Display device

Abstract

The utility model discloses a display device which comprises a backlight module and a display panel, the display panel is arranged on the backlight module, the backlight module comprises a back plate and an optical assembly, the back plate comprises a bottom plate and four side plates protruding out of the surface of the bottom plate, the four side plates are connected in a surrounding mode, and the optical assembly is arranged on the back plate. The back plate and the bottom plate form a back plate groove, and the optical assembly is placed in the back plate groove; the backlight module further comprises an outer middle frame, the outer middle frame is arranged around the optical assembly, a hollowed-out part is arranged on the ground side, corresponding to the display panel, of the outer middle frame, and a heat dissipation buffering piece is arranged on the hollowed-out part. An original four-edge outer middle frame is omitted, the outer middle frame is divided into three edges, one edge, corresponding to the ground side of the display panel, in the outer middle frame is hollowed out, the heat dissipation buffer room is used for replacing one edge of the original outer middle frame, heat on the display panel is conducted to the back plate, contact heat dissipation is achieved, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device. Background Art

[0002] Liquid Crystal Displays (LCDs) have numerous advantages, including thin design, power efficiency, and zero radiation, making them widely used. As the interface between users and information, LCDs have become the mainstream display method due to their superior features, including high space utilization, low electromagnetic interference, and zero radiation. They are widely used in new communication tools such as televisions, smartphones, and tablets. The liquid crystal module (LCM) of an LCD does not emit light itself; instead, a backlight module provides the light source. LCD backlight modules include direct-lit and edge-lit types. Direct-lit backlight modules are widely used in the industry due to their superior cost, and have gradually become the mainstream structure for LCDs.

[0003] Currently, the outer and middle frames of Mini-LED LCD displays on the market all feature a four-sided design. Some utilize a one-piece, four-sided plastic frame; others utilize aluminum or plastic extrusions to create the four-sided outer frame; and some utilize sheet metal components assembled together to create the four-sided outer frame. These designs require additional buffering components on the bonding side of the LCD panel to protect the driver chip when assembling the LCD panel. This complicates production and is costly. Furthermore, the heat generated by the driver chip in the bonding area can only be dissipated through airflow, which is poor heat dissipation. Utility Model Content

[0004] The purpose of the present application is to provide a display device that reduces the original structure of the display device, thereby simplifying the installation of the display device, reducing costs, and improving heat dissipation efficiency.

[0005] The present application discloses a display device, which includes a backlight module and a display panel. The display panel is arranged on the backlight module. The backlight module includes a backplane and an optical component. The backplane includes a bottom plate and four side plates protruding from the surface of the bottom plate. The four side plates are connected to each other and form a backplane groove with the bottom plate. The optical component is placed in the backplane groove; the backlight module also includes an outer middle frame, which is arranged around the four sides of the optical component and contacts the side plates of the backplane. The outer middle frame is provided with a hollow portion corresponding to the ground side of the display panel, and the hollow portion is provided with a heat dissipation buffer.

[0006] Optionally, the heat dissipation buffer component includes a buffer zone and a heat dissipation zone, and the heat dissipation zone is arranged in the buffer zone or the buffer zone is arranged in the heat dissipation zone; wherein, the buffer zone is provided with at least one material selected from the group consisting of EVA foam or PE cotton, and the heat dissipation zone is provided with at least one material selected from the group consisting of graphite, graphene or thermal conductive silicone.

[0007] Optionally, the outer middle frame includes a first side, a second side and a third side that are connected to each other, the first side and the third side are respectively arranged on the left and right sides of the display panel, the second side corresponds to the sky side of the display panel, and on the sky side of the display panel along the direction of the ground side of the display panel, the second side of the outer middle frame corresponding to the hollow portion covers the hollow portion, and the length of the hollow portion is equal to the length of the second side of the outer middle frame.

[0008] Optionally, the display device includes a chip-on-chip film, one side of which is connected to the ground side of the display panel, and the other side is bent toward the side of the back panel away from the display panel, and is attached to the side of the bottom plate of the back panel away from the display panel. The heat dissipation buffer is arranged between the chip-on-chip film and the side edge of the back panel corresponding to the ground side of the display panel, one side of the heat dissipation buffer is in contact with the chip-on-chip film, and the other side is in contact with the back panel.

