Packaging cover plate with light window step

Abstract

The utility model discloses a packaging cover plate with an optical window step, which comprises a first kovar part, a first silver-copper solder, a second kovar part, a second silver-copper solder and a third kovar part which are sequentially stacked from top to bottom, the peripheral width of the first kovar part, the peripheral width of the first silver-copper solder and the peripheral width of the second kovar part are the same and aligned, and the inner circumference width of the second kovar part, the inner circumference width of the second silver-copper solder and the inner circumference width of the third kovar part are the same and aligned. According to the packaging cover plate with the light window step, the first kovar part, the second kovar part and the third kovar part are assembled to form the packaging cover plate, compared with an etching process, the packaging cover plate only needs to be heated, welded and fixed, the processing cost is low, the processing efficiency is high, the production capacity is large, the thickness of the processed cover plate is not limited by the processing process, and the packaging cover plate is suitable for large-scale production. The method is extremely suitable for production of the step-type light window cover plate.

Description

Technical Field

[0001] The utility model relates to the technical field of microelectronic packaging equipment, in particular to a packaging cover plate with a light window step. Background Art

[0002] Microelectronic components are packaged through a package cover. To form an internal package space, the package cover is usually stepped. The traditional step-type package cover structure is mainly produced by etching. Due to the limitations of the etching process, the thickness of the step-type package cover that can be produced is usually less than 0.5mm.

[0003] As a type of microelectronic component, optoelectronic components are different from ordinary microelectronic components in that their packaging cover plates have a light-transmitting requirement, that is, their packaging cover plates need to adopt light window cover plates with light-transmitting windows. The step-type light window cover plate is assembled from a cover plate body with a light window sill and a light window lens, wherein the light window lens is embedded on the inner side of the cover plate body with the light window sill. In order to avoid the light window lens occupying the internal packaging space of the light window cover plate after being embedded on the inner side of the cover plate body with the light window sill, the cover plate body with the light window sill needs to be raised. For this reason, compared with the step-type packaging cover plates of ordinary microelectronic components, the thickness of the cover plate body with the light window sill is thicker, which exceeds the normal production range of the etching process. As a result, when the etching process is used to produce the cover plate with the light window sill, the processing speed is slow and the efficiency is low, which is not suitable for large-scale mass production. Utility Model Content

[0004] The utility model aims to provide a packaging cover plate with a light window step.

[0005] The technical solution for achieving the purpose of the utility model is: a packaging cover plate with a light window step, comprising a first kovar part, a first silver-copper solder, a second kovar part, a second silver-copper solder and a third kovar part stacked in sequence from top to bottom, the first kovar part, the first silver-copper solder, the second kovar part, the second silver-copper solder and the third kovar part are all rectangular rings with hollowed-out middles, wherein the outer width of the first kovar part, the outer width of the first silver-copper solder and the outer width of the second kovar part are the same and aligned, the outer width of the second kovar part is greater than the outer width of the second silver-copper solder and smaller than the outer width of the third kovar part; the inner width of the second kovar part is greater than the inner width of the first kovar part and smaller than the inner width of the first silver-copper solder, the inner width of the second kovar part, the inner width of the second silver-copper solder and the inner width of the third kovar part are the same and aligned; the first kovar part and the second kovar part are welded together by the first silver-copper solder, and the second kovar part and the third kovar part are welded together by the second silver-copper solder.

[0006] Further, the edge width of the first silver-copper solder is L2, and the edge width of the second kovar part is L3. The relationship between L2 and L3 satisfies (1 / 4*L3) < L2 < (1 / 2*L3). When the first silver-copper solder is heated to a certain temperature and melts to weld the first kovar part and the second kovar part, the melted first silver-copper solder will overflow, thereby widening the edge width of the first silver-copper solder. To avoid the need to remove the overflow material after the first silver-copper solder overflows the second kovar part and at the same time reduce the consumption of the first silver-copper solder, the edge width of the first silver-copper solder can be made smaller than the edge width of the second kovar part. However, considering the welding area between the first kovar part and the second kovar part to ensure the firmness of the welding between the first kovar part and the second kovar part, the edge width of the first silver-copper solder cannot be too small. Therefore, preferably, the relationship between L2 and L3 satisfies (1 / 4*L3) < L2 < (1 / 2*L3).

[0007] Further, the relationship between L2 and L3 satisfies L2 = 1 / 3*L3.

