Optical fiber temperature measuring device

Abstract

The utility model discloses an optical fiber temperature measuring device, and relates to the field of optical fiber temperature measurement. The optical fiber temperature measuring device comprises a circuit board, a plurality of optical channels located at the top or the bottom of the optical fiber temperature measuring device and located between the two opposite side faces of the optical fiber temperature measuring device, an optical fiber probe is arranged at one end of each optical channel, and a photoelectric device is arranged at the other end of each optical channel. The light splitting lens is obliquely arranged in the optical fiber temperature measuring device and comprises a first surface and a second surface which are opposite, the optical fiber probe faces the first surface, and the photoelectric device faces the second surface; an excitation light source and a photoelectric device are installed on the circuit board, the excitation light source is located on one side close to the first face, and the photoelectric device extends to one side of the second face. According to the optical fiber temperature measuring device, the excitation light source and the photoelectric device are integrated on one circuit board, the optical precision needed by temperature measurement is greatly improved, accurate positioning between the excitation light source and the photoelectric device in the device can be achieved only by effectively installing the position of one circuit board, the assembly procedures are reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of optical fiber temperature measurement, and in particular, provides an optical fiber temperature measurement device. Background Art

[0002] Fluorescent fiber optic temperature measurement technology is an interdisciplinary technology that has emerged in recent years. Fluorescent temperature measurement is to coat the end of the optical fiber with fluorescent material. After being stimulated by light of a certain wavelength, the fluorescent material is stimulated to radiate fluorescent energy. Since the fluorescent energy emitted by stimulated radiation can decay exponentially, and the decay time constant varies with temperature, the temperature of the measurement point can be obtained by measuring the decay time.

[0003] However, due to the internal device layout of the optical fiber temperature measurement device in the related art, it is difficult for the excitation optical power source and the optoelectronic device to effectively coordinate, resulting in poor overall optical accuracy of the module. When the product is produced in large quantities, the assembly is cumbersome and the product quality is uneven.

[0004] For the above problems, the prior art does not provide corresponding solutions. Summary of the invention

[0005] To achieve the above-mentioned purpose, some embodiments of the present application provide a fiber optic temperature measuring device, which includes: a circuit board, located at the top or bottom of the fiber optic temperature measuring device; a plurality of optical channels, located between two opposite side surfaces of the fiber optic temperature measuring device, one end of the optical channel is provided with a fiber optic probe, and the other end is provided with a photoelectric device; a spectrometer, obliquely arranged in the fiber optic temperature measuring device, comprising a first surface and a second surface opposite to each other, and the fiber optic probe faces the first surface; wherein the circuit board is installed with an excitation light source and the photoelectric device, the excitation light source is located on a side of the spectrometer close to the first surface, and the photoelectric device extends in a direction away from the circuit board to face the second surface.

[0006] Furthermore, it also includes an installation module, which includes a light guide portion, which extends along the light channel and is hollow inside, a part of the light channel is located in the light guide portion, and the optical fiber probe is inserted into the light guide portion.

[0007] Furthermore, the installation module also includes a positioning groove, the extension direction of which is perpendicular to the optical channel, and the optoelectronic device is inserted into the positioning groove.

[0008] Furthermore, the mounting module covers the circuit board so that the excitation light source is within a closed space between the circuit board and the mounting module.

[0009] Furthermore, the installation module also includes a positioning plate, which is obliquely arranged in the middle of the optical fiber temperature measuring device to support the beam splitter lens.

[0010] Furthermore, the light guide portion, the positioning groove and the positioning plate are integrally formed.

[0011] Furthermore, one optical channel is provided with one optical fiber probe, one optoelectronic device and one excitation light source; in the optical fiber temperature measuring device, all the optical channels are passed through one beam splitter lens.

[0012] Furthermore, the circuit board is provided with an amplifier circuit, a single-chip microcomputer chip and a connector, and the single-chip microcomputer chip is electrically connected to the excitation light source, the photoelectric device, the amplifier circuit and the connector respectively.