[0009] Optionally, the heat dissipation buffer is an L-shaped structure, and the heat dissipation buffer portion includes a first buffer portion and a second buffer portion, and the first buffer portion and the second buffer portion are vertically connected to each other; the chip-on-chip film includes a first horizontal portion, a first vertical portion, and a second horizontal portion connected in a U-shaped structure, one side of the first horizontal portion is connected to the ground side of the display panel, and the other side is connected to the first vertical portion, one side of the first vertical portion is connected to the first horizontal portion, and the other side is connected to the second horizontal portion; the first buffer portion is in contact with the first horizontal portion of the chip-on-chip film, and the second buffer portion is in contact with the first vertical portion of the chip-on-chip film.

[0010] Optionally, a first gap is provided between the display panel and the optical component, the first buffer portion is arranged in the first gap, and the thickness of the first buffer portion is equal to the width of the first gap; a second gap is provided between the side panel of the back panel close to the ground side of the display panel and the first vertical portion of the chip-on-film, the second buffer portion is arranged in the second gap, and the thickness of the second buffer portion is equal to the width of the second gap; in the direction of the display panel toward the back panel, the bottom surface of the second buffer portion abuts against a surface of the second horizontal portion close to the bottom plate.

[0011] Optionally, the optical component includes a light board, a diffuser plate and an optical film, the light board is arranged on the bottom plate of the back plate, the diffuser plate is arranged on the light board and spaced apart from the light board, the optical film is arranged on the diffuser plate, and on the sky side of the display panel along the ground side direction of the display panel, the length of the light board is smaller than the length of the bottom plate and smaller than the length of the diffuser plate, and the light board is spaced apart from the side plate of the back plate; the backlight module includes an inner middle frame, the inner middle frame includes a first supporting part and a second supporting part, the first supporting part and the second supporting part are L-shaped, the first supporting part is arranged between the bottom plate of the back plate and the diffuser plate, the two ends of the first supporting part are respectively abutted against the bottom plate of the back plate and the diffuser plate, one end of the second supporting part is connected to the first supporting part, and the other end is abutted against the side of the back plate.

[0012] Optionally, the thickness of the first buffer portion is greater than the thickness of the second buffer portion.

[0013] Optionally, the outer middle frame includes a first side, a second side and a third side that are connected to each other, the first side and the third side are respectively arranged on the left and right sides of the display panel, the second side corresponds to the sky side of the display panel, and on the sky side of the display panel along the direction of the ground side of the display panel, the second side of the outer middle frame corresponding to the hollow portion covers the hollow portion, the center point of the hollow portion coincides with the center point of the second side, and the length of the hollow portion is less than the length of the second side of the outer middle frame and greater than two-thirds of the length of the second side.

[0014] Optionally, the display device includes a front frame, which is arranged on the ground side of the display panel and is used to fix the display panel and the backlight module; wherein, the front frame includes side surfaces and a bottom surface, the side surfaces and the bottom surface are perpendicular to each other, the thickness of the bottom surface is greater than the thickness of the side surfaces, the first vertical portion of the chip-on-film is arranged to fit the bottom surface of the front frame, and the bottom surface of the front frame is provided with multiple hollow structures.

[0015] Compared with the solution of adding a heat sink on the other side of the driver chip in the binding area of ​​the display panel, the present application provides a new backlight module, which changes the outer middle frame. Specifically, the outer middle frame is set with three sides, that is, the side of the outer middle frame corresponding to the ground side of the display panel is hollowed out, and no border is made. Instead, a heat dissipation buffer room is used to replace the original side of the outer middle frame. In this way, the heat on the display panel can be conducted to the backplane, realizing contact heat dissipation and improving the heat dissipation efficiency. There is no need to set additional heat dissipation holes or heat sinks on the other side of the driver chip of the display panel to avoid drilling to affect the aesthetics or affect the production efficiency of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without inventive work. In the drawings:

[0017] Figure 1 is a schematic cross-sectional view of a display device according to a first embodiment of the present application;

[0018] Figure 2 is a partial structural diagram of a display device according to a second embodiment of the present application;

[0019] Figure 3 is an exploded view of the structure of a display device according to a second embodiment of the present application;

[0020] Figure 4 is a schematic cross-sectional view of a display device according to a third embodiment of the present application;

[0021] Figure 5 is an exploded view of the structure of a display device according to a fourth embodiment of the present application;

[0022] Figure 6 is a schematic cross-sectional view of a heat dissipation buffer member according to a fifth embodiment of the present application;

[0023] Figure 7 is a partial structural diagram of another display device according to the sixth embodiment of the present application;

[0024] Figure 8 It is a structural explosion diagram of the display device of the sixth embodiment of the present application.

