Automatic bonding wire pressing device

Abstract

The utility model discloses an automatic bonding wire pressing device which comprises a working table, a pressing mechanism is arranged on the upper surface of the working table, a processing cavity is formed in the working table, a bearing plate is arranged in the processing cavity, and one end of the pressing mechanism and the bearing plate are arranged in an up-down corresponding mode; the chip clamping device comprises a bearing plate, clamping assemblies and a cooling assembly, the number of the clamping assemblies is two, the two clamping assemblies are movably installed on the two sides of the bearing plate so as to be used for clamping and fixing a chip, and the cooling assembly is arranged on the clamping assemblies. According to the utility model, the chip is prevented from sliding, so that the problems that the bonding points of the chip and the bonding wire are not in the same horizontal plane, the pressing failure occurs, the performance, the reliability and the service life of the chip are influenced, the resource waste is caused, the cost is increased, and the bonding points of the chip and the bonding wire are air-cooled through the cooling assembly, so that the bonding points are quickly condensed, and the service life of the chip is prolonged are solved. Therefore, the advantages of improving the cooling speed and reducing the working time are achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of pressing devices, and in particular relates to an automatic pressing device for bonding wires. Background Art

[0002] Bonding wire is a thin metal wire used in the semiconductor packaging process to connect semiconductor chips. This connection method is usually used in the packaging of microelectronic devices. The bonding wire can be gold wire, copper wire, aluminum wire, etc. They are fixed to the chip and package through ultrasonic bonding, thermal compression bonding or thermal ultrasonic bonding. Generally, a dedicated pressing device is used for processing. The pressing device mainly uses heat and pressure to fix the metal wire to the chip.

[0003] However, there are some problems with the prior art: the existing automated bonding wire pressing device does not have a structure for clamping and fixing the chip during the pressing process, so the chip may slip during the pressing process, causing the bonding points of the chip and the bonding wire to be not in the same horizontal plane. At this time, pressing will result in an unsatisfactory pressing effect, which will have a certain impact on the performance, reliability and life of the chip itself after pressing. There are certain limitations, so we propose an automated bonding wire pressing device. Utility Model Content

[0004] In view of the problems existing in the prior art, the purpose of the utility model is to provide an automatic bonding wire pressing device, which uses a clamping component to limit and fix the chip to prevent the chip from sliding, resulting in the bonding points of the chip and the bonding wire not being in the same horizontal plane, resulting in pressing failure, affecting the performance, reliability and life of the chip, thereby causing waste of resources and increasing costs. After pressing, the cooling component is started to air-cool the bonding points of the two to make them condense quickly, thereby achieving the effect of increasing the cooling speed and reducing the working time.

[0005] The utility model is implemented in this way: the bonding wire automatic pressing device comprises:

[0006] A workbench, wherein a pressing mechanism is arranged on the upper surface of the workbench, a processing cavity is opened inside the workbench, a bearing plate is arranged inside the processing cavity, and one end of the pressing mechanism is arranged in a vertical correspondence with the bearing plate;

[0007] The clamping assembly and the cooling assembly are provided with two groups, and the two groups of the clamping assemblies are movably installed on both sides of the carrier plate to clamp and fix the chip, and the cooling assembly is arranged on the clamping assembly.

[0008] Optionally, the clamping assembly includes a movable seat, a clamping plate is provided on the upper surface of the movable seat, an extension plate is fixedly installed on one side of the clamping plate, an anti-slip pad is provided in the middle of the extension plate, and the movable seat is slidably installed on one side of the bearing plate.

[0009] Optionally, a slot is provided inside the bearing plate, an extension block at one end of the movable seat is slidably mounted inside the slot, and the lower end of the clamping plate is located on the upper surface of the bearing plate.

[0010] Optionally, a through hole is opened at the bottom end of the movable seat, a sliding rod is arranged in the through hole, the sliding rod is fixedly installed in the slot, and a fixing cap is detachably installed at one end of the sliding rod.

[0011] Optionally, the cooling assembly includes a bellows, which is disposed on a splint, a connecting pipe is disposed at one end of the splint, one end of the connecting pipe is disposed in the bellows, the other end of the connecting pipe is disposed on an extension plate, and a fan is disposed in the connecting pipe.

