Cooling device

Abstract

The embodiment of the utility model provides a cooling device which comprises a shell provided with a gas inlet channel and a gas outlet channel, and the gas inlet channel and the gas outlet channel form a gas path for cooling gas to enter and exit from the shell. The bearing part is positioned between the air inlet channel and the air outlet channel and is used for bearing an object to be cooled; and the air flow adjusting part is positioned between the air inlet channel and the bearing part and is used for intensively adjusting the cooling air in the air path to the to-be-cooled object. By the adoption of the technical scheme, the airflow adjusting piece is arranged between the air inlet channel and the bearing piece, cooling air in the air channel can be adjusted to the to-be-cooled object in a centralized mode, and therefore the cooling efficiency of the cooling device on the to-be-cooled object is improved, the cooling time of the cooling device on the to-be-cooled object is shortened, and the cooling efficiency of the cooling device on the to-be-cooled object is improved. Furthermore, the preparation time of the to-be-cooled material can be shortened, and the preparation efficiency of the to-be-cooled material is improved.

Description

Technical Field

[0001] The utility model embodiment relates to the field of semiconductor technology, and in particular to a cooling device. Background Art

[0002] The wafer manufacturing process includes processes that generate a lot of heat, such as photolithography, deposition and annealing. The temperature of the wafer after completing the above processes is relatively high, and the wafer needs to be placed in a cooling device to cool down before subsequent operations can be carried out.

[0003] The higher the cooling efficiency of the cooling device for the wafer, the higher the wafer preparation efficiency. Therefore, how to provide an improved technical solution to improve the cooling efficiency of the cooling device for the wafer has become a technical problem to be solved urgently. Utility Model Content

[0004] In view of this, an embodiment of the utility model provides a cooling device, which can improve the cooling efficiency of an object to be cooled.

[0005] The present invention provides a cooling device, comprising:

[0006] A housing having an air inlet passage and an air outlet passage, wherein the air inlet passage and the air outlet passage form an air path for cooling gas to enter and exit the housing;

[0007] A bearing member located between the air inlet passage and the air outlet passage and bearing an object to be cooled;

[0008] The air flow regulating member is located between the air inlet passage and the carrier, and centrally regulates the cooling gas in the air path to the object to be cooled.

[0009] Optionally, the housing comprises a top wall, a side wall and a bottom wall, wherein the top wall and the bottom wall are arranged opposite to each other and connected via the side wall;

[0010] The bearing member is fixedly mounted on the side wall;

[0011] The air inlet channel and the air outlet channel are opened on the side wall.

[0012] Optionally, the side wall includes a first side wall, a second side wall and a third side wall, and the first side wall is connected to the third side wall through the second side wall.

[0013] Optionally, the number of the air inlet channel is at least one, and the opening position of the air inlet channel includes at least one of the following:

[0014] a first side wall;

[0015] a second side wall;

[0016] a third side wall;

[0017] The number and the arrangement positions of the airflow adjustment members are matched with the number and the opening positions of the air intake channels.

[0018] Optionally, the positional relationship between the first side wall and the second side wall includes:

[0019] The projection of the first side wall on the bottom wall is perpendicular to the projection of the second side wall on the bottom wall;

[0020] or,

[0021] An included angle between a projection of the first side wall on the bottom wall and a projection of the second side wall on the bottom wall is an obtuse angle.

[0022] Optionally, the positional relationship between the third side wall and the second side wall includes:

[0023] The projection of the third side wall on the bottom wall is perpendicular to the projection of the second side wall on the bottom wall;

[0024] or,

[0025] An included angle between a projection of the third side wall on the bottom wall and a projection of the second side wall on the bottom wall is an obtuse angle.

[0026] Optionally, there are multiple carriers, and the multiple carriers are arranged in sequence along the direction from the top wall to the bottom wall, and adjacent carriers are arranged in parallel.