[0025] Among them, 100, display device; 200, backlight module; 210, back plate; 211, bottom plate; 212, side plate; 213, back plate groove; 220, optical component; 221, light board; 222, diffusion plate; 223, optical film; 230, outer middle frame; 231, hollow part; 232, first side; 233, second side; 234, third side; 240, heat dissipation buffer; 241, first buffer part; 242, second buffer Punch; 243, buffer zone; 244, heat dissipation zone; 250, inner middle frame; 260, first gap; 270, second gap; 280, double-sided tape; 300, display panel; 310, ground side; 320, sky side; 330, binding area; 400, driver chip; 410, cover film; 411, first horizontal portion; 412, first vertical portion; 413, second horizontal portion; 500, front frame; 510, side; 520, bottom. DETAILED DESCRIPTION

[0026] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative. However, the present application can be implemented in many alternative forms and should not be construed as being limited to the embodiments described herein.

[0027] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate relative importance or implicitly specify the quantity of the technical features indicated. Therefore, unless otherwise specified, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features; "plurality" means two or more. The term "comprising" and any variations thereof are intended to be non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0028] In addition, terms indicating orientation or positional relationships such as “center,” “lateral,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” and “outside” are described based on the orientation or relative positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present application, and do not indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present application.

[0029] Furthermore, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0030] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0031] like Figure 1 As shown, as a first embodiment of the present application, a display device 100 is disclosed, the display device 100 includes a backlight module 200 and a display panel 300, the display panel 300 is arranged on the backlight module 200, the backlight module 200 includes a back plate 210 and an optical assembly 220, the back plate 210 includes a bottom plate 211, and four side plates 212 ( Figure 1Only two side edges are shown, corresponding to the sky side and the ground side of the display panel respectively), four side panels 212 are connected to each other in a surrounding manner and to the bottom plate 211 to form a back plate groove 213, and the optical component 220 is placed in the back plate groove 213; the backlight module 200 also includes an outer middle frame 230, and the outer middle frame 230 is arranged around the four sides of the optical component 220 and contacts the side panels 212 of the back plate 210. The outer middle frame 230 is provided with a hollow portion 231 corresponding to the ground side 310 of the display panel 300, and the hollow portion 231 is provided with a heat dissipation buffer 240.

[0032] In this embodiment, considering that the ground side 310 of the display panel 300 is the binding area 330 of the display panel 300, a driving chip 400 (such as a cover film 410) is set in the binding area 330, and the outer middle frame 230 of the ground side 310 of the display panel 300 is replaced with a heat dissipation buffer 240, which can not only support the display panel 300, but also dissipate the heat generated by the driving chip 400 when working. One side of the outer middle frame 230 is directly replaced with a buffer heat dissipation component, and there is no need to set additional heat dissipation holes or heat dissipation components on the other side of the driving chip 400 of the display panel 300, so as to avoid punching to affect the aesthetics or affect the preparation efficiency of the display device 100.

[0033] Furthermore, the optical assembly 220 includes a light board 221, a diffuser plate 222 and an optical film 223. The light board 221 is arranged on the bottom plate 211 of the back plate 210. The diffuser plate 222 is arranged on the light board 221 and is spaced apart from the light board 221. The optical film 223 is arranged on the diffuser plate 222. On the sky side 320 of the display panel 300 along the ground side 310 of the display panel 300, the length of the light board 221 is less than the length of the bottom plate 211 and less than the length of the diffuser plate 222. The light board 221 is spaced apart from the side panel 212 of the back panel 210; the backlight module 200 includes an inner middle frame 250, and the inner middle frame 250 includes a first supporting portion and a second supporting portion. The first supporting portion and the second supporting portion are L-shaped. The first supporting portion is arranged between the bottom plate 211 of the back panel 210 and the diffuser plate 222. The two ends of the first supporting portion are respectively abutted against the bottom plate 211 of the back panel 210 and the diffuser plate 222. One end of the second supporting portion is connected to the first supporting portion, and the other end is abutted against the side of the back panel 210.

