Cold-guiding air-cooling double-effect heat dissipation case

Abstract

The utility model discloses a cold-guiding and air-cooling double-effect heat dissipation case which comprises a case frame, and a cold-guiding radiator, an air-cooling assembly and an electronic module are arranged in the case frame. The electronic modules comprise a low-power-consumption module and a high-power-consumption module, and the electronic modules are arranged in sequence; the number of the electronic module cold conduction radiators is two, and the electronic module is arranged between the two electronic module cold conduction radiators; the air cooling assembly comprises a first drainage plate, and the first drainage plate is arranged on the case frame, is parallel to the electronic module and is located between the low-power-consumption module and the high-power-consumption module. By additionally arranging the first drainage plate between the low-power-consumption module and the high-power-consumption module, heat in the high-power-consumption module area is prevented from spreading towards the low-power-consumption module, local air cooling can be performed on overheat points in the case in a targeted manner, the temperature of the case is reduced to the maximum extent under the condition of reasonably optimizing resources, and meanwhile resource waste is avoided.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation chassis, in particular to a conduction cooling and air cooling dual-effect heat dissipation chassis. Background Art

[0002] As the computing power of electronic equipment continues to increase, the total heat consumption and local heat flux density of electronic modules are increasing. Especially in the military field, the use environment of airborne and shipborne scenes is harsh, and the heat dissipation problem has become a technical bottleneck restricting the development of electronic equipment. At present, electronic equipment chassis often use three heat dissipation forms: conduction cooling, air cooling, and liquid cooling. Under the same boundary conditions, the heat dissipation capacity of the three heat dissipation forms generally increases in turn.

[0003] Conduction cooling refers to the process of heat being transferred from one object to another through direct contact, that is, heat conduction. In electronic chassis, conduction cooling usually refers to the heat generated by electronic components being transferred to the external environment through the metal structure of the chassis; air cooling is a heat dissipation method that uses air flow to remove heat. In electronic chassis, air cooling usually uses fans to increase air flow, thereby improving heat dissipation efficiency; liquid cooling is a heat dissipation method that uses liquid circulation to remove heat. In electronic chassis, liquid flows through electronic components or heat dissipation modules, absorbs heat and is then transported to an external radiator for heat exchange, which can more effectively handle high heat output and has lower noise, but this method is relatively expensive to use and complex to operate. It is generally suitable for high-performance electronic equipment that needs to handle large amounts of heat.

[0004] Prior art "An air-cooled chassis", announcement number: CN211880739U, discloses an air-cooled chassis, including a box body, an exhaust side panel assembly, an air inlet side panel and a fan; the box body includes a front panel, a rear panel, an upper cover plate, a lower cover plate, an upper heat conducting plate, a lower heat conducting plate, an upper partition plate and a lower partition plate; the main frame body surrounded by the front and rear panels, the upper heat conducting plate is fixedly installed between the front and rear panels, and a gap is left between the upper cover plate to form an upper air duct cavity; multiple upper partition plates are arranged in parallel in the upper air duct cavity, dividing the upper air duct cavity into multiple upper air ducts; the lower heat conducting plate is fixedly installed between the front and rear panels, and a gap is left between the lower cover plate to form a lower air duct cavity; multiple lower partition plates are arranged in parallel in the lower air duct cavity, dividing the lower air duct cavity into multiple lower air ducts. The utility model utilizes the fast heat transfer speed of the gas-liquid phase change of the working medium to ensure that the heat conducted from the board is quickly conducted on the upper and lower guide plates, thereby improving the heat dissipation efficiency of the fins.

[0005] However, if multiple functional modules are installed in the electronic chassis and the power consumption of electronic modules with different functions is unevenly distributed, if the heat dissipation chassis cannot implement different heat dissipation methods for low-power modules and high-power modules, two extremes will occur. The first is that if the heat dissipation solution is designed based on the low-power modules, the high-power modules will have poor heat dissipation and local high temperatures will occur; the second is that if the heat dissipation solution is designed based on the high-power modules, the heat dissipation function of the low-power module area will be excessive, resulting in a waste of resources. Utility Model Content

[0006] The embodiment of the present application provides a conduction-cooling and air-cooling dual-effect heat dissipation chassis, which solves the technical problem in the prior art that when multiple functional modules are installed in an electronic chassis and the power consumption of electronic modules with different functions is unevenly distributed, if the heat dissipation chassis cannot implement different heat dissipation methods for low-power modules and high-power modules, poor heat dissipation in the chassis or waste of resources will occur.