[0012] Optionally, the interior of the extension plate is hollow, and a plurality of exhaust holes are provided at both ends of one side of the extension plate.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The clamping assembly provided by the utility model can limit and fix the chip during the pressing process to prevent the chip from sliding, which causes the bonding points of the chip and the bonding wire to be not in the same horizontal plane, resulting in pressing failure, affecting the performance, reliability and life of the chip, thereby causing a waste of resources and increasing costs.

[0015] 2. Through the cooling component provided by the utility model, after the chip and the bonding wire are pressed together, the cooling component is started to air-cool the bonding points of the two to make them condense quickly, thereby achieving the purpose of increasing the cooling speed and reducing the working time.

[0016] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram provided by the utility model;

[0018] Figure 2 It is a schematic diagram of the clamping assembly provided by the utility model;

[0019] Figure 3 It is a schematic diagram of the extension plate provided by the utility model;

[0020] Figure 4It is a schematic diagram of a cooling assembly provided by the utility model.

[0021] In the figure: 1. workbench; 2. pressing mechanism; 3. processing chamber; 4. carrying plate; 5. clamping assembly; 501. movable seat; 502. clamping plate; 503. through hole; 504. extension plate; 505. anti-slip pad; 506. exhaust hole; 507. sliding rod; 508. fixing cap; 6. chip; 7. cooling assembly; 701. bellows; 702. connecting pipe; 703. fan. DETAILED DESCRIPTION

[0022] In order to further understand the content, features and effects of the utility model, the following embodiments are given as examples and described in detail with reference to the accompanying drawings.

[0023] like Figures 1 to 4 As shown, the bonding wire automatic pressing device provided by the embodiment of the utility model comprises: a workbench 1, a pressing mechanism 2 is arranged on the upper surface of the workbench 1, a processing cavity 3 is opened inside the workbench 1, a carrying plate 4 is arranged inside the processing cavity 3, one end of the pressing mechanism 2 is arranged correspondingly with the carrying plate 4 up and down; a clamping assembly 5 and a cooling assembly 7, the clamping assembly 5 is provided with two groups, the two groups of clamping assemblies 5 are movably installed on both sides of the carrying plate 4, so as to clamp and fix the chip 6, and the cooling assembly 7 is arranged on the clamping assembly 5;

[0024] Specifically, Figures 1 to 4 As shown, during lamination, the chip 6 is placed on the upper surface of the carrier plate 4, and then the two groups of clamping components 5 are relatively slid so that the two groups of clamping components 5 are in contact with both ends of the chip 6 to clamp the chip 6 to improve the stability of the chip 6 and prevent sliding during the lamination process, which causes the bonding points of the chip 6 and the bonding wire to be not in the same horizontal plane, resulting in lamination failure, affecting the performance, reliability and life of the chip 6, thereby causing resource waste and increasing costs. After the lamination tool heats the bonding wire to increase its temperature, plastically deforms the bonding wire, and bonds it to the chip 6, the cooling component 7 can be started to air-cool the bonding point between the chip 6 and the bonding wire to quickly cool it down, thereby achieving the effect of increasing hardness: rapid cooling can cause changes in the internal structure of the metal, thereby increasing the hardness of the material, improving wear resistance and enhancing toughness.

[0025] Furthermore, the clamping assembly 5 includes a movable seat 501, a clamping plate 502 is provided on the upper surface of the movable seat 501, an extension plate 504 is fixedly installed on one side of the clamping plate 502, an anti-slip pad 505 is provided in the middle of the extension plate 504, and the movable seat 501 is slidably installed on one side of the bearing plate 4;

[0026] Specifically, Figure 2 and Figure 3As shown, when the clamping plate 502 is clamping, the extension plate 504 and the anti-slip pad 505 cooperate to reduce the wear on the edge of the chip 6.

[0027] Furthermore, a slot is provided inside the bearing plate 4, and an extension block at one end of the movable seat 501 is slidably installed inside the slot, and the lower end of the clamping plate 502 is located on the upper surface of the bearing plate 4;

[0028] Specifically, Figures 2 to 4 As shown, the extension block at one end of the movable seat slides in the slot to change the clamping position of the clamping plate 502, thereby achieving the effect of convenient adjustment according to the size of the chip 6 and improving practicality.