[0034] In this embodiment, an inner middle frame 250 is provided to support the diffuser plate 222 and the structure above the diffuser plate 222 to prevent the diffuser plate 222 from falling onto the lamp board 221, thereby causing damage to the upper lamp beads of the lamp board 221; in order to improve the supporting effect, the inner middle frame 250 is provided with two supporting parts to support the diffuser plate 222 and the structure above the diffuser plate 222 in the vertical direction and the horizontal direction to ensure the supporting effect.

[0035] refer to Figure 2 and Figure 3 As shown, as the second embodiment of the present application, it is a further refinement of the above-mentioned first embodiment. After one side of the outer middle frame 230 is removed, the original three sides are retained. Specifically, the outer middle frame 230 includes a first side 232, a second side 233 and a third side 234 that are connected to each other. The two ends of the second side 233 are respectively connected to the first side 232 and the third side 234 vertically to form a U-shaped outer middle frame 230; generally, the first side 232 and the third side 234 are respectively arranged on the left and right sides of the display panel 300, and the second side 233 corresponds to the sky side 320 of the display panel 300. The sky side 320 of 300 is along the direction of the ground side 310 of the display panel 300, and the second side 233 of the outer middle frame 230 covers the hollow portion 231. The length of the hollow portion 231 is equal to the length of the second side 233 of the outer middle frame 230, which is equivalent to completely canceling the original outer middle frame 230 corresponding to the ground side 310, or when preparing the outer middle frame 230, using a mold with only three sides of the outer middle frame 230 for preparation, and the corresponding original fourth side is completely replaced by the heat dissipation buffer 240. Except for the different materials, the shape and size are the same as the fourth side of the original outer middle frame 230 corresponding to the ground side 310 of the display panel 300.

[0036] It should be noted that the three-sided outer middle frame 230 in the present application can be an integral injection molding, or it can be an aluminum extrusion or a plastic extrusion surrounded on three sides, or it can be a sheet metal splicing on three sides. When assembling one side of the ground side 310 of the display panel 300, there is no need to design an outer middle frame 230; the ground side 310 of the display panel 300 uses a buffer material to replace the original outer middle frame 230, so that the driver chip 400 can be directly in contact with the buffer. The buffer can not only protect the driver chip 400, but also directly conduct the heat of the driver chip 400 to the metal back plate 210 to achieve rapid heat dissipation.

[0037] Furthermore, the display device 100 includes a chip-on-film 410, one side of which is connected to the ground side 310 of the display panel 300, and the other side is bent toward the side of the back panel 210 away from the display panel 300, and is attached to the side of the bottom plate 211 of the back panel 210 away from the display panel 300. The heat dissipation buffer 240 is arranged between the chip-on-film 410 and the side of the back panel 210 corresponding to the ground side 310 of the display panel 300, one side of the heat dissipation buffer 240 is in contact with the chip-on-film 410, and the other side is in contact with the back panel 210.

[0038] The binding area 330 is mainly provided with a chip-on-chip film 410, which is bent in the binding area 330 of the display panel 300. After bending, it partially covers the back panel 210 and covers the heat dissipation buffer 240 at the same time. Specifically, one side of the heat dissipation buffer 240 contacts the chip-on-chip film 410, and the other side contacts the back panel 210. In this way, the heat dissipation buffer 240 can conduct the heat on the chip-on-chip film 410 to the back panel 210 to improve the heat dissipation efficiency.

[0039] refer to Figure 4 As shown, as the third embodiment of the present application, it is a further refinement of the above-mentioned second embodiment. The heat dissipation buffer 240 is an L-shaped structure. The heat dissipation buffer 240 includes a first buffer portion 241 and a second buffer portion 242. The first buffer portion 241 and the second buffer portion 242 are vertically connected to each other; the flip chip 410 includes a first horizontal portion 411, a first vertical portion 412 and a second horizontal portion 413 connected in a U-shaped structure. One side of the first horizontal portion 411 is connected to the ground side 310 of the display panel 300, and the other side is connected to the first vertical portion 412. One side of the first vertical portion 412 is connected to the first horizontal portion 411, and the other side is connected to the second horizontal portion 413; the first buffer portion 241 is in contact with the first horizontal portion 411 of the flip chip 410, and the second buffer portion 242 is in contact with the first vertical portion 412 of the flip chip 410. The heat dissipation buffer 240 is directly adhered to the metal backplane 210, so that the problem of the flip chip chip (Chip On Film) that has long been a problem can be solved. The heat of COF can be quickly transferred to the metal backplane, and the chip on film can be protected from damage by contact with the plastic middle frame and backplane.

