FPC module and display device
By opening bare steel sheet notches in the non-device area of the FPC motherboard and setting corresponding conduction areas on the conductive film, the reinforced steel sheet and the conductive film are directly connected, which solves the problems of many transfer conduction times and high production costs in the prior art, and achieves the effect of efficient release of static electricity and reducing production costs.
Patent Information
- Application Number
- CN202421590849.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-05
AI Technical Summary
The existing FPC steel sheet grounding technology has many transfer conduction times, which cannot efficiently release the static electricity of the steel sheet, and requires a large amount of conductive materials, resulting in high production costs.
A steel sheet exposed notch is opened in the non-device area of the FPC motherboard, so that the reinforced steel sheet is partially exposed after being bonded to the FPC motherboard, and a second conductive area corresponding to the exposed notch of the steel sheet is set on the conductive film, so that the reinforced steel sheet and the conductive film are directly conductive.
It reduces the number of transfer conduction times, achieves efficient release of static electricity, reduces the use of conductive materials, and reduces production costs.
Smart Images
Figure CN222827424U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of FPC steel sheet grounding, in particular to an FPC module and a display device. Background Art
[0002] When assembling the FPC and the iron back frame, a steel sheet is required for reinforcement. In order to solve the grounding problem of the steel sheet, the existing practice is: first, reserve multiple copper-exposed grounding areas on the non-device surface of the FPC, and then apply conductive glue on the non-device surface of the FPC to bond with the steel sheet, so that the steel sheet and the copper-exposed grounding area are conductive; then set a conductive double-sided tape on the back of the steel sheet and fix it on the back frame, so that the steel sheet and the back frame are also conductive to each other. Finally, reserve a copper-exposed grounding area in the blank space on the FPC device surface, and then reserve a conductive area after the conductive film is covered on the FPC device surface. The conductive area of the conductive film corresponds to the position of the copper-exposed grounding area on the FPC device surface, so that when the conductive film covers the FPC, the conductive film and the FPC are conductive. In this way, the FPC, steel sheet, back frame and conductive film are grounded and conductive, achieving the effect of releasing static electricity.
[0003] However, this approach has the problem of many transfer conduction times. For example, the static electricity of the steel sheet needs to be conducted to the FPC through the grounded exposed gold surface on the non-device side of the FPC, and then conducted to the conductive film through the grounded exposed gold surface on the device side of the FPC. It is difficult to achieve the effect of efficiently releasing the static electricity of the steel sheet. In addition, grounded exposed gold surfaces need to be set on both sides of the FPC, which requires a lot of conductive materials and leads to high production costs. Utility Model Content
[0004] The main purpose of the utility model is to provide an FPC module and a display device, aiming to solve the technical problem that the existing steel sheet grounding has many switching conduction times and cannot efficiently release the static electricity of the steel sheet.
[0005] To achieve the above-mentioned purpose, the utility model proposes an FPC module, including an FPC mainboard, a reinforcing steel sheet, a back frame and a conductive film; the FPC mainboard is provided with a steel sheet exposed gap outside the device area, and the FPC mainboard is provided with a copper exposed grounding area outside the device area on the device surface; the reinforcing steel sheet is insulated and connected to the non-device surface of the FPC mainboard; and at least part of it is exposed in the steel sheet exposed gap; the back frame is insulated and connected to the side surface of the reinforcing steel sheet away from the FPC mainboard; the conductive film covers the FPC The conductive film is provided on the FPC mainboard, and the edge of the conductive film protrudes from the edge of the FPC mainboard and is bonded to the back frame. The bonding surface of the conductive film has a first conductive area, a second conductive area and a third conductive area. The first conductive area is arranged corresponding to the position of the exposed copper grounding area to be bonded to the exposed copper grounding area. The second conductive area is arranged corresponding to the exposed notch of the steel sheet to be bonded to the reinforcing steel sheet exposed in the exposed notch of the steel sheet. The third conductive area is arranged in the section where the conductive film is connected to the back frame to be bonded to the back frame.
