, which can make the stirring frame 19 rotate. The stirring frame 19 can stir the water inside the cooling box 16, which can facilitate the replacement and recycling of the cooling, and can save the utilization of water resources.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling mechanism for integrated circuit semiconductor processing, comprising a cooling box (1), characterized in that: The cooling box (1) is fixedly connected to a mounting frame (2), and the two mounting frames (2) are both provided with a first driving mechanism (3). The output ends of the two groups of the first driving mechanisms (3) are drivingly connected to a filter box (4). A box cover (5) is hinged on the side of the filter box (4), and the box cover (5) is detachably connected to the filter box (4) through a fixed mechanism (6). A push plate (8) is slidably connected to the filter box (4) through two groups of guide mechanisms (7). The side of the push plate (8) is fixedly connected to a first magnetic column (9). The cooling box (1) is fixedly connected to a support plate (10), and the support plate (10) is provided with a second driving mechanism (11). The output end of the second driving mechanism (11) is drivingly connected to a second magnetic column (12). The first magnetic column (9) is fixedly connected to the side of the push plate (8). The column (9) and the second magnetic column (12) are magnetically connected, the top of the cooling box (1) is fixedly connected to a blanking plate (13), the side of the cooling box (1) is fixedly installed with a first water pump (14) and a second water pump (15), the output end of the first water pump (14) is fixedly connected to a cooling box (16), the input end of the second water pump (15) is fixedly connected to the cooling box (16), the cooling box (16) is fixedly connected to a support frame (17), the bottom of the support frame (17) is provided with a third driving mechanism (18), the output end of the third driving mechanism (18) is drivingly connected to a stirring frame (19), the inner wall of the cooling box (16) is fixedly connected to a cooling plate (20), and the outer side of the cooling box (16) is fixedly installed with a chassis (21).

2. The cooling mechanism for integrated circuit semiconductor processing according to claim 1, characterized in that: The two groups of the first driving mechanisms (3) respectively comprise a first servo motor (301) and a threaded rod (302); the first servo motor (301) is fixedly mounted on the bottom of the mounting frame (2); the threaded rod (302) is transmission-connected to the output end of the first servo motor (301) via a coupling; and the threaded rod (302) is threadedly connected to the filter box (4).

3. The cooling mechanism for integrated circuit semiconductor processing according to claim 1, characterized in that: The two groups of guide mechanisms (7) respectively comprise a guide rail (701) and a guide block (702); the guide rail (701) is fixedly connected to the inner wall of the cooling box (1); the guide block (702) is fixedly connected to the side of the push plate (8); and the guide block (702) is slidably connected in the guide rail (701).

4. The cooling mechanism for integrated circuit semiconductor processing according to claim 1, characterized in that: The fixing mechanism (6) comprises a first magnet (601) and a second magnet (602), wherein the first magnet (601) is fixedly connected to a side surface of the box cover (5), and the second magnet (602) is fixedly connected to a side surface of the filter box (4), and the first magnet (601) and the second magnet (602) are magnetically connected.

5. The cooling mechanism for integrated circuit semiconductor processing according to claim 1, characterized in that: The second driving mechanism (11) comprises a servo electric cylinder (111) and a support rod (112); the servo electric cylinder (111) is fixedly mounted on the support plate (10); the support rod (112) is transmission-connected to an output end of the servo electric cylinder (111) via a coupling; and the support rod (112) is fixedly connected to the second magnetic column (12).

6. The cooling mechanism for integrated circuit semiconductor processing according to claim 1, characterized in that: The third driving mechanism (18) comprises a second servo motor (181) and a connecting rod (182); the second servo motor (181) is fixedly mounted on the bottom of the support frame (17); the connecting rod (182) is transmission-connected to the output end of the second servo motor (181) via a coupling; and the connecting rod (182) is fixedly connected to the stirring frame (19).

7. The cooling mechanism for integrated circuit semiconductor processing according to claim 1, characterized in that: The stirring frame (19) is provided with a plurality of flow holes (22).

8. The cooling mechanism for integrated circuit semiconductor processing according to claim 1, characterized in that: A chamfer (23) is provided on one side of the blanking plate (13).

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