Packaging chip test clamp, system and device
By designing a packaged chip test fixture that includes an external matching circuit and adjusts the snap height, the self-excitation oscillation and focus problems during infrared thermal imaging measurements are solved, and the stability and accuracy of the test are achieved.
Patent Information
- Application Number
- CN202421567991.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-03
AI Technical Summary
In the prior art, when using infrared thermal imaging method to measure the surface heat distribution of gallium nitride chips, self-excitation oscillation is easily generated, affecting the test results. At the same time, the working distance of the objective lens of the infrared microscope is low, and the clamping height of the existing chip test fixture is high, which causes the lens to be unable to focus and cause inconvenience.
A package chip test fixture is designed, including a substrate and a fixing component. The substrate is composed of a PCB board and a thermal base. An external matching circuit is installed on the thermal base to avoid self-excitation. The snap height of the fixing component is adjusted from 10.76mm to 17.81mm, and a hollow is set at the center to ensure focus.
It effectively avoids the chip's self-exciting oscillation during the test, ensures the stability and accuracy of the test, and realizes the focus between the infrared microscope and the chip by adjusting the snap height and setting hollowing, simplifying the test process.
Smart Images
Figure CN222825452U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of electronic device testing and relates to a packaged chip testing fixture, a system and a device. Background Art
[0002] In the prior art, the heat accumulation effect has become one of the bottleneck problems for the further development and application of chips. In order to ensure the minimum heat dissipation of the chip during operation and improve the working life of the device, it is necessary to accurately measure the junction temperature of the chip. The methods for testing the junction temperature of the chip include Raman scattering, infrared thermal imaging, simulation and thermal impedance calculation. Among them, infrared thermal imaging is that the infrared detector receives the infrared radiation energy of the target to be measured through an optical imaging objective lens, and reflects the energy distribution on the photosensitive component of the infrared detector, thereby obtaining an infrared thermal image. After obtaining the heat distribution on the chip surface, the junction temperature of the chip is further calculated by means of modeling. However, when using infrared thermal imaging to measure the heat distribution on the chip surface to measure the junction temperature, the chip device will produce problems such as self-oscillation, which affects the test results. At the same time, when using an infrared microscope for testing, the working distance of the objective lens of the near-infrared microscope is low, and the height of the buckle of the chip test fixture in the prior art is high. When the infrared lens is low, the lens cannot focus, which further brings inconvenience to the chip test.
[0003] Therefore, in order to make up for the defect that the current infrared thermal imaging method is prone to self-oscillation and affects the test results when measuring the junction temperature of the packaged chip, it is necessary to further improve the structure of the fixture when testing the junction temperature of the packaged chip.
[0004] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the utility model and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology section of the utility model. Utility Model Content
[0005] In view of the shortcomings of the prior art described above, the purpose of the utility model is to provide a packaged chip test fixture, system and device, which is used to solve the problem that when the infrared thermal imaging method is used in the prior art to measure the surface heat distribution of the gallium nitride chip to measure the junction temperature, the chip device will produce self-excited oscillation and other problems, affecting the test results. At the same time, when using an infrared microscope for testing, the working distance of the objective lens of the near-infrared microscope is relatively low, and the height of the buckle of the chip test fixture in the prior art is relatively high. When the infrared lens is low, the lens cannot focus, which further brings inconvenience to the chip test.
[0006] In order to achieve the above-mentioned object and other related objects, the utility model provides a packaged chip test fixture, the packaged chip test fixture comprising: a substrate and a fixing component;
[0007] The substrate comprises a PCB board and a heat-conducting base; the PCB board is arranged on the heat-conducting base;
[0008] The PCB board is provided with a first through hole and an external matching circuit;
[0009] The front side of the heat-conducting base is provided with a first groove, and the first groove corresponds to the position of the first through hole; the first groove is provided with a second through hole; the back side of the heat-conducting base is provided with a second groove, and the second through hole also penetrates the second groove;
[0010] The fixing component is arranged on the first through hole of the PCB board, and the middle of the fixing component is arranged to be hollow.
[0011] Optionally, the packaged chip testing fixture further includes a temperature measuring component, and the temperature measuring component is disposed on the second groove and is electrically connected through the second through hole.