[0006] Optionally, in the first aspect of the utility model, the exposed notch of the steel sheet extends to a side edge of the FPC mainboard.
[0007] Optionally, in the first aspect of the present utility model, the conductive film is provided with an insulating layer in regions outside the first conductive region, the second conductive region and the third conductive region.
[0008] Optionally, in the first aspect of the utility model, an insulating glue layer is provided on the non-device surface of the FPC mainboard, and the insulating glue layer is bonded to the reinforcing steel sheet.
[0009] Optionally, in the first aspect of the utility model, the reinforcing steel sheet is provided with an insulating double-sided adhesive layer on a surface away from the FPC mainboard, and the insulating double-sided adhesive layer is bonded to the back frame.
[0010] The utility model also discloses a display device, comprising the FPC module as described in any one of the first aspects of the utility model.
[0011] The technical solution provided by the utility model may have the following beneficial effects:
[0012] In an FPC module provided by the utility model, a steel sheet exposed gap is opened in the non-device area of the FPC mainboard, so that after the FPC mainboard is bonded to the reinforcing steel sheet, the reinforcing steel sheet is at least partially exposed, and then a second conductive area corresponding to the position of the exposed gap of the steel sheet is opened on the conductive film, so that when the conductive film covers the FPC mainboard, the second conductive area is bonded to the reinforcing steel sheet exposed in the exposed gap of the steel sheet, so that the reinforcing steel sheet and the conductive film are directly conductive, reducing the number of switching conduction times, and achieving the effect of efficiently releasing static electricity. Among them, after the conductive film covers the FPC, the first conductive area is bonded to the corresponding copper exposed grounding area, so that the static electricity of the FPC mainboard can be directly conducted to the conductive film. Similarly, the third conductive area is bonded to the back frame, and the static electricity of the back frame can also be directly conducted to the conductive film.
[0013] It is worth noting that by opening a gap in the steel sheet in the non-device area of the FPC mainboard, there is no need to set up an exposed copper grounding area on the non-device surface of the FPC mainboard, which simultaneously reduces the use of conductive materials and reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0015] Figure 1 It is a structural schematic diagram of the conductive film of the FPC module of the utility model in an unfolded state;
[0016] Figure 2 This is a schematic diagram of a state where the conductive film of the FPC module of the utility model covers the FPC mainboard;
[0017] Figure 3 This is a front view of the FPC mainboard of the FPC module of the utility model;
[0018] Figure 4 It is a side view of the connection between the FPC module and the reinforcing steel sheet of the utility model;
[0019] Explanation of the accompanying drawings: 100-FPC mainboard, 110-exposed notch of steel sheet, 120-exposed copper grounding area, 130-insulating glue layer, 200-reinforcement steel sheet, 210-insulating double-sided adhesive layer, 300-back frame, 400-conductive film, 410-first conductive area, 420-second conductive area, 430-third conductive area, 440-insulating layer. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0022] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0023] In addition, in the present utility model, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0024] Combine the following Figures 1 to 4 , describing an FPC module of an embodiment of the utility model, comprising:
[0025] An FPC mainboard 100, wherein the FPC mainboard 100 is provided with a steel sheet exposed notch 110 outside the device area, and the FPC mainboard 100 is provided with a copper exposed grounding area 120 outside the device area on the device surface;
[0026] A reinforcing steel sheet 200, wherein the reinforcing steel sheet 200 is insulated and connected to the non-device surface of the FPC mainboard 100; and at least a portion of the reinforcing steel sheet 200 is exposed in the exposed notch 110 of the steel sheet;
[0027] A back frame 300, wherein the back frame 300 is insulated and connected to a surface of the reinforcing steel sheet 200 away from the FPC mainboard 100;
[0028] A conductive film 400, wherein the conductive film 400 covers the FPC mainboard 100, and the edge of the conductive film 400 protrudes from the edge of the FPC mainboard 100 and is bonded to the back frame 300, and the bonding surface of the conductive film 400 has a first conductive area 410, a second conductive area 420 and a third conductive area 430; the first conductive area 410 is arranged corresponding to the position of the exposed copper grounding area 120 to be bonded to the exposed copper grounding area 120; the second conductive area 420 is arranged corresponding to the exposed notch 110 of the steel sheet to be bonded to the reinforcing steel sheet 200 exposed in the exposed notch 110 of the steel sheet; the third conductive area 430 is arranged in the section where the conductive film 400 is connected to the back frame 300 to be bonded to the back frame 300.