[0007] In order to solve the above technical problems, the utility model provides the following technical solutions: a conduction-cooled and air-cooled dual-effect heat dissipation chassis, which includes a chassis frame, in which a conduction-cooled radiator, an air-cooled component and an electronic module are arranged; the electronic module includes a low-power module and a high-power module, and each of the electronic modules is placed in sequence; two electronic module conduction-cooled radiators are arranged, and the electronic module is arranged between the two electronic module conduction-cooled radiators; the air-cooled component includes a first guide plate, which is arranged on the chassis frame, parallel to the electronic module, and located between the low-power module and the high-power module. By adding the first guide plate between the low-power module and the high-power module, the heat in the high-power module area is prevented from spreading to the low-power module, laying the foundation for the subsequent addition of a separate heat dissipation means in the high-power module area.

[0008] As a preferred solution of the conduction-cooled and air-cooled dual-effect heat dissipation chassis described in the utility model, the chassis frame includes a chassis front panel, a chassis bottom panel, a chassis side panel, a chassis rear panel and a chassis top panel, and the panels are interconnected. An air inlet is provided on the chassis front panel, an axial flow fan is provided on the chassis rear panel, and a first guide plate is horizontally provided on the chassis front panel. Product information, warning signs, operating instructions, etc. can be printed on the chassis frame to provide users with necessary information while enhancing the overall appearance and brand image of the product. Through the cooperation of the front air inlet and the axial flow fan, a negative pressure air duct is formed in the chassis, and the cold air outside the chassis enters from the air inlet on the chassis front panel, passes through the electronic module and takes away the heat emitted by it, and is then discharged by the axial flow fan.

[0009] As a preferred solution of the conduction-cooled and air-cooled dual-effect heat dissipation chassis of the utility model, the electronic module includes multiple low-power modules and one high-power module, and each of the electronic modules is placed horizontally in sequence, and the high-power module is close to the top panel of the chassis. Hot air rises and cold air falls. The high-power module is set at the top of the electronic module group, which can reduce the heat of the high-power module from spreading to the low-power module.

[0010] As a preferred solution of the conduction-cooled and air-cooled dual-effect heat dissipation chassis described in the utility model, the air cooling component also includes electronic module heat dissipation fins and multiple guide plates. The electronic module heat dissipation fins are arranged on the side of the high-power module close to the chassis top panel. The multiple guide plates form a dedicated module air cooling air duct, and the dedicated module air cooling air duct passes through the electronic module heat dissipation fins. By adding electronic module heat dissipation fins to the high-power module, the contact surface between the high-power module and the air is increased and the heat dissipation is accelerated. At the same time, a dedicated module air cooling air duct is set to accelerate the heat dissipation of the high-power module.

[0011] As a preferred solution of the conduction-cooled and air-cooled dual-effect heat dissipation chassis of the utility model, an electronic module back plate is set at one end of the electronic module conduction-cooled radiator close to the chassis rear panel, an electronic module cover plate is set at one end between the two chassis side panels close to the chassis top panel, and an electronic module bottom plate is set at one side between the two chassis side panels close to the chassis bottom panel. The electronic module back plate, the electronic module cover plate, the electronic module bottom plate and the electronic module conduction-cooled radiator form a conduction-cooled module cavity. The electronic module is placed in the conduction-cooled module cavity. On the one hand, the heat of the electronic module can be quickly dissipated. On the other hand, it can serve as an electromagnetic shielding layer to reduce electromagnetic interference between electronic modules and protect the electronic module from physical damage.

[0012] As a preferred solution of the conduction cooling and air cooling dual-effect heat dissipation chassis of the utility model, the air cooling component also includes a second guide plate and a third guide plate, the second guide plate is arranged at one end of the electronic module cover plate close to the chassis rear panel, the third guide plate is arranged on the chassis top panel, the third guide plate is arranged at a position corresponding to the second guide plate, and a vent hole is arranged at a position of the electronic module cover plate corresponding to the second guide plate. A simple setting method of a dedicated module air cooling air duct is proposed, by setting a second guide plate, hot air can be prevented from directly blowing on the electronic module back plate, reducing the adverse effects on the electronic module back plate.