[0013] Furthermore, a side of the circuit board facing away from the excitation light source is covered with a top cover.

[0014] Furthermore, the top cover is a black pcv sticker.

[0015] More specifically, some embodiments of the present application may produce the following specific beneficial effects:

[0016] This optical fiber temperature measurement device integrates the excitation light source and the optoelectronic device on a circuit board, which greatly improves the optical accuracy required for temperature measurement. At the same time, during the production process, only one circuit board position needs to be effectively installed to achieve precise positioning between the excitation light source and the optoelectronic device in the device, reducing the assembly process and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of this application are used to provide a further understanding of this application, so that other features, purposes and advantages of this application become more obvious. The schematic embodiment drawings and their descriptions of this application are used to explain this application and do not constitute an improper limitation on this application. In the drawings:

[0018] Figure 1 is a schematic structural diagram of an optical fiber temperature measuring device according to an embodiment of the present application;

[0019] Figure 2 is a schematic structural diagram of an optical fiber temperature measuring device according to an embodiment of the present application;

[0020] Figure 3 This is a schematic diagram of the working principle of an optical fiber temperature measurement device according to an embodiment of the present application;

[0021] Figure 4 This is a schematic diagram of the circuit board structure of an optical fiber temperature measuring device according to an embodiment of the present application;

[0022] Figure 5 This is a schematic diagram of the structure of an installation module of an optical fiber temperature measuring device according to an embodiment of the present application;

[0023] Description of labels:

[0024] 10. Circuit board; 11. Amplifier circuit; 12. Single chip microcomputer chip; 13. Connector;

[0025] 20. Optical channel;

[0026] 30. Fiber optic probe;

[0027] 40. Optoelectronic devices;

[0028] 50. Excitation light source;

[0029] 60. Beam splitter lens; 61. First surface; 62. Second surface;

[0030] 70. Mounting module; 71. Light guide; 72. Positioning groove; 73. Positioning plate. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0032] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so as to describe the embodiments of the present application described herein.

[0033] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation. Moreover, in addition to being used to indicate orientation or positional relationships, some of the above terms may also be used to express other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present application can be understood according to the specific circumstances.

[0034] This application proposes an optical fiber temperature measuring device, such as Figure 1As shown, the optical fiber temperature measuring device generally has a rectangular structure, and includes a circuit board 10, a plurality of optical channels 20, an optical fiber probe 30, an optoelectronic device 40, an excitation light source 50 and a spectrometer 60.

[0035] The circuit board 10 is located at the top or bottom of the optical fiber temperature measuring device. Preferably, the circuit board 10 is located at the top of the optical fiber temperature measuring device for easy maintenance.

[0036] like Figure 1 , 2 As shown, the optical channel 20 is located between two opposite sides of the optical fiber temperature measuring device, an optical fiber probe 30 is provided at one end of the optical channel 20, and an optoelectronic device 40 is provided at the other end. It is worth noting that the optical channel 20 is not a physical entity, but is specifically a path through which the transmitted light and the light refracted by the beam splitter 60 pass. The number of the optical channels 20 can be 2, 3, 4, 5, etc., which is not limited in this embodiment.

[0037] Preferably, since most power equipment uses three-phase electricity, the number of optical channels 20 in this embodiment is three, and the optical fiber temperature measuring device is resistant to high voltage and is not affected by electromagnetic interference, and is particularly suitable for use in power systems.

[0038] Specifically, if Figure 1 As shown, one optical channel 20 is correspondingly provided with a fiber optic probe 30 , a photoelectric device 40 and an excitation light source 50 .

[0039] like Figure 2 As shown, the beam splitter 60 is tiltedly disposed in the optical fiber temperature measuring device, and includes a first surface 61 and a second surface 62 opposite to each other. The optical fiber probe 30 faces the first surface 61 , and the optoelectronic device 40 faces the second surface 62 .