[0027] Optionally, the airflow adjustment member includes a plurality of diversion holes, and the cooling gas entering the housing through the air intake passage is diverted through the plurality of diversion holes;

[0028] Among them, at least one diversion hole is provided at the position of the airflow adjustment member corresponding to the area between the top wall and the adjacent supporting member; at least one diversion hole is provided at the position of the airflow adjustment member corresponding to the area between two adjacent supporting members; at least one diversion hole is provided at the position of the airflow adjustment member corresponding to the area between the bottom wall and the adjacent supporting members.

[0029] Optionally, the carrier includes at least one of the following:

[0030] A composite structure constructed of multiple spaced-apart load-bearing units;

[0031] Continuously distributed plate-like structure.

[0032] Optionally, the carrier is a plate-like structure made of a heat-insulating material with a thermal conductivity not higher than 1 W / (m·K).

[0033] By adopting the above technical solution, an air path for cooling gas to enter and exit the shell can be formed by arranging an air inlet channel and an air outlet channel on the shell; by arranging a carrier between the air inlet channel and the air outlet channel, the object to be cooled on the carrier can be located on the air path; by arranging an airflow regulating member between the air inlet channel and the carrier, the cooling gas in the air path can be concentratedly regulated to the object to be cooled, thereby improving the cooling efficiency of the cooling device for the object to be cooled, shortening the cooling time of the cooling device for the object to be cooled, and further shortening the preparation time of the object to be cooled, thereby improving the preparation efficiency of the object to be cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments of the utility model or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 A schematic diagram of the main structure of a cooling device example in an embodiment of the utility model is shown;

[0036] Figure 2 Shows Figure 1 A top cross-sectional schematic diagram of ;

[0037] Figure 3 A schematic diagram of the main structure of another cooling device example in an embodiment of the utility model is shown;

[0038] Figure 4 Shows Figure 3 A top cross-sectional schematic diagram of ;

[0039] Figure 5 A structural schematic diagram of a bearing member in an embodiment of the utility model is shown. DETAILED DESCRIPTION

[0040] As described in the background technology, the wafer manufacturing process includes processes such as lithography, deposition and annealing that generate a lot of heat. The temperature of the wafer after completing the above processes is relatively high. For example, after completing lithography, the temperature of the wafer is usually between 100 and 150°C; after completing deposition, the temperature of the wafer is usually between 200 and 400°C; after completing annealing, the temperature of the wafer is usually between 200 and 1100°C. The temperature of the wafer after completing the above processes is relatively high. In order to prevent thermal damage and improve process quality, the wafer needs to be placed in a cooling device for cooling before subsequent operations can be performed. Therefore, how to provide an improved technical solution to shorten the cooling time of the cooling device for the wafer, improve the cooling efficiency of the cooling device for the wafer, thereby shortening the preparation time of the wafer and improving the preparation efficiency of the wafer has become a technical problem that needs to be solved urgently.

[0041] In order to solve the above technical problems, an embodiment of the utility model provides a cooling device, which includes: a shell having an air inlet channel and an air outlet channel, wherein the air inlet channel and the air outlet channel form an air path for cooling gas to enter and exit the shell; a carrier located between the air inlet channel and the air outlet channel, which carries an object to be cooled; and an air flow adjustment member located between the air inlet channel and the carrier, which centrally adjusts the cooling gas in the air path to the object to be cooled.

[0042] By adopting the above technical solution, an air path for cooling gas to enter and exit the shell can be formed by arranging an air inlet channel and an air outlet channel on the shell; by arranging a carrier between the air inlet channel and the air outlet channel, the object to be cooled on the carrier can be located on the air path; by arranging an airflow regulating member between the air inlet channel and the carrier, the cooling gas in the air path can be concentratedly regulated to the object to be cooled, thereby improving the cooling efficiency of the cooling device for the object to be cooled, shortening the cooling time of the cooling device for the object to be cooled, and further shortening the preparation time of the object to be cooled, thereby improving the preparation efficiency of the object to be cooled.