[0008] Further, the edge width of the second silver-copper solder is L4, and the edge width of the second kovar part is L3. The relationship between L4 and L3 satisfies (1 / 4*L3) < L4 < (1 / 2*L3). When the second silver-copper solder is heated to a certain temperature and melts to weld the second kovar part and the third kovar part, the melted second silver-copper solder will overflow, thereby widening the edge width of the second silver-copper solder. To avoid the need to remove the overflow material after the second silver-copper solder overflows the second kovar part and at the same time reduce the consumption of the second silver-copper solder, the edge width of the second silver-copper solder can be made smaller than the edge width of the second kovar part. However, considering the welding area between the second kovar part and the third kovar part to ensure the firmness of the welding between the second kovar part and the third kovar part, the edge width of the second silver-copper solder cannot be too small. Therefore, preferably, the relationship between L4 and L3 satisfies (1 / 4*L3) < L4 < (1 / 2*L3).

[0009] Further, the relationship between L3 and L4 satisfies L4 = 1 / 3*L3.

[0010] The package cover plate with light window step of the utility model is stacked with the first silver-copper solder between the first kovar part and the second kovar part, and the second silver-copper solder is stacked between the second kovar part and the third kovar part, so that the first silver-copper solder and the second silver-copper solder that are heated and melted can respectively weld the first kovar part and the second kovar part, and the second kovar part and the third kovar part. Under the welding action of the first silver-copper solder and the second silver-copper solder after melting, the separated first kovar part, the second kovar part and the third kovar part can finally form a whole and assemble into a package cover plate with light window step. Compared with the etching process, the package cover plate assembled by the first kovar part, the second kovar part and the third kovar part only needs heating and welding, and has low processing cost, high processing efficiency, large production capacity, and the thickness of the processed cover plate is not limited by the processing technology. It can be used not only for the production of ordinary microelectronic component step-type package cover plates, but also extremely suitable for the production of step-type light window cover plates, and the types of processed cover plates are wide.

[0011] The packaging cover plate with light window steps of the utility model is assembled by three layers of fellable parts, namely, the first fellable part, the second fellable part and the third fellable part. Under the three-layer fellable part assembly structure, the first fellable part, the second fellable part and the third fellable part do not have structures such as steps, and are ordinary flat plate structures. The materials and formation of the first fellable part, the second fellable part and the third fellable part are relatively simple, and the processing is convenient.

[0012] In the packaging cover plate with a light window step of the utility model, the outer width of the first kovable part, the outer width of the first silver-copper solder and the outer width of the second kovable part are the same, and the periphery of the first kovable part, the periphery of the first silver-copper solder and the periphery of the second kovable part are aligned, and at the same time, the inner width of the second kovable part, the inner width of the second silver-copper solder and the inner width of the third kovable part are the same, and the inner periphery of the second kovable part, the inner periphery of the second silver-copper solder and the inner periphery of the third kovable part are aligned. Under the structure that the periphery of the first kovar part, the periphery of the first silver-copper solder and the periphery of the second kovar part are aligned, and the inner periphery of the second kovar part, the inner periphery of the second silver-copper solder and the inner periphery of the third kovar part are aligned, when processing is convenient, the first kovar part, the first silver-copper solder and the second kovar part placed in the mold can be positioned by the periphery, and the inner periphery of the second kovar part, the inner periphery of the second silver-copper solder and the third kovar part placed in the mold can be positioned by the inner periphery, and in association with the second kovar part whose inner and outer periphery are positioned at the same time, the first kovar part, the first silver-copper solder, the second kovar part, the second silver-copper solder and the third kovar part can be positioned as a whole, thereby facilitating the welding and fixing processing of the first kovar part, the first silver-copper solder, the second kovar part, the second silver-copper solder and the third kovar part, which can not only improve the processing efficiency, but also improve the processing precision and accuracy.

[0013] In addition, in the packaging cover plate with a light window step of the utility model, the first silver-copper solder and the second silver-copper solder are also rectangular rings with a hollow middle portion. Compared with spot welding, after the first ring-shaped silver-copper solder and the second silver-copper solder are melted and welded, the packaging cover plate has good airtightness and no sealing problem. Moreover, while the outer width of the second kovable part is greater than the outer width of the second silver-copper solder, the outer width of the second kovable part is less than the outer width of the third kovable part, and the inner width of the second kovable part is greater than the inner width of the first kovable part. At the same time, the inner circumference width of the second kovable part is smaller than the inner circumference width of the first silver-copper solder, the side widths of the first silver-copper solder and the second silver-copper solder are both smaller than the side width of the second kovable part, and the inner side of the first silver-copper solder and the outer side of the second silver-copper solder both have overflow space. Due to the existence of the overflow space, even if the first silver-copper solder and the second silver-copper solder overflow after heating, they will not overflow the second kovable part to form overflow and need to be cleaned, which greatly improves the neatness after processing, reduces subsequent finishing operations, and improves operating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic structural diagram of a packaging cover plate with a light window step according to the utility model;

