Silicon wafer clamping device and silicon wafer detection device
By using airbag-type clippers in silicon wafer detection devices, the problem of difficult to accurately adjust the clamping force and silicon wafer wear in the prior art is solved, and more flexible and accurate silicon wafer clamping is achieved, reducing fragmentation rate.
Patent Information
- Application Number
- CN202421651218.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-12
AI Technical Summary
In the prior art, clamping arms made of hard materials are difficult to accurately adjust the clamping force when clamping the silicon wafer, which can easily lead to wear on the surface and edges of the silicon wafer.
A silicon wafer clamping device is designed, using an airbag-type clipper, which independently controls the clamping force by adjusting the inflation pressure of the airbag main body. Each clipper group includes two airbag-type clippers arranged at intervals, which can adapt to silicon wafers of different sizes and correct the position of the silicon wafer.
Through the use of airbag type clipper, the silicon wafer breakage caused by excessive clamping force is avoided, the fragmentation rate is reduced, and it can adapt to silicon wafers of different sizes, improving the clamping flexibility and accuracy.
Smart Images
Figure CN222826394U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of photovoltaic cell manufacturing, in particular to a silicon wafer clamping device and a silicon wafer detection device comprising the silicon wafer clamping device. Background Art
[0002] Solar energy is a clean and renewable energy source. Solar cells based on the photovoltaic effect, or photovoltaic cells, have broad application prospects. In the production process of photovoltaic cells, the cell is made into a PN junction that can generate electricity by light after processes such as texturing, diffusion and PECVD. Then, grid lines are added to the cell to form ohmic contact electrodes at both ends of the PN junction, thereby realizing current output. The process of adding grid lines to the cell is called metallization, which is one of the key processes in the preparation of photovoltaic cells. During the metallization process, metal slurry (such as silver paste and aluminum paste) can be printed on the front and back of the cell by screen printing technology, and then through processes such as low-temperature baking and high-temperature sintering, the fine electrodes of the photovoltaic cell are finally formed.
[0003] The main raw material of photovoltaic cells is silicon wafers. The quality of silicon wafers directly determines the conversion efficiency of photovoltaic cells. Therefore, it is necessary to test the incoming silicon wafers. When testing silicon wafers, it is necessary to clamp and fix the silicon wafers. In the prior art, two clamping arms that are relatively set and made of hard materials are usually used to clamp the silicon wafers. Because the material of the clamping arms is too hard and the clamping force cannot be accurately adjusted, the surface and edges of the silicon wafers are often worn. Utility Model Content
[0004] The utility model aims to solve at least one of the above-mentioned defects and / or other defects in the prior art.
[0005] According to a first aspect of the utility model, a silicon wafer clamping device is provided, the silicon wafer clamping device comprises two clamping device groups respectively arranged on both sides of the silicon wafer, each clamping device group comprises a first clamping device and a second clamping device spaced apart and arranged on the same side of the silicon wafer. The first clamping device and the second clamping device each comprise an airbag body, and the expansion degree of the airbag body of each clamping device can be independently controlled by adjusting the inflation pressure of the airbag body.
[0006] According to one embodiment of the utility model, the first clamps of the two clamp groups cooperate with each other to clamp the first end of the silicon wafer in the feeding direction, and the second clamps of the two clamp groups cooperate with each other to clamp the second end of the silicon wafer in the feeding direction.
[0007] According to one embodiment of the present utility model, the airbag body of each clip is equipped with a pressure sensor.
[0008] According to an embodiment of the present invention, the airbag body is made of rubber.
[0009] According to an embodiment of the present utility model, each clip further comprises a first fixing portion arranged at one axial end of the airbag body, and the center of the first fixing portion comprises an air inlet hole communicating with the inner cavity of the airbag body.
[0010] According to an embodiment of the present utility model, each clip further includes a second fixing portion arranged at the other axial end of the airbag body.
[0011] According to an embodiment of the present invention, the second fixing portion is made of metal.
[0012] According to a second aspect of the present invention, a silicon wafer detection device is provided, the silicon wafer detection device comprising a workbench and the silicon wafer clamping device as described above, wherein the silicon wafer clamping device is fixed on the workbench.