[0043] In order to enable those skilled in the art to better understand and implement the embodiments of the present invention, the concepts, schemes, principles and advantages of the embodiments of the present invention are described in detail below with reference to the accompanying drawings and through specific application examples.

[0044] In some embodiments of the present invention, Figures 1 to 4 , Figure 1 The figure shows a schematic diagram of the main structure of a cooling device in an embodiment of the utility model. Figure 2 Shows Figure 1 A schematic top view of a cross section of an example of a cooling device, Figure 3 A schematic diagram of the main structure of another cooling device example in an embodiment of the utility model is shown. Figure 4 Shows Figure 3Schematic top view of a cross section of an example cooling device.

[0045] Continue to combine references Figures 1 to 4 The cooling device N may include: a housing 1, a bearing 2 and an airflow adjustment member 3. Wherein:

[0046] The shell 1 may be provided with an air inlet channel a and an air outlet channel b, and an air path for cooling gas to enter and exit the shell 1 may be formed between the air inlet channel a and the air outlet channel b.

[0047] In some examples, the shell 1 has a structure with a cavity c, and the air inlet channel a and the air outlet channel b are channels opened on the shell 1. Through the air inlet channel a and the air outlet channel b, the cavity c of the shell 1 is connected to the outside.

[0048] The carrier 2 is used to carry the object M to be cooled, and the carrier 2 may be located between the air inlet channel a and the air outlet channel b.

[0049] In some examples, the carrier 2 may be located in the cavity c of the housing 1 and between the air inlet channel a and the air outlet channel b.

[0050] As an example, the bearing member 2 is located on an air path in and out of the housing 1 formed by the air inlet channel a, the cavity c and the air outlet channel b.

[0051] The airflow regulating member 3 may be located between the air inlet passage a and the supporting member 2 , and is used to centrally regulate the cooling gas in the air path to the object M to be cooled.

[0052] In some examples, the airflow adjustment member 3 may be located in the cavity c of the housing 1 and between the air inlet passage a and the carrier 2 .

[0053] As an example, the airflow regulating member 3 is located on an air path in and out of the housing 1 formed by the air inlet channel a, the cavity c and the air outlet channel b.

[0054] By arranging an air inlet channel and an air outlet channel on the shell, the cavity of the shell can be connected with the outside, so that an air path for the cooling gas to enter and exit is formed in the shell; by arranging a carrier between the air inlet channel and the air outlet channel, the object to be cooled on the carrier can be located on the air path; by arranging an airflow regulating member between the air inlet channel and the carrier, the cooling gas in the air path can be concentrated and regulated to the object to be cooled, thereby improving the cooling efficiency of the cooling device for the object to be cooled, shortening the cooling time of the cooling device for the object to be cooled, and further shortening the preparation time of the object to be cooled, and improving the preparation efficiency of the object to be cooled.

[0055] In some examples, the cooling gas may be a gas having good heat capacity and thermal conductivity.

[0056] As an example, the cooling gas may be one or more of chlorodifluoroethane, nitrogen, helium or argon.

[0057] In some examples, the object to be cooled may be a wafer.

[0058] In some examples, the shell may be a structure made of a material with a thermal conductivity higher than 80 W / (m·K).

[0059] As an example, the material constituting the housing may include aluminum alloy.

[0060] In some embodiments, continue to combine with reference Figures 1 to 4 The housing 1 may include a top wall 11, a side wall 12 and a bottom wall 13, wherein the top wall 11, the side wall 12 and the bottom wall 13 form a cavity c.

[0061] The top wall 11 and the bottom wall 13 are disposed opposite to each other, and the side wall 12 is located between the top wall 11 and the bottom wall 13 to connect the top wall 11 and the bottom wall 13 .

[0062] In some examples, the top wall 11 may be arranged parallel to the bottom wall 13 , and the side walls 12 may be perpendicular to the top wall 11 and the bottom wall 13 , respectively.

[0063] The supporting member 2 may be fixed to the side wall 12 .

[0064] In some examples, the carrier 2 is fixed to the side wall 12 , and a bearing surface of the carrier 2 is arranged parallel to the top wall 11 , wherein the bearing surface is used to bear the object M to be cooled.