[0015] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along line AA;

[0016] Figure 3 for Figure 2 Schematic diagram of the local structure;

[0017] Figure 4 It is a structural schematic diagram of the first cuttable part in the packaging cover plate with light window step of the utility model;

[0018] Figure 5 This is a schematic diagram of the structure of the first silver-copper solder in the packaging cover plate with light window step of the utility model;

[0019] Figure 6 It is a structural schematic diagram of the second cuttable part in the packaging cover plate with light window step of the utility model;

[0020] Figure 7 This is a schematic diagram of the structure of the second silver-copper solder in the packaging cover plate with a light window step of the utility model;

[0021] Figure 8 The utility model is a schematic structural diagram of the third cuttable part in the packaging cover plate with light window step. DETAILED DESCRIPTION

[0022] The preferred embodiment of the packaging cover plate with light window step of the utility model is described in detail below with reference to the accompanying drawings.

[0023] like Figures 1 to 8 As shown, a packaging cover plate with a light window step comprises a first kovable part 1, a first silver-copper solder 2, a second kovable part 3, a second silver-copper solder 4 and a third kovable part 5 which are stacked in sequence from top to bottom, wherein the first kovable part 1, the first silver-copper solder 2, the second kovable part 3, the second silver-copper solder 4 and the third kovable part 5 are all rectangular rings with hollowed-out middles, wherein the outer width D1 of the first kovable part 1, the outer width D2 of the first silver-copper solder 2 and the outer width D3 of the second kovable part 3 are the same and aligned, and the outer width D3 of the second kovable part 3 is greater than that of the first kovable part 1. The outer width D4 of the second silver-copper solder 4 is smaller than the outer width D5 of the third kovable part 5; the inner width d3 of the second kovable part 3 is larger than the inner width d1 of the first kovable part 1 and smaller than the inner width d2 of the first silver-copper solder 2; the inner width d3 of the second kovable part 3, the inner width d4 of the second silver-copper solder 4 and the inner width d5 ​​of the third kovable part 5 are the same and aligned; the first kovable part 1 and the second kovable part 2 are welded together by the first silver-copper solder 2, and the second kovable part 3 and the third kovable part 5 are welded together by the second silver-copper solder 4.

[0024] The package cover plate with light window step of the utility model is composed of the first kovable part 1, the first silver-copper solder 2, the second kovable part 3, the second silver-copper solder 4 and the third kovable part 5. The first kovable part 1, the first silver-copper solder 2, the second kovable part 3, the second silver-copper solder 4 and the third kovable part 5 of rectangular ring structure are stacked and positioned in sequence from top to bottom in the mold, and then sent to heat. The first silver-copper solder 2 and the second silver-copper solder 4 heated to a certain temperature are melted, wherein the first silver-copper solder 2 welds the first kovable part 1 and the second kovable part 2, and the second silver-copper solder 4 welds the second kovable part 3 and the third kovable part 5. After welding, the package cover plate with light window step of the utility model can be taken out of the mold.

[0025] In the packaging cover plate with light window step of the utility model, the outer width D3 of the second kovable part 3 is smaller than the outer width D5 of the third kovable part 5, and under the welding action of the first silver-copper solder 2 and the second silver-copper solder 4, the outer shapes of the first kovable part 1, the second kovable part 3 and the third kovable part 5 form a two-level step structure as a whole; the inner width d3 of the second kovable part 3 is larger than the inner width d1 of the first kovable part 1, and the first kovable part 1 with a smaller diameter facilitates the embedding of the light window lens.

[0026] In the packaging cover plate with light window step of the utility model, under the welding action of the first silver-copper solder 2 and the second silver-copper solder 4, the first kovable part 1, the second kovable part 3 and the third kovable part 5 form a two-level step structure as a whole, which is used as the main body of the light window cover plate. After the light window lens is embedded in the first kovable part 1, the light window cover plate can be assembled.