[0012] Optionally, the temperature measuring component is configured as a thermistor.
[0013] Optionally, the fixing component is configured as a fixing buckle.
[0014] Optionally, the height range of the fixing buckle is 10.76 mm to 17.81 mm.
[0015] Optionally, the thermally conductive base is configured as a metal thermally conductive base.
[0016] Optionally, the external matching circuit includes a first load module, a second load module and an excitation source internal impedance module, the first load module and the second load module are respectively arranged at two ends of the PCB board; and the excitation source internal impedance module is electrically connected to the first load module and the second load module.
[0017] The utility model also provides a packaged chip testing system, the packaged chip testing system at least comprising: a packaged chip and the packaged chip testing fixture;
[0018] The packaged chip passes through the first through hole to contact the first groove and is electrically connected to the PCB board; the fixing component fixes the packaged chip on the substrate.
[0019] Optionally, the packaged chip is configured as a ceramic flange packaged chip.
[0020] The utility model also provides a packaged chip testing device, which at least comprises: an infrared microscope, a heating component and the packaged chip testing system;
[0021] The packaged chip testing system is arranged above the heating component; the objective lens of the infrared microscope is suspended above the fixing component.
[0022] Optionally, the distance between the objective lens and the packaged chip is set to range from 10 mm to 15 mm.
[0023] As described above, the utility model provides a packaged chip test fixture, system and device, which have the following beneficial effects:
[0024] 1. The fixed buckle of the packaged chip test fixture of the utility model fixes the packaged chip to prevent the packaged chip from moving arbitrarily and affecting the test results during the test. The height of the fixed buckle is low, and the center position is set to be hollow, which further ensures that during the test, when the working distance between the objective lens of the infrared microscope and the packaged chip is about 15mm, it can also achieve focusing, so as to perform junction temperature testing.
[0025] 2. The packaged chip test fixture of the utility model avoids self-oscillation of the packaged chip during the test process by setting an external matching circuit on the metal base, thereby ensuring the stability and accuracy of the test.
[0026] 3. The packaged chip test fixture of the utility model is provided with a thermistor, which is in contact with the packaged chip, so as to monitor the temperature of the outer shell of the packaged chip during the infrared thermal imaging test. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 Shown is a structural schematic diagram of the test fixture of the utility model.
[0028] Figure 2 Shown is a schematic structural diagram of a PCB board of the present utility model.
[0029] Figure 3 Shown is a schematic structural diagram of the front side of the heat-conducting base of the present invention.
[0030] Figure 4 Shown is a schematic structural diagram of the reverse side of the heat-conducting base of the present invention.
[0031] Figure 5 Shown is a structural schematic diagram of the test system of the present utility model.
[0032] Figure 6 Shown is a structural schematic diagram of the testing device of the present utility model.
[0033] Component number description
[0034] 1 Packaged chip test fixture
[0035] 10 substrate
[0036] 100 PCB board
[0037] 100a First through hole
[0038] 100b First load module
[0039] 100c Second load module
[0040] 101 Thermal Base
[0041] 101a First groove
[0042] 101b Second through hole
[0043] 101c Second groove
[0044] 11. Fixing parts
[0045] 110 Card block
[0046] H1 Height of the fixing clip
[0047] 2 Test system
[0048] 20 Packaged Chips
[0049] 200 Flange
[0050] 3 Test setup
[0051] 30 Infrared Microscope
[0052] 300 Objective
[0053] 301 Stage
[0054] 31 Heating element DETAILED DESCRIPTION
[0055] The following is a description of the implementation of the present invention by means of specific examples. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
[0056] See also Figures 1 to 6. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no substantial technical significance. Any structural decoration, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed by the utility model without affecting the effects and purposes that can be achieved by the utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the utility model. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the utility model without substantially changing the technical content.
[0057] like Figure 1 As shown, this embodiment provides a packaged chip test fixture 1, including: a substrate 10 and a fixing component 11.
[0058] The substrate 10 includes a PCB board 100 and a heat-conducting base 101 ; the PCB board 100 is disposed on the heat-conducting base 101 .