[0040] Preferably, in the optical fiber temperature measuring device, all optical channels 20 are passed through a beam splitter lens 60, and multiple channels share a beam splitter lens 60, which can ensure that each channel has the same beam splitting characteristics and reduce the difficulty of assembly.

[0041] Among them, Figure 2 As shown, the circuit board 10 is installed with an excitation light source 50 and an optoelectronic device 40, the excitation light source 50 is located on the side of the beam splitter 60 close to the first surface 61, and the optoelectronic device 40 extends away from the circuit board 10 to face the second surface 62. Specifically, the light output path of the excitation light source 50 is perpendicular to the optical channel 20.

[0042] Specifically, if Figure 3 , 4 As shown, the circuit board 10 is provided with an amplifier circuit 11, a single-chip microcomputer chip 12 and a connector 13, and the single-chip microcomputer chip 12 is electrically connected to the excitation light source 50, the optoelectronic device 40, the amplifier circuit 11 and the connector 13 respectively.

[0043] Further, such as Figure 4 As shown, the optoelectronic devices 40 and the excitation light sources 50 required for the multiple optical channels 20 are all arranged on a circuit board 10 .

[0044] In the related art, the excitation light source and the optoelectronic device are respectively arranged on two different circuit boards. When the different circuit boards are actually positioned and assembled with each other, the optical accuracy of the overall module will be poor, thereby affecting the subsequent fluorescence temperature measurement software algorithm processing.

[0045] The optical fiber temperature measurement device integrates the excitation light source 50 and the optoelectronic device 40 on a circuit board 10, which greatly improves the optical accuracy required for temperature measurement. At the same time, during the manufacturing process, only one circuit board 10 needs to be effectively installed to achieve accurate positioning between the excitation light source 50 and the optoelectronic device 40 in the device, reducing the assembly process and improving production efficiency. Specifically, when assembling the circuit board 10, due to the overall temperature calibration, when all related devices are integrated on one circuit board 10, the manufacturer's inspection workload is less.

[0046] Preferably, Figure 5 As shown, the optical fiber temperature measuring device also includes an installation module 70, and the installation module 70 includes a light guide portion 71. The light guide portion 71 extends along the optical channel 20 and is hollow inside. The optical channel 20 can be cylindrical or rectangular tubular, etc. A part of the optical channel 20 is located in the light guide portion 71, and the optical fiber probe 30 is inserted into the light guide portion 71, so that the light emitted by the optical fiber probe 30 is as free from interference from other factors as possible.

[0047] Generally speaking, the optical fiber probe 30 and the light guide 71 are separate, and the optical fiber probe 30 can be quickly disassembled and assembled to the light guide 71. When the user needs to measure the temperature, the optical fiber probe 30 is inserted into the light guide 71.

[0048] Specifically, if Figure 5 As shown, the mounting module 70 further includes a positioning groove 72 , the extension direction of which is perpendicular to the light channel 20 , and the optoelectronic device 40 is inserted into the positioning groove 72 so that the optoelectronic device 40 is located at the end of the light channel 20 .

[0049] More specifically, the mounting module 70 covers the circuit board 10, and the mounting module 70 cooperates with the circuit board 10, so that the excitation light source 50 is in the closed space between the circuit board 10 and the mounting module 70, and the optoelectronic device 40 is in the closed space between the circuit board 10, the mounting module 70, and the positioning groove 72. In this way, both the refracted light and the transmitted light in the mounting module 70 are in a closed dark environment, so that when the optoelectronic device 40 receives the projection light emitted by the optical fiber probe 30, the ambient light will not cause any interference to it, and a filter lens can be directly omitted, which significantly reduces the production cost.

[0050] Preferably, the side of the circuit board 10 facing away from the excitation light source 50 is covered with a top cover, which can completely cover the circuit board 10, further ensuring that the components in the optical fiber temperature measuring device are in a dark space that is not disturbed by ambient light. At the same time, the top cover can protect the circuit board 10.

[0051] Specifically, the top cover can be made of stainless steel or a black pcv sticker. The pcv material has good UV resistance and can maintain good color stability, thereby avoiding the reduction of the light-shielding property of the black pcv sticker.