[0029] In the FPC module provided by the utility model, a steel sheet exposed notch 110 is opened in the non-device area of the FPC mainboard 100, so that after the FPC mainboard 100 and the reinforcing steel sheet 200 are bonded, the reinforcing steel sheet 200 is at least partially exposed, and then a second conductive area 420 corresponding to the position of the steel sheet exposed notch 110 is opened on the conductive film 400, so that when the conductive film 400 covers the FPC mainboard 100, the second conductive area 420 is bonded to the reinforcing steel sheet 200 exposed in the steel sheet exposed notch 110, so that the reinforcing steel sheet 200 and the conductive film 400 are directly conductive, reducing the number of switching conduction times, and achieving the effect of efficiently releasing static electricity. Among them, after the conductive film 400 covers the FPC, the first conductive area 410 is bonded to the copper exposed grounding area 120, so that the static electricity of the FPC mainboard 100 can be directly conducted to the conductive film 400. Similarly, the third conductive region 430 is bonded to the back frame 300 , and static electricity of the back frame 300 can also be directly conducted to the conductive film 400 .
[0030] It is worth noting that by opening the steel sheet exposed gap 110 in the non-device area of the FPC mainboard 100, there is no need to set the copper exposed grounding area 120 on the non-device surface of the FPC mainboard 100, thereby reducing the use of conductive materials and reducing production costs.
[0031] Optionally, the steel sheet exposed notch 110 extends to one side edge of the FPC mainboard 100. Thus, in actual production, the steel sheet exposed notch 110 can be cut out at the edge of the FPC mainboard 100, without processing from the middle of the FPC mainboard 100, so as to open the steel sheet exposed notch 110.
[0032] Specifically, the conductive film 400 is provided with an insulating layer 440 in the area outside the first conductive area 410, the second conductive area 420 and the third conductive area 430. In this embodiment, by providing the insulating layer 440 in the area outside the first conductive area 410, the second conductive area 420 and the third conductive area 430, only the surfaces of the first conductive area 410, the second conductive area 420 and the third conductive area 430 are conductive, and the surfaces of the remaining areas are non-conductive, so as to avoid short circuit of the components of the FPC mainboard 100.
[0033] More specifically, the non-device surface of the FPC mainboard 100 is provided with an insulating glue layer 130, and the insulating glue layer 130 is bonded to the reinforcing steel sheet 200. By applying the insulating glue layer 130 on the non-device surface of the FPC mainboard 100, the FPC mainboard 100 is bonded to the reinforcing steel sheet 200. Since there is no need for conduction between the FPC mainboard 100 and the reinforcing steel sheet 200, ordinary and commonly used non-conductive glue can be used as the insulating glue layer 130, further saving production costs. It also avoids the problems of bubbles, board explosion, increased grounding resistance, and over-specification caused by conductive glue. Among them, it is worth mentioning that since there is an exposed steel sheet gap 110 on the FPC mainboard 100, when glue is applied to the non-device surface of the FPC mainboard 100, the insulating glue layer 130 will not be formed at the exposed steel sheet gap 110, so that the reinforcing steel sheet 200 exposed in the exposed steel sheet gap 110 can be directly bonded to the second conductive area 420 of the conductive film 400.