[0040] refer to Figure 4As shown, the horizontal in the first horizontal portion 411 represents the horizontal direction, and the vertical in the first vertical portion 412 represents the vertical direction. After being bent, the flip chip film 410 is divided into three parts, namely the first horizontal portion 411, the first vertical portion 412 and the second horizontal portion 413. The two ends of the first vertical portion 412 are vertically connected to the first horizontal portion 411 and the second horizontal portion 413 respectively. The angle formed between the first vertical portion 412 and the first horizontal portion 411 is equal to the angle formed by the first buffer portion 241 and the second buffer portion 242. The tops of the two angles are abutted, which is equivalent to a small bending structure placed at the bending part of a large bending structure.

[0041] Furthermore, a first gap 260 is provided between the display panel 300 and the optical assembly 220, the first buffer portion 241 is provided in the first gap 260, and the thickness of the first buffer portion 241 is greater than or equal to the width of the first gap 260; a second gap 270 is provided between the side plate 212 of the back plate 210 close to the ground side 310 of the display panel 300 and the first vertical portion 412 of the chip-on-film 410, the second buffer portion 242 is provided in the second gap 270, and the thickness of the second buffer portion 242 is greater than or equal to the width of the second gap. The width of the gap 270; in the direction of the display panel 300 toward the back plate 210, the bottom surface 520 of the second buffer portion 242 abuts against the side of the second horizontal portion 413 close to the bottom plate 211, and the two buffer portions are placed in the corresponding two gaps. The width of the gap is the distance between the two structures, such as the width of the first gap 260, that is, the distance between the display panel 300 and the optical component 220. Because the heat dissipation buffer 240 has a certain elasticity, the thickness can usually be larger than the width of the gap, so that it can still play a supporting role after being squeezed by the two structures.

[0042] In addition, considering that the first buffer portion 241 is arranged between the binding area 330 of the display panel 300 and the optical component 220, and mainly plays a supporting role, and the second buffer portion 242 is arranged between the back plate 210 and the first vertical portion 412 of the cover chip film 410, and mainly plays a heat dissipation role, and the heat dissipation mainly transfers the heat generated by the cover chip film 410 to the back plate 210 in the form of heat conduction, the thickness of the first buffer portion 241 is greater than the thickness of the second buffer portion 242, which can not only ensure support but also improve the heat dissipation effect.

[0043] like Figure 5As shown, as the fourth embodiment of the present application, different from the above-mentioned second embodiment, the outer middle frame 230 includes a first side 232, a second side 233 and a third side 234 connected to each other, and the first side 232 and the third side 234 are respectively arranged on the left and right sides of the display panel 300, and the second side 233 corresponds to the sky side 320 of the display panel 300. On the sky side 320 of the display panel 300 along the direction of the ground side 310 of the display panel 300, the second side 233 of the outer middle frame 230 covers the hollow portion 231, and the center point of the hollow portion 231 coincides with the center point of the second side 233. The length of the hollow portion 231 is less than the length of the second side 233 of the outer middle frame 230, and is greater than two-thirds of the length of the second side 233.

[0044] In this embodiment, at the ground side 310 of the display panel 300, the outer middle frame 230 is not completely removed, but partially retained, that is, the side of the original outer middle frame 230 corresponding to the ground side 310 is formed by the heat dissipation buffer 240 and part of the outer middle frame 230. In this way, the two sides of the edge can use the material of the outer middle frame 230 to form the outer middle frame 230, and the middle area can be replaced by the heat dissipation buffer 240. The material of the outer middle frame 230 at the edge can better support structures such as the display panel 300 and the backlight module 200, and the heat dissipation buffer 240 in the middle corresponds to the chip-on-chip film 410 in the middle to better achieve heat dissipation.