[0013] As a preferred solution of the conduction-cooling and air-cooling dual-effect heat dissipation chassis of the utility model, a chassis door is arranged in the middle of the chassis front panel, the chassis door and the chassis front panel are connected to each other through a hinge support, and the first guide plate is arranged on the chassis door. The chassis door can rotate around the hinge support to realize the function of opening and closing the chassis. When adding or removing an electronic module into the chassis, it is only necessary to open the chassis door without removing the entire chassis front panel.

[0014] As a preferred solution of the conduction cooling and air cooling dual-effect heat dissipation chassis of the utility model, the electronic module conduction cooling radiator is provided with a plurality of conduction cooling radiator fins, and the conduction cooling radiator fins are arranged horizontally. By adding the conduction cooling radiator fins, the contact surface between the electronic module conduction cooling radiator and the air is increased, and the heat dissipation is accelerated.

[0015] As a preferred solution of the conduction-cooled and air-cooled dual-effect heat dissipation chassis of the utility model, chassis air-cooling air inlets are arranged on both sides of the chassis front panel and on the side close to the chassis bottom panel, the chassis air-cooling air inlets are arranged directly opposite to the electronic module conduction-cooled radiator, and module air-cooling air inlets are arranged on the chassis door, and the module air-cooling air inlets are located between the first guide plate and the chassis top panel. A reasonable distribution of air inlets is proposed to avoid dust from entering while meeting the needs of heat dissipation and air intake.

[0016] As a preferred solution of the conduction-cooling and air-cooling dual-effect heat dissipation chassis of the utility model, a chassis handle is arranged on the front panel of the chassis. By arranging a handle on the chassis frame, it is convenient to carry or install.

[0017] One or more technical solutions are provided in the embodiments of the present application, which have at least the following technical effects or advantages:

[0018] 1. Add a drainage plate between the low-power module and the high-power module to prevent the heat from the high-power module area from spreading to the low-power module;

[0019] 2. By setting up a dedicated air duct for module air cooling, high-power modules can be locally cooled by air while using the general low-power module conduction cooling method, thereby improving the heat dissipation speed and heat dissipation effect of high-power modules;

[0020] 3. Compared with the original conduction cooling method, by adding air cooling components, the ultimate maximum shell temperature of the original module chip simulation dropped from 82°C to 58°C, and the heat dissipation effect was significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0022] Figure 1 This is a three-dimensional picture of a dual-effect heat dissipation chassis with conductive cooling and air cooling.

[0023] Figure 2 This is the exploded diagram of the dual-effect cooling chassis with conductive cooling and air cooling.

[0024] Figure 3 This is a diagram of the interior of a dual-effect heat dissipation chassis with conductive cooling and air cooling.

[0025] Figure 4 This is the structural diagram of the cooling cavity of the dual-effect heat dissipation chassis with conduction cooling and air cooling.

[0026] Figure 5 for Figure 1 AA side section diagram of the cooling path of the cooling chassis.

[0027] Figure 6 for Figure 1 Top view of the cooling chassis BB cross-section and the cooling path diagram.

[0028] Figure 7 for Figure 1 AA side section of the cooling chassis with conduction cooling + air cooling heat dissipation path diagram.

[0029] Figure 8 for Figure 1 Top view of the cross-section of the cooling chassis BB with conduction cooling + air cooling heat dissipation path diagram.

[0030] Fig. 9 This is a stereoscopic rear view of the dual-effect heat dissipation chassis with conductive cooling and air cooling.

[0031] Fig.10 This is a picture of the second drainage plate of the dual-effect heat dissipation chassis with guided cooling and air cooling.

[0032] Fig.11 This is a diagram of the electronic module cover of a dual-effect heat dissipation chassis with conductive cooling and air cooling.

[0033] Fig.12 for Fig.10 and Fig.11 Connection diagram.

[0034] Fig.13 This is a diagram of the electronic module base plate of the dual-effect heat dissipation chassis with conduction cooling and air cooling.