[0029] Furthermore, a through hole 503 is formed at the bottom of the movable seat 501, a slide bar 507 is disposed in the through hole 503, the slide bar 507 is fixedly installed in the slot, and a fixing cap 508 is detachably installed at one end of the slide bar 507;

[0030] Specifically, Figures 2 to 4 As shown, the movable seat 501 slides on the outer surface of the sliding rod 507 through the through hole 503, and the movable seat 501 is positioned and guided by the sliding rod 507, so as to prevent the movable seat 501 from sliding out of the slot and falling, resulting in the movable seat 501 being unable to slide in the slot again. After the sliding adjustment, the fixing cap 508 is screwed to one end of the sliding rod 507 until one side of the fixing cap 508 contacts the movable seat 501 to limit the fixed seat 501.

[0031] Further, the cooling assembly 7 includes a bellows 701, the bellows 701 is arranged on the clamping plate 502, a connecting pipe 702 is arranged at one end of the clamping plate 502, one end of the connecting pipe 702 is arranged in the bellows 701, the other end of the connecting pipe 702 is arranged on the extension plate 504, and a fan 703 is arranged in the connecting pipe 702;

[0032] Specifically, Figures 2 to 4 As shown, the extension plate 504 clamps the chip 6 through the clamp 502, so that the distance between the extension plate 504 and the chip 6 is short, thereby starting the fan 703, drawing cold air from the bellows 701, and sending it into the extension plate 504 through the connecting pipe 702, and then sending air to the bonding point of the chip 6 through the extension plate 504, thereby increasing the cooling speed after pressing.

[0033] Furthermore, the interior of the extension plate 504 is hollow, and a plurality of exhaust holes 506 are provided at both ends of one side of the extension plate 504;

[0034] Specifically, Figure 2 and Figure 4As shown, the chip 6 is located on the carrier board 4, and the exhaust holes 506 on both sides of the extension board 504 are set at both ends, so that the exhaust holes 506 correspond to the pins at both ends of the chip 6, so that after pressing, cold air is blown onto the chip 6 through the exhaust holes 506 to achieve the effect of rapid cooling after pressing, improve the pressing effect, and reduce the working time.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. The bonding wire automatic pressing device is characterized by: include: A workbench (1), wherein a pressing mechanism (2) is arranged on the upper surface of the workbench (1), a processing cavity (3) is provided inside the workbench (1), a carrying plate (4) is arranged inside the processing cavity (3), and one end of the pressing mechanism (2) is arranged in a vertically corresponding manner to the carrying plate (4); A clamping assembly (5) and a cooling assembly (7), wherein the clamping assembly (5) is provided in two groups, and the two groups of the clamping assembly (5) are movably mounted on both sides of a carrier plate (4) to clamp and fix the chip (6), and the cooling assembly (7) is arranged on the clamping assembly (5).

2. The bonding wire automatic pressing device according to claim 1, characterized in that: The clamping assembly (5) comprises a movable seat (501), the upper surface of the movable seat (501) is provided with a clamping plate (502), one side of the clamping plate (502) is fixedly mounted with an extension plate (504), the middle part of the extension plate (504) is provided with an anti-slip pad (505), and the movable seat (501) is slidably mounted on one side of the bearing plate (4).

3. The bonding wire automatic pressing device according to claim 2, characterized in that: A slot is provided inside the bearing plate (4), an extension block at one end of the movable seat (501) is slidably mounted inside the slot, and the lower end of the clamping plate (502) is located on the upper surface of the bearing plate (4).

4. The bonding wire automatic pressing device according to claim 3, characterized in that: A through hole (503) is provided at the bottom end of the movable seat (501), a sliding rod (507) is arranged in the through hole (503), the sliding rod (507) is fixedly installed in the slot, and a fixing cap (508) is detachably installed at one end of the sliding rod (507).

5. The bonding wire automatic pressing device according to claim 4, characterized in that: The cooling assembly (7) comprises a bellows (701), wherein the bellows (701) is arranged on a clamping plate (502), a connecting pipe (702) is arranged at one end of the clamping plate (502), one end of the connecting pipe (702) is arranged in the bellows (701), and the other end of the connecting pipe (702) is arranged on an extension plate (504), and a fan (703) is arranged in the connecting pipe (702).

6. The bonding wire automatic pressing device according to claim 5, characterized in that: The interior of the extension plate (504) is hollow, and a plurality of exhaust holes (506) are provided at both ends of one side of the extension plate (504).

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