[0045] like Figure 6 As shown, as the fifth embodiment of the present application, compared with any of the above embodiments, this embodiment mainly refines the heat dissipation buffer zone 243. The heat dissipation buffer member 240 includes a buffer zone 243 and a heat dissipation zone 244. The heat dissipation zone 244 is arranged in the buffer zone 243, or the buffer zone 243 can be arranged in the heat dissipation zone 244; wherein, the buffer zone 243 is provided with at least one material selected from the group consisting of EVA foam or PE cotton, and the heat dissipation zone 244 is provided with at least one material selected from the group consisting of graphite, graphene or thermally conductive silicone, and can also be a new type of phase change material for heat dissipation.

[0046] In this embodiment, the design of the heat dissipation buffer 240 can use materials such as EVA foam or PE cotton, or heat dissipation materials such as graphite, graphene, or thermal conductive silicone can be added in the middle of the buffer. The buffer material such as EVA foam or PE cotton and heat dissipation materials such as graphite, graphene, or thermal conductive silicone can be mixed to form the heat dissipation buffer 240, or the heat dissipation material can be filled in the buffer material to form the heat dissipation buffer 240. Such a heat dissipation buffer material can not only protect the corresponding driving chip 400 on the ground side 310 of the display panel 300, such as the cover film 410, but also quickly conduct the heat on the chip to the metal back plate 210. The heat dissipation buffer 240 has a single-sided adhesive backing and is adhered to the diaphragm on the ground side 310 and the back plate 210. Such a design is simple to produce and assemble, saves materials, has a simple design, and reduces costs.

[0047] like Figure 7 and Figure 8 As shown, as the sixth embodiment of the present application, it is a further refinement and improvement of any of the above embodiments, the display device 100 includes a front frame 500, and the front frame 500 is arranged on the ground side 310 of the display panel 300, for fixing the display panel 300 and the backlight module 200; wherein, the front frame 500 includes a side surface 510 and a bottom surface 520, the side surface 510 and the bottom surface 520 are perpendicular to each other, the thickness of the bottom surface 520 is greater than the thickness of the side surface 510, the first vertical portion 412 of the cover chip film 410 is arranged in contact with the bottom surface 520 of the front frame 500, and the bottom surface 520 of the front frame 500 is provided with multiple hollow structures.

[0048] After the light board 221, the diffuser plate 222, the optical film 223 and the display panel 300 are stacked, the bottom of the entire structure formed by the display panel 300 and the backlight module 200 is fixed by the front frame 500 and the double-sided tape 280. In order to ensure the supporting and fixing effect, the thickness of the bottom surface 520 of the front frame 500 is greater than the thickness of the side surface 510, and the bottom surface 520 is also provided with a hollow structure, which is used as a heat dissipation hole to dissipate the heat on the back panel 210 in time.

[0049] It should be noted that the inventive concept of this application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the various embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the various embodiments or technical features are combined, the original technical effects will be enhanced.

[0050] The technical solution of the present application can be widely used in various display panels, such as TN (Twisted Nematic) display panel, IPS (In-Plane Switching) display panel, VA (Vertical Alignment) display panel, MVA (Multi-Domain Vertical Alignment) display panel, and the above solution can be applied to all of them.

[0051] The above content is a further detailed description of the present application in conjunction with specific optional implementation methods, and the specific implementation of the present application cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, they can make several simple deductions or substitutions without departing from the concept of the present application, which should be considered to fall within the scope of protection of the present application.

Claims

1. A display device, characterized in that: The device comprises a backlight module and a display panel, wherein the display panel is arranged on the backlight module, the backlight module comprises a back plate and an optical component, the back plate comprises a bottom plate and four side plates protruding from the surface of the bottom plate, the four side plates are connected to each other around the bottom plate to form a back plate groove, and the optical component is placed in the back plate groove; The backlight module also includes an outer middle frame, which is arranged around the optical component and contacts the side plate of the back plate. The outer middle frame is provided with a hollow portion on the ground side corresponding to the display panel, and the hollow portion is provided with a heat dissipation buffer.

2. The display device according to claim 1, wherein: The heat dissipation buffer comprises a buffer area and a heat dissipation area. The heat dissipation area is arranged in the buffer area or the buffer area is arranged in the heat dissipation area.