[0065] The air inlet channel a and the air outlet channel b may be opened on the side wall 12 .

[0066] In some examples, the air inlet channel a is opened on the side wall 12 , the air outlet channel b is opened on the other side of the side wall 12 oppositely arranged, and the flow direction of the cooling gas in the cavity c of the shell 1 is parallel to the bearing surface of the bearing member 2 .

[0067] In some embodiments, continue to combine with reference Figures 1 to 4 , the number of the side walls can be multiple.

[0068] In some examples, the side wall 12 may include the first side wall 121 , the second side wall 122 , and the third side wall 123 , and the first side wall 121 is connected to the third side wall 123 through the second side wall 122 .

[0069] As an example, refer to Figure 1 to Figure 2 The projection of the first side wall 121 and / or the third side wall 123 on the bottom wall 13 may be perpendicular to the projection of the second side wall 122 on the bottom wall 13 .

[0070] As an example, refer to Figure 3 to Figure 4 The included angle between the projection of the first side wall 121 and / or the third side wall 123 on the bottom wall 13 and the projection of the second side wall 122 on the bottom wall 13 may be an obtuse angle.

[0071] In some embodiments, the number of the air intake channels is at least one, and the air intake channels can be opened at one or more positions in the first side wall, the second side wall or the third side wall; accordingly, the number and setting positions of the air flow adjustment parts are adapted to the number and opening positions of the air intake channels.

[0072] In some examples, continue to combine reference Figures 1 to 4 The number of the air inlet channel a can be one, and the air inlet channel a is opened on the second side wall 122. Correspondingly, the number of the air flow adjustment member 3 is one, and the edges of the air flow adjustment member 3 are respectively fixed on the first side wall 121, the top wall 11, the third side wall 123 and the bottom wall 13.

[0073] In some examples, the number of the air inlet channels is three, and the air inlet channels are respectively opened on the first side wall, the second side wall and the third side wall. Correspondingly, the number of the air flow adjustment members is three, and the edges of the air flow adjustment members are respectively fixed on the top wall, the bottom wall and the adjacent air flow adjustment members. By increasing the number of air inlet channels and adjusting the opening positions, the cooling gas in the air path can be concentrated and adjusted to the object to be cooled, thereby improving the cooling efficiency of the cooling device on the wafer.

[0074] In some examples, the connection method between the airflow adjustment member and the top wall or the bottom wall may include any one of welding, clamping or plugging.

[0075] It is understandable that the above implementation is merely an example to illustrate the correspondence between the number and setting positions of the airflow adjustment members and the number and opening positions of the air intake channels, and should not be construed as a limitation on the above correspondence in the present disclosure.

[0076] In some examples, combined with reference Figure 1 and Figure 2 The opening size of the air inlet passage a is adapted to the positions of all the diverter holes 31 arranged on the airflow adjustment member 3 .

[0077] In some examples, combined with reference Figure 3 and Figure 4, along the direction in which the cooling gas enters the housing 1 , the inner diameter of the air inlet passage a gradually increases, and the maximum opening size of the air inlet passage a is adapted to the positions of all the diverter holes 31 provided on the airflow adjustment member 3 .

[0078] In some examples, combined with reference Figures 1 to 4 The first side wall 121, the top wall 11, the third side wall 123 and the bottom wall 13 can surround and form an air outlet channel b, and the air inlet channel a is located on the second side wall 122, and the air outlet channel b is arranged opposite to the air inlet channel a.

[0079] It is understood that the above implementation is only an example for illustrating the correspondence between the side wall and the air outlet channel, and cannot be understood as a limitation on the above correspondence in the present disclosure. For example, in some examples, the side wall may further include a fourth side wall opposite to the second side wall, and the air outlet channel is opened on the fourth side wall.

[0080] In some embodiments, the carrier may be a plate-like structure made of a heat insulating material.