[0013] The silicon wafer clamping device and silicon wafer detection device according to the utility model have at least the following beneficial effects: by arranging airbag-type clamps on both sides of the silicon wafer to clamp the silicon wafer, it is possible to avoid damage to the silicon wafer due to excessive clamping force, thereby reducing the fragmentation rate; by changing the expansion degree of the airbag body of the clamp, it is possible to adapt to silicon wafers of different sizes; by providing two airbag-type clamps arranged at intervals on both sides of the silicon wafer, the position of the silicon wafer can be corrected when the silicon wafer is placed at an angle. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The features and advantages of the present invention will be clearly understood from the detailed description provided below with reference to the accompanying drawings, in which:
[0015] Figure 1 A schematic diagram showing the configuration of a silicon wafer clamping device according to an exemplary embodiment of the present utility model is shown.
[0016] Figure 2 Show Figure 1 A schematic diagram of the structure of a wafer clamp in a silicon wafer clamping device is shown.
[0017] The accompanying drawings are only schematic and are not necessarily drawn to scale. They only show those parts necessary to illustrate the utility model, while other parts may be omitted or only briefly mentioned. In addition to the parts shown in the accompanying drawings, the utility model may also include other parts.
[0018] Description of reference numerals:
[0019] 1. Silicon wafer; 11. First end; 12. Second end; 2. Clip group; 3. First clip; 4. Second clip; 5. Airbag body; 6. First fixing part; 61. Air inlet; 7. Second fixing part; H. Feed direction; L. Transverse direction. DETAILED DESCRIPTION
[0020] Embodiments according to the present utility model are described below with reference to the accompanying drawings. In the following description, many specific details are set forth so that those skilled in the art can more fully understand the present utility model. However, it is obvious to those skilled in the art that the implementation of the present utility model may not have some of these specific details. In addition, it should be understood that the present utility model is not limited to the specific embodiments introduced. On the contrary, any combination of the following features and elements may be considered to implement the present utility model, regardless of whether they relate to different embodiments. Therefore, the following features, embodiments and advantages are for illustrative purposes only and should not be regarded as elements or limitations of the claims unless clearly stated in the claims.
[0021] In the following, terms such as "first", "second", etc. are used to describe the elements of the present application. These terms are only used to distinguish the various elements, and are not used to limit the nature, order or number of these elements. The terms "including" and "having" are used to express an open-ended inclusive meaning, and mean that there may be additional elements / components in addition to the listed elements / components.
[0022] Figure 1 The schematic diagram of the configuration of a silicon wafer clamping device according to an embodiment of the utility model is shown. The silicon wafer clamping device is used to clamp the corresponding silicon wafer 1, especially during the silicon wafer inspection process.
[0023] like Figure 1 As shown, the silicon wafer 1 is generally a square silicon wafer with chamfered corners. For example, the side length of the square silicon wafer can be 166 mm, 182 mm, 210 mm, etc. The silicon wafer clamping device according to this embodiment may include two wafer clamping device groups 2 respectively arranged on both sides of the silicon wafer 1. Specifically, Figure 1 In the embodiment, one clamping device group 2 is arranged on the left side of the silicon wafer 1, and the other clamping device group 2 is arranged on the right side of the silicon wafer 1. The two clamping devices 2 cooperate with each other to clamp the left and right sides of the silicon wafer 1. Each clamping device group 2 may include a first clamping device 3 and a second clamping device 4 arranged at intervals on the same side of the silicon wafer 1. Figure 1 In the embodiment, the first clamp 3 is located at the upper side and the second clamp 4 is located at the lower side.
[0024] Figure 1Also shown is a feeding direction H of the silicon wafer 1 and a lateral direction L perpendicular to the feeding direction H. Two clamping device groups 2 are respectively arranged on the left and right sides of the silicon wafer 1 along the feeding direction H. The silicon wafer 1 may include a first end 11 and a second end 12 in the feeding direction H. The first clamping devices 3 of the two clamping device groups 2 cooperate with each other to clamp the first end 11 of the silicon wafer 1. The second clamping devices 4 of the two clamping device groups 2 cooperate with each other to clamp the second end 12 of the silicon wafer 1.