3. The display device according to claim 1 or 2, characterized in that: The outer middle frame includes a first side, a second side and a third side that are interconnected, the first side and the third side are respectively arranged on the left and right sides of the display panel, the second side corresponds to the sky side of the display panel, and on the sky side of the display panel along the direction of the ground side of the display panel, the second side of the outer middle frame corresponds to the hollow portion covered, and the length of the hollow portion is equal to the length of the second side of the outer middle frame.

4. The display device according to claim 3, characterized in that The display device includes a chip-on-chip film, one side of the chip-on-chip film is connected to the ground side of the display panel, and the other side is bent toward the side of the back plate away from the display panel, and is attached to the side of the bottom plate of the back plate away from the display panel. The heat dissipation buffer is arranged between the chip-on-chip film and the side edge of the back plate corresponding to the ground side of the display panel, one side of the heat dissipation buffer is in contact with the chip-on-chip film, and the other side is in contact with the back plate.

5. The display device according to claim 4, characterized in that The heat dissipation buffer is an L-shaped structure, and the heat dissipation buffer portion includes a first buffer portion and a second buffer portion, and the first buffer portion and the second buffer portion are vertically connected to each other; The COF film comprises a first horizontal portion, a first vertical portion, and a second horizontal portion connected in a U-shaped structure, wherein one side of the first horizontal portion is connected to the ground side of the display panel, and the other side is connected to the first vertical portion, and one side of the first vertical portion is connected to the first horizontal portion, and the other side is connected to the second horizontal portion; The first buffer portion contacts the first horizontal portion of the chip-on-film, and the second buffer portion contacts the first vertical portion of the chip-on-film.

6. The display device according to claim 5, characterized in that A first gap is provided between the display panel and the optical component, the first buffer portion is provided in the first gap, and a thickness of the first buffer portion is equal to a width of the first gap; A second gap is provided between the side plate of the back plate close to the ground side of the display panel and the first vertical portion of the flip chip film, the second buffer portion is arranged in the second gap, and the thickness of the second buffer portion is equal to the width of the second gap; in the direction from the display panel to the back plate, the bottom surface of the second buffer portion abuts against a surface of the second horizontal portion close to the bottom plate.

7. The display device according to claim 5, characterized in that The optical component includes a lamp board, a diffuser plate and an optical film, the lamp board is arranged on the bottom plate of the back plate, the diffuser plate is arranged on the lamp board and spaced apart from the lamp board, the optical film is arranged on the diffuser plate, and on the sky side of the display panel along the ground side direction of the display panel, the length of the lamp board is smaller than the length of the bottom plate and smaller than the length of the diffuser plate, and the lamp board is spaced apart from the side plate of the back plate; the backlight module includes an inner middle frame, the inner middle frame includes a first supporting portion and a second supporting portion, the first supporting portion and the second supporting portion are arranged in an L shape, the first supporting portion is arranged between the bottom plate of the back plate and the diffuser plate, the two ends of the first supporting portion are respectively abutted against the bottom plate of the back plate and the diffuser plate, one end of the second supporting portion is connected to the first supporting portion, and the other end is abutted against the side of the back plate.

8. The display device according to claim 5, characterized in that The thickness of the first buffer portion is greater than the thickness of the second buffer portion.

9. The display device according to claim 1 or 2, characterized in that: The outer middle frame includes a first side, a second side and a third side that are connected to each other, the first side and the third side are respectively arranged on the left and right sides of the display panel, the second side corresponds to the sky side of the display panel, and on the sky side of the display panel along the direction of the ground side of the display panel, the second side of the outer middle frame corresponds to the hollow portion covering the hollow portion, the center point of the hollow portion coincides with the center point of the second side, and the length of the hollow portion is less than the length of the second side of the outer middle frame and greater than two-thirds of the length of the second side.

10. The display device according to claim 7, wherein: The display device comprises a front frame, which is arranged on the ground side of the display panel and is used to fix the display panel and the backlight module; The front frame includes a side surface and a bottom surface, the side surface and the bottom surface are perpendicular to each other, the thickness of the bottom surface is greater than the thickness of the side surface, the first vertical portion of the flip chip film is arranged in contact with the bottom surface of the front frame, and the bottom surface of the front frame is provided with multiple hollow structures.

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