[0035] Reference numerals: 1-electronic module cooling radiator; 11-cooling radiator fins; 12-boss; 13-electronic module back plate; 14-electronic module cover plate; 15-electronic module bottom plate

[0036] 2-chassis front panel; 21-1 side chassis air cooling air inlet; 21-2 bottom chassis air cooling air inlet; 22-chassis door; 221-module air cooling air inlet; 23-hinged support; 24-chassis handle;

[0037] 3-air cooling assembly; 31-electronic module heat sink fins, 32-first guide plate; 33-second guide plate; 34-third guide plate;

[0038] 4-Electronic module; 41-Low power module; 42-High power module

[0039] 5-Axial flow fan;

[0040] 6- Chassis bottom plate;

[0041] 7- Chassis side panel;

[0042] 8- Chassis rear panel;

[0043] 9- Chassis top plate; DETAILED DESCRIPTION

[0044] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0045] Reference Figure 1-13 This embodiment provides a conduction-cooling and air-cooling dual-effect heat dissipation chassis.

[0046] The conduction-cooling and air-cooling dual-effect heat dissipation chassis includes a chassis frame, in which an electronic module conduction-cooling radiator 1, an air-cooling component 3 and an electronic module 4 are arranged. The chassis frame provides necessary information to users by printing product information, warning signs, operating instructions, etc., while improving the overall appearance and brand image of the product; the electronic module conduction-cooling radiator 1 provides conduction-cooling heat dissipation for the electronic module 4; and the air-cooling component 3 provides local air-cooling heat dissipation for hot spots in the chassis.

[0047] Specifically, the chassis frame includes a chassis front panel 2 (located at the front), a chassis bottom panel 6 (bottom), a chassis side panel 7 (left and right), a chassis rear panel 8 (rear) and a chassis top panel 9 (top), and the panels are interconnected to form an internal cavity, and the electronic module 4, the electronic module cooling radiator 1 and the air cooling component 3 are all arranged in this internal cavity. An air inlet hole is opened on the chassis front panel 2, and two axial flow fans 5 are arranged on the chassis rear panel 8. The top, bottom, front, back, left and right in the following expressions shall be subject to the explanations in the above brackets.

[0048] The electronic module 4 includes a plurality of low-power modules 41 and a high-power module 42. The electronic modules 4 are placed in sequence. Each electronic module 4 can be placed horizontally or vertically, but the electronic module cooling radiator always maintains a vertical positional relationship with each electronic module 4. That is, if each electronic module 4 is placed vertically, the two electronic module cooling radiators 1 are respectively arranged at the upper and lower parts of the chassis; if each electronic module 4 is placed horizontally, the two electronic module cooling radiators 1 are respectively arranged at the left and right parts of the chassis. In this embodiment, it is preferred that the electronic module 4 is placed horizontally.

[0049] When each electronic module 4 is placed horizontally in sequence, multiple low-power consumption modules 41 and one high-power consumption module 42 are arranged in sequence from bottom to top, and the high-power consumption module 42 is close to the chassis top panel 9. The high-power consumption module 42 is arranged at the top of the electronic module group, and multiple electronic module cooling fins 31 are arranged on one side of the high-power consumption module 42 close to the chassis top panel 9.

[0050] The electronic module cooling radiator 1 is a hollow cuboid, and a plurality of cooling radiator fins 11 are arranged in the hollow position inside, and the cooling radiator fins 11 are arranged horizontally. A plurality of horizontal bosses 12 are integrally formed on the opposite surface of the electronic module cooling radiator 1, and the electronic module 4 is placed on the horizontal bosses 12.

[0051] Furthermore, an electronic module back plate 13 is provided at one end of the electronic module cooling radiator 1 close to the chassis rear panel 8, and a certain distance is left between the electronic module back plate 13 and the chassis rear panel 8. An electronic module cover plate 14 is provided at one end close to the chassis top panel 9 between the two chassis side panels 7, such as Figure 4 , 11 As shown, the electronic module cover 14 is close to the chassis top panel 9, and the electronic module cover 14 is facing the electronic module 4. An electronic module bottom plate 15 is arranged between the two chassis side panels 7 and close to the chassis bottom panel 6. A plurality of heat dissipation fins are arranged on the side of the electronic module bottom plate 15 facing the electronic module 4 and close to the chassis bottom plate 6, as shown in FIG. Figure 4 , 13 As shown. The electronic module back plate 13, the electronic module cover plate 14, the electronic module bottom plate 15 and the electronic module cooling radiator 1 form a cooling module cavity, and the electronic module 4 is placed in the cooling module cavity. The heat released by the electronic module 4 during operation is discharged by cooling and heat dissipation through the cooling material of the cooling module cavity. The function of the cooling module cavity is, on the one hand, to quickly dissipate the heat of the electronic module, and on the other hand, it can serve as an electromagnetic shielding layer to reduce electromagnetic interference between electronic modules and protect the electronic module from physical damage.