[0027] The packaging cover plate with light window step of the utility model is characterized in that the first silver-copper solder 2 is stacked between the first kovable part 1 and the second kovable part 3, and the second silver-copper solder 4 is stacked between the second kovable part 3 and the third kovable part 5, so that the first silver-copper solder 2 and the second silver-copper solder 4 that are heated and melted can respectively weld the first kovable part 1 and the second kovable part 3, and the second kovable part 3 and the third kovable part 5. Under the welding action of the first silver-copper solder 2 and the second silver-copper solder 4 after melting, the first kovable part 1, the second kovable part 3 and the third kovable part 5 that are separated can finally form a whole and be assembled into the packaging cover plate with light window step. Compared with the etching process, the packaging cover plate assembled by the first kovable part 1, the second kovable part 3 and the third kovable part 5 only needs heating and welding, with low processing cost, high processing efficiency, large production capacity, and the thickness of the processed cover plate is not limited by the processing technology. It can not only be used for the production of step-type packaging cover plates of ordinary microelectronic components, but also is extremely suitable for the production of step-type optical window cover plates, and the types of cover plates that can be processed are wide.

[0028] The packaging cover plate with light window step of the utility model is assembled by three layers of fellable parts, namely, the first fellable part 1, the second fellable part 3 and the third fellable part 5. Under the three-layer fellable part assembly structure, the first fellable part 1, the second fellable part 3 and the third fellable part 5 do not have structures such as steps, and are ordinary flat plate structures. The materials and formation of the first fellable part 1, the second fellable part 3 and the third fellable part 5 are relatively simple, and the processing is convenient.

[0029] In the packaging cover plate with light window step of the utility model, the outer width D1 of the first kovable part 1, the outer width D2 of the first silver-copper solder 2 and the outer width D3 of the second kovable part 3 are the same, the periphery of the first kovable part 1, the periphery of the first silver-copper solder 2 and the periphery of the second kovable part 3 are aligned, and at the same time, the inner width d3 of the second kovable part 3, the inner width d4 of the second silver-copper solder 4 and the inner width d5 ​​of the third kovable part 5 are the same, and the inner periphery of the second kovable part 3, the inner periphery of the second silver-copper solder 4 and the inner periphery of the third kovable part 5 are aligned. In the structure in which the periphery of the first kovable part 1, the periphery of the first silver-copper solder 2 and the periphery of the second kovable part 3 are aligned, and the inner periphery of the second kovable part 3, the inner periphery of the second silver-copper solder 4 and the inner periphery of the third kovable part 5 are aligned, when processing is convenient, the first kovable part 1, the first silver-copper solder 2 and the second kovable part 3 placed in the mold can be positioned by the periphery, and the inner periphery of the second kovable part 3, the inner periphery of the second silver-copper solder 4 and the third kovable part 5 placed in the mold can be positioned by the inner periphery. In association with the second kovable part 3 positioned at both the inner and outer periphery, the first kovable part 1, the first silver-copper solder 2, the second kovable part 3, the second silver-copper solder 4 and the third kovable part 5 can be positioned as a whole, thereby facilitating the welding and fixing processing of the first kovable part 1, the first silver-copper solder 2, the second kovable part 3, the second silver-copper solder 4 and the third kovable part 5, which can not only improve the processing efficiency, but also improve the processing precision and accuracy.

[0030] In addition, in the packaging cover plate with light window step of the utility model, the first silver-copper solder 2 and the second silver-copper solder 4 are also rectangular rings with hollowed-out middle parts. Compared with spot welding, after the annular first silver-copper solder 2 and the second silver-copper solder 4 are melted and welded, the air tightness of the packaging cover plate is good, and there is no sealing problem; and, while the outer width D3 of the second kovable part 3 is greater than the outer width D4 of the second silver-copper solder 4, the outer width D3 of the second kovable part 3 is smaller than the outer width D5 of the third kovable part 5, and the inner width d3 of the second kovable part 3 is greater than the inner width d4 of the first kovable part 1. While the inner circumference width d1, the inner circumference width d3 of the second kovable part 3 is smaller than the inner circumference width d2 of the first silver-copper solder 2, the side widths of the first silver-copper solder 2 and the second silver-copper solder 4 are both smaller than the side width of the second kovable part 3, and the inner side of the first silver-copper solder 2 and the outer side of the second silver-copper solder 4 both have overflow space. Due to the existence of the overflow space, even if the first silver-copper solder 2 and the second silver-copper solder 4 overflow after heating, they will not overflow from the second kovable part 3 to form overflow and need to be cleaned, which greatly improves the neatness after processing, reduces subsequent finishing operations, and improves operating efficiency.