[0052] Specifically, if Figure 5 As shown, the installation module 70 further includes a positioning plate 73 , which is obliquely disposed at the middle of the optical fiber temperature measuring device for supporting the beam splitter 60 .

[0053] The light guide portion 71 , the positioning groove 72 and the positioning plate 73 are integrally formed, which is convenient for installation and manufacturing.

[0054] Specifically, refer to Figure 3 The working mode of the optical fiber temperature measuring device is as follows: the single-chip microcomputer chip 12 controls the excitation light source 50 to emit a light beam of a predetermined wavelength in turn, which is reflected by the spectroscope 60 to excite the optical fiber probe 30. The optical fiber probe 30 returns a light beam of a different wavelength, which passes through the spectroscope 60 and is received by the optoelectronic device 40. The installation module 70 allows the optoelectronic device 40 to be in a closed dark environment, ensuring that the optoelectronic device is not affected by ambient light. The optical signal received by the optoelectronic device 40 is amplified by the amplifier circuit 11 and sent to the single-chip microcomputer chip 12 for processing. The temperature information processed by the internal software algorithm of the single-chip microcomputer chip 12 is transmitted through the connector 13.

[0055] Therefore, the optical fiber temperature measurement device uses one less filter lens, saves production costs, reduces assembly processes, improves optical accuracy, and reduces software algorithm complexity, making the temperature measurement more accurate, with better performance consistency and stability.

[0056] In this application, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0057] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An optical fiber temperature measuring device, characterized in that: include: A circuit board, located at the top or bottom of the optical fiber temperature measuring device; A plurality of optical channels, located between two opposite sides of the optical fiber temperature measuring device, wherein an optical fiber probe is disposed at one end of the optical channel and an optoelectronic device is disposed at the other end; A beam splitter lens is tiltedly disposed in the optical fiber temperature measuring device, comprising a first surface and a second surface opposite to each other, and the optical fiber probe faces the first surface; The circuit board is installed with an excitation light source and the optoelectronic device. The excitation light source is located on a side of the beam splitter lens close to the first surface. The optoelectronic device extends away from the circuit board to face the second surface.

2. The optical fiber temperature measuring device according to claim 1, characterized in that: It also includes an installation module, which includes a light guide portion, which extends along the light channel and is hollow inside, a part of the light channel is located in the light guide portion, and the optical fiber probe is inserted into the light guide portion.

3. The optical fiber temperature measuring device according to claim 2, characterized in that: The mounting module further comprises a positioning groove, the extension direction of which is perpendicular to the optical channel, and the optoelectronic device is inserted into the positioning groove.

4. The optical fiber temperature measuring device according to claim 3, characterized in that: The mounting module covers the circuit board so that the excitation light source is within a closed space between the circuit board and the mounting module.

5. The optical fiber temperature measuring device according to claim 4, characterized in that: The installation module also includes a positioning plate, which is obliquely arranged in the middle of the optical fiber temperature measuring device and is used to support the beam splitter.

6. The optical fiber temperature measuring device according to claim 5, characterized in that: The light guide portion, the positioning groove and the positioning plate are integrally formed.

7. The optical fiber temperature measuring device according to claim 1, characterized in that: One of the optical channels is correspondingly provided with one of the optical fiber probes, optoelectronic devices and excitation light sources; In the optical fiber temperature measuring device, all the optical channels are passed through by one beam splitter lens.

8. The optical fiber temperature measuring device according to claim 1, characterized in that: The circuit board is provided with an amplifier circuit, a single-chip microcomputer chip and a connector, and the single-chip microcomputer chip is electrically connected to the excitation light source, the photoelectric device, the amplifier circuit and the connector respectively.

9. The optical fiber temperature measuring device according to any one of claims 1 to 8, characterized in that: A side of the circuit board facing away from the excitation light source is covered with a top cover.

10. The optical fiber temperature measuring device according to claim 9, characterized in that: The top cover is a black pcv sticker.

Images