Receiving and transmitting end isolation cover plate applied to silicon light modulation optical module and optical module

Abstract

The utility model relates to the technical field of optical modules, in particular to a transmitting-receiving end isolation cover plate applied to a silicon light modulation optical module and an optical module, the transmitting-receiving end isolation cover plate is arranged on a PCB (Printed Circuit Board) and consists of a protective cover and a partition plate connected to the inner side of the protective cover, the protective cover covers a laser chip, a silicon light modulator and a photoelectric detector, and the partition plate is connected to the inner side of the protective cover. The laser chip and the silicon light modulator are arranged on the first side of the PCB, the photoelectric detector is arranged on the second side of the PCB, and the partition plate is arranged between the first side and the second side of the PCB. According to the utility model, the influence of modulated light of a transmitting end on a receiving end can be reduced, so that the sensitivity of a receiver is improved, and the sensitivity can be improved by 4dB at most to reach the same level as that of an electro-absorption laser scheme; the silicon optical modulation optical module carrying the receiving and transmitting end isolation cover plate can meet optical module receiver performance indexes proposed by the IEEE802.3 protocol in a wider temperature range.

Description

Technical Field

[0001] The utility model relates to the technical field of optical modules, and in particular to a transceiver isolation cover plate and an optical module applied to a silicon light modulation optical module. Background Art

[0002] With the rapid development of AI technology, the demand for high-speed data transmission and processing is increasing; traditional electron-based microelectronics technology has been getting closer and closer to the physical limit, while photon-based optoelectronics technology has gradually become an important part of the field of optical communication technology with its advantages of high speed, low power consumption and high bandwidth.

[0003] At present, electro-absorption lasers still account for the largest proportion in the modulation schemes used in 400G, 800G and even 1.6T high-speed optical modules, but they can no longer meet the increasing demand, so the introduction of silicon photonic solutions has become more urgent. First, compared with the electro-absorption laser solution, the number of lasers required for silicon photonic modulation is relatively small. Taking 400G DR4 as an example, the electro-absorption laser solution requires 4 independent lasers, but the use of silicon photonic modulators only requires 2 or even 1 laser; secondly, silicon photonic modulation does not require TEC to control the temperature of the laser, which can save the optical structure design and software control design of TEC. However, due to the influence of scattering and reflection of silicon photonic modulation, and at different temperatures, the intensity of the scattered light and reflected light varies greatly, which will have different degrees of impact on the receiving device. This performance poses a high challenge to the receiving indicators.

[0004] Therefore, it is necessary to design a transceiver isolation cover to block the scattering of modulated light and improve the receiving performance. Utility Model Content

[0005] The purpose of the utility model is to provide a transceiver isolation cover and an optical module applied to a silicon light modulation optical module. By designing the transceiver isolation cover, the problem that the scattering and reflection generated by the existing silicon light modulation optical module during silicon light modulation will affect the performance of the receiving end device is solved.

[0006] The embodiment of the utility model is realized through the following technical scheme: a transceiver isolation cover plate applied to a silicon light modulator optical module, the silicon light modulator optical module comprises a PCB board and a silicon light chip, a silicon light modulator and a photodetector are arranged on the silicon light chip, a laser chip is arranged on the input side of the silicon light modulator, the transceiver isolation cover plate is arranged on the PCB board, and is composed of a protective cover and a partition connected to the inner side of the protective cover, the protective cover is arranged on the laser chip, the silicon light modulator and the photodetector, the laser chip and the silicon light modulator are arranged on the first side of the PCB board, the photodetector is arranged on the second side of the PCB board, and the partition is arranged between the first side and the second side of the PCB board.

[0007] According to a preferred embodiment, optical fiber via holes are respectively formed on the first side and the second side of the protective cover corresponding to the PCB board.

[0008] According to a preferred embodiment, the transmitting and receiving end isolation cover is made of light absorbing material.

[0009] According to a preferred embodiment, the bottom of the transceiver isolation cover is bonded to the PCB board.

[0010] According to a preferred embodiment, the surface roughness Ra of the transmitting and receiving end isolation cover plate is 1-2 μm.

[0011] According to a preferred embodiment, the surface roughness Ra of the transmitting and receiving end isolation cover plate is 1.6 μm.

[0012] The utility model also provides a silicon light modulating optical module, comprising the above-mentioned transceiver isolation cover plate, and also comprising a transmitting end coupling lens, an isolator is arranged on the side of the laser chip close to the silicon light chip, the output end of the transmitting end coupling lens is electrically connected to the input end of the silicon light modulator, and the central axis of the light strip of the laser chip, the central axis of the isolator and the central axis of the transmitting end coupling lens coincide with each other;

[0013] A transmitting fiber array and a receiving fiber array are provided on one side of the silicon photonic chip, the input end of the transmitting fiber array is electrically connected to the output end of the silicon photonic modulator, the output end of the transmitting fiber array is connected to the transmitting pigtail adapter, the output end of the receiving fiber array is electrically connected to the input end of the photodetector, and the input end of the receiving fiber array is electrically connected to the receiving pigtail adapter;

[0014] The transmitting fiber array, laser chip, isolator and transmitting coupling lens are arranged on the first side of the PCB board, and the receiving fiber array is arranged on the second side of the PCB board. The transmitting fiber array and the receiving fiber array are respectively penetrated through corresponding fiber vias.