[0059] Specifically, in this embodiment, the PCB board 100 and the heat-conducting base 101 have the same size, so that the PCB board 100 can be placed on the heat-conducting base 101 accurately and correspondingly. The heat-conducting base 101 provides a stable support for the PCB board 100, and in order to achieve a better heat transfer effect, the heat-conducting base 101 is set as a metal heat-conducting base, which further ensures the uniformity of the ambient temperature during the test. In actual use, the material of the heat-conducting base 101 can be set arbitrarily according to needs, and will not be described in detail here.
[0060] like Figure 2 As shown, the PCB board 100 is provided with a first through hole 100 a and an external matching circuit.
[0061] Specifically, in this embodiment, a first through hole 100a is provided on the PCB board 100 to place the packaged chip, so that during testing, the pins of the packaged chip can be electrically connected to the leads on the PCB board 100. The external matching circuit includes a first load module 100b, a second load module 100c and an excitation source internal impedance module. The first load module 100b and the second load module 100c are respectively provided at both ends of the PCB board 100, and both include a load impedance of 50Ω. The excitation source internal impedance module is electrically connected to the first load module 100b and the second load module 100c. The internal impedance module of the excitation source includes multiple capacitors and multiple resistors. As an example, the external matching circuit is set as follows: the first load module 100b is connected to the gate of the packaged chip via the first capacitor C1 and the second capacitor C2 in sequence, the second capacitor C2 is connected in parallel with the first resistor R1, the third capacitor C3 and the second resistor R2 are connected in series to form a first series structure, and the first series structure is arranged between the gate of the packaged chip and the reference ground GND; the fifth capacitor C5, the sixth capacitor C6, the seventh capacitor C7, the eighth capacitor C8, the twelfth capacitor C12, and the thirteenth capacitor C13 are respectively connected in parallel with the first series structure; the fourth capacitor C4, the third capacitor C5, the sixth capacitor C6, the seventh capacitor C7, the eighth capacitor C8, the twelfth capacitor C12, and the thirteenth capacitor C13 are respectively connected in parallel with the first series structure; The ninth capacitor C9, the tenth capacitor C10 and the eleventh capacitor C11 are connected in parallel with each other and are arranged between VGG and the gate of the packaged chip; the drain of the packaged chip is connected to the second load module 100c via the twenty-first capacitor C21 in turn; the sixteenth capacitor C16, the seventeenth capacitor C17, the eighteenth capacitor C18 and the nineteenth capacitor C19 are all connected in parallel with each other and are all arranged between the drain of the packaged chip and the reference ground GND; the fourteenth capacitor C14, the fifteenth capacitor C15 and the twentieth capacitor C20 are connected in parallel with each other and are arranged between VDD and the drain of the packaged chip; and the source of the packaged chip is grounded. In actual use, any external matching circuit that can adjust the circuit impedance is applicable to the utility model, which will not be described one by one here. By adjusting the impedance of the circuit, the phases of each load module and the internal impedance module of the excitation source are inconsistent, thereby avoiding the self-oscillation of the packaged chip during the test process, and ensuring the stability and accuracy of the test process. In actual use, any load resistor value that can adjust the circuit impedance is applicable to the present invention, and will not be described in detail here.
[0062] like Figure 3 As shown, a first groove 101a is provided on the front of the heat-conducting base 101, and the first groove 101a corresponds to the position of the first through hole 100a; a second through hole 101b is provided in the first groove 101a; Figure 4 As shown, a second groove 101c is disposed on the back of the heat-conducting base 101, and the second through hole 101b also penetrates the second groove 101c.
[0063] Specifically, in this embodiment, the first groove 101a is provided on the front of the heat-conducting base 101, and the positions of the first groove 101a and the first through hole 100a correspond, that is, the heat-conducting base 101 and the PCB board 100 should be accurately aligned during installation. It is further ensured that the size of the first groove 101a is equal to the size of the first through hole 100a. In actual use, the size of the first groove and the size of the first through hole are set according to the size of the packaged chip, which will not be described one by one here.
[0064] More specifically, in this embodiment, a second through hole 101b is provided in the first groove 101a, and a second groove 101c is provided on the back of the heat-conducting base 101, wherein the second through hole 101b also penetrates the second groove 101c. That is, the positions of the first groove 101a and the second groove 101c correspond, but the sizes may be the same or different. In actual use, the size of the second groove can be arbitrarily set as needed, and is not limited to this embodiment.