[0025] In this embodiment, the first film clamp 3 and the second film clamp 4 are airbag type film clamps. Figure 2 FIG. 2 shows a schematic diagram of the structure of the airbag type clip. Figure 2 As shown, each of the clips includes a balloon body 5. The balloon body 5 is made of a stretchable material, especially rubber. By filling the inner cavity of the balloon body 5 with pressurized gas, such as compressed air, the balloon body 5 can expand radially outward so that its outer surface can abut against the edge of the silicon wafer 1.
[0026] Each clip also includes a first fixing portion 6 disposed at one axial end of the airbag body 5. The first fixing portion 6 may have an air inlet hole 61 in the center thereof that is in communication with the inner cavity of the airbag body 5. The air inlet hole 61 may be connected to a pressurized gas source via an air inlet pipe, in which a pressure limiting valve may be disposed. Each clip also includes a second fixing portion 7 disposed at the other axial end of the airbag body 5. Both the first fixing portion 6 and the second fixing portion 7 are made of a hard material, in particular, metal. The first fixing portion 6 and the second fixing portion 7 are used to fix the airbag body 5.
[0027] exist Figure 2 In the embodiment, the first fixing portion 6 having the air inlet hole 61 is located at the upper side, but the present invention is not limited thereto, and each clip can also be configured so that the pressurized gas enters the inner cavity of the airbag body 5 from the lower side. Those skilled in the art can also understand that the second fixing portion 7 can be provided on an adjustment mechanism, which can adjust the position of the clip in the transverse direction L and / or in the height direction perpendicular to the feeding direction H and the transverse direction L.
[0028] like Figure 2 As shown, the first fixing portion 6 and the second fixing portion 7 can be configured in a disc shape. As an example, the outer diameter of the first fixing portion 6 and the second fixing portion 7 can be 14mm, the axial height can be 2mm, and the spacing between the first fixing portion 6 and the second fixing portion 7 (i.e., the axial height of the airbag body 5) can be 8mm.
[0029] As described above, two clamping device groups 2 are respectively arranged on both sides of the silicon wafer 1, each clamping device group 2 includes a first clamping device 3 and a second clamping device 4 arranged at intervals on the same side of the silicon wafer 1, and each clamping device is an airbag type clamping device including an airbag body 5. Compared with the clamping arm made of hard material in the prior art, the use of the airbag type clamping device can avoid the damage of the silicon wafer due to excessive clamping force, thereby reducing the fragmentation rate. Moreover, by changing the expansion degree of the airbag body 5 of the clamping device, it can adapt to silicon wafers of different sizes.
[0030] For example, when clamping a silicon wafer 1 with a side length of 182 mm, the airbag body 5 of the first clamp 3 of the two clamp groups 2 is inflated to the first pressure value to clamp the first end 11 of the silicon wafer 1. The airbag body 5 of the second clamp 4 of the two clamp groups 2 is also inflated to the first pressure value to clamp the second end 12 of the silicon wafer 1. When clamping a silicon wafer 1 with a side length of 166 mm, it is only necessary to inflate the airbag body 5 of each clamp to a second pressure value greater than the first pressure value so that the degree of expansion of the airbag increases, thereby reducing the effective clamping distance between the two clamp groups 2. On the other hand, when clamping a silicon wafer 1 with a side length of 210 mm, by releasing part of the pressurized gas to reduce the internal pressure of the airbag body 5 of each clamp to a third pressure value less than the first pressure value, the degree of expansion of the airbag decreases, thereby increasing the effective clamping distance between the two clamp groups 2.
[0031] In addition, since two spaced-apart first clamps 3 and second clamps 4 are provided on both sides of the silicon wafer 1, and the expansion degree of the airbag body 5 of each clamp can be independently controlled by adjusting the inflation pressure of the airbag body 5, the silicon wafer clamping device according to this embodiment can also be used to correct the position of the silicon wafer 1.