[0015] The technical solution of a transceiver isolation cover and an optical module applied to a silicon photonic modulation optical module provided by an embodiment of the utility model has at least the following advantages and beneficial effects: the transceiver isolation cover solution provided by the utility model can reduce the impact of the modulated light at the transmitting end on the receiving end, thereby improving the sensitivity of the receiver. The sensitivity can be increased by up to 4dB, reaching the same level as the electro-absorption laser solution. Therefore, the silicon photonic modulation optical module using the transceiver isolation cover can meet the optical module receiver performance indicators proposed by the IEEE802.3 protocol within a wider temperature range (-5 to 75°C); in addition, the design can be extended to the application scenarios of 400G, 800G, and 1.6T silicon photonic modules, providing support for a wider application of silicon photonic modulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic layout diagram of a first preferred embodiment of a transceiver isolation cover plate applied to a silicon photonic modulation optical module of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of a silicon photonic modulation optical module;

[0018] Icon: 1-PCB board, 2-laser chip, 3-protective cover, 4-partition, 5-fiber via, 6-transmitting end coupling lens, 7-isolator, 8-transmitting end fiber array, 9-receiving end fiber array. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0020] Example 1

[0021] Figure 1 This is a schematic diagram of the layout of a first preferred embodiment of a transceiver isolation cover plate applied to a silicon photonic modulation optical module of the utility model. Figure 2 Figure 1 is a schematic diagram of the structure of a silicon photonics modulator module. Figure 2 As shown, the silicon photonic modulator optical module includes a PCB board 1 and a silicon photonic chip, on which a silicon photonic modulator and a photodetector are arranged, and a laser chip 2 is arranged on the input side of the silicon photonic modulator.

[0022] like Figure 1 As shown, the bottom of the transceiver isolation cover is bonded to the PCB board 1, which is composed of a protective cover 3 and a partition 4 connected to the inner side of the protective cover 3, and the protective cover 3 is provided on the laser chip 2, the silicon light modulator and the photodetector; further, the transceiver isolation cover is made of a light-absorbing material, and the light-absorbing material absorbs part of the reflected or scattered light of the emitted light to prevent the occurrence of cross-talk; the surface roughness Ra of the transceiver isolation cover is 1 to 2 μm, preferably 1.6 μm.

[0023] In one implementation of the present embodiment, the protective cover 3 includes a first side panel, a second side panel, a third side panel, a fourth side panel and a top cover. The first side panel, the second side panel, the third side panel and the fourth side panel form a frame enclosing the laser chip 2, the silicon light modulator and the photodetector. The top cover is arranged on the frame and is integrally formed with the first side panel, the second side panel, the third side panel and the fourth side panel to avoid leakage from the connection gap.

[0024] More specifically, the laser chip 2 and the silicon optical modulator are arranged on the first side of the PCB board 1, the photodetector is arranged on the second side of the PCB board 1, and the protective cover 3 is respectively provided with optical fiber vias 5 corresponding to the first side and the second side of the PCB board 1 for the optical fiber connecting the transmitting pigtail adapter and the receiving pigtail adapter to pass through; the partition 4 is arranged between the first side and the second side of the PCB board 1 to achieve isolation between the receiving end and the transmitting end.

[0025] The transceiver isolation cover provided by the utility model can reduce the impact of the modulated light at the transmitting end on the receiving end, thereby improving the sensitivity of the receiver. After actual verification, after adding the transceiver isolation cover, the sensitivity of the receiving end can be increased by up to 4dB. Specifically, in the absence of the transceiver isolation cover, the measured sensitivity of the receiving end at different temperatures (BER=2E-4) is only -3dBm, while after adding the transceiver isolation cover, the sensitivity of the receiving end at different temperatures (BER=2E-4) is only -7dBm, reaching the same level as the electro-absorption laser solution. Therefore, the silicon photonic modulator optical module using the transceiver isolation cover can meet the optical module receiver performance indicators proposed by the IEEE802.3 protocol in a wider temperature range (-5~75℃); in addition, the design can be extended to the application scenarios of 400G, 800G, and 1.6T silicon photonic modules, providing support for wider application of silicon photonic modulation.

[0026] In the second preferred embodiment of the isolation cover plate of the receiving and transmitting end of the utility model, a protective cover 3 is provided for the receiving end and the transmitting end respectively, and each protective cover 3 includes a first side plate, a second side plate, a third side plate, a fourth side plate and a top cover, and the first side plate, the second side plate, the third side plate and the fourth side plate form a frame enclosed and arranged outside the receiving end / transmitting end, and the top cover is arranged on the frame and is integrally formed with the first side plate, the second side plate, the third side plate and the fourth side plate. Compared with the first preferred embodiment, the second preferred embodiment provides protective covers 3 for the receiving end and the transmitting end respectively, which significantly increases the size of the adjacent parts, and it is difficult to realize independent design when the gap distance between optical components is small, so it will not be described in detail here.