[0065] like Figure 1 As shown, the fixing component 11 is disposed on the first through hole 100 a of the PCB board 100 , and the middle of the fixing component 11 is configured to be hollow.
[0066] Specifically, in the present embodiment, the fixing component 11 is set as a fixing buckle, and the left and right ends of the bottom of the fixing buckle are provided with a clamping block 110, and each clamping block 110 matches the flange edges at the left and right ends of the packaged chip to fix the packaged chip, further preventing the packaged chip from moving arbitrarily during the test and affecting the test results. And the height H1 of the fixing buckle ranges from 10.76mm to 17.81mm, such as 11mm, 13mm, 15mm, 17mm. In actual use, the height of the fixing buckle can be set arbitrarily as needed, which is not described here one by one. At the same time, the middle position of the fixing buckle is also set to be hollow. Further ensure that during the test, the working distance between the objective lens of the infrared microscope and the packaged chip is about 15mm, and focusing can be achieved, so as to perform junction temperature testing. In actual use, any device that can fix the packaged chip is suitable for the fixing component of the utility model, which is not described here one by one.
[0067] like Figure 1 As shown, the packaged chip test fixture 1 of the present invention further includes a temperature measuring component (not shown in the figure), which is arranged on the second groove 101c and is electrically connected through the second through hole 101b.
[0068] Specifically, in this embodiment, the temperature measuring component is set as a thermistor, and the thermistor is set on the second groove 101c to contact the shell of the packaged chip. At the same time, the connecting wire connecting the thermistor is passed through the second through hole 101b and buried in the second groove 101c to achieve electrical connection, which helps to protect the connecting wire, makes the circuit layout more reasonable, further saves space, achieves better space management and improves the overall neatness of the device. In actual use, any device that can measure the temperature of the shell of the packaged chip is suitable for the temperature measuring component of the utility model, and will not be described one by one here.
[0069] like Figure 5 As shown, the utility model further provides a packaged chip testing system 2 , which includes: a packaged chip 20 and a packaged chip testing fixture 1 .
[0070] like Figure 5 As shown, the packaged chip 20 passes through the first through hole 100 a and contacts the first groove 101 a , and is electrically connected to the PCB board 100 ; the fixing component 11 fixes the packaged chip 20 on the substrate 10 .
[0071] Specifically, in the present embodiment, since the ceramic flange package has a high thermal conductivity and excellent mechanical strength, the packaged chip 20 is set as a ceramic flange packaged chip. In actual use, any packaged chip method is applicable to the present utility model, which will not be described one by one here. The packaged chip 20 is passed through the first through hole 100a to contact the first groove 101a, and is electrically connected to the PCB board 100. At this time, the temperature measuring component on the first groove 101a is in contact with the shell of the packaged chip 20, so as to achieve the purpose of being able to monitor the temperature of the shell of the packaged chip 20 at any time, and further ensure the accuracy of the test results during the test. Then, the clamping blocks 110 at the left and right ends of the bottom of the fixing component 11 are matched with the flange edges 200 at the left and right ends of the packaged chip 20 to fix the packaged chip, further preventing the packaged chip from moving arbitrarily during the test process, affecting the test results, and fixing the packaged chip 20 to prevent the packaged chip 20 from moving arbitrarily during the test process, causing test failure or inaccurate test results.
[0072] like Figure 6 As shown, the utility model further includes a packaged chip testing device 3 , which includes: an infrared microscope 30 , a heating component 31 and a packaged chip testing system 2 .
[0073] like Figure 6 As shown, the packaged chip testing system 2 is disposed above the heating component 31 , and the objective lens 300 of the infrared microscope 30 is suspended above the fixing component 11 .