[0081] In some examples, the carrier may be made of a material with a thermal conductivity of no more than 1 W / (m·K). The carrier made of the above material can reduce the temperature gradient formed at the contact point between the carrier and the wafer and other locations, thereby reducing the thermal stress at the contact point, thereby reducing the probability of wafer breakage.

[0082] As an example, the carrier may be made of one or more of polytetrafluoroethylene (PTFE) and polyetheretherketone (PEEK).

[0083] In some examples, combined with reference Figure 1 and Figure 2 The supporting member 2 may be a continuously distributed plate-like structure, and two sides of the supporting member 2 are respectively connected to the first side wall 121 and the third side wall 123 .

[0084] As an example, a plurality of air-permeable through holes 21 are distributed in an array on the carrier 2 so that the bottom surface of the object M to be cooled carried by the carrier 2 can be in contact with the cooling gas, thereby improving the cooling efficiency of the cooling device.

[0085] In some examples, combined with reference Figure 3 and Figure 4 The carrier 2 may be a combined structure consisting of a plurality of carrier units 2a spaced apart and distributed on the side wall 12, and the highest points of the top surfaces of the plurality of carrier units 2a are in the same plane.

[0086] As an example, a plurality of carrying units 2 a are distributed at intervals on the first side wall 121 and the third side wall 123 , and top surfaces of the plurality of carrying units 2 a are in the same plane, together forming a carrying surface for carrying the object M to be cooled.

[0087] By providing a plurality of bearing units spaced apart on the side wall, the contact area between the bearing and the object to be cooled can be reduced, and the contact area between the object to be cooled and the cooling gas can be increased, thereby further improving the cooling efficiency of the cooling device.

[0088] In some embodiments, there may be multiple carriers.

[0089] In some examples, in conjunction with reference Figure 1 and Figure 3 , multiple carriers 2 can be arranged in sequence along the direction from the top wall 11 to the bottom wall 13, and adjacent carriers 2 are arranged in parallel. Multiple carriers can provide multiple bearing surfaces for bearing objects to be cooled. By increasing the number of carriers, the number of wafers that can be cooled by the cooling device can be increased.

[0090] In some examples, the air outlet channel is also used for wafers to enter and exit; the distance between the ends of adjacent carriers close to the air outlet channel is greater than the distance between the ends away from the air outlet channel, thereby facilitating the placement of the wafer on the carrying surface of the carrier from the direction of the air outlet channel.

[0091] As an example, see Figure 5 , Figure 5 A schematic structural diagram of a carrier in an embodiment of the utility model is shown, and the lower end surface of the carrier 2 close to the end of the air outlet channel is a convex surface.

[0092] In some embodiments, continue to combine with reference Figures 1 to 4 The airflow adjustment member 3 may include a diverter hole 31 , and the height of the diverter hole 31 is adapted to the height of the object to be cooled M carried by the carrier 2 .

[0093] The airflow regulating member can adjust the height of the cooling gas entering the cavity through the air inlet channel through the diverter hole, so that the cooling gas entering the cavity is concentrated to pass through the object to be cooled carried by the supporting member, thereby improving the cooling efficiency of the cooling device.

[0094] In some examples, the number of the diversion holes 31 can be multiple, and the multiple diversion holes 31 can be arranged in sequence along the direction from the top wall 11 to the bottom wall 13, and the cooling gas entering the shell 1 through the air intake channel a is diverted through the multiple diversion holes 31.

[0095] As an example, at least one diversion hole is provided at the position of the airflow adjustment member corresponding to the area between the top wall and the adjacent supporting member, so as to cool the top surface of the object to be cooled carried on the supporting member adjacent to the top wall.

[0096] As an example, at least one diversion hole is provided at the position of the airflow adjustment member corresponding to the area between two adjacent carriers to cool the bottom surface of the object to be cooled carried on one of the two adjacent carriers and the top surface of the object to be cooled carried on the other carrier.

[0097] As an example, at least one diversion hole is provided at the position of the airflow adjustment member corresponding to the area between the bottom wall and the adjacent supporting member, so as to cool the bottom surface of the object to be cooled carried on the supporting member adjacent to the bottom wall.