[0034] Furthermore, the reinforcing steel sheet 200 is provided with an insulating double-sided adhesive layer on the surface away from the FPC main board 100, and the insulating double-sided adhesive layer 210 is bonded to the back frame 300. By attaching the insulating double-sided adhesive layer 210 to the surface of the reinforcing steel sheet 200 away from the FPC main board 100, the reinforcing steel sheet 200 is bonded to the back frame 300. Since there is no need for conduction between the back frame 300 and the reinforcing steel sheet 200, a non-conductive double-sided adhesive can be used as the insulating double-sided adhesive layer 210, which further saves production costs.
[0035] The utility model also discloses a display device, including an FPC module of any of the above embodiments. In a display device provided by the utility model, in an FPC module, a steel sheet exposed notch 110 is opened in a non-device area of the FPC mainboard 100, so that after the FPC mainboard 100 is bonded to the reinforcing steel sheet 200, the reinforcing steel sheet 200 is at least partially exposed, and then a second conductive area 420 corresponding to the position of the steel sheet exposed notch 110 is opened on the conductive film 400, so that when the conductive film 400 covers the FPC mainboard 100, the second conductive area 420 is bonded to the reinforcing steel sheet 200 exposed in the steel sheet exposed notch 110, so that the reinforcing steel sheet 200 and the conductive film 400 are directly conductive, reducing the number of switching conduction times, and achieving the effect of efficiently releasing static electricity. Among them, after the conductive film 400 covers the FPC, the first conductive area 410 is bonded to the copper exposed grounding area 120, so that the static electricity of the FPC mainboard 100 can be directly conducted to the conductive film 400. Similarly, the third conductive area 430 is bonded to the back frame 300, and the static electricity of the back frame 300 can also be directly conducted to the conductive film 400. It is worth noting that by opening the steel sheet exposed gap 110 in the non-device area of the FPC mainboard 100, there is no need to set the copper exposed grounding area 120 on the non-device surface of the FPC mainboard 100, which simultaneously reduces the use of conductive materials and reduces production costs.
[0036] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the concept of the utility model, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.
Claims
1. An FPC module, characterized in that: include: An FPC mainboard, wherein the FPC mainboard is provided with a steel sheet exposed notch outside the device area, and the FPC mainboard is provided with a copper exposed grounding area outside the device area on the device surface; A reinforcing steel sheet, the reinforcing steel sheet is insulated and connected to the non-device surface of the FPC mainboard; and at least part of the reinforcing steel sheet is exposed in the exposed gap of the steel sheet; A back frame, the back frame being insulated and connected to a surface of the reinforcing steel sheet on one side away from the FPC mainboard; A conductive film, wherein the conductive film covers the FPC mainboard, and the edge of the conductive film protrudes from the edge of the FPC mainboard and is bonded to the back frame, and the bonding surface of the conductive film has a first conductive area, a second conductive area, and a third conductive area; the first conductive area is arranged corresponding to the position of the copper-exposed grounding area to be bonded to the copper-exposed grounding area; The second conductive area is arranged corresponding to the exposed gap of the steel sheet so as to be bonded to the reinforcing steel sheet exposed in the exposed gap of the steel sheet; The third conductive region is disposed in a section where the conductive film is connected to the back frame so as to be bonded to the back frame.
2. The FPC module according to claim 1, characterized in that: The exposed notch of the steel sheet extends to one side edge of the FPC mainboard.
3. The FPC module according to claim 1, characterized in that: The conductive film is provided with an insulating layer in a region other than the first conductive region, the second conductive region, and the third conductive region.
4. The FPC module according to claim 1, characterized in that: An insulating glue layer is provided on the non-device surface of the FPC mainboard, and the insulating glue layer is bonded to the reinforcing steel sheet.
5. The FPC module according to claim 1, characterized in that: The reinforcing steel sheet is provided with an insulating double-sided adhesive layer on a surface away from the FPC mainboard, and the insulating double-sided adhesive layer is bonded to the back frame.
6. A display device, characterized in that: Comprising the FPC module as described in any one of claims 1-5.