[0074] Specifically, in the present embodiment, the heating component 31 is set as a heating table, the heating table is placed on the stage 301 of the infrared microscope 30, and the packaged chip test system 2 is set on the heating table. In actual use, any device that can perform heating is suitable for the heating component of the present utility model, which will not be described one by one here. The objective lens 300 of the infrared microscope 30 is suspended above the fixed component 11, and the distance range between the objective lens 301 and the packaged chip 20 is set to 10mm to 15mm, such as 11mm, 12mm, 12.5mm, 13mm, 14.8mm; in actual use, the working distance between the objective lens of the infrared microscope and the packaged chip can be arbitrarily set as needed, not limited to the present embodiment.
[0075] In summary, the test fixture of the utility model is characterized in that the test fixture comprises: a substrate and a fixing component; the substrate comprises a PCB board and a heat-conducting base; the PCB board is arranged on the heat-conducting base; a first through hole and an external matching circuit are arranged on the PCB board; a first groove is arranged on the front of the heat-conducting base, and the first groove corresponds to the position of the first through hole; a second through hole is arranged in the first groove; a second groove is arranged on the back of the heat-conducting base, and the second through hole also penetrates the second groove; the fixing component is arranged on the first through hole of the PCB board, and the middle of the fixing component is arranged to be hollow. The fixing buckle of the test fixture of the utility model is used to fix the chip to avoid the random movement of the chip during the test process to affect the test result. The height of the fixing buckle is set relatively low, and the center position is hollowed out, which further ensures that during the test process, when the working distance between the infrared lens of the infrared microscope and the chip is about 10mm to 15mm, focusing can also be achieved, so as to perform junction temperature test. In addition, by arranging an external matching circuit on the metal heat-conducting base, the self-excited oscillation of the chip during the test process is avoided, and the stability and accuracy of the test are guaranteed. By setting the thermistor through the second through hole and contacting the packaged chip, it is convenient to monitor the temperature of the shell of the packaged chip during the test. Therefore, the utility model effectively overcomes various shortcomings of the prior art and has a high industrial utilization value.
[0076] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.
Claims
1. A packaged chip test fixture, characterized in that: The packaged chip testing fixture comprises: a substrate and a fixing component; The substrate comprises a PCB board and a heat-conducting base; the PCB board is arranged on the heat-conducting base; The PCB board is provided with a first through hole and an external matching circuit; The front side of the heat-conducting base is provided with a first groove, and the first groove corresponds to the position of the first through hole; the first groove is provided with a second through hole; the back side of the heat-conducting base is provided with a second groove, and the second through hole also penetrates the second groove; The fixing component is arranged on the first through hole of the PCB board, and the middle of the fixing component is arranged to be hollow.
2. The packaged chip test fixture according to claim 1, characterized in that: The packaged chip testing fixture further includes a temperature measuring component, which is disposed on the second groove and is electrically connected through the second through hole.
3. The packaged chip testing fixture according to claim 2, characterized in that: The temperature measuring component is configured as a thermistor.
4. The packaged chip testing fixture according to claim 1, characterized in that: The fixing component is configured as a fixing buckle.
5. The packaged chip testing fixture according to claim 4, characterized in that: The height range of the fixing buckle is 10.76 mm to 17.81 mm.
6. The packaged chip testing fixture according to claim 1, characterized in that: The heat-conducting base is configured as a metal heat-conducting base.
7. The packaged chip testing fixture according to claim 1, characterized in that: The external matching circuit includes a first load module, a second load module and an excitation source internal impedance module, the first load module and the second load module are respectively arranged at two ends of the PCB board; and the excitation source internal impedance module is electrically connected to the first load module and the second load module.
8. A packaged chip testing system, characterized in that: The test system comprises: a packaged chip and a packaged chip test fixture as described in any one of claims 1 to 7; The packaged chip passes through the first through hole and contacts the first groove, and is electrically connected to the PCB board; The fixing component fixes the packaged chip on the substrate.
9. The packaged chip testing system according to claim 8, characterized in that: The packaged chip is configured as a ceramic flange packaged chip.
10. A packaged chip testing device, characterized in that: The packaged chip testing device comprises: an infrared microscope, a heating component and the packaged chip testing system according to claim 8 or 9; The packaged chip testing system is arranged above the heating component; the objective lens of the infrared microscope is suspended above the fixing component.
11. The packaged chip testing device according to claim 10, characterized in that: The distance between the objective lens and the packaged chip is set to range from 10 mm to 15 mm.