[0098] It is understandable that the above-mentioned embodiments provide a variety of implementation schemes, and the various implementation schemes can be combined and cross-referenced with each other without conflict, thereby extending a variety of possible implementation schemes, which can all be considered as embodiment schemes disclosed in the embodiments of this application and the utility model.

[0099] It should be noted that the "examples" or "embodiments" referred to in this specification refer to specific features, structures or characteristics that may be included in at least one implementation of the embodiments of the utility model. And in the description of this specification, the terms "first", "second", "third", "fourth" and the like are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined by the terms "first", "second", "third", "fourth" and the like may explicitly or implicitly include one or more of the features. Moreover, the terms "first", "second", "third", "fourth" and the like are used to distinguish similar objects, and are not necessarily used to describe a specific order or to indicate importance. It is understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein.

[0100] Although the embodiments of the present invention are disclosed above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this specification shall be subject to the scope defined by the claims.

Claims

1. A cooling device, characterized in that: include: A housing having an air inlet passage and an air outlet passage, wherein the air inlet passage and the air outlet passage form an air path for cooling gas to enter and exit the housing; A bearing member located between the air inlet passage and the air outlet passage and bearing an object to be cooled; The air flow regulating member is located between the air inlet passage and the carrier, and centrally regulates the cooling gas in the air path to the object to be cooled.

2. The cooling device according to claim 1, characterized in that: The housing comprises a top wall, a side wall and a bottom wall, wherein the top wall is arranged opposite to the bottom wall and connected via the side wall; The bearing member is fixedly mounted on the side wall; The air inlet channel and the air outlet channel are opened on the side wall.

3. The cooling device according to claim 2, characterized in that: The side wall includes a first side wall, a second side wall and a third side wall, and the first side wall is connected to the third side wall through the second side wall.

4. The cooling device according to claim 3, characterized in that: The number of the air inlet channel is at least one, and the opening position of the air inlet channel includes at least one of the following: a first side wall; a second side wall; a third side wall; The number and the arrangement positions of the airflow adjustment members are matched with the number and the opening positions of the air intake channels.

5. The cooling device according to claim 3, characterized in that: The positional relationship between the first side wall and the second side wall includes: The projection of the first side wall on the bottom wall is perpendicular to the projection of the second side wall on the bottom wall; or, An included angle between a projection of the first side wall on the bottom wall and a projection of the second side wall on the bottom wall is an obtuse angle.

6. The cooling device according to claim 3, characterized in that: The positional relationship between the third side wall and the second side wall includes: The projection of the third side wall on the bottom wall is perpendicular to the projection of the second side wall on the bottom wall; or, An included angle between a projection of the third side wall on the bottom wall and a projection of the second side wall on the bottom wall is an obtuse angle.

7. The cooling device according to claim 2, characterized in that: There are multiple carriers, which are arranged in sequence along the direction from the top wall to the bottom wall, and adjacent carriers are arranged in parallel.

8. The cooling device according to claim 7, characterized in that: The airflow adjustment member includes a plurality of flow-dividing holes, and the cooling gas entering the housing through the air inlet passage is diverted through the plurality of flow-dividing holes; Among them, at least one diversion hole is provided at the position of the airflow adjustment member corresponding to the area between the top wall and the adjacent supporting member; at least one diversion hole is provided at the position of the airflow adjustment member corresponding to the area between two adjacent supporting members; at least one diversion hole is provided at the position of the airflow adjustment member corresponding to the area between the bottom wall and the adjacent supporting members.

9. The cooling device according to claim 1, characterized in that: The carrier includes at least one of the following: A composite structure constructed of multiple spaced-apart load-bearing units; Continuously distributed plate-like structure.

10. The cooling device according to claim 1, characterized in that: The bearing member is a plate-shaped structure made of a heat insulating material with a thermal conductivity coefficient not higher than 1 W / (m·K).

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