[0052] The air cooling assembly 3 includes electronic module heat dissipation fins 31 , a first guide plate 32 , a second guide plate 33 and a third guide plate 34 . The three guide plates form a dedicated module air cooling air duct, which passes through the electronic module heat dissipation fins 31 .

[0053] The first guide plate 32 is a narrow and long plate structure with a certain thickness. It is horizontally placed between the low-power module 41 and the high-power module 42, and is fixed to the chassis door 22 along the longitudinal side by screws. The two ends of the first guide plate 32 are close to the electronic module cooling radiator 1, but the two are not in contact with each other. The material of the first guide plate 32 close to the upper top surface is preferably a material with poor thermal conductivity, such as thermal grease, so that the heat of the high-power module 42 can be minimized from spreading to the low-power module 41.

[0054] The second guide plate 33 is an "L"-shaped plate structure, and the vertical edge of the "L"-shaped plate is fixed to one end of the electronic module cover 14 close to the rear panel 8 of the chassis by screws. The "L"-shaped plate opening faces the electronic module 4. The material on the inner side of the "L"-shaped plate is preferably a material with poor thermal conductivity, which can make most of the heat dissipated by the high-power module 42 concentrated in the module's dedicated air cooling air duct to prevent its heat from spreading to the low-power module 41.

[0055] The third guide plate 34 is a "U"-shaped groove, which is integrally formed with the chassis top panel 9. The position of the third guide plate 34 corresponds to the second guide plate 33, and a vent hole is provided at the position of the electronic module cover 14 corresponding to the second guide plate 33.

[0056] Due to the setting of the first guide plate 32, the heat emitted by the high-power module 42 cannot spread to the low-power module 41, so the heat emitted by the high-power module 42 is concentrated above the high-power module 42, forming a local hot spot. The path of local air cooling of the hot spot is that the cold air outside the chassis enters through the module air cooling inlet 221, passes through the high-power module 42 and the electronic module heat dissipation fins 31 above it, takes away the heat, and then follows the "L"-shaped path of the second guide plate 33, passes through the vents of the electronic module cover 14, spreads along the "U" path of the third guide plate 34, and is finally discharged through the axial flow fan 5, as shown in FIG. Figure 7 , 8 shown.

[0057] A chassis door 22 is provided in the middle of the chassis front panel 2. The chassis door 22 and the chassis front panel 2 are connected to each other through a hinge support 23 on the chassis front panel 2, and the chassis door 22 can rotate around the hinge support 23. When the chassis is in a closed state, the chassis door 22 is hinged on the chassis front panel 2, and the upper end of the chassis door 22 is fixedly connected to the chassis front panel 2 by two bolts. When it is necessary to open the chassis door to put in or take out the electronic module, it is only necessary to unscrew the two bolts fixed on the chassis door 22 without removing the entire chassis front panel 2. A module air cooling air inlet 221 is provided on the chassis door 22, and the module air cooling air inlet 221 is located between the first guide plate 32 and the chassis top panel 9.

[0058] Two side chassis air cooling inlets 21 - 1 are symmetrically opened on both sides of the chassis front panel 2, and the side chassis air cooling inlets 21 are arranged opposite to the electronic module cooling radiator 1. A row of bottom chassis air cooling inlets 21 - 2 are opened near the chassis bottom panel 6, and the bottom chassis air cooling inlets 21 - 2 are opposite to the multiple cooling fins under the electronic module bottom plate 15.

[0059] The heat emitted by the low-power module 41 is dissipated to the outside of the electronic module 4 through the cold module cavity. The heat conduction heat dissipation path is that the air outside the chassis passes through the side chassis air cooling air inlet 21-1, takes away the heat through the heat conduction radiator fins 11, and the air outside the chassis enters the chassis from the bottom chassis air cooling air inlet 21-2, takes away the heat through the multiple heat dissipation fins under the electronic module bottom plate 15, and then the above heat is discharged from the chassis through the axial flow fan 5 and discharged into the atmosphere. Figure 5 , 6 shown.