[0032] For example, when the silicon wafer 1 is tilted so that Figure 1 When the first end 11 of the silicon wafer 1 deviates to the left and the second end 12 deviates to the right, the position of the first end 11 of the silicon wafer 1 can be corrected to the right by increasing the inflation pressure of the airbag body 5 of the first clamp 3 on the left to increase its expansion degree, and / or by reducing the inflation pressure of the airbag body 5 of the first clamp 3 on the right to reduce its expansion degree. Similarly, the position of the second end 12 of the silicon wafer 1 can be corrected to the left by reducing the inflation pressure of the airbag body 5 of the second clamp 4 on the left to reduce its expansion degree, and / or by increasing the inflation pressure of the airbag body 5 of the second clamp 4 on the right to increase its expansion degree.
[0033] In order to better control the expansion degree of each clip, the airbag body 5 of each clip may be equipped with a pressure sensor (not shown), thereby obtaining the pressure inside the corresponding airbag body 5.
[0034] In the above embodiment, the feeding direction H of the silicon wafer 1 is Figure 1 However, the present invention is not limited thereto, and the feeding direction of the silicon wafer 1 may also be perpendicular to Figure 1 The direction of the paper.
[0035] The silicon wafer clamping device of the utility model is particularly suitable for clamping silicon wafers during the silicon wafer detection process. The corresponding silicon wafer detection device includes a workbench and the silicon wafer clamping device as described above, and the silicon wafer clamping device is fixed on the workbench. Specifically, the second fixing portion 7 of each first wafer clamp 3 and the second wafer clamp 4 can be fixed on the workbench directly or via an adjustment mechanism. In addition, the silicon wafer clamping device of the utility model can also be used to clamp silicon wafers in processes such as screen printing.
[0036] For those skilled in the art, various modifications and variations may be made to the embodiments disclosed above without departing from the scope or spirit of the utility model. Other embodiments of the utility model will be apparent to those skilled in the art from the practice of the utility model disclosed in this specification. This specification and the examples disclosed therein should be considered to be illustrative only, and the true scope of the utility model is specified by the appended claims and their equivalents.
Claims
1. A silicon wafer clamping device, characterized in that: The silicon wafer clamping device comprises two clamping device groups (2) respectively arranged on both sides of the silicon wafer (1), each clamping device group (2) comprises a first clamp (3) and a second clamp (4) arranged at intervals on the same side of the silicon wafer (1), the first clamp (3) and the second clamp (4) both comprise an airbag body (5), and the expansion degree of the airbag body (5) of each clamp can be independently controlled by adjusting the inflation pressure of the airbag body (5).
2. The silicon wafer clamping device according to claim 1, characterized in that: The first clamps (3) of the two clamp groups (2) cooperate with each other to clamp the first end (11) of the silicon wafer (1) in the feeding direction (H), and the second clamps (4) of the two clamp groups (2) cooperate with each other to clamp the second end (12) of the silicon wafer (1) in the feeding direction (H).
3. The silicon wafer clamping device according to claim 1 or 2, characterized in that: The airbag body (5) of each clip is equipped with a pressure sensor.
4. The silicon wafer clamping device according to claim 1 or 2, characterized in that: The airbag body (5) is made of rubber.
5. The silicon wafer clamping device according to claim 1 or 2, characterized in that: Each clip further comprises a first fixing portion (6) arranged at one axial end of the airbag body (5), wherein the center of the first fixing portion (6) comprises an air inlet hole (61) communicating with the inner cavity of the airbag body (5).
6. The silicon wafer clamping device according to claim 5, characterized in that: The first fixing part (6) is made of metal.
7. The silicon wafer clamping device according to claim 1 or 2, characterized in that: Each clip further comprises a second fixing portion (7) arranged at the other axial end of the airbag body (5).
8. The silicon wafer clamping device according to claim 7, characterized in that: The second fixing part (7) is made of metal.
9. A silicon wafer detection device, characterized in that: The silicon wafer detection device comprises a workbench and a silicon wafer clamping device according to any one of claims 1 to 8, wherein the silicon wafer clamping device is fixed on the workbench.