[0031] For the encapsulation cover plate with a light window step of the present utility model, preferably, the side width of the first silver-copper solder 2 is L2, the side width of the second kovar part 3 is L3, and the relationship between L2 and L3 satisfies (1 / 4 * L3) < L2 < (1 / 2 * L3). When the first silver-copper solder 2 is heated to a certain temperature and melts, when welding and fixing the first kovar part 1 and the second kovar part 2, the melted first silver-copper solder 2 will overflow, thereby widening the side width of the first silver-copper solder 2. To avoid removing the overflow material after the first silver-copper solder 2 overflows the second kovar part 3, and at the same time, reduce the consumption of the first silver-copper solder 2, the side width L2 of the first silver-copper solder 2 can be made smaller than the side width L3 of the second kovar part 3. However, considering the welding and fixing area of the first kovar part 1 and the second kovar part 2 to ensure the firmness of the welding and fixing of the first kovar part 1 and the second kovar part 2, the side width L2 of the first silver-copper solder 2 cannot be too small. For this reason, preferably, the relationship between L2 and L3 satisfies (1 / 4 * L3) < L2 < (1 / 2 * L3).

[0032] For the encapsulation cover plate with a light window step of the present utility model, preferably, the relationship between L2 and L3 satisfies L2 = 1 / 3 * L3.

[0033] For the encapsulation cover plate with a light window step of the present utility model, preferably, the side width of the second silver-copper solder 4 is L4, the side width of the second kovar part 3 is L3, and the relationship between L3 and L4 satisfies (1 / 4 * L3) < L4 < (1 / 2 * L3). When the second silver-copper solder 4 is heated to a certain temperature and melts, when welding and fixing the second kovar part 3 and the third kovar part 5, the melted second silver-copper solder 4 will overflow, thereby widening the side width of the second silver-copper solder 4. To avoid removing the overflow material after the second silver-copper solder 4 overflows the second kovar part 3, and at the same time, reduce the consumption of the second silver-copper solder 4, the side width L4 of the second silver-copper solder 4 can be made smaller than the side width L3 of the second kovar part 3. However, considering the welding and fixing area of the second kovar part 3 and the third kovar part 5 to ensure the firmness of the welding and fixing of the second kovar part 3 and the third kovar part 5, the side width L4 of the second silver-copper solder 4 cannot be too small. For this reason, preferably, the relationship between L4 and L3 satisfies (1 / 4 * L3) < L4 < (1 / 2 * L3).

[0034] For the encapsulation cover plate with a light window step of the present utility model, preferably, the relationship between L3 and L4 satisfies L4 = 1 / 3 * L3.

[0035] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, is also included in the patent protection scope of the present invention.

Claims

1. A packaging cover plate with a light window step, characterized in that: The invention comprises a first kovar part, a first silver-copper solder, a second kovar part, a second silver-copper solder and a third kovar part which are stacked in sequence from top to bottom, wherein the first kovar part, the first silver-copper solder, the second kovar part, the second silver-copper solder and the third kovar part are all rectangular rings with hollowed-out middle parts, wherein the outer width of the first kovar part, the outer width of the first silver-copper solder and the outer width of the second kovar part are the same and aligned, the outer width of the second kovar part is larger than the outer width of the second silver-copper solder and smaller than the outer width of the third kovar part; the inner width of the second kovar part is larger than the inner width of the first kovar part and smaller than the inner width of the first silver-copper solder, the inner width of the second kovar part, the inner width of the second silver-copper solder and the inner width of the third kovar part are the same and aligned; the first kovar part and the second kovar part are welded together by the first silver-copper solder, and the second kovar part and the third kovar part are welded together by the second silver-copper solder.

2. The packaging cover plate with light window step according to claim 1, characterized in that: The side width of the first silver-copper solder is L2, the side width of the second kovar part is L3, and the relationship between L2 and L3 satisfies (1 / 4*L3) <L2<(1 / 2*L3)。 3. The packaging cover plate with light window step according to claim 2, characterized in that: The relationship between L2 and L3 satisfies L2=1 / 3*L3.

4. The packaging cover plate with light window step according to claim 1, characterized in that: The side width of the second silver-copper solder is L4, the side width of the second kovar part is L3, and the relationship between L3 and L4 satisfies (1 / 4*L3) <L4<(1 / 2*L3)。 5. The packaging cover plate with light window step according to claim 4, characterized in that: The relationship between L3 and L4 satisfies L4=1 / 3*L3.

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