[0027] Example 2

[0028] This embodiment provides a silicon light modulator optical module, including the transceiver isolation cover plate as described in Example 1, and also including a transmitting end coupling lens 6. An isolator 7 is provided on the side of the laser chip 2 close to the silicon light chip. The output end of the transmitting end coupling lens 6 is electrically connected to the input end of the silicon light modulator. The central axis of the light strip of the laser chip 2, the central axis of the isolator 7 and the central axis of the transmitting end coupling lens 6 coincide with each other.

[0029] A transmitting fiber array 8 and a receiving fiber array 9 are provided on one side of the silicon photonic chip, the input end of the transmitting fiber array 8 is electrically connected to the output end of the silicon photonic modulator, the output end of the transmitting fiber array 8 is connected to the transmitting pigtail adapter, the output end of the receiving fiber array 9 is electrically connected to the input end of the photodetector, and the input end of the receiving fiber array 9 is electrically connected to the receiving pigtail adapter; in one implementation of the present embodiment, the output end of the silicon photonic modulator is electrically connected to a wavelength division multiplexer, and multiple groups of signals are merged into one through the wavelength division multiplexer and then electrically connected to the transmitting fiber array 8.

[0030] Furthermore, the transmitting fiber array 8, the laser chip 2, the isolator 7 and the transmitting coupling lens 6 are arranged on the first side of the PCB board 1, and the receiving fiber array 9 is arranged on the second side of the PCB board 1. The transmitting fiber array 8 and the receiving fiber array 9 are respectively arranged through the corresponding fiber vias 5.

[0031] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A transceiver isolation cover plate for a silicon light modulator optical module, the silicon light modulator optical module comprising a PCB board (1) and a silicon light chip, the silicon light chip being provided with a silicon light modulator and a photodetector, the input side of the silicon light modulator being provided with a laser chip (2), characterized in that: The transceiver isolation cover is arranged on a PCB (1), and is composed of a protective cover (3) and a partition (4) connected to the inner side of the protective cover (3); the protective cover (3) is arranged on a laser chip (2), a silicon light modulator and a photodetector; the laser chip (2) and the silicon light modulator are arranged on a first side of the PCB (1); the photodetector is arranged on a second side of the PCB (1); and the partition (4) is arranged between the first side and the second side of the PCB (1).

2. The transceiver isolation cover plate for a silicon photonic modulation optical module according to claim 1, characterized in that: The protective cover (3) is provided with optical fiber through holes (5) on the first side and the second side corresponding to the PCB board (1).

3. The transceiver isolation cover plate for silicon photonic modulation optical module according to claim 1, characterized in that: The transmitting and receiving end isolation cover plate is made of light absorbing material.

4. The transceiver isolation cover plate for a silicon photonic modulation optical module according to claim 1, characterized in that: The bottom of the transceiver isolation cover is bonded to the PCB board (1).

5. The transceiver isolation cover plate for a silicon photonic modulation optical module according to any one of claims 1 to 4, characterized in that: The surface roughness Ra of the transmitting and receiving end isolation cover plate is 1-2 μm.

6. The transceiver isolation cover plate for silicon photonic modulation optical module according to claim 5, characterized in that: The surface roughness Ra of the transmitting and receiving end isolation cover plate is 1.6 μm.

7. A silicon photonic modulation optical module, characterized in that: It comprises the transceiver isolation cover plate as claimed in any one of claims 1 to 6, and also comprises a transmitting end coupling lens (6), an isolator (7) is arranged on the side of the laser chip (2) close to the silicon photonic chip, the output end of the transmitting end coupling lens (6) is electrically connected to the input end of the silicon photonic modulator, and the central axis of the light strip of the laser chip (2), the central axis of the isolator (7) and the central axis of the transmitting end coupling lens (6) coincide with each other; A transmitting fiber array (8) and a receiving fiber array (9) are provided on one side of the silicon photonic chip, the input end of the transmitting fiber array (8) is electrically connected to the output end of the silicon photonic modulator, the output end of the transmitting fiber array (8) is connected to the transmitting pigtail adapter, the output end of the receiving fiber array (9) is electrically connected to the input end of the photodetector, and the input end of the receiving fiber array (9) is electrically connected to the receiving pigtail adapter; The transmitting end optical fiber array (8), the laser chip (2), the isolator (7) and the transmitting end coupling lens (6) are arranged on a first side of the PCB board (1), and the receiving end optical fiber array (9) is arranged on a second side of the PCB board (1). The transmitting end optical fiber array (8) and the receiving end optical fiber array (9) are respectively arranged through corresponding optical fiber vias (5).

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