[0060] Furthermore, two chassis handles 24 are provided on the chassis front panel 2 to facilitate transportation or installation.

[0061] It should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A conduction-cooling and air-cooling dual-effect heat dissipation chassis, characterized in that: It comprises a chassis frame, in which an electronic module cooling radiator (1), an air cooling component (3) and an electronic module (4) are arranged; The electronic module (4) comprises a low power consumption module (41) and a high power consumption module (42), and the electronic modules (4) are placed in sequence; Two electronic module cooling radiators (1) are provided, and the electronic module (4) is provided between the two electronic module cooling radiators (1); The air cooling assembly (3) comprises a first guide plate (32), wherein the first guide plate (32) is arranged on the chassis frame, the first guide plate (32) is parallel to the electronic module (4), and is located between the low power consumption module (41) and the high power consumption module (42).

2. The conduction-cooling and air-cooling dual-effect heat dissipation chassis according to claim 1, characterized in that: The chassis frame comprises a chassis front panel (2), a chassis bottom panel (6), a chassis side panel (7), a chassis rear panel (8) and a chassis top panel (9), wherein the panels are connected to each other, an air inlet is arranged on the chassis front panel (2), an axial flow fan (5) is arranged on the chassis rear panel (8), and a first guide plate (32) is horizontally arranged on the chassis front panel (2).

3. The conduction-cooling and air-cooling dual-effect heat dissipation chassis according to claim 2, characterized in that: The electronic module (4) comprises a plurality of low-power consumption modules (41) and a high-power consumption module (42), and the electronic modules (4) are placed horizontally in sequence, with the high-power consumption module (42) being close to the top panel (9) of the chassis.

4. The conduction-cooling and air-cooling dual-effect heat dissipation chassis according to claim 2, characterized in that: The air cooling assembly (3) further comprises an electronic module heat dissipation fin (31) and a plurality of guide plates, wherein the electronic module heat dissipation fin (31) is arranged on a side of the high power consumption module (42) close to the chassis top panel (9), and the plurality of guide plates form a dedicated module air cooling air duct, wherein the dedicated module air cooling air duct passes through the electronic module heat dissipation fin (31).

5. The conduction-cooling and air-cooling dual-effect heat dissipation chassis according to claim 2, characterized in that: An electronic module back panel (13) is provided at one end of the electronic module cooling radiator (1) close to the chassis rear panel (8), an electronic module cover panel (14) is provided at one end between the two chassis side panels (7) close to the chassis top panel (9), and an electronic module bottom panel (15) is provided at one side between the two chassis side panels (7) close to the chassis bottom panel (6).

6. The conduction-cooling and air-cooling dual-effect heat dissipation chassis according to claim 2, characterized in that: The air cooling assembly (3) further comprises a second guide plate (33) and a third guide plate (34); the second guide plate (33) is arranged at one end of the electronic module cover plate (14) close to the rear panel (8) of the chassis; the third guide plate (34) is arranged on the top panel (9) of the chassis; the position of the third guide plate (34) corresponds to that of the second guide plate (33); and a vent hole is arranged at a position of the electronic module cover plate (14) corresponding to the second guide plate (33).

7. The conduction-cooling and air-cooling dual-effect heat dissipation chassis according to claim 2, characterized in that: A chassis door (22) is arranged in the middle of the chassis front panel (2); the chassis door (22) and the chassis front panel (2) are connected to each other via a hinged support (23); and a first guide plate (32) is arranged on the chassis door (22).

8. The conduction-cooling and air-cooling dual-effect heat dissipation chassis according to claim 7, characterized in that: Chassis air cooling inlets (21-1) are provided on both sides of the chassis front panel (2) and on a side close to the chassis bottom panel (6), the chassis air cooling inlets (21-1) are provided directly opposite the electronic module cooling radiator (1), the module air cooling inlet (221) is provided on the chassis door (22), and the module air cooling inlet (221) is located between the first guide plate (32) and the chassis top panel (9).

9. The conduction-cooling and air-cooling dual-effect heat dissipation chassis according to claim 1, characterized in that: The electronic module cooling radiator (1) is provided with a plurality of cooling radiator fins (11), and the cooling radiator fins (11) are arranged horizontally.

10. The conduction-cooling and air-cooling dual-effect heat dissipation chassis according to claim 2, characterized in that: A chassis handle (24) is provided on the chassis front panel (2).

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